SMTA International

Conference: Sep. 27 - Oct. 1, 2015
Exhibition: Sep. 29 - 30, 2015

Donald Stephens Convention Center
Rosemont, IL, USA
More About SMTA

Technical Sessions

Sessions are 1.5 hour programs in which three technical papers are presented under the direction of a chairperson. Each paper is presented by the author on a topic related to the main subject of the session, and is followed by audience questions. The objective of a technical session is to bring new scientific and technical developments to light. Emphasis is placed on original, previously unpublished papers.

Session tracks and symposiums:
Advanced Packaging Technology (APT)
Evolving Technologies (ET)
Lean Initiatives (EMS)
Flux, Solder, Adhesives (FSA)
Harsh Environment Applications (HE)
Inspection Technologies (INS)
Lead-Free Soldering Technology (LF)
Manufacturing Excellence (MFX)
Substrates/PCB Technology (SUB)
Monday
  • Evolving Technologies Summit
  • Harsh Environment Symposium
  • Tuesday
  • 11:00am - 1:00pm
  • 2:00 - 3:30pm
  • 4:00 - 5:30pm
  • Wednesday
  • 8:00 - 9:30am
  • 10:30am - 12:00pm
  • 2:00 - 3:30pm
  • 4:00 - 5:30pm
  • Thursday
  • Lead-Free Soldering Technology Symposium


  • Please note that speakers with a Speaker of Distinction icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done.



    MONDAY, September 28


    Evolving Technologies Summit
    FREE with a VIP or Technical Conference Registration!
    Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Steve Greathouse, Plexus Corp. and Richard Coyle, Ph.D., Alcatel-Lucent
    Monday, September 28 | 9:00am - 5:00pm

    Co-Sponsored by


    ET1

    Alternate Alloys

    Chair: Richard Coyle, Ph.D., Alcatel-Lucent
    Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
    Monday, September 28 | 9:00am - 10:30am

    Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling environments, particularly if vibration and shock loading are involved. Additionally, there are problems associated with the high temperature processing required for SAC305, and the cost of high Ag alloys is an issue in some market segments. These recent observations and findings indicate that high Ag alloys are not an optimum or even acceptable solution for other applications. Further, it appears unlikely that a single-alloy solution may not exist across all electronic applications. These sessions share recent process and reliability work done on alloys being considered as alternatives to high Ag SAC305.

  • Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics
    Morgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Rahul Raut, Sutapa Mukherjee, Siuli Sarkar and Bawa Singh, Alpha
  • Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature
    Emmanuelle Guene, P.E., Inventec Performance Chemicals
  • Effect of Bi Content on Properties of Low Silver SAC Solders
    M. Maalekian, Y. Xu, K. Seelig, AIM Solder



    ET2

    Alternate Alloys (Continued)

    Chair: Richard Coyle, Ph.D., Alcatel-Lucent
    Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
    Monday, September 28 | 11:00am - 12:30pm


  • Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments
    Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Auburn University
  • Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys
    Speaker of DistinctionBrian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC
  • Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced BiSn Based Solder Pastes
    Olivia Chen, Al Molina, Kok Kwan Tang, Kevin Byrd, Scott Mokler and Raiyo Aspandiar, Ph.D., Intel Corporation



    ET Keynote Lunch

    Chair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
    Monday, September 28 | 12:30pm - 1:30pm

    Wearables Technology - The Next Manufacturing Wave

    Murad Kurwa, Flextronics International

    A new wave of wearables brings with it plenty of manufacturing and process development concerns. Kurwa will discuss substrate advances like stretchable conductive fabrics, interconnects, new sensor technology including printed sensors (ECG) and OLED, assembly concerns for flexible conductive adhesive and nano-sintering, and encapsulation techniques such as low pressure molding and water proof coating. New equipment like R2R printing and assembly, fabric laser cutting, and ultrasonic welding on fabric will be discussed. The presentation will also address how reliability testing has adapted with flexibility testing, washability, salt spray, and sweat testing.

    *To ensure an adequate number of lunches, you must pre-register in advance by checking "Evolving Technologies Summit" (Monday) on the registration form.



    ET3

    Wearable Electronics Technology Development

    Chair: Alex Chen, Celestica Inc.
    Co-Chair: Brian Toleno, Ph.D., Henkel Electronic Materials LLC
    Monday, September 28 | 1:30pm - 3:00pm

    Wearable electronics devices are expanding from fitness and wellness applications to almost anything, including health-tech and medical industry, automotive industry, security and defense industry. This brave new sector is propelled by technology advances and experiencing some growing pains – technological challenges, such as selecting the right interconnect technology, how to make textiles smart, or how to manufacture new and innovative high-mix products at high volume but low cost. The session on wearable electronics will bring insights on some exciting technological advances and ways of managing the challenges.

  • Smart Textiles for Wearable Technology
    Speaker of DistinctionChris Hunt, Ph.D., Roya Ashayer-Soltani and Kathryn Wills, National Physical Laboratory
  • Connector Design for Wearables
    Speaker of DistinctionRandy Schueller, Ph.D., DfR Solutions
  • Wearable Electronics & Big Data = High Volume, High Mix SMT!
    Speaker of DistinctionCharles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation



    ET4

    Evolving Technologies Panel: Covering Key Technologies Including: 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded Technologies

    COMPLIMENTARY BEER AND PRETZELS!
    Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Lab
    Co-Chair: Paul Wang, Ph.D., Mitac International
    Monday, September 28 | 3:30pm - 5:00pm

    Panelists include:
  • Lars Böttcher, Fraunhofer IZM Berlin
  • Richard Coyle, Ph.D., Alcatel-Lucent
  • Steve Greathouse, Plexus Corp.
  • Irene Sterian, P.E., Celestica, Inc.
  • Chuck Woychik, Ph.D., Invensas Corporation








  • Harsh Environments Symposium
    FREE with a VIP or Technical Conference Registration!
    Organized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University
    Monday, September 28 | 8:00am — 3:00pm
    Tuesday, September 29 | 11:00am - 4:00pm
    (Note: this symposium continues on Tuesday)


    HE1

    Reliability of Components in Harsh Environments

    Chair: Matt Kelly, P.Eng., MBA, IBM Corporation
    Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
    Monday, September 28 | 8:00am — 10:00am

    Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics. This session examines hardware reliability performance including mirrored memory with underfill configurations, isothermal fatigue of doped lead-free alloys, and mechanical vibration conditions. Application needs, field use simulation conditions, and resulting failure analysis will be discussed.

  • Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
    Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., Michael Bozack, Ph.D. and Wayne Johnson, Ph.D., Auburn University
  • Solder Joint Fatigue Characterization of DDR3 SDRAMs and Other Advanced BGA Packaging Memory Types
    Arnaud Grivon, Michel Brizoux, Damien Baudet, Aurélien Lecavelier and Wilson Maia, Thales
  • Avionics Vibration Durability Between Sn-Pb and Lead-free Solder Interconnects
    Speaker of DistinctionJoseph Juarez, Ph.D., Honeywell International
  • Isothermal-Fatigue of High-Temperature Solder Joints
    Harry Schoeller, Ph.D., Universal Instruments Corporation



    HE2

    Electronics in Corrosive Environments

    Chair: Marie Cole, IBM Corporation
    Co-Chair: John Evans, Ph.D., Auburn University
    Monday, September 28 | 10:30am — 12:30pm

    Electronics in data centers that may have harmful environments resulting from the ingress of outdoor particulate and/or gaseous contamination can be at risk for corrosion. Supplying robust hardware for these data centers, mostly in emerging markets, can be a challenge if the risk of corrosion failures is not well understood. In this session, you will learn about the corrosion risk associated with various PCB finishes and memory module components, how to mitigate corrosion risks for electronics. and methods to predict field performance in high sulfur environments through accelerated laboratory testing.

  • Sulfer Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments
    Matthew Weeks, Ph.D. and David J. Zueck, Western Digital Technologies, Inc.
  • Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2
    Prabjit Singh, IBM Corporation; Haley Fu, iNEMI; Aamir Kazi and Wallace Ables, Dell Corporation; Dem Lee and Jeffrey Lee, iST-Integrated Service Technology, Inc.; Karlos Guo and Jane Li, Lenovo (Beijing) Limited Corporation; Simon Lee and Geoffrey Tong, The Dow Chemical Company; Tao Yoon, Hsien Taiwan
  • The Corrosion Failure Risk Assessment of Memory Module at Data Center in Harsh Environmental Conditions
    Sungwon Han, Samsung Electronics
  • An Attempt to Study the MFG Test Pollutant Chemistry Effect to Match Filed Data
    Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik, and Balu Pathangey, Intel Corporation



    HE Keynote Lunch

    Chair: Pradeep Lall, Ph.D., Auburn University
    Monday, September 28 | 12:30pm — 1:30pm

    Extreme Environment Electronics - Where We've Been, Where We Are Going and What Could Be Next

    Jim Springer, John Deere Electronic Solutions

    To feed the world population in 2050 it is estimated the current agricultural production must double. Technology is critical to increasing agricultural equipment's utilization and output leading to more efficient farming methods and improved yields. The quality and reliability of electronics used for precision guidance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electronics used in farming is challenging, both in electronic design and manufacturing as well as material selection. This has become more apparent following the global transition of electronic manufacturing from the conventional leaded component technology to lead-free technology. Jim will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.

    *To ensure an adequate number of lunches, you must pre-register in advance by checking “Harsh Environments Summit” (Monday) on the registration form.



    HE3

    Materials for Harsh Environments

    Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
    Co-Chair: Iulia Muntele, Ph.D., Sanmina Corporation
    Monday, September 28 | 1:30pm — 3:00pm

    The requirements and demands placed on heat sinking and soldering materials for applications in aerospace, automotive, defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries.

  • Assessment of Thermal Pastes for Use in Space Electronics Applications
    Jeff Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation
  • Novel Lead-Free Solder Alloys Development for Automotive Applications
    *Ning-Cheng Lee, Ph.D. and Weiping Liu, Indium Corporation
  • Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications
    Rahul Raut, Westin Bent and Michael Liberatore, Alpha, an Alent plc Company



    TUESDAY

    HE4

    Electronics Ruggedization Through Coating

    Chair: Chair: Iulia Muntele, Ph.D., Sanmina Corporation
    Co-Chair: Pradeep Lall, Ph.D., Auburn University
    Tuesday, September 29 | 11:00am - 12:30pm

    Whether it is protection from hostile environments (temperature and/or pressure extreme values, humidity, corrosive atmosphere, UV light, shock and/or vibration), or to aid in the electrical design parameters of a PCBA, conformal coating has been the method of choice for designers. Despite a wide range of coating materials availability, ongoing research efforts continue to close gaps and expand the quest for lighter, easier application and reworkable materials. Both consumer and high-reliability electronics benefit from the results of these research efforts. This session’s presentations bring forth the data acquired in recent investigations of epoxy, silicone, parylene, fluoropolymer coatings, and highlight their applicability in harsh environments with hard to control temperature and moisture levels.

  • Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure
    Erik Olson, Molly Smith, Greg Marszalek and Karl Manske, 3M Company
  • Characterization of Conformal Coatings
    Prabjit Singh, Ph.D., IBM Corporation
  • Ensuring Performance and Reliability of High Temperature Electronics Through Thermally Stable Parylene HT at Nano/Micro Levels
    Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.







    TUESDAY, September 29
    11:00am - 1:00pm


    APT1

    3D IC and PoP Assembly

    Chair: Lars Böttcher, Fraunhofer IZM Berlin
    Co-Chair: Vern Solberg, Solberg Technical Consulting
    Tuesday, September 29 | 11:00am - 12:30pm

    Package on Package and 3DIC has become widely spread in today's mobile applications. Both need to address reliable and cost efficient technology and assembly. This session will address both PoP and TSV methods and, in addition, will look into the reliability performance of new interconnect materials like copper wire bonds.

