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Title: 2000 New & Emerging Technologies for Electronics Packaging and Assembly
Author: SMTA
Publisher: SMTA
Copyright Year: N/A
Number of Pages: 145
Non-Member Price: $45.00
Member Price:
$35.00
Featured during SMTA Dallas, the 6th Annual New & Emerging Technologies for Electronics Packaging & Assembly took place on November 1 and 2, 2000. The SMTA-sponsored symposium is dedicated to addressing cutting edge issues in electronics packaging and assembly by bringing microelectronics industry leaders together to discuss the most recent and future trends.
The 6th Annual Emerging Technologies program was arranged by co-chairs Reza Ghaffarian, Jet Propulsion Labs/NASA, and Steve Greathouse, Intel, and focused on the following areas:
Advanced & Emerging High Density
Packaging
Lead Free and New Materials / Processes
High Density Substrate / PCB
Assembly & Reliability / Reliability & Rework
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