SMTA International

Conference: Oct. 14 - 18, 2012
Exhibition: Oct. 16 - 17, 2012

Walt Disney World Dolphin
Orlando, Florida

Free Sessions

Free events for attendees each day!

Opening Session
Lee Smith, Amkor Technology

Package on Package (PoP): Past, Present and Future
Lee Smith, Vice President of Marketing and Business Development, Amkor Technology
Tuesday, October 18 | 8:00am – 9:30am | 203A/B
FREE to All Attendees!

Join us as we review the evolution of PoP, the development of industry standards, the latest in assembly trends, and what may be in the making for next generation PoP. Following Lee's presentation, there will be an extended Q and A session.

The 2010 SMTA International Conference Award Winners will also be recognized:

Rich Freiberger Best of Conference Presentation
NASA DoD -55 to +125 Thermal Cycle Test Results
David Hillman, Rockwell Collins

Pradeep Lall, Ph.D.

Best of Proceedings Papers
Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling
Pradeep Lall, Ph.D., MBA, Auburn University

Best International Paper
High Complexity Lead-Free Wave and Rework: The Effects of Material, Process, and Board Design on Barrel Fill
Craig Hamilton, P.E. Celestica Inc.

Conflict Materials - What Does It All Mean...Panel Discussion
Moderator: Krista Crotty, Alberi EcoTech
Tuesday, October 18 | 9:30am - 10:30am
Exhibit Hall Theater
FREE to All Attendees!

The latest issue for companies related to product environmental compliance is the issue of conflict materials. This panel of experts will give you the latest information on what the industry expects and what the requirements are for reporting.

Panelists:
Alan Rae, TPF Enterprises
Deborah Albers, Dell
Beverly Clemmons, Texas Instruments
Krista Crotty, Alberi EcoTech

Process Improvement Methods for QFN Devices Using 2D and 3D (Virtual Cross-Section) X-ray Analysis
Chair: Roy Starks, Libra Industries
Speaker: Evstatin Krastev, Ph.D., Nordson DAGE
Tuesday, October 18 | 11:00am - 11:30am
Exhibit Hall Theater
FREE to All Attendees!

Quad flat packages with no leads (QFN's) have been widely used in the mobile wireless industry because of its lost cost, low standoff and their excellent thermal and electrical properties. As the package terminations are under the component, it makes it difficult to inspect these components with traditional inspection like Automated Optical Inspection (AOI). X-ray analysis is a way of nondestructive testing of any semiconductor device on a printed circuit board assembly (PCBA). The extremely high resolution and crisp image quality of a 2-D X-ray device can be used to analyze the defects in a printed circuit board assembly like analyzing the quality of the joint. With the advent of Computer Tomography or the 3-D X-ray analysis it became even easier to analyze these defects without destructive tests like doing a cross-section.

Poster Session
Tuesday, October 18 | 12:00pm – 2:00pm | Exhibit Hall
FREE to All Attendees!

Integrity Data Checks for Integrated Circuits Manufacturing
Andre Amaral, CTPIM

Step Stencil Applications
William Coleman, Photo Stencil

Yield Improvement by SMT Operator
Chetankumar Gabani, Precision Technology, Inc.

How to Eliminate NTF Through Testers Characterization Analysis
Ye Qin, Zhijun Wang, and Ya Jun Gu, Flextronics International

Cost Trade-offs Between Direct Chip Attachment and Packaged Chips
Chet Palesko, SavanSys Solutions LLC

Evolution of Gold-Constraining SAC305 Solder Joints Under Isothermal Aging
Juli Silk, Agilent Technologies

MSD Council Meeting
Tuesday, October 18 | 2:00pm – 2:00pm | 204A
FREE to All Attendees!

Officers:
Mumtaz Y. Bora, Peregrine Semiconductor
Steve Martell, Sonoscan
Michelle Ogihara, Seika Machinery, Inc.

Agenda:

Industry Standards for Moisture Sensitivity Packages
- Update J-STD 033B.1
- J-STD -020D.1

Package Handling/Baking/Packaging Guidelines

PWB Handling/ Baking/Packaging Guidelines
- Updates – IPC 1601 Standard

Controls at PWB/Assembly Site

Summary/Q&A

iNEMI Roadmap
Chair: Bill Barthel, Plexus Corporation
Speaker: Chuck Richardson, iNEMI
Tuesday, October 18 | 2:30pm - 3:15pm
Exhibit Hall Theater
FREE to All Attendees!

Since the first roadmap in 1994, iNEMI (International Electronics Manufacturing Initiative) has enjoyed increasingly greater support and participation from industry. The effort reaches beyond iNEMI membership to involve a broad range of organizations from the global electronics industry.

Chuck will present the iNEMI 2011 Roadmap overview (developed during 2010), as well as highlight issues addressed by selected chapters from the 2011 Roadmap (released to the industry in March 29, 2011 via two global webinars) that will likely help drive the electronics industry for the next several years. Please join with us and see what the future may hold and how the iNEMI roadmap might impact that future!

