SMTA CERTIFICATION - PROCESSES AND SIX SIGMA GREENBELT (August 18-20)
MANUFACTURING AND ASSEMBLY
Tutorials
T11 LGA (Land Grid Array), QFN (Quad Flat No-lead) Design, Assembly, Inspection & Rework
8:00am - 11:30am
T12 Reflow Soldering Lead-Free Alloys – Successfully
1:30am - 5:00pm
T13 The 10 "Deadly Sins" of SMT and Lead-Free Assembly
1:30pm – 5:00pm
ADVANCED PACKAGING
Tutorials
T14 3D Packaging Applications, Requirements, Infrastructure and Technologies
8:30am - 11:30am
T15 Next Generation Technologies in Electronic Packaging and Production
1:30pm – 5:00pm
T16 Construction, PCB Design and Assembly of BGA and Leadless Packages for Pb-Free
1:30pm - 5:00pm
T17 Advanced Flip Chip Technology and Processing
1:30pm – 5:00pm
Evolving Technologies Summit
ET1 University Research: New Processing for Electronic Packaging
8:00am - 9:30am
ET2 Time for Paradigm Shifts
10:00am – 11:30am
Keynote Lunch Solderless Assembly of Electronics – Technical Pipe Dream or Wave of the Future?
11:30am – 1:00pm
ET3 Embedded Technologies: Their Applications and Reliability
1:00pm – 3:00pm
ET4 Evolving Technology and Current Issues Panel
3:30pm – 5:00pm
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SOLDERING
Tutorials
T18 Pb-Free Soldering Processes—Survival, Quality, Reliability
8:00am - 5:00pm
T19 What You Want to Know About Lead-free Electronics
8:00am - 11:30am
PROCESS CONTROL
Tutorial
T20 Common Failure Modes in Electronic Packages and Assemblies and How to Avoid Them
8:00am – 11:30am
SUBSTRATES
Tutorial
T21 Implementing a Halogen-Free Circuit Board Assembly Process
8:00am - 5:00pm
Alternative Energy Symposium
FCS1 Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing
8:00am - 9:30am
FCS2 Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing - Continued
10:00am – 11:30am
Keynote Lunch Photovoltaics-The Next Great Electronics Market
11:45am – 12:30pm
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