October 24 - 28, 2010   Walt Disney World Swan and Dolphin Resort   Orlando, FL     Conference    Tutorials        Instructors    Tech Sessions    Symposiums    Sponsors At-A-Glance    Sunday    Monday    Tuesday    Wednesday    Thursday Special Events Golf Free Sessions Poster Session Job Center Accommodations Register Now Be A Sponsor! Marketing Ask Your Boss Next Year SMTAI remains the best-in-class technical conference in the industry, encouraging engineers to engage in noncommercial, technically-driven conversations about current manufacturing and supply chain issues. -Mike Buetow, CIRCUITS ASSEMBLY Magazine Follow the event on Facebook! Official Twitter hashtag #smtai2010 Add to My Outlook Calendar The following Evolving Technologies Summit and symposia feature paper sessions and panel discussions organized by industry experts, and they are included with either a VIP or Technical Conference registration. Please note that speakers with a icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done. MONDAY Evolving Technologies Summit FREE with VIP or Technical Conference Registration Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Lars Böttcher, Fraunhofer IZM, and Steve Greathouse, Plexus Corporation Monday, October 25 8:00am – 5:00pm, Asia 1 The time is right to stimulate your thinking and catalyze new success - be ready for the new market rise. Innovation always leads the way so join us as we explore emerging and evolving technologies from around the world. The 2010 ET Summit has the largest array of timely topics we've ever assembled. Learn the challenges of implementing Micro Electrical Mechanical Systems (MEMs) and sensor technology, packaging and reliability that is needed for wider use. Gain insight as how advancements in exotic packaging and through silicon vias (TSVs) is being pursued. Learn all about rapidly growing printed electronics starting with luncheon speaker covering challenges and an outlook followed by three other excellent paper presentations. The ET Panel will discuss and debate timely topics that include: Challenges in discrete and embedded capacitors, solar energy and extreme density electronics. So bring your questions and ideas as we power ahead into a brighter future. ET1 MEMS and Image Sensor Assembly Processing and Reliability Chair: Steve Greathouse, Plexus Corporation Co-Chair: Lars Böttcher, Fraunhofer IZM Monday, October 25 8:00am–9:30am, Asia 1 Micro Electrical Mechanical Systems (MEMS) are finding their way into almost all phases of life. As the population grows and matures, society is demanding better and much more cost effective diagnostic products to improve long-term health and well being. For many MEMS technologies to function, the package needs to have access and interact with the environment. This can present numerous challenges in the design and manufacturing process. You will be missing a great MEMS session if you don’t attend! Encapsulation of MEMS/Sensors on Package Level and Wafer Level Ton van Weelden, Boschman Technologies B.V. Reliability Testing of Linear Image Sensor Devices Awni Qasaimeh, Mridula Gosavi, Frank Andros, and Susan Lu, Binghamton University Development and Characterization of a Novel BioMEMS Sensor for Point-of-Care Prognostics Arvind Sai Sarathi Vasan, Yunhan Huang, Ravi Doraiswami, Ph.D., Michael Osterman, Ph.D., and Michael Pecht, Ph.D., Center for Advanced Life Cycle Engineering (CALCE), University of Maryland ET2 Advanced Packages and Processes Chair: Andrew Perkins, Ph.D., Aptina Imaging Co-Chair: Brian Roggeman, Universal Instruments Monday, October 25 10:00am – 12:00pm, Asia 1 Advancements in packaging processes are needed for products with exotic semiconductor materials, nanocomposite materials, through silicon vias, and multiple components. This session presents wafer edge protection during TSV formation as well as package considerations for CZT detectors, RF MMIC devices, and microfabricated neural electrode arrays made from a variable-modulus nanocomposite material. Insight will be gained as to how conventional packaging processes like die handling and wirebonding can be modified for new packaging