|
|
|
|
SMTAI covers the most important topics in the industry. Discover the latest technologies and techniques, stay current with industry trends and learn from the following respected tutorial instructors.
Daniel F. Baldwin, Ph.D., is the President of Engent, Inc. providing enabling process technologies and manufacturing services in the areas of electronics, optoelectronics, and MEMS. He was formerly the Vice President of the Advanced Assembly Technology Division at Siemens Dematic Electronic Assembly Systems. He also holds an Associate Professor of Mechanical Engineering position at the Georgia Institute of Technology heading the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Dr. Baldwin has served as the General Chair and Program Chair of the International Advanced Technology Workshop on Flip Chip Technology for four years. He has also served as the Technical Program Chair for the 4th International Symposium on Advanced Packaging Materials: Processing, Properties and Interfaces. In addition, he was the recipient of the 1998 Outstanding Research Faculty of the Year Award and 1995-1996 Outstanding Faculty of the Year Award from the NSF - Packaging Research Center for his exemplary contributions in research, education, technology transfer, and infrastructure development. Prior to joining the faculty, he was a Member of the Technical Staff at Bell Laboratories, Princeton NJ working on electronic product miniaturization. Dr. Baldwin received his S.M. and Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively. He has eleven years of experience in the electronics manufacturing and polymer processing industries, four U.S. Patents, over 100 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design. Dr. Baldwin is on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing Division (SME/EM) and on the Board of Directors for the Surface Mount Technology Association (SMTA).
Jean-Paul Clech, Ph.D., has over 20 years of practical experience in SMT design, soldering quality and reliability assurance. He maintains one of the largest databases of solder joint reliability data, material properties and life prediction models in the industry and is constantly challenged by problems brought about by new and emerging technologies. His current research interests are in BGA, CSP, flip-chip and lead-free assembly reliability, including the development of lead-free solder acceleration factors and life prediction models.
Jean-Paul is the founder of EPSI Inc. in Montclair, NJ. His responsibilities include technical consultation and problem solving for clients across the electronics industry worldwide, and the development of engineering tools and training programs to prevent or solve reliability problems in electronic packages and board assemblies. He is the principal developer of the “Solder Reliability Solutions” model and application software. He has also served as an expert-witness in product litigations involving solder joint field failures.
Jean-Paul previously was Manager of Electronic Packaging at a European super-computer start-up, a Member of the Technical Staff and then consultant at AT&T Bell Laboratories. He received the Diplôme d' Ingénieur from Ecole Centrale de Paris, France (Materials Science major), and the M.S. and Ph.D. degrees in Mechanical Engineering from Northwestern University, Evanston, IL. His technical interests include thermal, mechanical, structural and fatigue behavior of electronic materials, packages and assemblies, and the application of engineering principles to the physical design and manufacturing of electronic systems. He is the author of over forty technical papers, a frequent speaker at technical conferences, and has been an invited lecturer and instructor at various corporate events and professional venues in Asia, Europe and North America. He is an active member of ASME, IEEE, TMS and SMTA. In 2003, Jean-Paul received the SMTA Member of Distinction award. In 2006, he was presented with the IPC's Distinguished Committee Service award in appreciation and recognition of his contribution to the development of IPC-9701A, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments.
Werner Engelmaier has over 42 years experience in electronic packaging and interconnection technology. Known as ‘Mr. Reliability’ in the industry, he is the president of Engelmaier Associates, Inc., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. Prior to forming his own company in 1990, Mr. Engelmaier was a Distinguished Member of the Technical Staff at AT&T Bell Laboratories for 24 years.
Mr. Engelmaier is the author of over 160 technical publications in a variety of fields related to Electronic Packaging and Interconnection Technology and has been awarded a number of patents in these areas. He has conducted numerous tutorial workshops, contributed to numerous task forces, specifications, standards, and design guides. He chairs the IPC Product Reliability Committee, and is a member of the Editorial Advisory Board of Electronic Packaging and Production magazine. He was inducted into the IPC Hall of Fame in 2003, and is an IMAPS Fellow and life member. He has been the recipient of many honors and awards, including Best Paper Awards at IEEE ECC Conference in 1971, IEPS Conference in 1990, and Surface Mount International in 1991; the Distinguished Technical Staff Award from AT&T Bell Laboratories in 1986; the Electronic Packaging Achievement Award, jointly awarded from the IEPS and Electronic Packaging & Production Magazine, in 1987; the IPC President’s Award in 1988, and the IPC Committee Service Award in 1997. He is a Fellow and Life Member of IMAPS, formerly ISHM, and was inducted into the IPC Hall of Fame in 2003. For two of his developments he received R&D 100 Awards in 1978 and 1981 from Research & Development Magazine.
