Come. Focus.
Participate in the industry's best conference
The SMTA International Technical Committee invites you to submit an abstract for the 2008 conference. Short course descriptions are also being solicited.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature.
Papers are being solicited in the following categories:
Emerging Technologies: New Materials and Processes, Consumer Applications, System in a Package, MEMS/RF, MEMS/MOEMS, Optoelectronics, Wireless Applications including Bluetooth and Wi-Fi, Nanotechnology, 0201/02005, Components and Assembly, "Getters".
Components: BGA, Battery Interactions, CSP (including Wafer-Level Packages), Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine Pitch Technology, Flip Chip / Direct Chip Attach, Harsh Environments (including automotive, military, and aerospace), Lead/Termination Finish, Leadless Packaging, Multichip Packages (including 3-D Packaging, Package on Package).
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Moisture Sensitivity, Placement, Printing, Reflow Soldering, Rework and Repair, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Supplier Engineering, Wave Soldering, Yield Improvement.
PCB Technology: Black Pad, Embedded Passive and Active Components, HDI, Microvias (including filled and unfilled), Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish.
Process Control: AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray.
Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, Technology Roadmaps.
Choose the Submit Abstract button below and fill out all information on the following form.
IMPORTANT: PLEASE BE SURE TO OBTAIN APPROVAL TO BOTH WRITE AND PRESENT YOUR PAPER PRIOR TO SUBMITTING AN ABSTRACT. ONCE A PAPER IS ACCEPTED IT IS OUR EXPECTATION THAT YOU HAVE THE APPROVALS REQUIRED.
Abstracts Due: January 7, 2008. Late submissions will be accepted until January 31 | Acceptance: March 3, 2008 | MANUSCRIPTS DUE: Monday, June 2, 2008
There are many benefits to participating:
1. You will be making a contribution to our industry by sharing your work.
2. You will help to advance the industry and your company as you will be recognized by industry colleagues.
3. Discounted conference registration.
4. $1,000 cash awards for the best of conference paper, best of proceedings paper, and best international paper.
Thanks and we'll look forward to hearing from you!
Best regards,
SMTAI Conference Chairman Rob Rowland, RadiSys Corporation
SMTA VP Technical Programs Bill Barthel, Plexus Corporation
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