SMTA International  

Conference: Oct. 14 - 18, 2012  
Exhibition: Oct. 16 - 17, 2012  

Walt Disney World Dolphin  
Orlando, Florida  
 

Special Events

The opportunity to gain new skills and update your technical knowledge is around every corner at SMTA International. From the exhibition area to the conference, you are sure to find valuable information that will prepare you to succeed in today's highly competitive market.

Many events below are free and some require fees and advance registration. See the registration form for complete information.



AIMS (Harsh Environments Symposium)
Included with a VIP or Technical Conference Registration, saving you MONEY!
Monday, October 17 | 8:30am - 5:00pm | 202A

Lunch will be provided to those who register in advance and select this symposium. This symposium will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of “end-users” with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements for automotive electronics are explored from the system level and potential supply-based solutions are presented. In addition, requirements and solutions for non-automotive vehicles and industrial electronics applications will be addressed.

HE1 Thermo-Mechanical Analysis and Prognostics of Lead-Free Solders for Harsh Environment Applications
8:30am - 10:00am

HE2 Metallization and Connector Failure Mechanisms
10:30am - 12:00pm

HE Keynote Lunch: "How the Defense/Aerospace Industry is Responding to the Pb-Free (Lead-Free) Challenge"
12:00pm - 1:30pm

HE3 Lead-Free Component and Solder Joint Reliability Testing
1:30pm - 3:00pm

HE4 Reliability of SAC Solder Joints
3:30pm - 5:00pm



Evolving Technologies Summit
FREE with VIP or Technical Conference Registration
Monday, October 17 | 8:30am - 5:00pm | 202B

Lunch will be provided to those who register in advance and select this symposium. The time is right to stimulate your thinking and catalyze new success - be ready for the new market rise. Innovation always leads the way so join us as we explore emerging and evolving technologies from around the world. The 2011 ET Summit has the largest array of timely topics we've ever assembled. Learn the challenge of implementing and evaluating embedded packaging technology from passive to active devices. Gain further insight on printed electronics, a follow up to the last year's successful session on this topic. Learn all about rapidly growing LED from the experts - from technology trends to challenges on reliability. Four excellent presentations on LED will be given. The ET Panel will discuss and debate timely topics including solar energy and extremely dense electronics. So bring your questions and ideas as we power ahead into a brighter future.

ET1 Embedded Component Technology (ECT) - Ready for Prime Time
8:30am - 10:30am

ET2 Printing and Jetting Technologies for Electronics Applications
11:00am - 12:30pm

ET Keynote Lunch Illumination-Grade LED's: Roadmap and Challenges for Manufacturing
12:30pm - 1:30pm

ET3 Opportunities and Challenges in Solid State Lighting
1:30pm - 3:00pm

ET4 Evolving Technology and Current Issues Panel
3:30pm - 5:00pm



Women's Leadership Connection
Monday, October 17 | 5:00 - 6:30pm | 101

We extend a cordial invitation to all women attending SMTA International to join us for a wine and cheese reception. This is a great opportunity for you to get together with other women in our industry for networking and socializing.



Opening Session
Lee Smith, Amkor Technology Package on Package (PoP): Past, Present and Future
Lee Smith, Vice President of Marketing and Business Development, Amkor Technology
Tuesday, October 18 | 8:00am - 9:30am | 203A/B
FREE to All Attendees!

Join us as we review the evolution of PoP, the development of industry standards, the latest in assembly trends, and what may be in the making for next generation PoP. Following Lee's presentation, there will be an extended Q and A session.

4 Reasons to Attend the Opening Session:

1. Learn how you can participate in 3D packaging, which is the hottest topic in the electronics industry today, with the PoP solution enabled by surface mount technology.

2. You'll get an expert's view on how PoP has evolved to over 10million units stacked per week and where PoP supply and demand is headed in the future.

3. You'll better understand the high growth applications that drive PoP technology and what densities will continue to increase with 0.3mm pitch on the horizon.

4. Gain an understanding of how supply chain collaboration is advancing PoP technology and infrastructure.


The 2010 SMTA International Conference Award Winners will also be recognized:
David Hillman Rich Freiberger Best of Conference Presentation
NASA DoD -55 to +125 Thermal Cycle Test Results
David Hillman, Rockwell Collins

Pradeep Lall, Ph.D. Best of Proceedings Papers
Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling
Pradeep Lall, Ph.D., MBA, Auburn University

Craig Hamilton Best International Paper
High Complexity Lead-Free Wave and Rework: The Effects of Material, Process, and Board Design on Barrel Fill
Craig Hamilton, P.E. Celestica Inc.



International Coffee Break International Attendee Coffee Break
Tuesday, October 18 | 9:30am - 10:30am
Location: Aisle 100 (next to the poster session)

If you live in a country outside of the US we invite you to come and join other international colleagues as we start the week at SMTAI. SMTA Board and Staff will be there to meet with you, welcome you to SMTAI and answer any questions that you may have.



THE PARTY at Billy Bob's
Tuesday, October 18 | 5:00pm - 10:00pm
Hosted by the Dallas SMTA Chapter

Billy Bob's was voted the #1 Country Music Club in the World and is also the largest of its kind! That's why we chose it as the setting for THE PARTY.

