SMTA International  

Conference: Sep. 28 - Oct. 2, 2014  
Exhibition: Sep. 30 - Oct. 1, 2014  

Donald Stephens Convention Center  
Rosemont, IL  
 

Conference At-A-Glance

  Sunday, October 13
TUTORIALS (MORNING)

T1 Advanced Component Packages and Processes
8:30am - 12:00pm
(Room 104)

T2 Electrochemical Migration and CAF Formation
8:30am - 12:00pm
(Room 202C)

T3 Design and Assembly for Flexible and Rigid Flex Circuits
8:30am - 12:00pm
(Room 103A)




TUTORIALS (AFTERNOON)

T5 SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
1:30pm - 5:00pm
(Room 104)

T7 The Deadly Sins of SMT and Lead-Free Assembly
1:30pm - 5:00pm
(Room 103A)

T8 3D Packaging, Interconnect and Assembly
1:30pm - 5:00pm
(Room 103B)




  Monday, October 14
TUTORIALS (MORNING)

T9 SMT Manufacturing: Preventing Production Defects and Failures - Part I
8:30am - 12:00pm
(Room 202C)

T11 Design and Assembly Process Challenges for BTCs
8:30am - 12:00pm
(Room 104)

T12 Failure Analysis: Lessons Learned in Manufacturing and Research
8:30am - 12:00pm
(Room 103B)

T16 Soldering Technology for SMT: Achieving High Yields and Reliability
8:30am - 12:00pm
(Room 103B)

TUTORIALS (AFTERNOON)

T14 SMT Manufacturing: Preventing Production Defects and Failures - Part II
1:30pm - 5:00pm
(Room 202C)

T15 DFM: Impacts to Achieving High Yield Process with Today's PCB and Component Packaging
1:30pm - 5:00pm
(Room 104)

T17 Implementing High Reliability Lead-Free Assembly and Test Methodologies
1:30pm - 5:00pm
(Room 201C)




AIMS/HARSH ENVIRONMENTS SYMPOSIUM

HE1 Thermal Issues with Harsh Environment Electronics
8:30am - 10:15am
(Room 202A)

HE2 Modeling and Predictions in Harsh Operational Environments
10:30am - 12:00pm
(Room 202A)

HE3 Power Electronics Packaging
1:30pm - 3:00pm
(Room 202A)

HE4 Lead-Free for High Reliability Applications
3:30pm - 5:30pm
(Room 202A)




EVOLVING TECHNOLOGIES SUMMIT

ET1 Printed Electronics Technology Status and Implementation Challenges
10:30am - 12:00pm
(Room 203C)

ET Keynote Lunch
12:15pm - 1:15pm
(Room 203C)

ET2 Materials, Materials, Materials
1:30pm - 3:00pm
(Room 203C)

ET3 Evolving Technologies Panel — FREE!
3:30pm - 5:00pm
(Room 203C)




  Tuesday, October 15
FREE SPECIAL EVENT
Opening Keynote Session
F-35 Lightening II: The Centerpiece for 21st Century Global Security
8:00am - 9:30am
(Room 203A/B)
Free Breakfast!




TECHNICAL SESSIONS

AAT1 Addressing the Challenges of Emerging Package Technologies
10:30am - 12:30pm
(Room 202B)

MFX1 Challenges and Solutions for Liquid Soldering Processes
10:30am - 12:00pm
(Room 202D)

EMS1 Seamless Sourcing Teams: Best Practices in Information Exchange
10:30am - 1:00pm
(Room 203C)

ENV1 Sustainability and Environmental Regulations
10:30am - 12:00pm
(Room 104)

HE5 Reliability of Pb-Free Electronic Products Subjected to Harsh Field Conditions
2:00pm - 3:30pm
(Room 202A)

AAT2 QFN Package Reliability
2:00pm - 3:30pm
(Room 202B)

MFX2 Advanced Studies in Bumped Component Reliability
2:00pm - 3:30pm
(Room 202D)

SMT1 Process Development for Miniaturized and High Reliability Electronics
2:00pm - 3:30pm
(Room 202C)

HE6 Manufacturing for Harsh Environments
4:00pm - 5:30pm
(Room 202A)

AAT3 Pad Cratering
4:00pm - 5:30pm
(Room 202B)

MFX3 Conformal Coating: The Next Level for High Reliability in Harsh Environments
4:00pm - 5:30pm
(Room 202D)

SMT2 Performance of Stencil Applied Coatings
4:00pm - 5:30pm
(Room 202C)

SPOTLIGHT SESSIONS! FREE!

