Call for Papers
Lei from Intel relates her experience as a speaker at SMTA International
Be Part of the Solution...
Participate in the industry's best technical conference
The SMTA International Technical Committee invites you to submit an abstract for the 2012 conference. Short course (1/2 day - 3.5 hours) proposals are also being solicited.
Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.
There are many benefits to participating!
You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for $1,000 cash awards for the 'Best of Conference', 'Best of Proceedings', and 'Best International' papers.
Abstracts Due: March 12, 2012 | Acceptance: April 30, 2012 |
Final Technical Papers Due: July 27, 2012.
Choose the Submit Abstract button below and fill out all information on the following form.
Emailed abstracts will not be accepted, they must be submitted online.
IMPORTANT: Please be sure to obtain approval to both write and present your paper prior to submitting an abstract. When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.
The Technical Committee is soliciting abstracts in the following categories:
Advanced Packaging/Components: 0.3mm Pitch Area Array, 3D Packaging and Integration, BGA / CSP, Biomedical Packaging, Bumping, Chip on Board, Direct Chip Attach, Embedded and Miniature Passives, Failure Analysis, Fine Lead Pitch, Flip Chip, High Temperature Packaging, Lead Finishes, Leadless Packages (LGA / QFN / BTC), MEMS and Sensors, Package on Package (PoP), Photonics, Photovoltaics and Solar Packaging, Reliability, Solid and Collapsible Wafer Bumps, Through Silicon Vias (TSVs), Tin Whiskers, Wafer Level Packaging (WLP)
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Conflict Minerals, Conformal Coating and Potting, Connector Technology, Copper Erosion, Copper Wire Bonding, DFX/Design for Six Sigma, Dispensing, Epoxy Flux, Equipment Selection, Flux and Solder, Halogen and Halogen-Free, Head-in-Pillow Defect, High Melting Point Solders, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reduction of Silver and Precious Metals in Interconnection Materials, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill and Corner Glue, Vapor Phase Reflow for High Reliability / Thermal Mass Assemblies, Wave Soldering, Yield Improvement.
Business / Supply Chain: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS/REACH Compliance, Supplier Management, Technology Roadmaps.
Emerging Technologies: 0201/01005 Components and Assembly, Advanced Packaging Concepts/Applications, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives / Passives and Assembly, Flexible Electronics, LED Technology / Assembly / Reliability, MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Printed Electronics, Power Electronics Packaging, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, Solid State Lighting, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi.
Harsh Environment Applications: Alternative Energy, Components and Component Reliability, Corrosion, Extreme Environmental Applications, Lead-free Issues for Harsh Environments, Substrates and Finishes for Harsh Environments, Thermal Management, and Tin Whiskers.
PCB Technology: Black Pad and Surface Finish Defects, Board Warpage, Creep Corrosion, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish.
Process Control: Acoustic Imaging (C-SAM), AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray.
Thanks and the SMTAI Technical Committee looks forward to hearing from you!
SMTAI Conference Chair, Rob Rowland, RadiSys Corporation
SMTA VP Technical Programs, Marie Cole, IBM Corporation
|
|
View the scrapbook of SMTAI 2011!
What you are saying:
 Your boss should be forcing you to attend SMTAI.
Bob Willis
ASKBobWillis.com
|