South East Asia Technical Conference on Electronics Assembly
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."


Technical Program Finalized

Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

View the full program here!




Intel's Mokler to Give Keynote Address

How Thinner, Smaller Packages are Challenging Board Assembly Manufacturing

Scott Mokler, Intel Corporation Scott Mokler, Intel Corporation

As electronic devices grow in complexity and functionality they are also becoming smaller, thinner and more integrated. This combination, along with the continuous drive for cost reduction, creates a myriad of new challenges for surface mount and assembly processes. At Intel, we are investigating these challenges and exploring opportunities to accelerate Moore’s law though novel SMT and assembly technologies. In this presentation, I will describe our efforts to address the challenges, such as high temperature warpage, and to create opportunities such as Direct Chip Attach (DCA) and System-in-Package (SiP) integration to meet device miniaturization requirements.

Scott Mokler manages the platform development group within Intel’s Assembly & Test Technology Development Group. His team leads research and development in PCB and SMT technologies as well as board & system test integration for Intel. He has over 50 publications in the areas of semiconductor surface chemistry, semiconductor test as well as PCB and SMT technology. Scott graduated from Oregon State University with a PhD in Chemistry and spent five years as a Research Associate at the Imperial College prior to joining Intel in 1994.





Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately






  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.