  • High-Volume-Manufacturing (HVM) of BVA™ Enabled Advanced Package-on-Package (PoP)
    Speaker of DistinctionWael Zohni, Ashok S. Prabhu, and Rajesh Katkar, Invensas Corporation
  • Assembly Challenges for 2.5 and 3D IC Packaging
    Speaker of DistinctionCharles G. Woychik, Ph.D., Cyprian Uzoh, Guilian Gao, Hong Shen, Liang Wang, Sangil Lee, Roseann Alatorre, Scott McGrath, Sitaram Arkalgud and Mohamed Elassar, Invensas Corporation
  • Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments
    Speaker of DistinctionPradeep Lall, Ph.D. and Yihua Luo, Auburn University; Luu Nguyen, Ph.D., Texas Instruments



    EMS1

    Taking the Cost out of EMS: Getting the Best Return for Lean Initiatives

    Chair: Susan Mucha, Powell-Mucha Consulting, Inc.
    Co-Chair: Mike Buetow, Circuits Assembly Magazine
    Tuesday, September 29 | 11:00am - 12:30pm

    In today's world of variable demand and higher mix product, electronics manufacturing services (EMS) companies need to be flexible and agile to respond to changing customer needs. At the same time, EMS companies also need to address efficiency and cost reduction in an environment characterized by razor thin margins. Does a more holistic approach to implementing Lean manufacturing philosophy hold the answers to best addressing these challenges? Join us as a regional EMS provider and supplier of manufacturing shop floor control solutions discuss how a Lean, yet agile EMS operation can be created by rethinking how customers, the supply chain, support functions and manufacturing operations work together in an interconnected Lean environment. Following the presentations, there will be a panel discussion with the audience focused on ways this type of holistic approach can eliminate the common constraints to effective Lean implementation found in the EMS environment.

  • Lean Flow On The SMT Factory Floor
    Michael Ford, Mentor Graphics, Valor Division
  • Applying Lean Philosophies to Supply Chain Management in EMS
    Wally Johnson, Firstronic
  • Panel Discussion




    FSA1

    Improved Area Array Component Solder Reliability Through Use of Underfills, Edge Bonds and Encapsulants

    Chair: Dale Lee, Plexus Corp.
    Co-Chair: Morgana Ribas, Ph.D., Alpha India Research Centre
    Tuesday, September 29 | 11:00am - 12:30pm

    With increased use of area array components in high reliability and harsh environment applications, the need for solder connection reliability enhancement materials has increased. This session will share recent work done to improve reliability of solder connections through use of solder joint encapsulant, edge bond and underfill materials.

  • WLCSP and BGA Reworkable Underfill Evaluation and Reliability
    Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D. and Kelley Hodge, Engent, Inc.; Qing Ji, Ph.D., and Ben Bo, H.B. Fuller
  • Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA Applications
    Speaker of DistinctionDaniel F. Baldwin, Ph.D., Fei Xie, Ph.D., Han Wu, Swapan Bhattacharya, Ph.D. and Kelley Hodge, Engent Inc.; Qing Ji, Ph.D., H.B. Fuller
  • A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
    Wusheng Yin, Ph.D. and Mary Liu, YINCAE Advanced Materials, LLC



    MFX1

    Pathways to Prolific Printing

    Chair: Jeff Schake, ASM Assembly Systems - DEK
    Co-Chair: Ray Whittier, Vicor Corporation
    Tuesday, September 29 | 11:00am - 12:30pm

    Although the SMT stencil printing process is conceptually simple, it is governed by a complicated network of interrelated variables. Detangling these variables leads to different investigation paths that ultimately converge to improve overall printing process understanding. This session explores a diverse range of printing research interests, from managing print process control in unfavorable production conditions to controlled experiments pursuing low area ratio printing characterization and visualization.

  • Evaluation of the Stencil Printing for Highly Miniaturized SMT Components With 03015mm in Size
    Speaker of DistinctionStefan Härter and Jörg Franke, Institute for Factory Automation and Production Systems (FAPS), Freidrich-Alexander-University Erlangen-Nürnberg (FAU); Carmina Läntzsch, LaserJob GmbH
  • Video Analysis of Solder Paste Release from Stencils
    Speaker of DistinctionChrys Shea, Shea Engineering Services; Mike Bixenman, DBA and Wayne Raney, Kyzen Corporation; Ray Whittier, Vicor Corporation
  • A Different Perspective on Solder Paste Printing: Perfecting the Print Process with Practical Solutions
    Michael J. Cieslinski and Brent Fischthal, Panasonic Factory Solutions Company of America



    TUESDAY, September 29
    2:00pm - 3:30pm


    APT2

    BGA Reliability

    Chair: Randy Schueller, Ph.D., DfR Solutions
    Co-Chair: Derrick Herron, Indium Corporation
    Tuesday, September 29 | 2:00pm - 3:30pm

    Area Array Packages continue to be pushed to higher levels of reliability to meet the demands of the industry. The papers in this session do an excellent job of determining, through modeling and experimentation, the critical variables of both the package and PCB that most impact the reliability.

  • Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications
    Burton Carpenter, Freescale Semiconductor and Thomas Koschmieder, Cirrus Logic, Inc.
  • Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
    Speaker of DistinctionJean-Paul Clech, EPSI, Inc.
  • Bending Strength of Solder Joints as a Function of Joint Length
    Saeed Akbari Roknabadi, Amir Nourani and Jan K. Spelt, University of Toronto



    FSA2

    New Developments in No-Clean Solder Paste and Flux Technology and Reliability

    Chair: Eric Bastow, Indium Corporation
    Co-Chair: Renzhe Zhao, Huawei Technologies Co., Ltd.
    Tuesday, September 29 | 2:00pm - 3:30pm

    This session will focus on new developments and reliability challenges in the no-clean solder paste and flux arena. Special attention will be given to electrical reliability challenges associated with partially activated flux residues. This will be incorporated with an overview of the ongoing evolution of flux technology driven by miniaturization and new component designs and soldering challenges.

  • Evolution of the Performance and Reliability Requirements of Soldering Fluxes
    Karl Seelig and Timothy O'Neill, AIM
  • "Partially-Activated" Flux Residue Influence on Surface Insulation Resistance of Electronic Assembly
    Xiang (Shawn) Wei, Ph.D., Kyle Loomis, Jennifer Allen and Bruno Tolla, Kester Inc.
  • The Risk and Solution for No-Clean Flux not Fully Dried Under Component Terminations
    Speaker of DistinctionNing-Cheng Lee, Ph.D. and Fen Chen, Indium Corporation



    MFX2

    Challenges in Advanced Package on Package Applications

    Chair: John McMahon, P.E., Celestica Inc.
    Co-Chair: Greg Wade, Indium Corporation
    Tuesday, September 29 | 2:00pm - 3:30pm

    "Package on Package" (PoP) is the dominant configuration for mobile processors. It enables processor/cache memory interaction using industry generic packages and represents the lowest cost solution by maintaining supply chain options until final assembly. Continuing miniaturization is driving component height reductions in direct competition to increasing functionality. This session highlights some challenges and solutions associated with the advances in PoP applications.

