August 17 - 21, 2008
Disney's Coronado Springs Resort
Orlando, Florida
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The following Evolving
Technologies Summit and symposiums feature paper sessions and panel discussions
organized by industry experts, and they are included with either a VIP or
Technical Conference registration.
MONDAY
Evolving Technologies Summit
FREE with VIP or Technical Conference Registration
Monday, August 18th
8:00am – 5:00pm
Better hold on…as ET shatters old boundaries and enters amazing new dimensions to boldly launch into exciting technology futures. First, we'll hear from international researchers who cover everything from jet-printed electronics to nano-materials. They'll throw in some opto-multichip modules for your enlightenment. Next, veterans from the industry will predict paradigm shifts – it’s "shift or stall"…so get in gear and don’t be left flat. But are you really ready to let go…to part with the past? Then we’ll tell you how to get the solder out…not just the lead. This is true solderless assembly, and we’re not talking about conductive adhesives. After all, solder might be 7,000 years old and ready to retire. We'll also cover some valuable "ready now" topics, like embedded chips and passives. And to bring us back down to planet earth, a diversified panel will make observations and have a go at answering your questions.
ET1
University Research: New Processing for Electronic Packaging
Chair: Lars Boettcher, Fraunhofer IZM
Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Monday, August 18
8:00am – 9:30am
Increasing demands in electronic packaging call for the further development of existing packaging methods and encourage the use of new manufacturing processes. Ink jet printing allows new opportunities for system assembly and integration. This technology can realize structure sizes down to 20 µm line, which is in many cases sufficient for IC contacts and PCB. The use of nano particle inks for such printing processes requires a suitable sintering process. An optimized sintering process is essential for the final properties of ink jet printed circuits. For optoelectronic packaging based on a multi-chip module (MCM), the thermal management becomes crucial. The comprehension of the thermal behavior of the system, by analyzing it with extensive simulations, helps to optimize the package design. The goal is to enable the implementation of an integrated adaptive temperature control for system.
Applicability of Inkjet Technology for Electronics Manufacturing
Kimmo Kaija, Matti Mäntysalo, and Pauliina Mansikkamäki, Tampere University of Technology
Thermal-Analysis of a Silicon-Platform-Based Optoelectronic Multi-Chip Module
Jun Tian and M. Bartek, Delft University of Technology
Sintering of Ag Nano Particle Inks for Printed Electronics
Jussi Pekkanen, Matti Mäntysalo, and Pauliina Mansikkamäki, Tampere University of Technology
ET2
Time for Paradigm Shifts
Chair: Ken Gilleo, Ph.D., ET-Trends LLC
Co-Chair: Steve Greathouse, Plexus Corporation
Monday, August 18
10:00am – 11:30am
All technologies run out of "steam". Knowing when to jump to a future tech is the key to paradigm shift success. We'll cover areas that are ready to shift or stall. We'll start with ESD - an under valuated, but $90-billion problem. A bolder tactic is needed - and it’s ready. Next, it's on to camera modules for mobiles that must keep shrinking in size and cost to thrive - but now is the time to make the jump to WLP. Then, it's on to a new semiconductor transfer printing technique - a massively parallel process for efficiently moving ICs to substrates, especially flexible - and it's ready. Don't hesitate to join us now - it's shift or stall.
Electrostatic Discharge (ESD) and the Technology Roadmap To 2020 and Packaging Performance for Today and the Future
Hartmut Berndt, B.E.STAT European ESD
The Future of Cameras for Mobile Electronics
Yehudit Dagan, Tessera, Inc.
Transfer Printing: An Emerging Technology for Massively Parallel Assembly of Microcircuits
Christopher Bower, Etienne Menard, and Phillip Garrou, Semprius, Inc.
Evolving Technologies Keynote Lunch
Solderless Assembly of Electronics – Technical Pipe Dream or Wave of the Future?
