SMTA International

Conference: Sep. 27 - Oct. 1, 2015
Exhibition: Sep. 29 - 30, 2015

Donald Stephens Convention Center
Rosemont, IL, USA
More About SMTA

Conference At-A-Glance

  Sunday, September 27
T1 Advanced Closed Loop Process Control for Selective Soldering 8:30am - 12:00pm
T2 It is Time for Low Temperature - Low Temperature Solders, New Developments, and Their Applications 8:30am - 12:00pm
T3 Stencil Printing – A Practical Guide to Defect Prevention and Yield Improvement 8:30am - 12:00pm
T4 0201, 01005 & Smaller Design, Assembly, Inspection and Rework 8:30am - 12:00pm
T5 Solder Reflow Fundamentals – Thermal Profiles & Defect Mitigation 1:30pm - 5:00pm
T6 Manufacturing Wrong: Case Studies in Nonconformance 1:30pm - 5:00pm
T7 SMT Design and Assembly Process Principles for Flexible and Rigid Flex Circuits 1:30pm - 5:00pm
T8 Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys 1:30pm - 5:00pm



  Monday, September 28
Speaker Breakfast 7:00am - 8:00am
HE1 Reliability of Components in Harsh Environments 8:00am - 10:00am
T9 Failure Analysis: Analytical Techniques and What They Tell You About Your Failure 8:30am - 12:00pm
T10 3D Packaging for the SMT Specialist 8:30am - 12:00pm
T11 Solder Joint Reliability – Principles and Applications 8:30am - 12:00pm
T12 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 1 8:30am - 12:00pm
T13 ZEN and Science of Electronic Assembly - Best Practices in SMT Assembly - Part 1 8:30am - 12:00pm
ET1 Alternate Alloys 9:00am - 10:30am
HE2 Electronics in Corrosive Environments 10:30am - 12:30pm
ET2 Alternate Alloys (Continued) 11:00am - 12:30pm
MarCom Committee Meeting 11:30am - 12:30pm
ETKN ET Keynote Lunch 12:30pm - 1:30pm
HEKN HE Keynote Lunch 12:30pm - 1:30pm
ET3 Wearable Electronics Technology Development 1:30pm - 3:00pm
HE3 Materials for Harsh Environments 1:30pm - 3:00pm
T14 Reliability of Electronics – the Role of Intermetallic Compounds 1:30pm - 5:00pm
T15 "Tipping Point" Cleaning and Deflux 1:30pm - 5:00pm
T16 Design for Manufacturing (DFM): Today's Design Challenges Require New Assembly Methods 1:30pm - 5:00pm
T17 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 2 1:30pm - 5:00pm
T18 ZEN and Science of Electronic Assembly - Best Practices in SMT Assembly - Part 2 1:30pm - 5:00pm
Certification Committee Meeting 2:00pm - 3:00pm
ET4 Evolving Technologies Panel 3:30pm - 5:00pm
Chapter Leadership Committee Meeting 4:30pm - 6:00pm
Women's Networking Connection 5:00pm - 6:30pm