  • Advanced Analysis of Package-on-Package Interconnect Gaps During Reflow Assembly
    Ken Chiavone, Akrometrix, LLC
  • Assembly Process Development for a 14mmx14mm Bond Via Array (BVA) Package-on-Package (PoP)
    Shane M. Lewis, Ph.D., Sanmina Corporation; Charles Woychik, Ph.D., Invensas Corporation; Vineeth Bastin, Nordson DAGE
  • Challenges for SMT Assembly of PoP Packages
    Lilia May, Ph.D., Rajen S. Sidhu, Chang Lin Pubudu Goonetilleke, Huiyang Fei, Satyajit S. Walwadkar and Katherine J. Downes, Intel Corporation



    HE5

    Thermal Management (Get the Heat Out!)

    Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
    Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
    Tuesday, September 29 | 2:00pm - 4:00pm

    Efficient thermal relief is required in order to obtain expected performance of electronic components, especially those operating in high temperature environments. The Get the Heat Out session presents works on different heat management technologies as well as the unintended consequences of some thermal relief methods to the reliability of electronic components.

  • Design Considerations in the Use of Phase Change Materials in Data Center Cooling
    Jeff Luttrell, Abhishek Guhe and Dereje Agonafer, Ph.D., University of Texas - Arlington
  • Peak Temperature Limitation of Electronic Assemblies with Phase Change Materials
    Mathias Nowottnick, Andrej Novikov and Daniel Lexow, University of Rostock
  • High Efficient Heat Dissipation on Printed Circuit Boards
    Markus Wille, Schoeller Electronics GmbH
  • Defining Mechanical Load Limits for Thermal Solutions on High Performance fcBGA Packages
    Speaker of DistinctionBrian Roggeman, Jintao Zheng, Mark Schwarz and Ahmer Syed, Qualcomm Inc.



    TUESDAY, September 29
    4:00pm - 5:30pm


    APT3

    Advances in WLP and CSP Interconnect Design and Assembly Processes

    Chair: Chuck Woychik, Ph.D., Invensas Corporation
    Co-Chair: Mike Bixenman, DBA, Kyzen Corporation
    Tuesday, September 29 | 4:00pm - 5:30pm

    As WLP component pitches decrease, it becomes more difficult to assemble these packages. A systematic approach has been used to develop a robust stencil printing process for 0.3 mm pitch packages. Data will be presented along with conclusions on how the stencil printing process affects the ultimate reliability of 0.3 mm pitch CSP assemblies. Also, in this session the use of polymer cored balls was evaluated on CSP packages which resulted in a 70% improvement in drop testing and 25% improvement in thermal cycle testing. The process used to assemble these polymer core assemblies will be discussed along with the reliability data. Finally, a novel dip encapsulant was evaluated to improve board level reliability on CSP packages. This dip encapsulant is a polymer adhesive which encapsulates the BGA joints after reflow. Thermal cycling was performed using -40 to 125º C temperature range. This work reveals that dip encapsulation can be used as an alternative to solder paste printing, while also improving board level reliability.

  • The Development of a 0.3mm Pitch CSP Assembly Process, Part 2: Assembly & Reliability
    Speaker of DistinctionMark Whitmore and Jeff Schake, DEK Printing Solutions, ASM Assembly Systems
  • Development of Low Cost and High Pin Count Wafer Level Packaging
    Karthik Thambidurai, Viren Khandekar, Tiao Zhou, Ph.D. and Kaysar Rahim, Maxim Integrated
  • Improved SMT Assembly and BLR of 0.35mm Pitch Wafer Level Packages
    Speaker of DistinctionBrian Roggeman and Beth Keser, Qualcomm Inc.



    FSA3

    The How's and Why's of Fluxes in Electronics Assembly

    Chair: Scott Priore, Cisco Systems Inc.
    Co-Chair: Rod Howell, Libra Industries
    Tuesday, September 29 | 4:00pm - 5:30pm

    There have been some key advances in the fluxes that are used in electronic assemblies. Fluxes are the most critical element in soldering and these three papers will look at the advances in flux for solder paste, wave solder, and the use of epoxy fluxes for some applications.

  • Rosin vs. Non-Rosin Wave Flux- Which Creates More Reliable Electronic Assemblies?
    Speaker of DistinctionRon Lasky, Ph.D., P.E. and Adam Murling, Indium Corporation
  • Formulation of a New Liquid Flux for High Temperature Soldering
    Speaker of DistinctionTony Lentz, FCT Assembly
  • Epoxy Flux Material and Process for Enhancing Electrical Interconnections
    Speaker of DistinctionBrian Toleno, Ph.D., Neil Poole, Ph.D. and Elvira Vasquez, Henkel Electronic Materials LLC



    WEDNESDAY, September 30
    8:00am - 9:30am


    FSA4

    The Influence and Impact of Materials & Process Selection on Reliability

    Chair: David Hillman, Rockwell Collins
    Co-Chair: Ursula Marquez de Tino, Plexus Corp.
    Wednesday, September 30 | 8:00am - 9:30am

    An electronic assembly is the sum of its materials and processes – a detailed balance of material combinations and design parameters which done correctly produces today's modern electronics or when done incorrectly, causes process engineers headaches. This technical session will provide a deep dive into three distinct materials and process topics: the use of SIR testing to characterize electrochemical reliability; the interaction of component diversity and product reliability; the role of phosphorus in evolution of today's lead-free solder alloys.

  • SIR and ECM Testing of Soldering Materials vs. Soldering Processes
    Karen Tellefsen, Alpha
  • Reliability Improvements by the Creation of Intermetallic Connections
    Speaker of DistinctionJoerg Trodler, Dipl.-Ing, Heraeus Deutschland Gmb&Co.KG and Heinz Wohlrabe, Ph.D., Technical University Dresden
  • The Effects of Phosphorus in Lead-Free Solders
    Speaker of DistinctionKeith Sweatman, Takatoshi Nishimura and Takuro Fukami, Nihon Superior Co., Ltd.