requirements. A Cost Effective Process for Edge Protection of Wafers and Fabrication of Through Silicon Vias Using Wet Etching of Silicon Ramachandran Trichur, Gary J. Brand, Curtis Planje, and Xie Shao, Brewer Science, Inc. Challenges of Packaging Cd-Zn-Te (CZT) Detectors Charles G. Woychik, Ph.D., Brian D. Yanoff, Jay Cao, Ian M. Spinelli, and Vincent S. Smetkowski, GE Global Research; James Adriance, Lawrence Harvilchuck, Brian Roggeman, and George Westby, Universal Instruments Corporation Overcoming Assembly Challenges with RF MMIC Products Steve Greathouse, Richard Garcia, Jennifer Davidson, and Gary Catlin, Plexus Corporation Development of a Packaging System for Clinical Evaluation of a Nanocomposite-Based Neural Electrode Array Fabricated From a Chemoresponsive Polymer Substrate Andrew Barnes and Allison Hess, Case Western Reserve University Evolving Technologies Keynote Lunch Reading the Fine Print: Challenges and Outlook for Printed Electronics Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Monday, October 25 12:00pm – 1:30pm, Asia 1 ET3 Printed Electronics: Solar, Lighting, Batteries, Etc. Chair: Alexander Zeitler, Soligie, Inc. Co-Chair: Jeff Kennedy, Celestica Inc. Monday, October 25 1:30pm – 3:00pm, Asia 1 Printed electronics is a new and emerging technology which uses conductive, semi-conductive, and dielectric inks printed with a multitude of methods on paper and plastic film substrates to produce mass production of products. This session will discuss the market of printed electronics trends and barriers, OLED construction and production methods, and all processes and materials that make-up the industry. After this session, you will leave with a good understanding of what it is about and a high level understanding of what it takes to build these products. Organic and Printed Electronics-A View From the Traditional Electronic Component Marketplace David Baron and Frank Bruening, Atotech Deutschland GmbH Printed Electronics for Flexible Solid State Lighting Marc Chason, Marc Chason and Associates, Inc. Materials and Process Methods for Printed Electronics Dan Fenner and Brian Toleno, Ph.D., Henkel Corporation ET4 Evolving Technology and Current Issues Panel - FREE Beer and Pretzels! Chair: Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory Co-Chair: Jeff Kennedy, Celestica Inc. Monday, October 25 3:30pm – 5:00pm, Asia 1 Come and join the team of industry experts to learn where the technology is heading and the current key issues in packaging, surface mount materials and manufacturing. Experts from industry will first present an overview of current and future technology, current status of solar and the SMT relationship, as well as a special presentation on challenges of embedded capacitors. Bring your challenging issues/questions from work to get answers from experts who provide unique perspectives based on their experience. New Challenges and Developments in Discrete and Embedded Capacitors Alan Rae, Ph.D., TPF Enterprises LLC Panelists will include: Lars Böttcher, Fraunhofer IZM, (Advanced Packaging in Europe) Ken Gilleo, Ph.D., ET-Trends LLC, (The Next Generation) Steve Greathouse, Plexus Corporation, (New/Evolving Technologies) Alan Rae, Ph.D., TPF Enterprises LLC, (Nano Materials and Embedded Technology) Irene Sterian, Celestica Inc., (Solar Energy and SMT) Charles Woychik, Ph.D., Tessera (Advanced Packaging) AIMS (Harsh Environments Symposium) Monday, October 25 8:00am – 5:00pm, Oceanic 7 NEW THIS YEAR: Included with a VIP or Technical Conference Registration, saving you MONEY! This symposium will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of “end-users” with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements are explored from the system level and potential supply-based solutions are presented. HE1 Pb-Free Technology Insertion Chair: John Evans, Ph.D., Auburn University Co-Chair: Heather McCormick, Celestica Inc. Monday, October 25 8:00am – 9:30am, Oceanic 7 The Pb-free (Lead-free) in Electronics Risk Mitigation (PERM) Consortium Anthony Rafanelli, Ph.D., P.E., Raytheon Integrated Defense Systems Overview of the New DoD Reliability Revitalization