The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Technical Program Finalized
Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.View the full program here!
Intel's Mokler to Give Keynote Address
How Thinner, Smaller Packages are Challenging Board Assembly ManufacturingScott Mokler, Intel Corporation
As electronic devices grow in complexity and functionality they are also becoming smaller, thinner and more integrated. This combination, along with the continuous drive for cost reduction, creates a myriad of new challenges for surface mount and assembly processes. At Intel, we are investigating these challenges and exploring opportunities to accelerate Moore’s law though novel SMT and assembly technologies. In this presentation, I will describe our efforts to address the challenges, such as high temperature warpage, and to create opportunities such as Direct Chip Attach (DCA) and System-in-Package (SiP) integration to meet device miniaturization requirements.
Scott Mokler manages the platform development group within Intel’s Assembly & Test Technology Development Group. His team leads research and development in PCB and SMT technologies as well as board & system test integration for Intel. He has over 50 publications in the areas of semiconductor surface chemistry, semiconductor test as well as PCB and SMT technology. Scott graduated from Oregon State University with a PhD in Chemistry and spent five years as a Research Associate at the Imperial College prior to joining Intel in 1994.
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