    INS1

    X-ray Inspection: The Growing Complexity of Applications and Capability Needs for Tomorrow's PCBs

    Chair: States Mead, Navitas Systems, LLC
    Co-Chair: Terry Munson, Foresite, Inc.
    Wednesday, September 30 | 8:00am - 9:30am

    This session covers the evolving level of detail inspection requirements being asked of X-ray equipment. Learn about how this is being achieved through development of enhanced algorithms, optimization techniques, and added capabilities of X-ray inspection for components like solder charge and press-fit connectors. We will also explore how X-ray technology is even being pushed to establish measurements of deformation and strain in operational electronics which is currently limited to cut-plane techniques.

  • Algorithms: The Next Frontier for X-Ray Inspection
    Speaker of DistinctionBill Cardoso, Ph.D., Creative Electron
  • Optimization of X-ray Inspection for Solder Charge Connectors
    Zhen (Jane) Feng, Ph.D., David Geiger, Jennifer Nguyen, Weifeng Liu, Ph.D., Anwar Mohammed, Golden Xu, Lea Su, Murad Kurwa and George Tint, Ph.D., Flextronics International
  • Deformation and Strain Measurements in Operational Electronics Using X-ray Micro-CT and Digital Volume Correlation
    Speaker of DistinctionPradeep Lall, Ph.D. and Junchao Wei, Auburn University



    MFX3

    Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies

    Chair: Barbara Kanegsberg, BFK Solutions LLC
    Co-Chair: Mike Havener, Benchmark Electronics, Inc.
    Wednesday, September 30 | 8:00am - 9:30am

    Increased complexity and miniaturization of electronic assemblies along with demanding end-use requirements mean that we must clean in situations where cleaning was previously not required. Presenters will explore their studies of how variables in the assembly process impact efficacy of the cleaning process. Attendees will gain tools to increase product reliability.

  • Impact of Multiple Thermal Cycles on the Cleaning Process
    Speaker of DistinctionUmut Tosun, M.S.Ch.E. and Jigar Patel M.S.Ch.E., ZESTRON Americas
  • Determining the Effect of Water Quality on Cleaning Effectiveness
    Speaker of DistinctionEric Camden, Foresite
  • Cleanliness Makes a Difference When Miniaturization Kicks In
    Speaker of DistinctionMike Bixenman, DBA and David Lober, Kyzen Corporation; Mark McMeen and Jason Tyne, STI Corporation



    SUB1

    Investigating Surface Finish Reliability and Attributes Outside of Solderability

    Chair: Lenora Toscano, MacDermid, Inc.
    Co-Chair: Don Banks, St. Jude Medical
    Wednesday, September 30 | 8:00am - 9:30am

    Market needs and environmental changes push the industry for advances in surface finishing. Though solderability is always the primary goal for final finishes, many other critical attributes must also be considered. This session will review alternative surface finishes and speak to performance characteristics for areas left unsoldered. It will also review the latest revisions to the IPC 4552 standard as attention to the core surface finishes is a responsibility of this industry.

  • Final Finish Specifications Overview IPC Plating Subcommittee 4-14
    George Milad, Uyemura International Corporation
  • Eliminating False Positive ICT Response Through the Use of Organic-Metal Final Finish
    Speaker of DistinctionRita Mohanty, Ph.D., Sathiya Narayana and John Fudala, Enthone
  • Comparing PCB Surface Finishes and Their Assembly Process Compatibility
    Ray Prasad, Ray Prasad Consultancy Group; and Rob Rowland, Axiom Electronics LLC



    APT4

    Improvements in Voiding and Reliability of BTCs

    Chair: Brian Roggeman, Qualcomm Inc.
    Co-Chair: Fei Xie, Ph.D., Engent Inc.
    Wednesday, September 30 | 8:00am - 10:00am

    The primary focus on BTCs continues to be voiding, especially on the large thermal pads, while secondary focus is on the field reliability. Improvements in voiding control will be shared using novel preform technology. Finite element modeling and empirical testing investigate the effects of PCB design, underfills and other types of encapsulants as a means to improve reliability.

  • Voiding Control Beneath Bottom Terminated Components Using Solder Fortification Preforms
    Derrick Herron, Christopher Nash, Raymond Luo and Andy Wei, Indium Corporation
  • Impact of Layer Removal and Layer Thickness of QFN Mounted PCB Boards During Drop Testing
    Sayalee Sabne, A.R. Nazmus Sakib and Alok Lohia, University of Texas at Arlington
  • Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat No-lead (PQFN) Package
    Speaker of DistinctionPaul Vianco, Ph.D. and Michael Neilsen, Ph.D., Sandia National Laboratories
  • Board Level Reliability Comparison of BGA and LGA Packages Mounted to an LGA Footprint Motherboard
    Speaker of DistinctionRobert Darveaux, Howard Chen, Shaul Branchevsky and Bhuvaneshwaran Vijayakumar, Skyworks Solutions Inc.; Christopher J. Berry and Ben Zarkoob, Amkor Technology, Inc.



    WEDNESDAY, September 30
    10:30am - 12:00pm


    FSA5

    Solder Joint Reliability Assessment

    Chair: Tim Jensen, Indium Corporation
    Co-Chair: Joerg Trodler, Heraeus Deutschland GmbH & Co. KG
    Wednesday, September 30 | 10:30am - 12:00pm

    Assessing the reliability of a finished solder joint can be a complex exercise. With the continued move toward Pb-Free, additional challenges that impact reliability have arisen. In this session, some of these reliability challenges related to Pb-Free transition will be discussed and ways to assess reliability will be reviewed.

  • Assessing Backward Compatible Solder Joint Reliability Under Standard and Mildly Accelerated Test Conditions
    Speaker of DistinctionRichard Coyle, Ph.D., Peter Read, Richard Popowich and Debra Fleming, Alcatel-Lucent; Vasu Vasudevan, Raiyo Aspandiar and Steve Tisdale, Intel Corporation; Iulia Muntele, Sanmina Corporation
  • Quantifying Qualitative Attributes of Cored Solder Wire in LED Luminaire Soldering - Part 1
    Amit Patel, Steve Prokopiak, Nicholas Herrick, Bin Mo, Rahul Raut and Ranjit Pandher, Ph.D.,Alpha, an Alent plc Company
  • The Quantitative Assessment of Mixed BGA Joint With the Elimination of Low-melting Point Alloy Re-melting Process
    Hongqin Wang, Guanghui He and Daojun Luo, CEPREI Laboratory



    INS2

    PCB Quality Management

    Chair: Randy Bird, Plexus Corp.
    Co-Chair: Sang Liu Ph.D., Huawei Technologies Co., Ltd.
    Wednesday, September 30 | 10:30am - 12:00pm

    Build, Ship, Repeat. That's what you hope for. Regardless of your manufacturing discipline, you strive to deliver defect-free products to your customers. This session will offer process control solutions to help you do just that.

