Call for Papers
Be Part of the Solution...
Participate in the industry's best technical conference
On behalf of the SMTA International Technical Committee, I invite you to submit an abstract for the 2016 conference. Short course (1/2 day - 3.5 hours) proposals are also being solicited.
Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.
There are many benefits to participating!
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for $1,000 cash awards for the 'Best of Conference', 'Best of Proceedings', and 'Best International' papers.
5. $500 award for the best student paper.
We look forward to reviewing your abstract!
SMTAI Committee Chair
Abstract Deadline Extended: March 25, 2016
Acceptance: April 27, 2016 | Final Papers Due: July 15, 2016
IMPORTANT: Please be sure to obtain approval to both write and present your paper prior to submitting an abstract. When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.
The Technical Committee is soliciting abstracts in the following categories:
2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental Testing Failure Analysis Techniques Fine Pitch BGA Flip Chip High Temperature Packaging Lead Finishes Magnetic Soldering
MEMS and Sensors
Moisture Sensitive Devices (MSD)
Package on Package (PoP)
Photovoltaics and Solar
System in Package (SiP)
Through Silicon Vias (TSVs)
Wafer Level Packaging (WLP)
3D Board Assembly
Alternate Solder Alloys
Bottom Terminated Components
Cavity Board Assembly
Cleaning, Conformal Coating and Potting
Connector Assembly to PCB
DFX/Design for Six Sigma
Direct Chip Attach to PCB (DCA)
Dispensing & Underfill
Halogen and Halogen-Free
Head on Pillow Defect/Warpage Induced Solder Joint Defects
High Melting Point Solder
Leadless Area Array Packages
Low Temperature Processing
Non-Wet Open (NWO) Defects
Reflow Soldering/ Wave Soldering
Rework and Repair of QFNs (01005, Leadless Components, PoP, Rework Reliability
Solder Paste/Solder Voids in Joints
Thermo Compression Bonding
Underfill/ Corner Glue/ Other Polymeric Reinforcements
Vapor Phase Reflow
Doing Business in Overseas
<= 0.3mm Pitch Area Array Technologies
3D Printing & Design Rules
Assembly to Flex Substrates
Assembly to Glass Substrates
Embedded Active Technology
Embedded Passive Technology
Jetting of Solder Pastes
Microsystems Packaging / Modular Microsystems
Nanotechnology, Materials, & Electronics
New Materials and Processes
Plastic 3D PCB to PCB Technology
Power or Thermal Management
Printed Electronics Technology
Reliability of Nanodevices
Resin Reinforcement Solder Pastes
Sensors and Manufacturing
Smart Manufacturing Systems
Small Die Size Singulation
Solid State Lighting
System in a Package
Thermal Interface Materials
Touch Screen Technologies
Harsh Environment Applications
(Military, Aerospace, Automotive, Industrial, Oil & Gas):
Components and Reliability
High Lead Solder Replacement
High Temperature Electronics
Substrates and Finishes
Black Pad and Surface Finish Defects
Conductive Anodic Filament (CAF)
Embedded Passive/Active Components
High Power PCBs
Micro-vias (including filled/unfilled)
New Laminate Materials
New Surface Finishes & Solderability
Acoustic Imaging (C-SAM)
Benefits of AOI & SPI
Thanks and the SMTAI Technical Committee looks forward to hearing from you!
SMTAI Conference Chair, Rob Rowland, Axiom Electronics
SMTA VP Technical Programs, Raiyo Aspandiar, Ph.D., Intel Corporation