Thin Heat Spreader Attach Process for Thermally Constrained Embedded Markets
Chair: Brian Toleno, Ph.D., Henkel Corporation
Speaker: Shawn Lloyd, Intel Corporation
Tuesday, October 18 | 3:30pm - 4:30pm
Exhibit Hall Theater
FREE to All Attendees!

The thermal environment for some embedded markets, such as Automotive In-Vehicle Infotainment and Industrial, is characterized by high operating ambient (70 to 85oC), relatively poor thermal interfaces (gap pads) and fanless or very low airflow system thermal solutions. For the Atom-branded products intended for these markets, operating within Tj limits is often a challenge unless an Integrated Heat Sink (IHS) is added to the package, which means all packages will have an IHS where only select design environments need thermal enhancement. To address the thermal issue and provide a level of product flexibility, a process has been developed that enables a customer to design and install a thin heat spreader using conventional SMT equipment and off-the-shelf adhesive Thermal Interface Material (aTIM). This presentation will address the material selection, heat sink design, assembly process development with resulting metrics to measure heat spreader placement and aTIM bond line thickness consistency.

Using Automated Solder Paste Inspection to Improve Print Yields
Chair: David Steele, Da-Tech Corporation
Speaker: Chrys Shea, Shea Engineering Services
Wednesday, October 19 | 9:30am - 10:30am
Exhibit Hall Theatre
FREE to All Attendees!

Automated Solder Paste Inspection (SPI) has been deployed in a broad range of electronics assembly operations because it saves money. By preventing print defects from becoming solder defects, the SPI technology helps manufacturers avoid the costs of rework, test failure, scrap and even field failures. This presentation reviews different applications of SPI and simple experiments that can be performed quickly during production breaks to improve printing processes and prevent print defects from occurring. Topics covered include stencil verification, vendor qualification, material type, solder powder size and paste formulation, and how to mine through production data to pinpoint the root causes of defects.

Solar Module Manufacturing - Panel Discussion
Moderator: Chrys Shea, Shea Engineering Services
Wednesday, October 19 | 11:00am - 12:00pm
Exhibit Hall Theater
FREE to All Attendees!

What does the future of solar manufacturing hold for you? How fast will the market grow in the US and abroad? What are the latest advancements in equipment and materials, and what process challenges still exist? Who is responsible for longterm reliability and warranty issues?

Whether you're thinking of entering the solar manufacturing business or already in it, this panel discussion will help you! Experts will be sharing their experience and insights to answer your questions in all areas of solar energy systems manufacture, including panels, junction boxes, and power management equipment. Audience members are encouraged to bring their questions to the event, or submit them in advance by emailing Chrys@sheaengineering.com.

Panelists will include:
Matthew Holzmann, Christopher Associates Inc.
Paul Lancaster, BTU
Alan Rae, Ph.D., TPF Enterprises
Dongkai Shangguan, Ph.D., Flextronics International

Celebrity Electronics Jeopardy
Organized by Trevor Galbraith, Global SMT & Packaging Magazine
Wednesday, October 19 | 2:00pm - 3:00pm
Exhibit Hall Theater
FREE to All Attendees!

Come and watch some of the industry's leading icons compete in an electronics celebrity version of the popular TV program, "Jeopardy." Hosted by Global SMT & Packaging magazine, this event is in three rounds - an electronics round that will test the contestants' process knowledge, followed by a general knowledge round, then a Final Jeopardy round. Contestants Mike Konrad, Aqueous Technologies; Tom Forsythe, Kyzen Corporation; and Hal Hendrickson, Nordson DAGE will compete for points. Global SMT & Packaging Magazine will donate $1,000 in cash to the winner's charity. Watch the fun and cheer on your favorite contestant!

View last year's episode:

The Relevance of Long Duration TLP Stress on System Level ESD Design
Join us for this "award winning" paper from the 2010 ESD Conference!
Speaker: Gianluca Boselli, Ph.D., Analog Technology Development ESD Lab, Texas Instruments Inc.
Wednesday, October 19 | 3:30pm - 4:00pm
Exhibit Hall Theater
FREE to All Attendees!

An analysis of long-duration TLP stress will be performed on ESD clamps representative of the most commonly used ESD protection strategies. It will be shown that snapback-based High Voltage devices feature static filamentary conduction after triggering. This leads to failure for TLP pulse widths in excess of 100ns, well below the expected power scaling levels. The need for long TLP testing to establish ESD protection robustness in the system level stress regime will be demonstrated.

SMTA's GIFT to YOU!
To thank you for 27 years of support for the SMTA, we are offering a FREE half day course for members on Thursday, October 20th. Rob Rowland, SMTA Conference Chair and STAR Instructor, will teach his popular course, "A Guide to Pb-free Reflow and Wave Soldering". Full details can be found on the tutorials page. NO COST to you if you are an SMTA MEMBER. We request that you register in advance to ensure adequate handouts.

View the scrapbook of SMTAI 2011!

What you are saying:

I can learn from the industry's best technical staff and research groups. It allows me to keep a pulse on the latest technology trends and issues affecting electronics hardware assembly.

Matthew Kelly, P. Eng.
IBM Corporation

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