SMTA International

Conference: Oct. 14 - 18, 2012
Exhibition: Oct. 16 - 17, 2012

Walt Disney World Dolphin
Orlando, Florida

Symposia

The following Evolving Technologies Summit and symposia feature paper sessions and panel discussions organized by industry experts, and they are included with either a VIP or Technical Conference registration.

Please note that speakers with a Speaker of Distinction

icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done.

MONDAY

Evolving Technologies Summit
FREE with VIP or Technical Conference Registration
Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Lars Böttcher, Fraunhofer IZM, and Steve Greathouse, Plexus Corporation
Monday, October 17
8:30am – 5:00pm, 202B

The time is right to stimulate your thinking and catalyze new success - be ready for the new market rise. Innovation always leads the way so join us as we explore emerging and evolving technologies from around the world. The 2011 ET Summit has the largest array of timely topics we've ever assembled. Learn the challenges of implementing Micro Electrical Mechanical Systems (MEMs) and sensor technology, packaging and reliability that is needed for wider use. Gain insight as how advancements in exotic packaging and through silicon vias (TSVs) is being pursued. Learn all about rapidly growing printed electronics starting with luncheon speaker covering challenges and an outlook followed by three other excellent paper presentations. The ET Panel will discuss and debate timely topics that include: Challenges in discrete and embedded capacitors, solar energy and extreme density electronics. So bring your questions and ideas as we power ahead into a brighter future.

ET1 Embedded Component Technology (ECT) - Ready for Prime Time
Chair: Steve Greathouse, Plexus Corporation
Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Monday, October 17 | 8:30am - 10:30am | 202B

The use of embedded active and passive components (sometimes referred to as embedded component technology (ECT) may be one of the most significant developments in the electronics industry since the IC package was invented. The use of embedded components gives significant improvements to product performance, and can even reduce cost. Moving the component from the outer surface of the PCB or device substrate into the inner layers reduces both lead-inductance and parasitic capacitance. In digital circuits, clock rates and signal rise time improves. In analog circuits, both bandwidth and signal rise times improve. What applications are driving the demand? Which companies are using the technologies? Is the infrastructure sufficiently developed? Has embedded technology reached the point of being cost effective? Attend this session and you will get the answers to these and many other questions related to the developing implementation of this technology.

Embedded Components on the Way to Industrialization
J. Stahr, AT&S

The Effect of Physical Dimensions of an Embedded Planar Capacitor on Reliability
Michael Azarian, Mohammed A. Alam, Michael G. Pecht, University of Maryland-CALCE

Embedding Components: Design and Process Implementation Principles
Vern Solberg, STC-Madison

Modular System Packaging by Embedding: Technologies, Applications and Perspectives
Lars Boettcher Speaker of Distinction

, S. Karaszkiewicz, A. Ostmann, Fraunhofer Institute IZM; D. Manessis, Thomas Loeher, Technical University of Berlin

ET2 Printing and Jetting Technologies for Electronics Applications
Chair: Lars Boettcher, Fraunhofer Institute IZM
Co-Chair: Steve Greathouse, Plexus Corporation
Monday, October 17 | 11:00am – 12:30pm | 202B

Printing and jetting technologies has moved from R&D to manufacturing in a wide range of commercial markets over the last years. Ink jet printing allows new opportunities for system assembly and integration. Different approaches for printing and jetting can realize interconnect structures; for example RFID, OLED or MEMS applications. Ink-Jet micro dispensing can also provide a highly accurate method as in drug delivery. Solder paste jetting can help to overcome the limits of conventional screen printing processes and realize ultra-fine dots and lines for the assembly of miniature components.

Printed Electronics Using Ink Jet Technology
Donald Hayes, Ph.D., MicroFab Technologies, Inc.

Nanomaterials and Printed Electronics
Alan Rae, Ph.D. Speaker of Distinction

, TPF Enterprises LLC

Solder Paste Jetting: A Practical Solution
Rita Mohanty, Ph.D. Speaker of Distinction

, Rajiv Iyer, Speedline Technologies

ET Keynote Lunch
Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Monday, October 17 | 12:30pm – 1:30pm | 202B

Illumination-Grade LED's: Roadmap and Challenges for Manufacturing
Ron Bonné, LC, Philips Lumileds Lighting Company

ET3 Opportunities and Challenges in Solid State Lighting
Chair: Marc Chason, Marc Chason and Associates, Inc.
Co-Chair: Charles Woychik, Ph.D., Tessera, Inc.
Monday, October 17 | 1:30pm – 3:00pm | 202B

Solid State Lighting (SSL) products are entering the market place as alternatives to incandescent and fluorescent lamps. With rapidly expanding global market opportunities, supply chains are developing to address the product needs. LED based SSL assemblies require unique materials and assembly processes to produce long term reliability, while OLED based SSL luminaires require novel thin-film manufacturing methods. As a result, new manufacturing processes are evolving to drive lower cost assembly.