  • Multi-array PCB Traceability System
    Christoph Wimmer, Microscan
  • Man vs. Machine
    Keith Bryant, SMT Solutions and Thorsten Rother, YXLON International GmbH
  • "There is No Instant Pudding" - Understanding the Roles Test Plays in Managing the Quality of Electronic Printed Circuit Board Assemblies
    Alan Albee, Teradyne



    MFX4

    Ruggedization Technologies & Materials to Meet Today's Electronic Requirements

    Chair: Jason Keeping, P.E., Celestica Inc.
    Co-Chair: Timothy O'Neill, AIM
    Wednesday, September 30 | 10:30am - 12:00pm

    Ruggedization is not a new concept; however the materials and processes used to implement these quality improvements are a crucial part of quality developments. Without a viable total ruggedization solution; even your additional processes that are added to increase quality may still not meet the production/field yields and costs objectives of the total project. This session shares recent work done on upstream processes as well as material and application developments for ruggedization.

  • The Future of Nanotechnology in Electronics Assembly and the Investigation of Nano-coating Materials for Water Resistant Applications
    Speaker of DistinctionJennifer Nguyen, David Geiger, Anwar Mohammed and Murad Kurwa, Flextronics International
  • Evaluating the Effects of Plasma Treatment Prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage
    John D. Vanderford, MSEE and Ann E. Paxton, Desich SMART Center; David Selestak, Nordson MARCH
  • The Impact of Improper Conformal Coating Processes on BGA Solder Joint Integrity
    Speaker of DistinctionDavid Hillman, Russ Wilcoxon, Doug Pauls and Dan White, Rockwell Collins



    APT5

    Advances in Electronics Failure Analysis

    Chair: Andrew Mawer, Freescale Semiconductor
    Co-Chair: Glen Herzog, Fairfield Industries, Inc. (Retired)
    Wednesday, September 30 | 10:30am - 12:30pm

    This informative session will cover some of the latest techniques used to analyze a variety of failure modes in electronics assemblies. The first paper outlines a novel method for real-time detection of BGA solder joint opens. Next, a technique to detect cratering during board bending will be described followed by a discussion of an acoustic method to detect pad cratering resulting from PCB bending. Lastly, a review of several improved methods of cross-sectioning will be outlined.

  • Innovative BGA Defect Detection Method for Transient Discontinuity
    Speaker of DistinctionSteven Perng, Weidong Xie, Tae-Kyu Lee and Cherif Guirguis, Cisco Systems, Inc.
  • Detection of Pad Crater Initiation in Shock Using Acoustic Emission Detection
    W. Carter Ralph, Southern Research Institute; Gregory N. Morscher, The University of Akron, Elizabeth Elias Benedetto, Keith Newman and Aileen Allen, Hewlett-Packard; Julie Silk, Keysight Technologies
  • On-Board Package Decapsulation Techniques for Failure Analysis
    Priyanka Dobriyal, Ph.D., Anil Kurella, Ph.D., and Suzi Southwick, Intel Corporation
  • Alternative Preparation Methods for Cross-Sectioning of SMT and PCB Architectures
    Paco Solis, Foresite



    SUB2

    Emerging Topics on Design and Process Technologies of Printed Circuit Boards

    Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
    Co-Chair: Srini Chada, Ph.D., Schlumberger
    Wednesday, September 30 | 10:30am - 12:00pm

    Printed Circuit Board Technology continues to evolve to meet densification, miniaturization and power requirements of new products and new markets. This session will discuss novel PCB design, materials and process technology developments.

  • Development of Advanced Embedded Die Modules for Power Electronics Applications
    Speaker of DistinctionLars Boettcher, Stefan Karaszkiewicz and Andreas Ostmann, Fraunhofer Institute for Reliability and Microintegration (IZM); Dionysios Manessis, Technical University Berlin
  • Direct Metallization System for Flexible Printed Circuit Board
    Speaker of DistinctionRita Mohanty, Ph.D., Albert Angstenberger, Melanie Rischka and Han Verbunt, Enthone, Inc.
  • Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware
    Speaker of DistinctionMatt Kelly, P.Eng, MBA, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis and Mitch Ferrill, IBM Corporation



    WEDNESDAY, September 30
    2:00pm - 3:30pm


    APT6

    Solder-Joint Reliability

    Chair: Burt Carpenter, Freescale Semiconductor
    Co-Chair: Jeff Jennings, Harris Corporation
    Wednesday, September 30 | 2:00pm - 3:30pm

    Solder-joint reliability is an important aspect which can determine the useful lifetime of a component mounted to a PCB. This session will explore the effects of a variety of package types (including PBGA, CBGA, and Super-BGA), package sizes and solder alloy composition on the solder-joint lifetime in temperature cycle testing. Data from drop shock, component shear, and vibration tests will also be shown.

  • Development of Lead-Free Alloys With Ultra-High Thermal-Mechanical Reliability
    Morgana Ribas, Ph.D., Pritha Choudhury, Ph.D., Ranjit Pandher, Ph.D., Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D., and Bawa Singh, Ph.D., Alpha
  • A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day
    Speaker of DistinctionJohn McMahon, P.E., Russell Brush and Brian Standing, Celestica Inc.
  • Component Level Reliability for High Temperature Power Computing With SAC305 and Alternative High Reliability Solders
    Thomas Sanders, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael Bozack, Ph.D., Wayne Johnson, Ph.D., and Jeff Suhling, Ph.D., Auburn University



    FSA6

    Test Optimization for Improved Quantification of Material and Assembly Quality

    Chair: Martin Anselm, Ph.D., Rochester Institute of Technology
    Co-Chair: William Capen, Benchmark Electronics
    Wednesday, September 30 | 2:00pm - 3:30pm

    Defects in manufacturing are inevitable. Incoming device electrical defects, underreported halogen content and Head in Pillow failures are some of the most elusive defects to quantify. This session investigates improvements evaluating these conditions and proposes new methodologies to improve detection.