Born in Vienna, Austria, Mr. Engelmaier holds Mechanical Engineering degrees from TGM, Vienna, Austria, from the University of South Carolina, and from MIT. He is a member of ASME, ASTM, the Components, Hybrids, and Manufacturing Technology Society (CHMT) of IEEE, IPC, and SMTA.
Joseph Fjelstad is the founder of Verdant Electronics and co-founder of SiliconPipe with more than 35 years of experience in the field of electronic interconnections. Fjelstad has authored several books on the subject and is a frequent contributor to numerous industry magazines. He also has more than 170 U.S. patents either issued or pending. He received the IPC Presidents Award and was recognized in an industry poll as one the most influential persons in the electronics interconnection industry.
Ken Gilleo holds a Ph.D. in organic chemistry and has applied it to flex materials and processes. He has developed new products for over 35 years and holds over 30 US patents. His flex products have received 3 R&D 100 Awards. Ken has authored over 500 papers, presentations and workshops. He has written books on flex, PTF and BGAs. His 8th book, Industrial Forensics is a free web download. Ken gained flex experience while heading R&D at Sheldahl, Poly-Flex Circuits, and Tessera. Ken is CEO of ET-Trends LLC, a consulting, electronic package design, and IP firm dedicated to Emerging Technologies.
W. James Hall is a consultant to the PWB Assembly Industry and on the staff of ITM Consulting (Durham, NH). His area of responsibility includes working with OEM's and Contract Electronic Assemblers to solve assembly problems and optimize facility operations.
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 28 years. In the late 1970's he joined HTC a manufacturer of vapor phase soldering systems. As Senior Development Engineer, Jim was awarded Patents for the design of Single Vapor Batch, Vapor Phase Solder Leveling (an alternative to Hot Air Solder Level for PWB finishes), and Inline Reflow systems. These systems became the industry standard for reflow processing for several years.
Craig Hillman, Ph.D., CEO and managing partner of DfR Solutions, is an expert in the development and implementation of strategic reliability processes and operations. His specialties include best practices in Design for Reliability (DfR), strategies for transition to Pb-Free, supplier qualification, accelerated test plan development, and root-cause analysis of component, interconnect, and printed board failures. Dr. Hillman has over 40 publications and has presented on a wide variety of quality and reliability issues to over 250 companies and organizations, including Apple, Dell, Hewlett Packard, Motorola, IBM, Cisco Systems, General Electric, Emerson Electric, Lockheed Martin, Northrop Grumman, Raytheon, Honeywell, and General Dynamics, among others. Over the past four years, Dr. Hillman has led DfR Solutions through a period of tremendous growth into one of the largest and most well-renowned reliability organizations in the international electronics marketplace. His degrees include a post doctoral fellowship from Cambridge University, a PhD in materials from the University of California, Santa Barbara, and a BS in metallurgical engineering and material science from Carnegie Mellon.
Jennie Hwang, Ph.D., a pioneer and sustained leader in lead-free electronics, brings her 28-year SMT manufacturing experience combined with her 18-year lead-free R&D and hands-on production implementation to this presentation. She is a major contributor to SMT manufacturing since its inception. She has provided hands-on solutions to challenging production and reliability issues as well as served as an advisor to OEM/EMS worldwide and the U.S. government including U.S. Defense Department F-22 program.
Among her various awards and honors, Dr. Hwang is elected to the National Academy of Engineering; received the U.S. Congressional Certificates of recognition; honorary doctoral degree; YWCA Women Achievement Award; named R&D-Stars-to-Watch; and inducted into WIT International Hall of Fame. She is recently featured as one of the ten luminaries in the inaugural volume: “Road to Scientific Success - Inspiring Life Stories of Prominent Researchers”, published by World Scientific Publications. She is also inducted into the Ohio Women’s Hall of Fame.
Hwang is a holder of a number of patents and the author of over 300 publications including the sole authorship of several textbooks used worldwide. Her books, columns, and publications have been widely cited in the industry worldwide. Over the years, she has taught over 20,000 professionals and researchers in professional advancement courses, focusing on disseminating new technologies and providing the professional advancement education to the workforce. She is a popular keynoter and featured speaker at the national and international events across the U.S. and abroad including Israel, France, Germany, Belgium, Netherlands, Spain, England, Sweden, Denmark, Finland, Canada, Mexico, Brazil, Hong Kong, Singapore, Malaysia, Taiwan, Korea, Japan, China, Puerto Rico, Australia, etc…
Dr. Hwang has served as a reviewer for U.S. government programs and for numerous publications and research institutions worldwide.
Outside the industry, Hwang is a prolific writer and speaker on the topics of trade, business, and educational and social agenda. As an invited keynote speaker worldwide, sharing her thoughts and vision with various audiences, her topics range from commencement keynote speech at universities to the emerging technologies at the U.S. Patent and Trademark Office. Additionally, Dr. Hwang has served the U.S. Commerce Department Export Council, Department of Defense’s Globalization Committee and Forecasting Future Disruptive Technologies Committee, National Research Council’s Panel in Assessing National Laboratories and others...
Timothy Jensen is the Product Manger for PCB Assembly Materials in Indium Corporation’s Solder Products Business Unit. He is an SMTA-Certified SMT Process Engineer.
Tim has spent over a decade troubleshooting and optimizing SMT process lines. He works closely with Indium’s Technical Service, Research & Development, and Sales Teams to ensure that Indium continues to offer cutting edge products to meet unique challenges in the electronics assembly industry.
Having worked directly on hundreds of surface mount lines, and building thousands of different products, Tim understands each customer’s unique requirements, and tailors Indium’s products and services to meet or exceed those needs.
Tim has a Bachelors degree in Chemical Engineering from Clarkson University. He has authored several technical publications and numerous process and technical guidelines. He is a member of the SMTA and participates actively in several IPC standards development committees.
Bob Klenke is a mechanical engineer with over 25 years of experience in the electronics assembly industry with companies such as ERSA, Siemens, Plexus and Philips and has extensive experience with selective soldering over the past 9 years. He is a principal consultant of ITM Consulting, an international consulting firm specializing in process refinement and training, equipment evaluation and selection, techno-marketing studies
and legal services. He is also president and founder of RHK Associates, an independent firm providing technical marketing services to clients throughout the electronics assembly, plastics and automation industries.
Ronald C. Lasky, Ph.D., P.E., is currently a Senior Technologist at Indium Corporation and an Instructional Professor at Dartmouth College. Prior to these assignments, he had over twenty years experience in electronic and optoelectronic packaging at IBM, Universal Instruments and Cookson Electronics.
He has authored or edited 5 books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Six Sigma Program. Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a licensed professional engineer.
Andrew Mawer is currently the manager of the Packaging Applications and Analysis Labs within the Worldwide Quality organization at Freescale Semiconductor in Austin, Texas. Freescale was formerly the Semiconductor Products Sector of Motorola until becoming an independent company in 2004. Andrew has been with Freescale/Motorola for a total of 14 years. His primary areas of interest there are new packaging technology assessment and implementation and array packaging interconnect reliability characterization. He is also involved with package design, package assembly process development, and surface mount process characterization. Prior to joining Freescale/Motorola, he spent four years at Compaq Computer where he was involved with the implementation of some of the first high pin count BGAs in the industry. He has been active in authoring and presenting on many aspects of packaging and reliability at a variety of conferences, symposia, and in industry publications including two book chapters. Mr. Mawer is an active member of SMTA and serves on the Technical Committee of the SMTA International Conference, the Review Board of the SMTA Journal and as the President of the Central Texas SMTA chapter. Andrew received his B.Sc. degree in Mechanical Engineering from the University of Texas at Austin, in 1987 and an M.Sc. degree in Mechanical Engineering from Rice University in Houston, Texas, in 1989.
Rita Mohanty, Ph.D., is the Director of Advanced Development at Speedline Technologies, Inc. and a certified Six Sigma instructor. She has taught custom workshop starting from one day to 2weeks long. She provides certification course along with custom workshop. She has over fifteen years of experience in both industry and academic relating to engineering and electronic polymers, electronic packaging and assembly. She is a regular workshop contributor to SMTA and IMAPS.
Susan Mucha has over 25 years experience in the electronics manufacturing services (EMS) industry. She began her career at SCI Systems, Inc. in 1981. She held progressively more responsible positions in marketing, strategic planning and/or sales management at AVEX Electronics, Flextronics, XeTel and Sparton Electronics. Most recently, she spent four years as Vice President, Sales and Marketing and an officer of Elamex S.A. de C.V. In 2001, she founded Powell-Mucha Consulting, Inc. PMCI focuses on a range of consulting activities for the EMS market which include: strategic partner identification, market positioning strategy development and web-based training.
In addition to the results her programs have generated, Ms. Mucha has received numerous industry awards. In 1994, she was the recipient of the IPC's President's Award for her work in support of IPC's Electronics Manufacturing Services Industry (EMSI) Council. She has also won regional and international awards for marketing programs implemented at AVEX and XeTel.
Ms. Mucha holds an M.A.S. degree from the University of Alabama in Huntsville and a B.S. degree in journalism from the University of Florida. She is a Certified Manager through the Institute of Certified Professional Managers (ICPM) and an Accredited Business Communicator through the International Association of Business Communicators (IABC). She literally wrote the book on EMS account acquisition, having recently authored, Find It, Book It, Grow It: A Robust Process for Account Acquisition in Electronics Manufacturing Services.
Doug Peck is Founder and Director of the Advanced Electronics Interconnect Center in New Durham, NH. Founded in 1991, the AEIC provides solder training and consulting services to the electronics industry.
Doug has over 30 years experience in optical thermal design, nuclear power plant design, solar systems and equipment development. He has held management positions with manufacturers of vapor phase, IR and convection reflow, screen printers, and SMT rework systems.
He holds a BSME and MS in Engineering Management from Northeastern University. He has authored and presented extensively and holds several individual and joint patents. Doug is a member of SMTA and has served as Boston Chapter Treasurer for several years.
Ray Prasad held key technology positions at Boeing and Intel for 15 years before starting his consulting practice in 1994 on SMT, BGA, fine pitch and Lead Free implementation.. He was the SMT Program Manager at Intel responsible for developing and implementing SMT in Intel products and developed and taught in-house and design and manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed Intel PentiumProTM package program for Intel and introduced SMT into Boeing airplanes as the lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers, now also translated into Chinese, and numerous papers, Ray is a popular workshop leader at national and international conferences. A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA”. He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.
Ray is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to SMTA and the advancement of electronics industry. He is a columnist for the SMT magazine and also serves on its advisory board. Ray Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley. He is a registered Professional Metallurgical Engineer.
Lee Smith is recognized as an industry expert in 3D packaging, with over 27 years of diverse technology and end market applications experience. Beginning in early 80’s with flex
circuit based folded or dynamic flex assemblies for hearing aids, hard disk drives, cameras, portable PC and automotive applications.
Over the past 10 years Lee held 3D packaging technology, infrastructure and business development responsibilities at Amkor, Texas Instruments and Tessera with market emphasis in mobile handsets. Lee has authored or co-authored numerous patents, technical
papers and industry articles, and he is the author of the Stacked / 3D Packages chapter in McGraw-Hill's "Area Array Packaging Handbook."
Lee was responsible for definition, development and deployment of PoP technology while at TI. Successfully drove the co-development of PoP between Nokia, TI and Amkor, resulting in 15 month product launch from the final concept. The past few years, Lee has been instrumental in the infrastructure development for PoP including JEDEC standard development, stacking process capabilities and board level reliability reports. Lee’s 3D packaging workshop at past IWLPC and SMTAI events were highly rated by
attendees and conference organizers.
Bob Willis currently operates a training and consultancy business based in England. Bob is the Technical Manager of the SMART Group and a member of the technical committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. In the last 10 years focusing on lead-free manufacture which has earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. Bob has worked with the GEC Technical Directorate as Surface Mount Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division.
As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture for MOD and British Telecom. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of failure and defect analysis. Over the last 20 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.
Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia, South Africa and the Far East looking at areas of electronics consulting and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the ICT and PCIF originally one of Europe's largest printed circuit associations.
Bob has conducted workshops and set up production lines with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made.
Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He was responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob Willis helped organise the SMART Group-Lead Free Mission to Japan to examine and report on the current state of lead-free research and implementation of lead-free processes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry and coordinator of the LEADOUT Project for the SMART Group.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose, CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM in 1993, Phil Zarrow has helped numerous clients in such areas as
SMT Implementation and Assembly facility set-up
Manufacturing yield improvement
Equipment Evaluation and Selection
No-clean solder paste evaluation and process implementation
Lead-free Road-mapping and Process Implementation and Optimization
SMT Manufacturing Process Audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Reflow of Through-hole feasibility, development and implementation
Implementation of BGA, CSP and Flip-Chip
SMT process equipment benchmark testing and evaluation
SMT product development
Technical evaluations related to business acquisitions and mergers
Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of "SMT Glossary - Terms and Definitions", an industry reference book
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and is the author of the award winning "On the Forefront" and “Better Manufacturing” columns.
|
|
|