Joseph Fjelstad, Verdant Electronics
Monday, August 18
11:30am – 1:00pm
Light lunch served
NOTE: You must pre-register for this symposium to receive lunch.
Solder has been used for the assembly of electronic components to printed circuit boards since the earliest days of the industry; however, it has not been without its problems. Most manufacturing defects are related to soldering and most reliability problems stem from weaknesses in the basic process. Moreover, with the implementation of RoHS and lead-free solder, those problems have been magnified. What if electronic assembly could be accomplished without solder? This is the primary objective of a growing family of related solderless assembly methods that have come be know as Occam Process technologies, in honor of the 14th century philosopher who stressed simplicity. These process approaches are fundamentally reverse order electronics assembly concepts that step away from conventional methods. The technologies now being investigated in locals around the globe obviate the widespread need for and dependence on solder with all of its intrinsic and inherent problems, both legislative and technical. This talk will describe the process, some of its prospective variations, and its prospective benefits that could pave the way for less costly, more environmentally responsible, higher performing, and more reliable electronics assemblies.
ET3
Embedded Technologies: Their Applications and Reliability
Chair: Steve Greathouse, Plexus Corporation
Co-Chair: Ken Gilleo, Ph.D., ET-Trends LLC
Monday, August 18
1:00pm – 3:00pm
Embedded technologies have been driven by the need to save board area and/or reduce board size, increase functionality, lower costs and improve electrical performance. Innovative packaging techniques are required in order to meet the increasing size, weight, power, and reliability requirements of this industry without sacrificing electrical, mechanical, or thermal performance. Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of chip capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems are being designed to utilize this technology. Learn how this technology is being done, the details behind the problems encountered, and how they are being addressed.
Embedded Chip Packages – Technology and Applications
L. Boettcher and A. Ostmann, Fraunhofer IZM; D. Manessis and H. Reichl, Technical University of Berlin
Advanced Packaging Technologies: Imbedding Components for Increased Reliability
Casey Cooper, STI Electronics, Inc.
Use of Buried Capacitance Layers: Performance and Lessons from A Real World Example
John Andresakis, Oak-Mitsui
Reliability Testing of Advanced Semiconductors Using Embedded Chip Build-Up (ECBU) Packaging Technology
Charles G. Woychik, Ph.D., Raymond A. Fillion, Tan Zhang, Richard J. Saia, Paul A. McConnelee, and Shane Lewis, GE Global Research; Kishor V. Desai and Patrick Variot, LSI Logic Corporation
ET4
Evolving Technology and Current Issues Panel
Moderator: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Co-Chair: Lars Boettcher, Fraunhofer IZM
FREE Beer and Pretzels
Monday, August 18
3:30pm – 5:00pm
Come and join the team of industry experts to learn where the technology is heading and the current key issues in packaging, surface mount materials and manufacturing. Experts from industry will first present an overview of current and future technology, current status of lead-free implementation, and experience building new lead-free and packaging. Then, these experts join selected speakers from various ET sessions to answer your questions. Bring your challenging issues/questions from work to get answers from experts who provide unique perspectives based on their experience.
Panelists will include:
Ken Gilleo, Ph.D., ET-Trends LLC (Technology Trends)
Ron Lasky, Ph.D., Indium Corporation, (Lead-Free Materials)
Irene Sterian, Celestica Inc. (EMS Perspective)
Charles Woychik, Ph.D., GE (Embedded Technology)
Joseph Fjelstad, Verdant Electronics
Steve Greathouse, Plexus Corporation
Alternative Energy Symposium NEW EVENT!
Monday, August 18
8:00am – 12:30PM
NEW this year! The current world demand for electrical power is in excess of 4 Terrawatts per year. Existing sources, such as oil, are rising in price due to scarcity, and other sources, such as coal and nuclear, are not as environmentally acceptable. This current energy shortage has forced the world to look at alternate energy sources such as wind, wave, fuel cells, and solar cells. This SMTAI special event will focus on two sources that are gaining popularity: fuel cells and solar cells. The papers in this session will explain the technologies and the manufacturing process, as well as put these assembly methods in the context of more traditional high volume electronic assembly methods. It is possible to go from the lab to automated production given today's technology and equipment.
