Monday At-A-Glance
Monday, October 17
TUTORIALS (MORNING)
T9 Design & Assembly Guidelines for BTCs
8:30am - 12:00pm | Room 103A
T10 DFM Project Setup From Introduction to Advanced DFM Analysis
8:30am - 12:00pm | Room 103B
T14 Failure Modes & Process Defects for Flip Chip/Advanced Package/Board Assemblies
8:30am - 12:00pm | Room 202D
T18 BGA/CSP/LGA/WLP Reliability in Pb-free Packaging & Assembly
8:30am - 12:00pm | Room 202C
T19 3D Assembly... CSP to PoP to Board
8:30am - 12:00pm | Room 201C
TUTORIALS (AFTERNOON)
T12 BTC Assembly – Material, Process and Reliability
1:30pm - 5:00pm | Room 202C
T13 Today's Toughest Rework Challenges
1:30pm - 5:00pm | Room 103B
T16 Optimizing X-Ray Inspection: Equipment, Processes & Procedures
1:30pm - 5:00pm | Room 103A
T17 APL Failure Analysis: Lessons Learned in Manufacturing
1:30pm - 5:00pm | Room 202D
T20 Head and Pillow SMT Failures in Electronic Assemblies
1:30pm - 5:00pm | Room 201C
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AIMS/HARSH ENVIRONMENTS SYMPOSIUM
HE1 Thermo-Mechanical Analysis & Prognostics of LF Solders
8:30am - 10:00am | Room 202A
HE2 Metallization and Connector Failure Mechanisms
10:30am - 12:00pm | Room 202A
HE Keynote Lunch: Defense/Aerospace Industry Responds to Lead-Free Challenge
12:00pm - 1:30pm | Room 202A
HE3 Leaded and Lead-Free Component Solder Joint Reliability Testing
1:30pm - 3:00pm | Room 202A
HE4 Reliability of SAC Solder Joints
3:30pm - 5:00pm | Room 202A
EVOLVING TECHNOLOGIES SUMMIT
ET1 Embedded Component Technology (ECT)
8:30am - 10:30am | Room 202B
ET2 Printing and Jetting Technologies
11:00am - 12:30pm | Room 202B
ET3 Keynote Lunch: Illumination-Grade LED's Roadmap & Challenges
12:30pm - 1:30pm | Room 202B
ET3 Opportunities and Challenges in Solid State Lighting
1:30pm - 3:00pm | Room 202B
ET4 Evolving Technologies Panel - FREE!
3:30pm - 5:00pm | Room 202B
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View the scrapbook of SMTAI 2011!
What you are saying:
 Technical sessions, especially the lead-free were excellent. Attendees represent the key companies and are the most knowledgeable in the industry.
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