South East Asia Technical Conference on Electronics Assembly
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

Sessions and topics in our 2014 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately




    Technical Program

    Training Courses - Tuesday, April 8th

    9:00 am – 12:00 pm
    T1 - Electromigration – The Hurdle for Miniaturization and High Power Devices
    Ning-Cheng Lee, Ph.D., Indium Corporation

    9:00 am – 12:00 pm
    T2 - 3D PoP for the SMT World
    Charles Bauer, Ph.D., TechLead Corporation

    1:30 pm – 4:30 pm
    T3 - Achieving High Reliability of Lead-Free Soldering - Materials Consideration
    Ning-Cheng Lee, Ph.D., Indium Corporation

    1:30 pm – 4:30 pm
    T4 - Cleaning and Contamination Process Guide
    Mike Bixenman,Ph.D., Kyzen Corporation




    Conference Day 1- Wednesday, April 9th

    Session 1: Sustainable Lead Free Manufacturing

    Chair: David Vetharudge, Listech Technology

    9:00     Applying Lean Six Sigma in Manufacturing (Printed Circuit Board Assembly)
    Johan Jr. Chan, IBM Corporation

    9:30     Do's and Don'ts - Good and Bad Practices - Myths and Reality of Soldering, Rework and Repair
                Terry Clitheroe, SMCBA (Australian SMT Association)

    10:00 0.35mm Pitch Extra Small Outline No Lead (XSON) Package PCBA Process Characterization (On Main Board)
                  Ricky Liew, Motorola Solutions Sdn Bhd

    Coffee Break - 10:30 – 10:45

    Session 2: Solder Paste Reliability

    Chair: KL Lim, Plexus Corporation

    10:45   The Rheology and Printing Behavior of Water Soluble Solder Pastes
       Li Tianpeng, Kester Components Pte Ltd

    11:15   Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys
                Sze Pei Lim, Indium Corporation

    11:45 High Reliability Pb-Free Halogen Free Solder
               Ian Wilding, Henkel Ltd

    Lunch - 12:15 - 1:15

    Session 3: Reliability of Low Silver Alternatives to SAC Alloys

    Chair: Chee Choong Kooi, Intel Corporation

    1:15   The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped With Mn
              Sehar Samiappan, Indium Corporation

    1:45   Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality
              Kok Kwan Tang, Intel Corporation

    2:15   Gold Embrittlement in Lead-free Solder
               Alex Chiu, Agilent Technologies

    2:45   Properties and Structure of Magnetic Receptive Fe_Centric SAC305 Solder
               R. Gopal Krishnan, National University of Singapore

    Coffee Break – 3:15 -3:30

    Session 4: Latest Advances in High Density Interconnect

    Chair: Khaw Mei Ming, Agilent Technologies

    3:30    TSV Barriers Create SMT Opportunities
                Charles Bauer, Ph.D., TechLead Corporation

    4:00   High Density Assembly in PCB Cavities
                Ranilo Aranda, Flextronics

    4:30   Failure Analysis of High Density Printed Circuit Board Assembly Inside Smartphone
                CK Lim, Intel Corporation




    Conference Day 2- Thursday, April 10th

    Session 5: Cleaning

    Chair: AK Tan, Jabil Circuit Sdn. Bhd.

    9:00   Concentration Monitoring & Closed Loop Control – A Technological Advancement
                Yeoh GT, ZESTRON

    9:30   Cleaning PCBs in Electronics: Understanding Today's Needs
               Steven Teh, Inventec Performance Chemicals

    10:00 Cleaning Soldering Residues from High Lead Soldered PCBs
                Mike Bixenman, Kyzen Corporation

    Coffee Break – 10:30 - 10:45

    Session 6:   Miniaturization

    Chair: Jensen Lee, Round Roots

    10:45  Ultra Miniaturized 01005 Passives Assembly
               Ng Chin Fei, Motorola Solutions

    11:15  Lead-Free and Halogen Free Solder Flip Chips Integration on Board Using SMT Process
                 Ranilo Aranda, Flextronics

    11:45   Failure Modes and Failure Analysis of LEDs in ICMs and Process and Design Optimization for LEDs Within ICMs
                Johan Jr. Chan, IBM Corporation

    Lunch – 12:15 – 1:15

    Session 7: QFN Reliability

    Chair: Tay Cheng Siew, Intel Product (M) Sdn. Bhd.

    1:15   Reliability Improvement of Array QFN Package
               You Chye How, Texas InstrumentS

    1:45   Optimizing Solder Voids Performance at Thermal Pad and Printability of its Peripheral Pads for Dual Row QFN Assembly
               Wong Hon Sern, Motorola Solutions (M) Sdn Bhd

    2:15   Bottom Termination Component Design Considerations to Improve Cleaning
               Mike Bixenman, Kyzen Corporation 

    2:45   A Process for Improved QFN Reliability
                John Ganjei, Ph.D., MacDermid, Inc.

    Coffee Break – 3:15 – 3:30

    Session 8:   Emerging Technologies

    Chair: Jonas Sjoberg, Round Roots

    3:30    Inspection Strategies for More Accurate, Faster and Smarter Inspection
                Dick Johnson, CyberOptics Corporation

    4:00   The Use of Micro/ATR FTIR in PCBA CRD Smearing Failure Analysis
               Kong Hui Lee, Cisco Systems (Malaysia) Sdn. Bhd.

    4:30   Package on Package (POP) Process Characterization and Capability Study 
               Kenny Chiong, Motorola Solutions






  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.