Low Voiding Reliable Solder Interconnects for LED Packages on Metal Core PCBs
Ravi Bhatkal, Ph.D., Ellen Tormey, Ph.D., Rahul Raut, Ranjit Pandher, Ph.D., Bawa Singh, Cookson Electronics

Packaging Technologies for OLED Displays and Lighting Products
G. Rajeswaran, Ph.D., Moser Baer Technologies, Inc.

Failure Mechanisms for High Brightness LEDs
Randy Schueller, Ph.D. Speaker of Distinction

, Greg Caswell, DfR Solutions

ET4 Evolving Technology and Current Issues Panel
FREE Beer and Pretzels! Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Co-Chair: Marc Chason, Marc Chason and Associates, Inc.
Monday, October 17 | 3:30pm – 5:00pm | 202B

ET cannot go home without answering your most challenging questions. So, come and join the team of industry experts to learn even more about where the technology is heading and the current key issues in packaging, SMT, LED, Solar and printed electronics. Experts from industry will present an overview of current and future technology, current status of solar and the SMT relationship. Bring your challenging issues/questions from work to get answers from experts who provide unique perspectives based on their experience.

Panelists:

Charles Woychik, Ph.D., Tessera, Inc.,
(Packaging Trends)

Alan Rae, Ph.D., TPF Enterprises LLC,
(Nanotechnology)

Steve Greathouse, Plexus Corporation,
(Advanced Packaging Technologies)

Irene Sterian, P.E., Celestica Inc.,
(Solar Energy and SMT)

Lars Boettcher, Fraunhofer Institute IZM,
(Embedded Die Technology/Europe)

AIMS (Harsh Environments Symposium)
Monday, October 17
8:30am – 5:00pm, 202A

Included with a VIP or Technical Conference Registration, saving you MONEY!
This symposium will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements are explored from the system level and potential supply-based solutions are presented.

HE1 Thermo-Mechanical Analysis and Prognostics of Lead-Free Solders for Harsh Environment Applications
Chair: John Evans, Ph.D., Auburn University
Co-Chair: Mike Bixenman, DBA, Kyzen Corporation
Monday, October 17 | 8:30am – 10:15am | Room 202A

This session explores the impact of harsh thermal and mechanical environments on lead-free solder alloys. In particular, the causes of specific failures are addressed, as well as, methods for prognostication for better reliability projections. The session places particular focus on grid array packages with a comparison to SnPb packages.

Comparative Reliability of SnPb and Pb Free BGA's and LGA's: Effects of Solder Joint Height and Microstructure
Michael Meilunas, Brian Roggeman, Universal Instruments Corporation

Prognostication of Remaining Life and Prior Thermo-mechanical Damage in Field-Deployed Electronics
Pradeep Lall, Ph.D., MBA Speaker of Distinction

, Mahendra Harsha, Krishan Kumar, Jeff Suhling, Kai Goebel, Auburn University

HE2 Metallization and Connector Failure Mechanisms
Chair: Pradeep Lall, Ph.D., MBA, Auburn University, NSF CAVE3 Electronics Research Center
Co-Chair: Dock Brown, Medtronic
Monday, October 17 | 10:30am – 12:00pm | 202A

In this session, various interconnect failure mechanisms will be presented with a focus on thermo-mechanical stresses, electromigration, and contact resistance degradation. Specifically, the papers present their findings on metallization and connector failure mechanisms. The first paper deals with electromigration in solder joints in automotive applications. The second paper examines Intermittent connector failures in electronic assemblies. The third paper examines the stability of aluminum thin films on flexible substrate under thermo-mechanical environments.

