Call for Papers
Be Part of the Solution...
Participate in the industry's best technical conference
The SMTA International Technical Committee invites you to submit an abstract for the 2013 conference. Short course (1/2 day - 3.5 hours) proposals are also being solicited.
Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.
There are many benefits to participating!
You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for $1,000 cash awards for the 'Best of Conference', 'Best of Proceedings', and 'Best International' papers.
We will be accepting late submissions until March 29th
Acceptance: April 29, 2013 | Final Papers Due: July 31, 2013.
Choose the Submit Abstract button below and fill out all information on the following form.
Emailed abstracts will not be accepted, they must be submitted online.
IMPORTANT: Please be sure to obtain approval to both write and present your paper prior to submitting an abstract. When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.
The Technical Committee is soliciting abstracts in the following categories:
Advanced Packaging/Components:
3D Packaging and Integration, BGA/CSP, Biomedical Packaging
Bumping, Chip on Board, Copper Wire Bonding, Direct Chip Attach, Embedded and Miniature Passives, Failure Analysis, Fine Lead Pitch, Flip Chip, Hermetic Packaging for High Rel, High Temperature Packaging, Lead Finishes, Leadless Pkgs (LGA/QFN/BTC), MEMS and Sensors, Package on Package (PoP), Photonics, Photovoltaics and Solar, Reliability, Through Silicon Vias (TSVs), Tin Whiskers, and Wafer Level Packaging (WLP)
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Conformal Coating and Potting, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head on Pillow Defect/Warpage Induced Solder Joint Defects, High Melting Point Solder, Land Pattern Design, Lead-Free Soldering/Reliability, Lean Manufacturing, Low Temperature Soldering, Low Volume/Prototype, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill and Corner Glue, Vapor Phase Reflow, Wave Soldering, and Yield Improvement.
Business/Supply Chain:
Capacity Modeling, Conflict Minerals, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing, Operations Management, Remaining Competitive, RoHS/REACH Compliance, Supplier Management, and Technology Roadmaps.
Emerging Technologies:
0201/01005 Components/Assembly, Advanced Packaging, Consumer Applications, Electronic Printing Technology, Embedded Technology, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Microsystems Packaging / Modular Microsystems, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Printed Electronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, Solid State Lighting, System in a Package, Thermal Interface Materials, and Wireless Applications.
Harsh Environment Applications:
Alternate Energy, Components and Reliability, Corrosion, Lead-free Issues, Substrates and Finishes, Thermal Management, and Tin Whiskers.
PCB Technology:
Black Pad and Surface Finish Defects, Creep Corrosion, Embedded Passive/Active Components, Halogen Free, HDI, Microvias (including filled/unfilled), Moisture Sensitivity, High Power PCBs, Soldermask, Substrate Reliability, Substrate Solderability, and Surface Finish.
Process Control:
Acoustic Imaging (C-SAM), AOI, CIM, In-Circuit Test, Process Modeling, Software, Solder Paste Inspection, Test Strategies, and 2D/3D X-Ray
Thanks and the SMTAI Technical Committee looks forward to hearing from you!
SMTAI Conference Chair, Rob Rowland, Axiom Electronics
SMTA VP Technical Programs, Marie Cole, IBM Corporation
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 I was able to find answers to sticky technical questions after relationships were built at SMTAI.
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St. Jude Medical
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