Initiatives James McLeish, CRE, DfR Solutions; Grant R. Schmieder, CRE, Defense Research and Engineering Transition to Lead Free Production for Avionics, Steps Forward Along a Lead Free Control Plan and Further Requirements Michael Jeremias, EADS Deutschland GmbH HE2 Component Packaging Challenges in Harsh Environments Chair: Salvatore Rampaul-Pino, Vision Research Co-Chair: Larry Wang, Lord Corporation Monday, October 25 10:00am – 12:00pm, Oceanic 7 High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Circuits Steve Riches, GE Aviation Systems The Resistance of Common PCB Surface Finishes Against Corrosion in Harsh Environments Mustafa Özkök, Sven Lamprecht, and Mario Gensicke, Atotech Deutschland GmbH, Hugh Roberts and Joe McGurran, Atotech USA How Do Whiskers and Hillocks Grow in Pb-free Sn Coatings? Eric Chason, Nitin Jadhav, Eric Buchovecky, Allan Bower, and Sharvan Kumar, Brown University Harsh Environment Impact on Resistor Reliability Marie Cole, George Hutt, Tibor Kiraly, Steve Nickel, Lenas Hedlund, Tim Tofil, Prabjit Singh, and Levente Klein, IBM Corporation Harsh Environments Keynote Lunch The Tech in Green Tech Irene Sterian, Celestica Inc. Chair: John Evans, Ph.D., Auburn University Co-Chair: Heather McCormick, Celestica Inc. Monday, October 25 12:00pm – 1:30pm, Oceanic 7 HE3 Organic Materials Adapted for Harsh Environments Chair: Larry Wang, Lord Corporation Co-Chair: Salvatore Rampaul-Pino, Vision Research Monday, October 25 1:30pm – 3:00pm, Oceanic 7 Harsh Environments and Volatiles in Sealed Enclosures Robert Lowry, Richard Kullberg, and Dan Rossiter, Electronics Materials Consulting Functional Fillers in Silicone Elastomer Systems Michelle Velderrain and V. Malave, NuSil Technology An Evaluation of Sealants Used in Photovoltaic (PV) Module Jasbir Bath, Mike Moreau, and Martin Gershenson, Christopher Associates Inc.; Cathy He, Yinbai Li, and Miaosheng Zheng, Beijing Tonsan Adhesive Co. Ltd. HE4 Interconnection Reliability Chair: Heather McCormick, Celestica Inc. Co-Chair: John Evans, Ph.D., Auburn University Monday, October 25 3:00pm – 5:00pm, Oceanic 7 Ball Grid Array Component Failure Analysis for High Reliability Electronic Systems J. Scott Nelson, Harris Corporation Solder Joint Reliability Issues With LED Assemblies Alissa Wild and Justin Kolbe, The Bergquist Company High Temperature Reliability Bond Pads Terence Collier, CV, Inc. Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling Pradeep Lall, Ph.D., Rahul Vaisya, and Vikrant More, Auburn University; Kai Goebel, NASA Ames Research Center TUESDAY Contract Manufacturing Symposium Organized by Mike Buetow, CIRCUITS ASSEMBLY Magazine and Sue Mucha, Powell-Mucha Consulting, Inc. Tuesday, October 26 2:00pm – 5:30pm, Europe 1 FREE with VIP or Technical Conference Registration! As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you’ll benefit from the Contract Manufacturing Symposium. EMS1 Outsourcing Strategies: Niche Requirements and EMS Best Practices Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine Co-Chair: Sue Mucha, Powell-Mucha Consulting, Inc. Tuesday, October 26, 2:00pm – 3:30pm, Europe 1 Determining whether to outsource is sometimes the simplest part of the decision tree. Deciding where and with whom to outsource is often what determines success or failure. Two of this session's presentations will help shape the OEM buyer's or engineer's approach to choosing the best fit for their product and service requirements. Meanwhile, the final paper looks at the equation from the OEM's perspective, outlining just what makes a best-in-class EMS company for a high-growth market. ODM or EMS: Which Choice is Best for Your Project? Jim Chen, Tailyn Communication Company Ltd. How Efficient Is Your High Mix EMS Supplier? Roy Starks, Libra Industries, and Dave Cesar, The Parkland Group Outsourcing LED PCB Manufacture Scott Maudlin, LEDnovation EMS2 EMS Segment Focus: Aerospace/Defense Chair: Sue Mucha, Powell-Mucha Consulting, Inc. Co-Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine Tuesday, October 26, 4:00pm – 5:30pm, Europe 1 This year's Contract Manufacturing Symposium inaugurates a new