For only: $30/person you get:
  • Admission Ticket into Billy Bob’s
  • Worry-free round trip transportation
  • Plenty of tasty Texas food
  • LOTS of entertainment Find out more...



    SMTA Annual Meeting/Keynote Luncheon
    "Creating a Supply Chain That Provides a True Competitive Differentiation is Increasingly Difficult in an Industry Dominated by the Outsourced Manufacturing Model"
    Mark Medlen, Vice President of Operations and Supply Chain Services, Riverwood Solutions
    Wednesday, October 19 | 12:00pm - 2:00pm | 201

    Mark Medlen, Riverwood Solutions The recent catastrophic natural disasters that have caused significant shocks to the global electronics supply chain have caused OEM Supply Chain Executives to reexamine their supply chain responsiveness, flexibility and risk mitigation plans.

    Is it possible to develop highly differentiated supply chain performance and agility in a mostly outsourced world? When OEMs are increasingly relying upon manufacturing service providers for raw material sourcing, capacity planning, production, and even product fulfillment, how does the Brand Owning Enterprise (BOE) develop a more responsive supply chain than its competitors? In a globalized world dominated by the outsourced manufacturing model, how can product companies develop a more responsive or more efficient supply chain using those same tools, suppliers, systems, and manufacturing partners that are broadly available to all of their competitors?

    Mark Medlen is a career operations, engineering and supply chain professional with more than 25 years of global operations experience. He has held operations and engineering roles at several companies including Texas Instruments, Micron, Flextronics and Abbott Labs. Mark has managed a number of technology manufacturing plants around the world, producing an incredibly diverse array of different products ranging from miniature optical components to massive pieces of factory automation. Over the last few years, Mark has spent the majority of his time in China managing various EMS and ODM activities for some of the world's leading OEMs. Mark holds nine U.S. patents for various manufacturing processes and production technologies.



    Contract Manufacturing Symposium
    Chair: Sue Mucha, Powell-Mucha Consulting, Inc.
    Co-Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine
    Tuesday, October 18 | 10:30am - 1:00pm | 204A

    FREE with VIP or Technical Conference Registration!

    The nature of outsourcing is changing due to greater awareness of the risks from geopolitical events, local legislation, and natural disasters. This session, aimed at OEMs, and EMS program managers and executives, looks at risk mitigation strategies from Asia to Eastern Europe, and selected SMT processing solutions that could benefit those companies grappling with RoHS and other environmental or leading-edge (high BGA pin count) technical issues.



    4th Annual SMTAI Golf Tournament
    SMTAI Golf Tournament The Golf Club at Fossil Creek
    Ft. Worth, TX
    Thursday, October 20, 2011
    8AM Shotgun start

    The Golf Club at Fossil Creek, 3401 Clubgate Drive, Ft. Worth, TX 76137 (8 miles from the Fort Worth Convention Center)

    Find more information on the course online: www.thegolfclubatfossilcreek.com

    Last chance to register is Oct. 12.
    Contact Gayle 540-763-2191/gayle@smta.org if you miss the cut-off... we will try to get you in!

    COST:
    Cost: $70.00 per player, $280 per 4-some team, Includes Awards Luncheon
    Sign up on-line by October 12
    Club Rentals: $59.96 (please arrive early if you will need to rent clubs)     		Thanks to all of our sponsors!

    CONTACT:
  • Rich Brooks, 615-831-0888, rich_brooks@kyzen.com
  • Gregg Schoenrade, 214-912-1747, gschoenrade@gforcereps.com
  • Gayle Jackson, 540-763-2191, gayle@smta.org




    • Lead-Free Soldering Technology Symposium
    Organized by Organized by Paul Vianco, Ph.D., Sandia National Laboratories and Matthew Kelly, P. Eng., MBA, IBM Corporation
    Thursday, October 20 | 8:00am - 5:00pm | 204A/B

    Free With VIP or Technical Conference Registration

    Lunch will be provided to those who register in advance and select this symposium. The present research and development thrust in Pb-free soldering technology is towards understanding the reliability of interconnections, particularly those that will potentially be used in avionics, military, and space electronics. In response to this need, the second phase of the NASA-DoD Pb-Free Consortium project is providing unprecedented data on the long-term performance of Pb-free interconnections. The scope of these experiments addresses alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. These efforts will be reported upon during the 2010 Lead-Free Soldering Technology Symposium, beginning with an overview of the current project. That overview is followed by presentations that will report the results of the consortium drop test and mechanical shock experiments. The second session of the symposium will complete the NASA-DOD project reports with presentations describing the invaluable data that were obtained from vibration testing, thermal cycling, and combined thermal cycling/vibration environments. The third session of the symposium will step away from reliability and address three pressing issues in Pb-free process development. Those topics are processing high complexity/high component mix assemblies; mitigating pad catering defects; and optimizing wave soldering processes. The 2010 symposium will conclude by returning to the topic of reliability in the fourth and final session. An investigation will be described that studied the effects of cooling rate and solder silver content on the long-term reliability of area-array solder joints. A very interesting presentation will address the solder microstructural changes caused by electromigration and the consequences to the low-cycle fatigue of the solder joint.



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    What you are saying:

    Great 'community-like' feeling, friendly and very technical for an industry conference.



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