  • A Packaging Physics of Failure Based Testing Methodology for Semiconductor IC Part Reliability Assessment
    Ming Sun, Ph.D. and Jingsong Xie, RelEng Technologies, Inc.
  • Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion Chromatography
    Speaker of DistinctionRon Lasky, Ph.D., P.E., George Kraeger, and Christopher J. Pontius, Indium Corporation
  • Measurement Systems Analysis Techniques For Head in Pillows
    Jose Servin and Tabata Nöthel, Continental Automotive Guadalajara



    INS3

    Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch

    Chair: Michael Newman, Harris Corporation
    Co-Chair: Christoph Wimmer, MICROSCAN
    Wednesday, September 30 | 2:00pm - 3:30pm

    Process controls for modeling, manufacturing inspection and electronic assembly reliability can save valuable product development time and money. 3D Printing technology is quickly becoming a necessity in various manufacturing disciplines. The ability to model the process effectively can be a real time saver. With the advent of smaller and smaller electronic components 3D vision systems are becoming the norm and to accomplish this in a timely and reliable manner can add to manufacturing success. Understanding Coefficient of Thermal Expansion (CTE) between SMT components and the substrate is fundamental in understanding the reliability of electronic assemblies whether it be a cell phone or a communication module in a lunar landing module. Using a process to actually measure the differences can provide insight to this phenomena.

  • Digital Image Correlation Using High Magnification Optical Microscopy
    W. Carter Ralph, Cheri B. Moss and Kevin B. Connolly, Southern Research Institute
  • Addressing High Precision Automated Optical Inspection Challenges With Unique 3D Technology Solution
    Todd Liberty and Tim Skunes, CyberOptics Corporation
  • Thermo-Mechanical Warpage and Stress Simulation for 2.5D and 3D IC Packaging
    Akash Agrawal, Bong-Sub Lee, Guilian Gao, Laura Mirkarimi and Sitaram Arkalgud, Invensas Corporation



    MFX5

    Innovation and Process Control for Liquid Soldering Processes

    Chair: Ursula Marquez de Tino, Plexus Corp.
    Co-Chair: Amol Kane, Schlumberger
    Wednesday, September 30 | 2:00pm - 3:30pm

    This session addresses implementation of process controls on selective soldering equipment and alternative flux deposition method. All these proposals aim to obtain a repeatable and reliable process. By controlling machine parameters and flux application, it is possible to reduce the number of defects from wave and selective soldering processes.

  • Plasma Based VOC-free Fluxing for Selective and Wave Soldering
    Andreas Reinhardt, Ph.D. and Sonja Wege, Ph.D., SEHO Systems GmbH
  • Advanced Closed Loop Process Control for Selective Soldering
    Bob Klenke, ITM Consulting
  • Achieve Repeatable, Consistent Control Over the Selective Solder Production Process
    Gerjan Diepstraten, Vitronics Soltec BV



    SUB3

    Surface Finish Parameters that Impact Interconnect Reliability

    Chair: Srini Chada, Ph.D., Schlumberger
    Co-Chair: Viswam Puligandla Ph.D., Nokia (Retired)
    Wednesday, September 30 | 2:00pm - 3:30pm

    Several parameters that are part of the surface finishes on PCBs as well as the choice of surface finish itself have a profound impact on the formation and subsequently the reliability of the interconnect, whether it be on the wire bond or the solder joint. In this session we explore some of these variables from surface finish chemistry vendor perspective. This session investigates solder joint reliability based on the choice of the surface finish and solder alloy combination, the impact of copper roughness on surface finish and the effect of P content on the solder and wire bond reliability.

  • Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability
    Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu and Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.
  • Controlling Copper Roughness to Enhance Surface Finish Performance
    Speaker of DistinctionLenora Toscano and Ernest Long, Ph.D., MacDermid
  • The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of the ENEPIG Deposits
    Speaker of DistinctionDonald Gudeczauskas and George Milad, UIC Technical Center; Tsuyoshi Maeda, Shinsuke Wada, Katsuhisa Tanabe, Yukinori Oda and Shigeo Hashimoto, C. Uyemura & Corporation Co., Ltd. Central Research Laboratory



    WEDNESDAY, September 30
    4:00pm - 5:30pm


    APT7

    Ceramic Column Grid Arrays – Applications, Materials and Optimization

    Chair: Marie Cole, IBM Corporation
    Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
    Wednesday, September 30 | 4:00pm - 5:30pm

    Ceramic Column Grid Array packages are a good alternative to BGA packages for high I/O, high performance and/or high reliability applications. Learn more about the challenging applications that can benefit from CCGA interconnections and the variety of available CCGA structures. In addition, this session will share best practices for CCGA package and card assembly processes for high yield and reliability.

  • CCGA - Solder Column Attachment for Absorbing Large CTE Mismatch
    Martin Hart, Topline Corporation
  • Automation, Process Control and Test for Highly Reliable CGA Devices
    Marti McCurdy, Silicon Turnkey Solutions, Inc.
  • Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages
    Minerva M. Cruz and Russell T. Winslow, Six Sigma



    SUB4

    Influence of Finishes on Printed Circuit Board (PCB) Reliability

    Chair: Srini Chada, Ph.D., Schlumberger
    Co-Chair: Robert Farrell, Benchmark Electronics, Inc.
    Wednesday, September 30 | 4:00pm - 5:30pm

    Either as plated layers within a through-hole or as thin films on a LTCC, surface finish selection is critical for the survival of PCB. Stresses imparted during exposure to real-life operating conditions create failures within these surface finish layers to eventually lead to loss of interconnectivity in electronics. The two papers in this session deal with TH hole plating impact on PWB reliability and investigation of a thin film material used in LTCC for harsh environments, respectively.