type of session focused on a specific market segment. The defense and aerospace segment provides both opportunity and challenges. Presentations look at the differences between this segment and consumer EMS program management models, maintaining ITAR compliance, and improving factory material handling efficiency while maintaining required controls and traceability. Maintaining a Balance Between Consumer and Military Program Management Alan Day, IEC/Crane ITAR Compliance – Challenges and Benefits in an Outsourced Relationship Joe O'Neill, Hunter Technology Corporation Practical Issues and Solutions for Handling Plastic Encapsulated Microcircuits (PEMs) Rick Iodice, Raytheon Integrated Defense Systems THURSDAY Lead-Free Soldering Technology Symposium Organized by Organized by Paul Vianco, Ph.D., Sandia National Laboratories and Matthew Kelly, P. Eng., MBA, IBM Corporation Thursday, October 28 8:00am – 5:00pm, Asia 1 Free With VIP or Technical Conference Registration The present research and development thrust in Pb-free soldering technology is towards understanding the reliability of interconnections, particularly those that will potentially be used in avionics, military, and space electronics. In response to this need, the second phase of the NASA-DoD Pb-Free Consortium project is providing unprecedented data on the long-term performance of Pb-free interconnections. The scope of these experiments addresses alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. These efforts will be reported upon during the 2010 Lead-Free Soldering Technology Symposium, beginning with an overview of the current project. That overview is followed by presentations that will report the results of the consortium drop test and mechanical shock experiments. The second session of the symposium will complete the NASA-DOD project reports with presentations describing the invaluable data that were obtained from vibration testing, thermal cycling, and combined thermal cycling/vibration environments. The third session of the symposium will step away from reliability and address three pressing issues in Pb-free process development. Those topics are processing high complexity/high component mix assemblies; mitigating pad catering defects; and optimizing wave soldering processes. The 2010 symposium will conclude by returning to the topic of reliability in the fourth and final session. An investigation will be described that studied the effects of cooling rate and solder silver content on the long-term reliability of area-array solder joints. A very interesting presentation will address the solder microstructural changes caused by electromigration and the consequences to the low-cycle fatigue of the solder joint. LF1 NASA-DoD Lead-Free Electronics Project: Overview as Well as Drop Test and Mechanical Shock Test Data Chair: Paul Vianco, Ph.D., Sandia National Laboratories Co-Chair: Thomas Woodrow, Ph.D., Boeing Company Thursday, October 28, 8:00am – 9:30am, Asia 1 The NASA-DoD Lead Free Electronics Project brings together experts from electronics communities in an intensive test program that is examining the reliability of Pb-free solder interconnections. The study incorporates many of the current technical drivers in a Pb-free conversion, including the solder alloy selection, surface finish, and the impact or repair and rework on the integrity of electronic packaging and interconnections. A brief overview will be presented, which describes the tasks and deliverable of the NASA-DoD project for the attendee. Then, the technical results will be presented from two important assessments: (a) drop test performance and (b) mechanical shock environments. These individual test programs are critical to the implementation of Pb-free technology in both commercial and military electronics. NASA-DoD Lead-Free Electronics Project - Update Kurt Kessel, ITB, Inc. (NASA) Drop Test Assessment of a Medium Complexity Assembly for High Reliability Applications P. Snugovsky, Ph.D., J. Bragg, Z. Bagheri, and M. Romansky, Celestica International Inc.; A. Ganster, Crane Division NSWC; W. Russell, Raytheon; J. P. Tucker and C. A. Handwerker, Ph.D., Purdue