South East Asia Technical Conference on Electronics Assembly
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

Submit an Abstract

Abstracts (300 words) are due January 4, 2016. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please indicate if your abstract is for a course you are offering to instruct.

Click here to submit an abstract

Presentations are sought in the following key technology tracks: Assembly

  • Adhesives, Alternate Alloys, BGA/CSP Assembly
  • Cleaning
  • Connector Technology
  • Copper Erosion
  • DFX/Design for Six Sigma
  • Equipment Selection
  • Flux and Solder
  • Halogen and Halogen-Free
  • Head-in-Pillow Defect
  • Land Pattern Design
  • Laser Soldering
  • Lead-Free Soldering (including case studies)
  • Lead-Free Reliability
  • Lean Manufacturing
  • Low Volume / Prototype Assembly
  • Medical Electronics
  • Placement
  • Printing
  • Reflow Soldering
  • Rework and Repair of QFNs
  • RFID Assembly
  • Selective Soldering
  • Set Up Reduction
  • Solder Paste
  • Solder Voids
  • Supplier Engineering
  • Underfill
  • Vapor Phase Reflow for High Reliability Assemblies
  • Wave Soldering
  • Yield Improvement


  • BGA
  • Battery Interactions
  • BTCs (Bottom Termination Components)
  • CSP (including Wafer-Level Packages)
  • Component Solderability
  • Component Reliability
  • Connectors
  • Embedded Passives
  • Failure Analysis
  • Fine Pitch Technology
  • Flip Chip / Direct Chip Attach
  • Lead/Termination Finish
  • Leadless Packaging
  • Multichip Packages (including 3-D Packaging, Package on Package)
  • Tin Whiskers

    Emerging Technologies

  • 0201/01005 Components and Assembly
  • Consumer Applications
  • Counterfeit Electronics
  • Electronic Printing Technology
  • Embedded Technology / Actives and Assembly
  • Flexible Electronics
  • Nanoelectronics
  • Reliability of Nanodevices
  • New Materials and Processes
  • Optoelectronics
  • Power or Thermal Management
  • Sensors and Manufacturing
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Wireless Applications including Bluetooth and Wi-Fi

    Harsh Environment Applications

  • Components and Component Reliability
  • Lead-free Issues for Harsh Environments
  • Substrates
  • Thermal Management

    PCB Technology

  • Black Pad and Surface Finish Defects
  • Embedded Passive and Active Components
  • Halogen Free
  • HDI
  • Microvias (including filled and unfilled)
  • Moisture Sensitivity
  • Soldermask
  • Substrate Reliability & Solderability
  • Surface Finish Pros and Cons
  • PCB Laminates

    Process Control

  • Acoustic Imaging
  • AOI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • X-Ray


  • Capacity Modeling
  • Contract Manufacturing
  • Doing Business in Asia
  • Environmental Issues
  • Lean Manufacturing / Quality Initiatives
  • Operations Management
  • Remaining Competitive
  • RoHS Compliance
  • Supplier Management
  • Technology Roadmap

  • Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.