South East Asia Technical Conference on Electronics Assembly

Training Workshops - Tuesday, March 28th

Note: Training workshops are not included with two-day conference registration

8:30am - 12:00pm
WS1 - Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies

WS2 - Choosing Solders For The New Era Part 1 (Low Cost High Reliability Lead-Free Solder Alloys)

1:30pm - 5:00pm
WS3 - Fan-Out Wafer-Level Packaging and 3D Packaging

WS4 - Choosing Solders For The New Era Part 2 (It is Time for Low Temperature-Low Temperature Solders, New Development, and Their Applications)



8:30am - 12:00pm

WS1 - Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies

Jason Keeping, P. Eng., Celestica, Inc. **SMTA Excellence in International Leadership Award Winner**

Course Description:

This course will cover the basics of conformal coating and assumes no prior knowledge of coatings. Covered topics will include: conformal coating usages, coating types, coating specifications, engineering tradeoffs, selecting a conformal coating, popular myths and misconceptions, and common causes of coating problems. The second half of the course is dedicated to conformal coating in the manufacturing environment. The course will touch on design, manufacturing, inspection and rework.

Who Should Take This Course:

This slightly humorous and irreverent presentation is designed for someone new to conformal coating or coating processes. Anyone that is either looking into, starting or has a conformal coating process in production should attend to see what is the latest industry news and best practices for conformal coating.

About The Instructor:

Jason Keeping is the Global Process Subject Matter Expert for Ruggedized Electronics within the Advanced Corporate Development team at Celestica. He holds a B.A.Sc in Electrical Engineering from the University of Ryerson, is a Six Sigma/Lean Professional and a licensed professional engineer. Jason has focused his career on assessing the manufacturability and capabilities of conformal coating, potting, underfill chemistries & their interactions, dispensing technologies/processes and on assembly-level cleaning for the past twelve years. Jason is the recipient of several awards, including the 2016 SMTA Excellence in International Leadership Award, the Shingo prize for Celestica's site in Monterrey, Mexico in 2007, and has contributed to Celestica’s Frost & Sullivan awards in 2005, 2009, 2012 & 2013. Jason is the co-chair of the IPC-HDBK-830 handbook; author for conformal coating chapter of the Printed Circuits Handbook and was featured in the cover of Circuits Assembly in May 2008 and is currently the vice-chair of the 5-30 Cleaning and Coating Committee. Most recently, Jason presented with Dave Hillman of Rockwell Collins; an industry wide baseline study, on conformal coating, supporting a J-STD-001 initiative with data and support of industry leading organizations. Jason is currently working alongside Stephen Meschter of BAE Systems as a principle investigator on Celestica's second-joint U.S. DoD Strategic Environmental Research and Development Project (SERDP) examining corrosion induced whisker growth.






8:30am - 12:00pm

WS2 - Choosing Solders For The New Era Part 1
(Low Cost High Reliability Lead-Free Solder Alloys)

Ning-Cheng Lee, Ph.D., Indium Corporation

Overview:

While the electronic industry is advancing rapidly toward miniaturization, two more important drivers actually dictate whether the manufacturers could stay in the game or not – Low Cost, and High Reliability. The former is the ticket to get into the game, while the latter is the ticket to stay in the game. These two drivers exemplified their vital role most astonishingly in solder materials. This course covers the roles of solder composition on cost, and on reliability. After reviewing the role of Ag in both cost and reliability, the solder materials are reviewed from the lowest cost, zero-Ag solders to composition with higher and higher Ag content. Among all of the alloy options present on the market, the representative alloys are introduced with more details, including materials properties, soldering performance, some of the known failure modes, and the primary merit of these alloys.

Who Should Take This Course:

Anyone who wants to know what solder alloys are available, and what are the pros and cons of all options for solder alloys should take this course.

About The Instructor:

Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Learn more about Dr. Lee.






1:30pm - 5:00pm

WS3 - Fan-Out Wafer-Level Packaging and 3D Packaging

John Lau, Ph.D., ASM Pacific Technology

Course Description:

Recent advances in, e.g., fan-out wafer/panel level packaging (TSMC’s InFO-WLP and Fraunhofer IZM’s FO-PLP), 3D IC packaging (TSMC’s InFO_PoP vs. Samsung’s ePoP), 3D IC integration (Hynix/Samsung’s HBM for AMD/NVIDIA’s GPU vs. Micron’s HMC for Intel’s Knights Landing CPU), 2.5D IC Integration (TSV-less interconnects and interposers), embedded 3D hybrid integration (of VCSEL, driver, serializer, polymer waveguide, etc.), 3D CIS/IC integration, and 3D MEMS/IC integration will be discussed in this presentation. Emphasis is placed on various FOWLP assembly methods such as chip-first with die-up, chip-first with die-down, and chip-last (RDL-first). Since RDLs (redistribution layers) play an integral part of FOWLP, various RDL fabrication methods such as Cu damascene, polymer, and PCB (printed circuit board) will be discussed. A few notes and recommendations on wafer vs. panel, dielectric materials, and molding materials will be provided. Also, TSV-less interposers such as those given by Xilinx/SPIL, Amkor, SPIL/Xilinx, ASE, MediaTek, Intel, ITRI, Shinko, Cisco/eSilicon, Samsung, and Sony will also be discussed. Furthermore, new trends in semiconductor packaging will be presented.

Who Should Attend:

If you (students, engineers, and managers) are involved with any aspect of the electronics assemblies, you should attend this course. It is equally suited for R&D professionals and scientists. All the materials are based on the papers and books published in the past 3 years and each participant will receive more than 200 pages of the lecture notes.

About The Instructor:

With more than 37 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 440 peer-reviewed papers, 30 issued and pending patents, and 18 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill Book Company, 2010), Reliability of RoHS compliant 2D and 3D IC Interconnects (McGraw-Hill Book Company, 2011), TSV for 3D Integration, (McGraw-Hill Book Company, 2013), and 3D IC Integration and Packaging (McGraw-Hill Book Company, 2016). John is an elected ASME Fellow and has been an IEEE Fellow since 1994.






1:00pm - 5:00pm

WS4 - Choosing Solders For The New Era Part 2
(It is Time for Low Temperature-Low Temperature Solders, New Development, and Their Applications)

Ning-Cheng Lee, Ph.D., Indium Corporation

Overview:

Since the dawn of electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperature around 300C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200C. Low temperature solders with melting temperature less than 180C are currently mainly used for niche applications. However, iNEMI roadmap predicts low temperature soldering to become one of the main stream processes by 2017. The low temperature soldering is greatly desired for a number of special applications, such as many sensors used in IoT, heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

What You Will Learn:

You will learn the benefits of low temperature soldering, and how this may broaden up your options in product design, your soldering process, your choice of components and board materials, and hierarchic combinations. You will also know the variety of solder alloys, and the pro and cons of each of the alloys in terms of their properties and their performance at the applications.

Who Should Take This Course:

Technology directors, technology managers, product managers, design engineers, process engineers, reliability engineers, material scientists, process technicians, and anyone who is interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course.

About The Instructor:

Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Learn more about Dr. Lee.

Questions? Contact Conference Organizer Jenny Ng, jenny@smta.org or call +1-952-920-7682.




Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.