University; D. D. Fritz, SAIC NASA/DoD Lead-Free Electronics Project: Mechanical Shock Testing Thomas Woodrow, Ph.D., Boeing Company LF2 NASA DoD Lead-Free Report and Update (Part 2) Chair: Matt Kelly, P. Eng., MBA, IBM Corporation Co-Chair: Paul Vianco, Ph.D., Sandia National Laboratories Thursday, October 28, 10:00am – 11:30am, Asia 1 As commercial electronic hardware supply chains continue to migrate towards supporting lead-free printed circuit board assembly, this shift continues to apply supply chain pressure and technical risk to mission critical, high complexity, high reliability systems currently exercising various exemptions. Reliability assessment of hardware systems operating in ruggedized, harsh environment, avionic, and space applications is of critical importance. Part 2 of the NASA DoD lead-free update will report on resulting thermomechanical reliability performance studies of these high reliability systems. This is an excellent opportunity to learn more about NASA's lead-free assembly / test experience and application requirements. NASA-DoD Combined Environments Testing Results Cynthia Garcia and Jeff Bradford, Raytheon Company NASA/DoD Lead-Free Electronics Project: Vibration Testing Thomas Woodrow, Ph.D., Boeing Company NASA DoD -55°C to +125°C Thermal Cycle Test Results David Hillman, Rockwell Collins LF3 The Impact of Lead-Free Materials and Soldering Processes on Printed Wiring Assemblies Chair: Dave Hillman, Rockwell Collins Co-Chair: Gus Rinella, Research In Motion Thursday, October 28, 1:00pm – 2:30pm, Asia 1 The impact of the European Union's RoHS legislation on the electronics industry's material and process selection processes for printed wiring assembly manufacture has been profound. Maintaining a balance of characterized laminate materials, understood printed wiring board/component surface finishes and capable equipment technologies for the production of large, high complex electronic products is a significant task. The three papers in this session demonstrate the due diligence and document the challenges of manufacturing electronic products in a lead-free solder process environment. Lead-Free HASL: Balancing Benefits and Risks for High Complexity High Reliability Server and Storage Hardware Matthew Kelly, Jeffrey Taylor, Brett Krull, Marie Cole, and Tom Truman, IBM Corporation Mechanical Failures in Pb-Free Processing: Selected Mitigation Techniques for Pad Crater Defects Brian Gray and John McMahon, Celestica Inc. High Complexity Lead-Free Wave and Rework: The Effects of Material, Process and Board Design on Barrel Fill Craig Hamilton, John McMahon, Jose Traya, Wang Yong Kang, and Khoo Kok Wei, Celestica Inc.; Matthew Kelly and Marie Cole, IBM Corporation LF4 Lead-Free Solder Joint Reliability: Impact of Alloy Composition, Design and Load Parameters Chair: Jean-Paul Clech, Ph.D., EPSI, Inc. Co-Chair: Kola Akinade, Ph.D., Cisco Systems Thursday, October 28, 3:00pm – 4:30pm, Asia 1 Lead-free solder joint reliability is affected by solder alloy composition, process, design parameters and loading conditions. Addressing these requirements is key to the successful implementation of lead-free technology in mainstream as well as high-end product board assemblies. Speakers in this session will share their experiences and fundamental understanding of what helps make lead-free assemblies reliable. Solder Joint Reliability of Pb-free Tin-Silver-Copper Ceramic Ball Grid Array (CBGA) Packages as a Function of Cooling Rate and Silver Content Richard Coyle, Ph.D., Peter Read, Debra Fleming, and Richard Popowich, Alcatel-Lucent; Robert Kinyanjui,Ph.D., Mulugeta Abtew, Jonathon Shirey, and Iulia Muntele, Sanmina-SCI Corporation New Developments in High-Temperature, High-Performance Lead-Free Solder Alloys Anton-Zoran Miric, W.C. Heraeus GmbH Combinatorial Effects of Electromigration and Low Cycle Fatigue Christopher Hunt, Ph.D., Davide Di Maio, Charles Murdock, and Owen Thomas, NPL Home | Top Copyright © 1999-2010 SMTA, All rights reserved. Reproduction in whole or in part without permission is prohibited. SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819