FCS1
Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing
Chair: Irene Sterian, Celestica Inc.
Co-Chair: Rod Howell, Libra Industries
Monday, August 18
8:00am – 9:30am
Mass Imaging for Alternative Energies
Clive Ashmore, DEK Printing Machines
Solar Material Science at Indium Corporation
David Preische and Fehzan Sayed, Indium Corporation
Screens for Solar Cell Printing
William E. Coleman, Photo Stencil
FCS2
Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing - Continued
Chair: Irene Sterian, Celestica Inc.
Co-Chair: Emmanuel Siméus, Raytheon Missile Systems
Monday, August 18
10:00am – 11:30am
Design of an Automated Fuel Cell Manufacturing Line
Alexander Proracki and Michael W. Fowler, University of Waterloo
Solar is Hot for Electronics Suppliers
Rob DiMatteo, BTU International
An Alternative Dispense Process for Application of Catalyst Film on MEA's
Horatio Quinones, Ph.D., and Brian Sawatzky, Asymtek
Alternative Energy Keynote
Photovoltaics - The Next Great Electronics Market
A Survey of Opportunities Throughout the Photovoltaics Supply Chain
Jeff Doubrava, Prismark Partners
Monday, August 18
11:45am – 12:30pm
Light lunch served
NOTE: You must pre-register for this symposium to receive lunch.
WEDNESDAY
 Contract Manufacturing Symposium
Organized by Mike Buetow, UP Media Group/Circuits Assembly Magazine
and Sue Mucha, Powell-Mucha Consulting, Inc.
Wednesday, August 20
1:30pm – 5:00pm
FREE with VIP or Technical Conference Registration!
As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you’ll benefit from the Contract Manufacturing Symposium.
EMS1
Teaming for Efficient Manufacturing
Organized by Mike Buetow
UP Media Group/Circuits Assembly Magazine
Sue Mucha, Powell-Mucha Consulting, Inc.
FREE with VIP or Technical Conference Registration!
Chair: Sue Mucha, Powell-Mucha Consulting, Inc.
Co-Chair: Chelsey Drysdale, Circuits Assembly Magazine
Wednesday, August 20
1:30pm – 3:00pm, Fiesta 1
The electronics manufacturing services (EMS) has grown beyond simply providing a high quality, alternate manufacturing venue. Today’s EMS providers are expected to be problem solvers capable of addressing the entire product realization process. This session highlights some best practices and identifies needed areas of improvement. While topic specific Q and A will follow each speaker, time at the end will be allotted for a panel discussion where all speakers will address questions related to process efficiency and emerging trends.
Emerging Technologies in RF Design and Implications on Design for Manufacturability and Testability in Outsourced Production
Roger Allcorn, Syncro Corporation
Teaming for Increased Process Visibility
Jeff Roberts, Clover Electronics
EMS Audits: What We've Learned
Phil Zarrow, ITM Consulting
EMS2
Managing Our Suppliers and Ourselves
Chair: Mike Buetow, Circuits Assembly Magazine
Co-Chair: Rod Howell, Libra Industries
Wednesday, August 20
3:30pm – 5:00pm, Fiesta 1
FREE with VIP or Technical Conference Registration!
From the OEM perspective, outsourcing is a means to shed headaches and cost. But contracting work isn’t the same as eliminating problems: it simply moves them down the supply chain, and in some cases, even magnifies them. EMS companies faced with managing complex supply chains must learn how to turn the microscope on all their internal processes – be they sales, procurement, processing or quality assurance. And they must learn how to identify not only the proper combinations of data collection and analyses, but also the right personnel.