Electro-Migration and Material Transport in Solder Joints
Mathias Nowottnick, Andrej Novikov, University of Rostock; Andreas Fix, Robert-Bosch GmbH

Intermittent Connector Failures in Electronic Assemblies
Aravind Munukutla, Anil Kurella, Intel Corporation

Stability of Aluminum Thin Films on Flexible Substrate Under Thermal and Isothermal Conditions
Mohammad Hamasha, Tara Dhakal, Khalid Alzoubi, Awni Qasaimeh, Susan Lu, Ph.D., Charles R. Westgate, Ph.D., Binghamton University

HE Keynote Lunch
Chair: Pradeep Lall, Ph.D., MBA, Auburn University
Monday, October 17 | 12:00pm – 1:30pm | 202A

How the Defense/Aerospace Industry is Responding to the Pb-Free (Lead-Free) Challenge
Anthony Rafanelli, Ph.D., P.E., Raytheon Integrated Defense Systems

HE3 Leaded and Lead-Free Component Solder Joint Reliability Testing
Chair: Mike Nadreau, Henkel Corporation
Co-Chair: John Evans, Ph.D., Auburn University
Monday, October 17 | 1:30pm – 3:00pm | 202A

This session will discuss the data collected during the testing of solder joints under mechanical loading as well as electrical components subjected to shock and vibration. Additionally, the results from a smart phone test vehicle plan will be shared. The test plan includes 01005 discrete and fine pitch CSP components that were subjected to thermal cycling, vibration and drop testing as well as failure analysis results.

Studies on Solder Joints Reliability Under Constant Mechanical Loadings
Sven Peng, P.E., Wayne Zhang, P. K. Pu, IBM Corporation; Hill Liu, Wistron

Health Monitoring of Lead-Free Electronics Under Mechanical Shock and Vibration with Particle Filter Based Resistance Spectroscopy
Pradeep Lall, Ph.D., MBA Speaker of Distinction

, Ryan Lowe, Kai Goebel, Auburn University

Reliability Testing of Leading Edge Components for Handheld Portable Devices
Heather McCormick, P.E. Speaker of Distinction

, Jimmy Chow, Russell Brush, Craig Hamilton Speaker of Distinction

, Subramaniam Suthakaran, Mike Berry, Celestica Inc.

HE4 Reliability of SAC Solder Joints
Chair: John McMahon, Celestica Inc.
Co-Chair: Tom Borkes, The Jefferson Project
Monday, October 17 | 3:30pm – 5:00pm | 202A

While considerable progress has been made in understanding the reliability of assemblies manufactured using SAC alloys, much remains to be done. This session looks at three different aspects of SAC reliability - the performance of SAC relative to tin/lead for an unusual component, the effect of thermal aging on copper-tin intermetallics, and the reliability of joints formed from different SAC alloys in thermal cycling and drop testing.

Reliability of Mixed Alloy Ball Grid Arrays Under Thermal Fatigue and Drop Shock
Ranjit Pandher, Ph.D., Ashok Pachamuthu, Cookson Electronics

Effects of Thermal Aging on Solder-Copper Interface of SAC 305 Solder
Andrew Kelley, Teneil Ryno, Dana Medlin, Ph.D., Clay Voyles, South Dakota School of Mines and Technology

Thermal Fatigue and Lifetime Estimate of a Surface Mount Three-Port Circulator Assembled with SnPb and Pb-free Solders
Richard Coyle, Ph.D. Speaker of Distinction

, Robert Kotlowitz, Peter Read, Richard Popowich, Alcatel-Lucent; Robert Quigley, Robert O'Neill, M/A-COM Technology Solutions

TUESDAY

Contract Manufacturing Symposium

Organized by Mike Buetow, CIRCUITS ASSEMBLY Magazine and Sue Mucha, Powell-Mucha Consulting, Inc.
Tuesday, October 18 | 10:30am – 1:00pm | 204A

FREE with VIP or Technical Conference Registration!

As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you'll benefit from the Contract Manufacturing Symposium.

EMS Global Strategies for Lowering EMS Costs
Chair: Sue Mucha, Powell-Mucha Consulting, Inc.
Co-Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine
Tuesday, October 18 | 10:30am – 1:00pm | 204A

The nature of outsourcing is changing due to greater awareness of the risks from geopolitical events, local legislation, and natural disasters. This session, aimed at OEMs, and EMS program managers and executives, looks at risk mitigation strategies from Asia to Eastern Europe, and selected SMT processing solutions that could benefit those companies grappling with RoHS and other environmental or leading-edge (high BGA pin count) technical issues.