  • Fatigue Life Estimation of Electroplated Through Hole in PWB by FEM with Thin Cu Material Properties
    Yoshiyuki Hiroshima, Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies LTD; Yoshiharu Kariya, Ph.D., Naoyuki Yajima and Kizuku Obinata, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Co.Ltd; Kazuhiko Nakamura, HDP User Group International, Inc.
  • Establishing a Ti-Cu-Pt-Au Thin Film – on – Low Temperature Co-Fired Ceramic (LTCC) Technology for High-Temperature Electronics
    Speaker of DistinctionPaul Vianco, Ph.D., J. Rejent, M. Grazier, A. Kilgo, B. McKenzie and A. Allen, Sandia National Laboratories; E. Guerrero and W. Price, Nuclear Security Complex, Honeywell Inc.



    THURSDAY, October 1


    Lead-Free Soldering Technology Symposium
    Organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matthew Kelly, P.Eng., MBA, IBM Corporation and Elizabeth Benedetto, Hewlett-Packard Company
    Thursday, October 1 | 8:00am - 4:30pm

    Free with a VIP or Technical Conference Registration!


    LF1

    Universal Instruments Consortium Pb-Free Project Update

    Chair: Paul Vianco, Ph.D., Sandia National Laboratories
    Co-Chair: Matt Kelly, P.Eng., MBA, IBM Corporation
    Thursday, October 1 | 8:30am — 10:00am

    Consortia activities continue to fill the gaps in Pb-free technology and, in particular, long term reliability. This session begins with the results of a study to examine the effects of surface finishes on the reliability of Pb-free interconnections used with wafer-level, chip-scale packages (WLCSPs). The second presentation investigates the role of conformal coatings on the survivability of quad flat pack, no lead (QFN) packages when the latter are targeted for harsh environments applications. The session is rounded out with an analysis of new Pb-free die attach materials and their performance in thermo-mechanical conditions.

  • Metallization and Surface Finish Effects on Pb-free WLCSP Thermal Cycle Reliability
    Speaker of DistinctionJim Wilcox and Michael Meilunas, Universal Instruments Corporation
  • Harsh Environment Reliability of Micro-Leadframe (QFN) Components and Conformal Coating Effects
    Speaker of DistinctionJim Wilcox and Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Rochester Institute of Technology
  • Thermo-Mechanical Evaluation of Alternative Pb-free Die Attach Materials
    Harry Schoeller, Ph.D., Universal Instruments Corporation, Sandeep Mallampati and Junghyun Cho, Ph. D., Binghamton University



    LF2

    Corrosion and Flux Residue Impacts of Lead Free Solders

    Chair: Matthew Kelly, P.Eng., MBA, IBM Corporation
    Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent
    Thursday, October 1 | 10:30am — 12:00pm

    Today, electronic systems must operate in a wide variety of field conditions. These systems are now generally built using lead-free no-clean solders per EU RoHS regulations. Understanding environmental corrosion and surface electromigration failure mechanisms is critical in ensuring reliable system performance. This session reports the latest research in better understanding corrosion and flux residue impacts relating to surface electromigration failure mechanisms.

  • Electronic Assembly Pitting / Crevice Corrosion Research
    Speaker of DistinctionMike Bixenman, DBA, Kyzen Corporation; Wallace Ables, Dell Computer; Richard Kraszewski, Plexus Corporation; Julie Silk, Keysight Technologies; Keith Howell, Nihon Superior; Jim Hartzell, Enthone; Karl Sauter, Oracle; Robert Smith, HDPUG
  • Critical Parameters of a No-Clean Process
    Terry Munson, Foresite Inc.
  • Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study
    Bruno Tolla, Ph.D., Xiang (Shawn) Wei, Yanrong Shi, Hemal Bhasvar, Jennifer Allen and Kyle Loomis, Kester



    LF3

    Research Challenges with Tin Whiskers and Mitigation

    Chair: Jeff Kennedy, Celestica Inc.
    Co-Chair: Elizabeth Benedetto, Hewlett-Packard
    Thursday, October 1 | 1:00pm — 2:30pm

    This session will explore the latest research initiatives in the areas of Tin Whiskers and mitigation. Continued examination from last year’s presentation of what promotes the Tin Whisker growth and the related risk associated with these fine metallic filaments for products in the high reliability products will be covered. Mitigation of the risk associated with these Tin Whiskers will also be discussed as well as some novel material developments using nano-particles in conformal coating. A presentation of what is required to use coating as a Tin Whisker mitigation method and how to perform the required material study to support this new performance objective for conformal coatings will conclude the session.

  • SERDP Nanoparticle Enhanced Conformal Coating Project: Modeling for Tin Whisker Mitigation
    Speaker of DistinctionStephan Meschter, Ph.D. and S. McKeown, BAE Systems; P. Snugovsky, Ph.D., J. Kennedy, Z. Bagheri, J. Keeping, P.E. and E. Kosiba, Celestica, Inc.; J. Cho, Binghamton University; David Edwards, Henkel LLC; K. Elsken, Bayer Material Science
  • Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components
    Speaker of DistinctionChris Hunt, Ph.D., Owen Thomas, Martin Wickham, and Kate Clayton, National Physical Laboratory
  • Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation
    Junghyun Cho, Ph.D. and Suraj Maganty, Binghamton University; Stephan J. Meschter, Ph.D., BAE Systems - Electronic Systems



    LF4

    Lead-Free Solder Joint Reliability: Recent Advances

    Chair: Jean-Paul Clech, Ph.D., EPSI, Inc.
    Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc.
    Thursday, October 1 | 3:00pm - 4:30pm


    Material and reliability experts will share recent findings on lead-free alloys and solder joint reliability characterization. Topics to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions.

  • Effect of Test Specimen on Fracture Behavior of Lead-free Solder Joints
    Amir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto
  • A New Method of Increasing the Reliability of Lead-free Solder
    Takatoshi Nishimura, Keith Sweatman, Akira Kita and Shuhei Sawada, Nihon Superior Co., Ltd.
  • iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life
    Speaker of DistinctionRichard Coyle, Ph.D. and Joe Smetana, Alcatel-Lucent; Richard Parker, iNEMI; Elizabeth Benedetto and Aileen Allen, Hewlett Packard; Keith Howell and Keith Sweatman, Nihon Superior Co.; Weiping Liu, Indium Corporation; Michael Osterman, CALCE; Julie Silk, Keysight Technologies; Rafael Padilla and Tomoyasu Yoshikawa, Senju Metal Industry Co.; Mitch Holtzer, Alpha







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