Turning Your Smallest Customer into Your Biggest
Craig Arcuri, NBS Design
Avoiding and Resolving Disputes over Unsatisfactory Components
Kristal Snider, ERAI
Ensuring Supply Chain Materials Integrity
Jed Jones, Inovar
THURSDAY
Lead-Free Soldering Technology Symposium
Organized by Paul Vianco, Ph.D., Sandia National Laboratories
Thursday, August 21
8:00am – 5:00pm
Free With VIP or Technical Conference Registration
The experience base continues to expand with respect to Pb-free solutions within the electronics community. Successful assembly processes are being used by a growing number of original equipment manufactures (OEMs) and contract manufacturing services (CMSs) in the US as well as overseas. Moreover, Pb-free finishes and assembly processes are now being investigated by many companies in the “high-end” segment of the industry, which includes medical, military and space electronics. In the latter case, solder joint reliability continues to be the major hurdle for Pb-free implementation. That is not to say that the consumer electronics sector does not have its reliability issues, specifically, the drop test requirement that is being placed on hand-held electronics. In fact, this latter requirement has led to the development of new solder alloys. The Lead-Free Soldering Technology Symposium will begin with a full session describing the latest consortium activities by the iNEMI group. Of particular interest will be a discussion of methodologies to evaluate the many new alloy compositions for different product applications. The second and third sessions are devoted to the very popular topic of case-studies. The six papers will describe the actual experiences of companies that are currently at the forefront of implementing a Pb-free solder solution for consumer and high-reliability products. The fourth session of the symposium will provide the attendee with state-of-the-art information pertaining to Pb-free interconnection reliability. Specific topics will range from the latest test data on the thermal cycling and shock testing of various alloy compositions and package designs, to forwards and backwards compatibility issues that remain as a significant concern for companies making high-reliability products. Attendees will find all of these presentations to be timely and extremely informative.
LF1
Lead-Free Alloy Alternatives
Chair: Gregory Henshall, Ph.D. Hewlett-Packard
Co-Chair: Paul Vianco, Ph.D., Sandia National Laboratories
Thursday, August 21
8:00am – 9:30am, Coronado A
Within the past 1-2 years, the industry has seen a proliferation in the number of Pb-free solder alloy choices. The increasing number of Pb-free alloys provides both opportunities and challenges to the industry. This session will begin with a presentation of the results from an iNEMI study into the present state of industry knowledge on "alternative" Sn-Ag-Cu alloys and an assessment of critical gaps. This will be followed by a panel discussion with experts from all segments of the industry, including solder suppliers, EMS providers, component manufacturers, and OEMs.
iNEMI Speakers Include:
Gregory Henshall, Ph.D., Hewlett-Packard
Polina Snugovsky, Ph.D., Celestica Inc.
Richard Coyle, Ph.D., Alcatel-Lucent
Panelists Include:
Gregory Henshall, Ph.D., Hewlett-Packard
Polina Snugovsky, Ph.D., Celestica Inc.
Richard Coyle, Ph.D., Alcatel-Lucent
Bill Barthel, Plexus Corporation
Keith Sweatman, Nihon Superior Co. Ltd.
Ning-Cheng Lee, Ph.D., Indium Corporation
Robert Kinyanjui, Ph.D., Sanmina-SCI Corporation
LF2
High Complexity, High Reliability Lead-Free Case Studies, Part 1
Chair: Matt Kelly, IBM Corporation
Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Thursday, August 21
10:00am – 11:30am, Coronado A
Although the majority of products within electronic consumer market segments have now switched to lead-free printed circuit board hardware assembly, it is clear that many technology / supply chain challenges still remain to ensure high quality, reliability, and yield levels for high reliability application environments. As many of the industry's OEM and CM firms prepare position statements for the upcoming RoHS exemptions review, it is important to understand both the successes and challenges associated with high complexity / high reliability electronics manufacturing. This session is intended to showcase these issues through case study involving real product qualification and testing.