Eastern European EMS Site Location Options: Why Kimball Electronics Saw Poland as the Best Choice
Tom Ferris, Kimball Electronics Group

Technical Trends in Networking from a Manufacturing Perspective
Roger Hung, Tailyn Communication Company, Ltd.

Driving Improvements in Quality, Delivery and Cost in High Mix, Low Volume Manufacturing Operations
Kevin Camelon, Fabrinet

Vapor Phase Technology Supports EMS RoHS Challenges
Jochen Lipp, IBL Technologies, LLC

Speaker Panel - Building an EMS Cost Model

THURSDAY

Lead-Free Soldering Technology Symposium
Organized by Organized by Paul Vianco, Ph.D., Sandia National Laboratories and Matthew Kelly, P. Eng., MBA, IBM Corporation
Thursday, October 20 | 8:00am – 5:00pm | 204A/B

Free With VIP or Technical Conference Registration

The present research and development thrust in Pb-free soldering technology is towards understanding the reliability of interconnections, particularly those that will potentially be used in avionics, military, and space electronics. In response to this need, the second phase of the NASA-DoD Pb-Free Consortium project is providing unprecedented data on the long-term performance of Pb-free interconnections. The scope of these experiments addresses alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. These efforts will be reported upon during the 2011 Lead-Free Soldering Technology Symposium, beginning with an overview of the current project. That overview is followed by presentations that will report the results of the consortium drop test and mechanical shock experiments. The second session of the symposium will complete the NASA-DOD project reports with presentations describing the invaluable data that were obtained from vibration testing, thermal cycling, and combined thermal cycling/vibration environments. The third session of the symposium will step away from reliability and address three pressing issues in Pb-free process development. Those topics are processing high complexity/high component mix assemblies; mitigating pad catering defects; and optimizing wave soldering processes. The 2011 symposium will conclude by returning to the topic of reliability in the fourth and final session. An investigation will be described that studied the effects of cooling rate and solder silver content on the long-term reliability of area-array solder joints. A very interesting presentation will address the solder microstructural changes caused by electromigration and the consequences to the low-cycle fatigue of the solder joint.

LF1 NASA-DoD Lead-Free Electronics Project: Project Overview and Update
Chair: Paul Vianco, Ph.D., Sandia National Laboratories
Co-Chair: Matt Kelly, P. Eng., MBA, IBM Corporation
Thursday, October 20 | 8:00am – 10:00am | 204A/B

The NASA-DoD Lead-Free Electronics Project brings together experts from electronics communities in an intensive test program that is examining the reliability of Pb-free solder interconnections. The study incorporates many of the current technical drivers in a Pb-free conversion, including the solder alloy selection, surface finish, and the impact or repair and rework on the integrity of electronic packaging and interconnections. A brief overview will be presented, which describes the tasks and deliverable of the NASA-DoD project for the attendee. Also, the technical results will be presented from two important assessments: (a) effect of rework on vibration reliability and (b) -20°C/80°C thermal cycling tests. These individual test programs are critical to the implementation of Pb-free technology in high-reliability commercial and military electronics

NASA-DoD Lead-Free Electronics Rework Project: Effect of 1X and 2X Eutectic Solder Rework on Vibration Reliability
J. P. Tucker, C. A. Handwerker, Ph.D., Purdue University; W. Russell, Raytheon; D. D. Fritz, SAIC; A. Ganster, Crane Division-NSWC; P. Snugovsky, Ph.D., J. Bragg, Z. Bagheri, M. Romansky, Celestica Inc.

NASA/DoD Lead-Free Electronics Project: -20°C to +80°C Thermal Cycle Test
Thomas Woodrow, Ph.D. Speaker of Distinction

, Boeing

NASA-DoD Lead-Free Electronics Project - Joint Test Report
Kurt Kessel, NASA TEERM (ITB, Inc.); David Hillman Speaker of Distinction

, Rockwell Collins

NASA-DoD Lead-Free Electronics Project - Joint Test Report - continued

LF2 Investigating the Edges of Lead-Free Assembly Processes
Chair: David Hillman, Rockwell Collins
Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
Thursday, October 20 | 10:30am – 12:00pm | 204A/B

The electronics industry has been successfully characterizing and qualifying the various aspects of lead-free solder processes for several years. Baseline material sets and process parameters have been established for a number industry product segments. However, there are numerous portions of the lead-free soldering processes that are now just getting industry attention. This session will provide an attendee insight into lead-free plated thru hole rework, lead-free vapor phase assembly and lead-free product qualification.

Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server
P. K. Pu, IBM China Procurement Limited; Theron Lewis, Marie Cole Speaker of Distinction

, Mark Hoffmeyer, John Shaughnessey, Tom Finck, Mark Stevens, Kari Fischer, Joe Doman, IBM Corporation

Lead-Free Vapor Phase Assembly Compatible Materials for a High Performance SMT Backplane Connector
Matthew Kelly, P.Eng., MBA Speaker of Distinction

, Ying Yu, John Healey, Emanuele Lopergolo, Jing Zhang, Jay Diepenbrock, Theron Lewis, Vijay Khanna, Ruediger Kellmann, Jim Bielick, IBM Corporation

Lead-Free Wave Solder Rework Process Development
Sunil Gopakumar, Ph.D., Francois Billaut, Eric Fremd, Brocade Communications; K. Y. Tsai, Chu Lin, Foxconn; Jasbir Bath Speaker of Distinction

, Brocade, FoxConn, and Bath Technical Consultancy

Lead-Free Keynote Lunch
Chair: Matt Kelly, P. Eng., MBA, IBM Corporation

Thursday, October 20 | 12:00pm – 1:30pm | 204A/B

Programmatic Challenges of Pb-Free Technology for the High-Reliability Electronics Industry
Paul Vianco, Ph.D. Speaker of Distinction

, Sandia National Laboratories

LF3 Mechanical Reliability Performance of Lead-Free Solder Alloys
Chair: Matt Kelly, P. Eng., MBA, IBM Corporation
Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Thursday, October 20 | 1:30pm – 3:00pm | 204A/B

Although much of the industry continues to focus on thermal fatigue wear-out performance of new lead-free solder joints, for many applications it is equally important to understand resultant mechanical reliability performance of interconnect structures. This session focuses on mechanical reliability issues and performance comparisons during PCB pad cratering assessment and high strain rate mechanical shock test protocols.

Material Testing and Mitigation Techniques for Pad Crater Defects
Brian Gray, P.E., John McMahon, Celestica Inc.

Reliability Impact of Partial Pad Craters
Brian Roggeman, David Rae, AREA Consortium, Universal Instruments Corporation

Stress-Strain Behavior of SnAgCu Lead-Free Alloys at High Strain Rates Typical of Mechanical Shock
Pradeep Lall, Ph.D., MBA Speaker of Distinction

, Sandeep Shantaram, Mandar Kulkarni, Geeta Limaye, Jeff Suhling, Auburn University

LF4 Lead-Free Solder Joint Reliability: Impact of Alloy Composition, Design and Load Parameters
Chair: Jean-Paul Clech, Ph.D., EPSI, Inc.
Co-Chair: Kola Akinade, Ph.D., Cisco Systems
Thursday, October 20 | 3:30pm – 5:00pm | 204A/B

This session highlights recent progress in the understanding of lead-free solder joint reliability under thermal cycling conditions. A wide range of accelerated test data is presented that is of use to assess the effect of both pre-conditioning (aging) and thermal cycling profiles on SnAgCu (SAC) assembly reliability. Pros and cons of various lead-free acceleration factors - which are badly needed to extrapolate test failure data to field conditions - are discussed, including recent improvements developing more reliable acceleration factor models.

Assessment of Sn-3.0Ag-0.5Cu Solder Joints Submitted to Different Thermal Cycling
Olivier Maire, Ph.D., EADS Innovation Works: S. Bousquet, Airbus; M. Tran, Airbus EDYY; C. Gil, MBDA; N. Wazad, Eurocoptor; M. Jeremias, Astrium Satellites; T. Backes, Cassidian; M. Jeremias, Sodeern

Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning
Joseph Smetana, Richard Coyle, Ph.D. Speaker of Distinction

, Peter Read, Richard Popowich, Alcatel-Lucent; Thilo Sack, Celestica Inc.

Simple Acceleration Factor Model for Thermal Fatigue of SAC Solder
Ahmer Syed, Amkor Technology

View the scrapbook of SMTAI 2011!

What you are saying:

I enjoyed the hospitality extended to the speakers. I feel SMTA has some of the very best technical papers in the industry.

Home | Top

Copyright © 1999-2012 SMTA, All rights reserved.
Reproduction in whole or in part without permission is prohibited.
SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819