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 1 Polymeric Reinforcement of BGAs
9:30am - 11:00am
(Exhibit Hall Theatre)

SPOTLIGHT 2 CAMEST: The Newest Industry Coalition
11:30am - 12:30pm
(Exhibit Hall Theatre)

SPOTLIGHT 3 BGA Pad Cratering in PCB Laminates
1:30pm - 2:30pm
(Exhibit Hall Theatre)




FREE Lunch!
12:00pm - 2:00pm, Exhibit Hall

Poster Session
12:00pm - 2:00pm | Exhibit Hall




CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)







  Wednesday, October 16
TECHNICAL SESSIONS

AAT4 Development and Optimization of 0.3mm Pitch BGA Packages for Mobile Applications
8:00am - 9:30am
(Room 202B)

MFX 4 Reliability of Low Silver Alternative to SAC Alloys
8:00am - 9:30am
(Room 202D)

SMT3 BGA Profiling and Reballing
8:00am - 9:30am
(Room 202C)

SUB1 PCB Fabrication and Reliability
8:00am - 9:30am
(Room 204A)

AAT5 Advances in PoP: Process and Reliability
10:30am - 12:30pm
(Room 202B)

MFX5 Alloy Selection and its Influence on Electronic Assembly
10:30am - 12:00pm
(Room 202D)

SMT4 Advances in Reflow Soldering
10:30am - 12:30pm
(Room 202C)

SUB2 Printed Circuit Board Performance and Reliability
10:30am - 12:00pm
(Room 204A)

AAT6 Wafer Level and Flip Chip Package Reliability
2:00pm - 3:30pm
(Room 202B)

MFX6 PCB Cavity or Inner Layer Component Assembly
2:00pm - 3:00pm
(Room 202D)

SMT5 BTCs: Voiding, Cleaning and Other Assembly Considerations
2:00pm - 3:30pm
(Room 202C)

SUB3 Investigation of Reliability for Alternate Surface Finishes
2:00pm - 3:30pm
(Room 204A)

PRC1 Process Inspection Technologies
2:00pm - 3:30pm
(Room 201B)

AAT7 The Impact of the Process Environment on Solder Defects
4:00pm - 5:30pm
(Room 202B)

SMT6 Advancements in Cleaning Process Controls
4:00pm - 5:30pm
(Room 202C)

SUB4 Substrate Technologies for Advanced Electronics
4:00pm - 5:30pm
(Room 204A)

PRC2 Imaging, Inspection, and Quality
4:00pm - 5:30pm
(Room 201B)

SPOTLIGHT SESSIONS

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 4 Process and Yield Improvement in SMT
9:30am - 11:00am
(Exhibit Hall Theatre)

SPOTLIGHT 5 Test Engineering Strategies and Systems for Test of PCBAs in Manufacturing
11:30am - 1:00pm
(Exhibit Hall Theatre)

SPOTLIGHT 6 Increasing Product Reliability with Better ESD, SPI, SIR Understanding
1:30pm - 3:00pm
(Exhibit Hall Theatre)

FREE Lunch!

12:00pm - 2:00pm, Exhibit Hall




CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)




SPECIAL EVENT

Corporate USERS Solution Session
5:00pm
(Room 104)




  Thursday, October 17
COUNTERFEIT ELECTRONICS SYMPOSIUM

PRC3 New Technologies for the Detection of Counterfeit Components
8:30am - 10:00am
(Room 204B)

PRC4 Counterfeit Components and Supply Chain Management
10:30am - 12:00pm
(Room 204B)




LEAD-FREE SOLDERING SYMPOSIUM

LF1 Printed Circuit Board Technology in a Pb-Free Electronics Industry: A Report by the High Density Packaging Users Group (HDPUG) Consortium
8:30am - 10:00am
(Room 204A)

LF2 Lead-Free Alloys, Surface Finishes, and Reliability Impacts
10:30am - 12:00pm
(Room 204A)

LF3 Miniaturization Effects on Pb-Free Process, Reliability, and Reworkability - AREA (Advanced Research in Electronic Assembly) Consortium
1:15pm - 3:00pm
(Room 204A)

LF4 Actively Improving Your Soldering Process
3:30pm - 5:00pm
(Room 204A)




TUTORIAL

T18 Design for Reliability for PCBs
FREE for Members!
8:30am - 12:00pm
(Room 104)



CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)




SMTA GOLF TOURNAMENT
Shotgun start
8:00am | The Golf Club At Fossil Creek

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Shea Engineering Services

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