  Tuesday, September 29
Speaker Breakfast 7:00am - 8:00am
SMTA Annual Meeting and Opening Keynote Address 8:00am - 10:00am
Exhibits Open 9:00am - 5:00pm
L3 1 Come and See Where the Future is Going! 11:00am - 12:30pm
HE4 Electronics Ruggedization Through Coating 11:00am - 12:30pm
APT1 3D IC and PoP Assembly 11:00am - 12:30pm
EMS1 Taking the Cost out of EMS: Getting the Best Return for Lean Initiatives 11:00am - 12:30pm
FSA1 Improved Area Array Component Solder Reliability through Use of Underfills, Edge Bonds and Encapsulants 11:00am - 12:30pm
MFX1 Pathways to Prolific Printing 11:00am - 12:30pm
PS Poster Session 12:00pm - 2:00pm
Chapter Officer's Meeting 12:30pm - 2:00pm
Training Committee Meeting 12:30pm - 2:00pm
International Attendee Meeting 2:00pm - 3:00pm
L3 2 Solder Recycling and Recovery 2:00pm - 3:30pm
APT2 BGA Reliability 2:00pm - 3:30pm
FSA2 New Developments in No-Clean Solder Paste and Flux Technology and Reliability 2:00pm - 3:30pm
MFX2 Challenges in Advanced Package on Package Applications 2:00pm - 3:30pm
HE5 Thermal Management (Get the Heat Out!) 2:00pm - 4:00pm
Great Lakes Chapter Meeting 3:00pm - 3:30pm
MSD Council Meeting 3:00pm - 4:00pm
Ambassador's Meeting 4:00pm - 5:00pm
APT3 Advances in WLP and CSP Interconnect Design and Assembly Processes 4:00pm - 5:30pm
FSA3 The How’s and Why’s of Fluxes in Electronics Assembly 4:00pm - 5:30pm
Retirement Celebration for JoAnn Stromberg 6:00pm - 9:00pm



  Wednesday, September 30
Speaker Breakfast 7:00am - 8:00am
Exhibitor Appreciation Breakfast 8:00am - 9:00am
FSA4 The Influence and Impact of Materials & Process Selection on Reliability 8:00am - 9:30am
INS1 X-ray Inspection: The Growing Complexity of Applications and Capability Needs for Tomorrow’s PCB’s 8:00am - 9:30am
MFX3 Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies 8:00am - 9:30am
SUB1 Investigating Surface Finish Reliability and Attributes Outside of Solderability 8:00am - 9:30am
L3 3 Factory Automation – Optimizing to Reduce Cost and Increase Reliability and Yield 8:00am - 10:00am
APT4 Improvements in Voiding and Reliability of BTCs 8:00am - 10:00am
Exhibits Open 9:00am - 4:00pm
Membership Committee Meeting 10:00am - 11:30am
L3 4 Real World SMT Production Problems, Investigations and Solutions 10:30am - 11:30am
FSA5 Solder Joint Reliability Assessment 10:30am - 12:00pm
INS2 PCB Quality Management 10:30am - 12:00pm
MFX4 Ruggedization Technologies & Materials to Meet Today's Electronic Requirements 10:30am - 12:00pm
SUB2 Emerging Topics on Design and Process Technologies of Printed Circuit Boards 10:30am - 12:00pm
APT5 Advances in Electronics Failure Analysis 10:30am - 12:30pm
Users Solution Lunch 11:45am - 12:45pm
L3 5 Product Life Cycle 2:00pm - 3:00pm
APT6 Solder-Joint Reliability 2:00pm - 3:30pm
FSA6 Test Optimization for Improved Quantification of Material and Assembly Quality 2:00pm - 3:30pm
INS3 Advances in Process Control 2:00pm - 3:30pm
MFX5 Innovation and Process Control for Liquid Soldering Processes 2:00pm - 3:30pm
SUB3 Surface Finish Parameters that Impact Interconnect Reliability 2:00pm - 3:30pm
APT7 Ceramic Column Grid Arrays – Applications, Materials and Optimization 4:00pm - 5:30pm
SUB4 Influence of Finishes on Printed Circuit Board (PCB) Reliability 4:00pm - 5:30pm
Technical Committee Meeting 5:30pm - 6:30pm



  Thursday, October 1
Speaker Breakfast 7:00am - 8:00am
LF1 Universal Instruments Consortium Pb-Free Project Update 8:30am - 10:00am
T19 LED, BGA, and QFN Assembly and Inspection 8:30am - 12:00pm
Golf Tournament 8:30am - 1:00pm
LF2 Corrosion and Flux Residue Impacts of Lead Free Solders 10:30am - 12:00pm
LF3 Research Challenges with Tin Whiskers and Mitigation 1:00pm - 2:30pm
LF4 Lead-Free Solder Joint Reliability: Recent Advances 3:00pm - 4:30pm




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