The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Abstract Submission Due Date ExtendedAbstracts (300 words) are due January14, 2015. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio.
Also Accepting Course Abstracts on SMT and Semiconductor, LED, Photovoltaic, and Nano-Technology and any other topics you wish to submit. When you submit your abstract please indicate if it is a course.
Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.
Why Should You Attend: