Instructors
SMTAI covers the most important topics in the industry. Discover the latest technologies and techniques, stay current with industry trends and learn from the following respected tutorial instructors.
Please note the  preceding some of the instructor biographies listed below. These internationally respected STAR instructors have been recognized by the SMTA International Technical Committee for consistently receiving exceptionally high ratings from attendees for the previous courses they taught at SMTAI.
Dudi Amir is a Senior Process Engineer for Intel Inc. based in Oregon since 1994 supporting new technology development. He has participated in the development of assembly process for motherboards and mobile modules. He has also been a part of folded stacked and PoP packages development. Prior to working for Intel, Dudi was a process engineer for NEC Corporation supporting PBX and microwave board assembly. He received his Bachelor of Science in Mechanical Engineering from State University of New York at Buffalo and a Master of Science at Portland State University in Oregon. He has given many industry papers and has been awarded 9 US patents in package and board technologies.
Since 2002 Martin Anselm has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.
Daniel F. Baldwin, Ph.D. is the President and CEO of Engent, Inc. - Enabling Next Generation Technologies providing enabling manufacturing services and process technologies in the areas of microelectronics, flip chip, optoelectronics, and MEMS. He is one of the 2003 founding partners of Engent. He recently completed an Adjunct Associate Professor of Mechanical Engineering position at the Georgia Institute of Technology. He was a tenured Associate and Assistant Professor of Mechanical Engineering at Georgia Tech from 1995 through 2005. At Georgia Tech, he headed the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Prior to joining the faculty, he was a Member of the Technical Staff at Bell Laboratories, Princeton NJ working on electronic product miniaturization. He was formerly the Vice President of Siemens’ Advanced Assembly Technology Division. He also served as a research manager and research assistant at MIT’s Laboratory for Manufacturing and Productivity from 1990 to 1994, a Draper Fellow at the Charles Stark Draper Laboratory in Cambridge MA from 1988 to 1990, and an Engineering Intern for Mitsubishi Electric, Kamakura, Japan in 1987. Dr. Baldwin received his S.M. and Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively. Dr. Baldwin served as the Technical Program Chair of the IMAPS 2nd International Advanced Technology Workshop on Flip Chip Technology and the General Chair of the IMAPS 3rd International Advanced Technology Workshop on Flip Chip Technology. Dr. Baldwin was the recipient of the ASME Electrical and Electronics Packaging Division's Outstanding Young Engineer Award, 1998 and the Milton C. Shaw Outstanding Young Manufacturing Engineer Award, Society of Manufacturing Engineers, 1999. He has sixteen years of experience in the electronics manufacturing and packaging industries, eight U.S. Patents, over 220 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design. Dr. Baldwin is the President of the Surface Mount Technology Association (SMTA), and formerly on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing Division (SME/EM). He was on the editorial advisor board of Advanced Packaging magazine and HDI magazine. He is on the Board of Directors of Engent, Inc. and the Board of Advisors for IC Interconnect and was on the technical Board of Advisors of RFIDentics Corp. recently purchased by Avery Dennison Corp.
Charles E. Bauer, Ph.D., a graduate of Stanford University, focuses in the areas of strategic technology planning, market analysis and international business development. With more than 30 years experience, Dr. Bauer also serves on Advisory Boards for a variety of academic and governmental institutions bringing tremendous breadth and depth to his work. Currently, Chuck serves as Senior Managing Director at TechLead Corporation.
Founder, Pan Pacific Microelectronics Symposium
Fellow, IMAPS (1994), IMAPS President (2001-2002)
SMTA Board of Directors (1997-2001)
SMTA International Leadership Award (2007)
SMTA Luminary (2009)
Senior Member IEEE/CPMT
Founder, ISHM/IMAPS Advanced Technology Workshop Program
University of Portland Pamplin School of Business Administration Significant 75 Alumni Award
TechLead Corporation, an international management and engineering consulting firm with offices in Asia, Europe, and North America, stimulates the growth and success of its clients. Differentiating from other consultancies, TechLead emphasizes rigorous analysis and expert judgment resulting in actionable recommendations. TechLead's staff of seasoned professionals combines unique and extensive knowledge with more than 140 years of in-depth industry experience to transform data into INFORMATION and knowledge into UNDERSTANDING yielding substantiated insight into your organization’s most demanding business and technology needs.
Joe Belmonte is a Principal Consultant with ITM Consulting (Durham, NH). Joe has been a process engineer and process engineering manager in the electronic manufacturing industry for over 25 years with experience in all aspects of electronic product assembly operations. Past positions include Manager of Advanced Manufacturing Engineering as well as a Supplier Engineer at Bose Corporation, a Consultant at Cookson Electronics/Speedline Technologies Performance Solutions Group and Project Manager at Speedline Technologies Advanced Process Group, as well as Director of Process Technology, where he managed the Application Engineering and Process Development Functions. Joe also worked as a process engineer and process engineering manager at Motorola ISG for 18 years where he was Manager of the SMT Manufacturing Engineering Group.
At ITM, Joe's area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide.
Joe's area of expertise includes:
SMT implementation and assembly facility set-up
Manufacturing yield improvement
Equipment evaluation and selection
SMT manufacturing process audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Implementation of BGA, CSP and flip-chip and miniature component assembly
SMT process equipment benchmark testing and evaluation
SMT product development
Process structure and documentation development
Process design
Lead free assembly
Design of Experiments (DOE)
Statistical Process Control (SPC)
Quality Systems Review (QSR)
Process layout and installation
Process optimization
Pin in Paste Process
New Product Introduction (NPI)
Six Sigma and Lean Manufacturing
Manufacturing Systems Assessment
Joe is well-known throughout Asia and SE Asia for both his process work and teaching engagements. Joe has written papers for and made technical presentation at numerous industry trade shows and professional society meetings. Joe is the co-holder of the United States Patent (US Patent Number 6,572,702) for High Speed Electronic Systems and Methods.
Joe has been a senior member of the Society of Manufacturing Engineers (SME) for over 20 years. He served as a member of the Electronic Manufacturing Association of SME Board of Advisors and was the chairman of the EM/SME board of advisors in 1996 and 2002. He was a member of the Motorola Corporate TOPS (Technical Operations) Council. He has also authored a technical column for Circuit Assembly Magazine. Joe has been a member of the Surface Mount Technology Association since 1985 and currently serves as a member of the SMTA Board of Directors.
Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Durham, NH). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:
SMT implementation and assembly facility set-up
Manufacturing yield improvement
Counterfeit Component avoidance and mitigation
Equipment evaluation and selection
Lead-free road-mapping and implementation
SMT manufacturing process audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Implementation of BGA, CSP and flip-chip
SMT process equipment benchmark testing and evaluation
SMT product development
Process structure and documentation development
Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 200 engineers in the US, Canada, Mexico, Hong Kong, and China. Mr. Hall coordinates and implements all updates and improvements to the exams and course materials.
As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered at Dartmouth College, presenting units on subjects including:
LEAN
FMEA
DFM
TRIZ
Cost Estimating
Failure Analysis
Tear-Down Analysis
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 26 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for NEPCON, IMAPS and SMTA. Jim is also the co-host of Circuitnet/Circuitmart’s “BoardTalk” audio program.
Matt Hamand is a Sr. Materials and Process engineer at Rockwell Collins, a position he has held since 2003. His responsibilities include failure analysis, process troubleshooting, surface mount connect reliability, and fiber optic process development. Matt obtained a Bachelors degree in Materials Science & Engineering from Iowa State University in 2004. He is a member of the American Society of Materials, Surface Mount Technology Association, and Electronic Device Failure Analysis Society. Matt has published four industry papers on electronics manufacturing concentrating on lead free materials and products.
David Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his present assignment he serves as an "expert of call" to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published numerous technical papers with the 2010 SMTA International Conference on lead-free thermal cycle test results presentation being selected as “Best of Conference”.
Jennie Hwang, Ph.D., a pioneer and long-standing leader in SMT manufacturing, brings her 30-year SMT practice combined with her sustained 20-year lead-free R&D and manufacturing experience to this course. A major contributor to Surface Mount manufacturing implementation since its inception through hands-on production and as an advisor to OEMs, EMS and U.S. government, Dr. Hwang has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues for both commercial and military applications. She holds patents and has 300+ publications to her credit, including the sole authorship of several internationally-used textbooks. Dr. Hwang has been a frequent keynote/featured speaker at worldwide events (United States Patent and Trademark Office, Federal Women’s Program, numerous industry events) and has lectured to more than 30,000 professionals and managers in professional development courses. She also has served on the Board of NYSE Fortune 500 companies and civic, government and university boards and committees, including U.S. Commerce Dept. - Export Council, U.S. Defense Dept. - Globalization Committee, National Research Council - Forecasting Future Disruptive Technologies Committee, National Research Council – National Laboratories Assessment Panel. She is a reviewer of various government programs. Her formal education includes Harvard Business School Executive Program and Ph.D. M.S., M.S., B.S. degrees in Materials & Metallurgical Engineering, Inorganic Chemistry, Liquid Crystals Science and Chemistry, respectively. She has held various senior executive positions with Lockheed Martin, SCM Corp, Sherwin Williams Co, and IEM Corp. and is currently a principal of H-Technologies Group, providing business and manufacturing solutions to the electronics industry. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.
Bob Klenke is a consultant to the printed circuit board assembly industry and a staff member of ITM Consulting. His area of responsibility includes working with OEM's and CEM's to solve assembly problems and optimize facility operations. His expertise includes process optimization, process troubleshooting and value-added defect resolution strategies. Bob also holds the position of Managing Director with ITM Marketing, a full service technical marketing and market research firm.
Dale Lee is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.
Dale is an author, instructor and speaker on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA" and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF .
He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.
Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA.
S. Manian Ramkumar, Ph.D. is a professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center and the Automation laboratories at RIT. The electronics packaging Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site.
Rob Rowland is currently a Staff Technology Engineer at RadiSys Corporation in Hillsboro, Oregon. Rob has more than 25 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA). He has been the technical program director of SMTA International for more than 10 years. In 1999 he received the SMTA Founders Award and in 2010 he received the SMTA Member of Technical Distinction Award. In 2005 and 2008 he received Distinguished Committee Service Awards for his contributions to IPC-7095. Rob is a frequent author and speaker at industry trade events. He also writes a manufacturing column for SMT Magazine in addition to serving on the editorial advisory board. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
Randy Schueller, Ph.D. received his Ph.D. in materials science engineering in 1992 and began working in the electronics industry with 3M where he led a team in the development of many IC packaging products. This was followed by 4 years as Director of IC Packaging and Engineering at Extreme Devices. Randy then moved to Dell in 2003. As Sr. Manager of Dell’s Component Engineering and Failure Analysis Groups where he helped drive lead-free solutions across all of Dell’s product lines. In 2008 Randy moved to Minneapolis and accepted a position with DfR Solutions as a Sr. Member of Technical Staff. Randy has 15 patents and has authoring and presenting over 40 papers for the electronics industry.
Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and as an educator.
In addition to tutorial and workshop programs for industry related events Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronics Laboratories in Salina.
Solberg holds several patents and awards for IC packaging innovations including the folded-flex 3D package technology and is the author of ‘Design Guidelines for Surface Mount and Fine-Pitch Technology’ a McGraw-Hill publication.
Vern also participates in and supports several industry organizations including IEEE, IPC, JNAC, SMTA and IMAPS. Current IPC activity:
• Chairman of the task group that developed the IPC-7094, ‘Design and Assembly Process Implementation for Flip Chip and Die Size Components’ • Co-chairs the task group developing the IPC-7093, ‘Design and Assembly Process Implementation for Bottom Terminal Components (SON and QFN)’. • Chairman of the task group assigned to develop the IPC-7092, ‘Design and Assembly Process Implementation for Buried Components'
Bob Wettermann, prior to owning his own businesses, made his way through a variety of career stops at companies ranging from a start-up venture, through mid-tier companies, and all the way to a Fortune 100 company. BEST Inc, his business, provides test, rework and PCB repair services, training services as well as PCB repair products. Bob was awarded an electrical engineering degree from the University of Illinois and also holds an MBA from DePaul University. He holds patents in surface science, electrical controls, and electronics assembly products. Currently Bob is a member of the SMTA and is a CIT IPC instructor. Bob enjoys spending time with his family, road bicycling, and playing squash.
Bob Willis has been involved with the introduction and implementation of lead-free process technology for the last seven years. He recently received A SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry to help the implementation of the technology. He was responsible for co-ordination and introduction of the first series of hands-on lead-free training workshops in Europe for Cookson Electronics during 1999-2001. These events were run in France, Italy and the UK and involved lead-free theory, hands-on paste printing, reflow, wave and hand soldering exercises. Each non commercial event provided the first opportunity for engineers to get first hand experience in the use of lead-free production processes and money raised from the events was presented to local charity. More recently he co-ordinated the SMART Group Lead-Free Hands On Experience at Nepcon Electronics 2003. This gave the opportunity for over 150 engineers to process four different PCB solder finishes, with two different lead-free pastes through convection and vapour phase reflow. He also ran the Experience 2 & 3 in 2004/2005. 2006 sees Nepcon back at Birmingham and Bob will again be organising the features. Bob was recently presented with awards from the SMTA and IPC for his industry support.
He has also run training workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe. Bob has organised and run three lead-free production lines at international exhibitions Productronica, Hanover Fair and Nepcon Electronics in Germany and England to provide an insight to the practical use of lead-free soldering on BGA Ball Grid Array, CSP Chip Scale Package, 0210 chip and through hole intrusive reflow connectors. This has resulted in technical papers being published in Germany, USA, and the United Kingdom. Bob also defined the process and assisted with the set-up and running of the first Simultaneous Double Sided Lead-Free Reflow process using tin/silver/copper for reflow of through hole and surface mount products. This year 2005, he will be running a Lead-Free Production and Seminar feature at Productronica in Munich Germany with Global SMT magazine. Bob also had the pleasure of contributing a small section to the first Lead-Free Soldering text book “Environment - Friendly Electronics: Lead-Free Technology” written by Jennie Hwang in 2001. The section provided examples of the type of lead-free defects companies may experience in production. Further illustrations of lead-free joints have been featured in here most recent publication “Implementing Lead-Free Electronics” 2005.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose, CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM in 1993, Phil Zarrow has helped numerous clients in such areas as
SMT Assembly and Soldering Failure Analysis
EMS/Supplier Process and Quality Assessment Audits
Counterfeit Component Avoidance and Interception Programs
SMT Implementation and Assembly facility set-up
Lead-free Process Implementation and Optimization
Manufacturing yield improvement
Equipment Evaluation and Selection
No-clean and lead-free solder paste evaluation and process implementation
SMT Manufacturing Process Audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Reflow of Through-hole feasibility, development and implementation
Implementation of BGA, CSP and Flip-Chip
SMT process equipment benchmark testing and evaluation
SMT product development
Technical evaluations related to business acquisitions and mergers
Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions".
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of Circuitnet/Circuitmart’s “Boardtalk” audio program.
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What you are saying:
 The three biggest draws for me to SMTAI are its world class electronics manufacturing conference, its excellent industry networking opportunities and its best in class exhibition.
Dan Baldwin, Ph.D.
Engent, Inc.
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