Package On Package (PoP) Design and Assembly Center
October 16 and 17, 2012
In the Exhibit Hall
Free to Attend!
Sponsored by
Brand new technology center for visitors to SMTA International
See it, hear it and do it at SMTAI
Package on Package (POP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on design and assembly engineers. POP is also finding favour in professional handheld tablets and commercial high reliability applications? Package on package is new to many engineers but ready to explode in the market place.
In simple terms PoP represents the stacking of area arrays one on top of another, either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include flip chip, wire bonding or conductive adhesives for device to device interconnection. The second generation of devices feature finer pitch and through vias for greater interconnection.
PoP is new to many contract and OEM assembly staff but with the demands of dip paste or flux dipping, reflow warpage, increased placement accuracy and flexability during paste application for assembly and rework. Gaining practical knowledge and experience is vital to your competitive edge. Multi level ball inspection can be a challenge for standard x-ray equipment as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
What will you see or learn at the PoP Center?
PoP components explained
PCB design rules and PCB specification
Changes necessary in the assembly process
In process inspection criteria
Solder joint reliability data
What will you see live at the POP Center?
Placement of PoP
In process Inspection of package assemblies
Application of dip paste and dip flux
Rework of POP and inspection
POP process defects – causes and cures
What benefits will your company get from visiting the POP Center?
Learn PoP Technology from A-Z
Handle PoP samples
Faster implementation of the technology
Obtain inspection standards for your line
Hands on assembly, inspection and rework
"Package on Package (POP) Defect – Causes & Cures"
Even if you are running package on package we have solutions for you. This year the POP Center will give you the opportunity to have your POP failures or process defects examined by recognised experts on the subject. You can bring board assemblies, components, and failure analysis reports for discussion and free advice to help you pin point the true cause of failure. You can email your questions or problems before the show and book an appointment. Email your photographs and problems prior to your visit to popcenter@smta.org.
Package On Package Technology Center Participants
Package on Package (POP) Design & Assembly Center Seminars at SMTA International
Attend the daily 20min seminars and you and your company will receive a copy of each of the slides and access to a video library of each of the presentations to assist your company staff to successfully implement PoP.
Tuesday, October 16
11:00am - Design Guidelines for Package on Package Assembly
Bob Willis - Bobwillisonline.com
12:00 noon - Assembly Process Challenges with PoP
Rafael Padilla - Senju
1:00pm - Optical & X-ray Inspection Guidelines for Package on Package
Keith Bryant - DAGE
2:00pm - How to Rework POP Assemblies with Confidence
Bob Willis - Bobwillisonline.com
3:00pm - Convection and Vapour Phase Reflow for Package on Package Assembly
Jochen Lipp - IBL
Wednesday, October 17
11:00am - Design Guidelines for Package on Package Assembly
Keith Bryant - DAGE
12:00 noon - Assembly Process Challenges with PoP
Brook Sandy - Indium
1:00pm - Optical & X-ray Inspection Guidelines for Package on Package
Keith Bryant - DAGE
2:00pm - How to Rework POP Assemblies with Confidence
Bob Willis - Bobwillisonline.com
SMTA Technical Library on PoP Technology
Visitors to the POP Center will benefit from exclusive access to numerous technical papers covering Package on Package and stacked packaging technology. This is a unique opportunity to access and learn from one of the largest collection of technical papers made possible by SMTA. "Having worked for many years with SMTA, a worldwide organisation I know the quality of the material and it's great to be able to access this resource for visitors," said Bob Willis, the POP Design & Assembly Center Organiser. Having the opportunity to learn from so many sources will make a company's introduction of POP so much easier. The hundreds of technical papers focus on design, assembly, reliability and so much more.
Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in your future products. Bob Willis POP Center Coordinator
Attend the daily 20min seminars and you and your company will receive a copy of each of the slides and access to a video library of each of the presentations to assist your company staff to successfully implement PoP. 
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Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in your future products.