Improving Hole-Fill in Lead-Free Wave Soldering of Thick Printed Circuit Boards with OSP Finish
J. Li, P-F Tsai, and K. Srihari, Binghamton University; C.C. Chew, M. Abtew, and R. Kinyanjui, Ph.D., Sanmina-SCI-Corporation
The Path of Taking High Reliability Products to Lead-Free
Alex Chan, Alcatel-Lucent Canada Inc.
Lead-Free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Dave Hillman and Matt Hamand, Rockwell Collins
LF3
High Complexity, High Reliability Lead-Free Case Studies, Part II
Chair: Matt Hamand, Rockwell Collins
Co-Chair: Brian Toleno, Ph.D.,
Henkel Technologies
Thursday, August 21st
1:00pm – 2:30pm, Coronado A
Although the majority of products within electronic consumer market segments have now switched to lead-free printed circuit board hardware assembly, it is clear that many technology/supply chain challenges still remain to ensure high quality, reliability, and yield levels for high reliability application environments. As many of the industry's OEM and CM firms prepare position statements for the upcoming RoHS exemptions review, it is important to understand both the successes and challenges associated with high complexity/high reliability electronics manufacturing. This session is intended to showcase these issues through case study involving real product qualification and testing.
Test Data Requirements for Assessment of Alternative Pb-Free Solder Alloys
Helen Holder, Gregory Henshall, Ph.D., Aileen Maloney, Elizabeth Benedetto, Kris Troxel, Guillermo Oviedo, Jian Miremadi, and Michael Roesch, Hewlett-Packard
A Case Study for Transitioning Server Motherboards to Lead-Free
W. Ables, J. Fitch, and R. Schueller, Ph.D., Dell Inc.
Lead-Free Card Assembly Advances and Challenges for Server PCBA's
Matthew Kelly, Marie Cole, and Jim Wilcox, IBM Corporation; Simin Bagheri, Craig Hamilton, Heather McCormick, and Irene Sterian, Celestica Inc.
LF4
Lead-Free Reliability
Chair: Jean-Paul Clech, EPSI, Inc.
Co-Chair: Kola Akinade, Ph.D., Scientific Atlanta, A Cisco Company
Thursday, August 21
3:00pm – 5:00pm, Coronado A
Given the proliferation of lead-free alloy compositions, much work remains to be done to achieve the same qualitative and quantitative understanding of lead-free attachment reliability as for standard SnPb assemblies. Papers in this session provide much needed contributions to the industry's knowledge-base on lead-free solder joint reliability and related issues. Test results are presented for several alloys (SAC & SnCu-based) and mixed assemblies under mechanical (shock and vibration) and/or thermal cycling conditions. The first paper investigates the effect of thermal aging on the performance of SAC305 assemblies under mechanical shock conditions. The next two papers provide detailed test results and a template for the minimum amount of testing needed to characterize the attachment reliability of a particular lead-free alloy (SnCu-based) under a wide range of conditions (thermal, shock & vibration) and for a variety of component types. The last paper provides insight in the effect of dwell time on solder joint reliability under accelerated thermal cycling conditions for SAC305, SnPb and mixed assemblies.
Study on Dynamic Shock Performance of Lead-Free SAC305 Solder Joint Under Different Aging Conditions
Dong Hyun Kim, Ph.D., Cisco Systems, Inc.
Reliability Testing of Ni-Modified SnCu and SAC305-Accelerated Thermal Cycling
Joelle Arnold, DfR Solutions, and Keith Sweatman, Nihon Superior Co., Ltd.
Reliability Testing of Ni-Modified SnCu and SAC305-Shock and Vibration
Joelle Arnold, DfR Solutions, and Keith Sweatman, Nihon Superior Co., Ltd.
A Comprehensive Solder Joint Reliability Study of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes
Richard Coyle, Ph.D., Alcatel-Lucent; Steven Kummerl, Texas Instruments; Peter Read, Debra Fleming, Richard Popowich, John Manock, and Aaron Unterborn, Flextronics International
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