SMTA International  

Conference: Sep. 28 - Oct. 2, 2014  
Exhibition: Sep. 30 - Oct. 1, 2014  

Donald Stephens Convention Center  
Rosemont, IL  
 

Conference At-A-Glance

  Sunday, September 28
TUTORIALS (MORNING)

T1 Solder Reflow Fundamentals
8:30am - 12:00pm
(Room 50)

T2 Advanced Rework: Hands-On BGA Reballing, Leadless Devices and Fine Pitch Parts
8:30am - 12:00pm
(Room 51)

T3 Conformal Coating Applications, Inspection, Rework and Quality Control
8:30am - 12:00pm
(Room 52)

T4 Tin Whiskers - What's Important to Know
8:30am - 12:00pm
(Room 53)




TUTORIALS (AFTERNOON)

T5 The 5 Boogiemen of Lead-Free Soldering Processes
1:30pm - 5:00pm
(Room 50)

T6 BMC, LGA, QFN-How to Improve Your Process Yields
1:30pm - 5:00pm
(Room 52)

T7 Next Generation High Density PCB Structures and Applications
1:30pm - 5:00pm
(Room 51)

T8 Shock-Impact Reliability of Portable Electronics
1:30pm - 5:00pm
(Room 53)




  Monday, September 29
TUTORIALS (MORNING)

T9 Effective Strategies for Selecting and Qualifying Assembly Process Materials
8:30am - 12:00pm
(Room 53)

T10 SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
8:30am - 12:00pm
(Room 50)

T11 Stencil Printing-A Practical Guide to Defect Prevention and Yield Improvement
8:30am - 12:00pm
(Room 51)

T12 Properties and Applications of Low Temperature Solders
8:30am - 12:00pm
(Room 54)

T13 Considerations in On-Shoring/Regionalizing Electronic Assembly
8:30am - 12:00pm
(Room 52)

TUTORIALS (AFTERNOON)

T14 Fundamental Methodologies and Strategy for Embedding Passive and Active Components
1:30pm - 5:00pm
(Room 53)

T15 Advanced Component Packages and Processes
1:30pm - 5:00pm
(Room 50)

T16 Reliability of Lead-Free Assemblies and Failure Analysis
1:30pm - 5:00pm
(Room 54)

T17 3D IC Packaging and 3D IC Integration
1:30pm - 5:00pm
(Room 51)

T18 Design for Manufacturing: New Solutions to Today's Challenges
1:30pm - 5:00pm
(Room 52)




HARSH ENVIRONMENTS SYMPOSIUM

HE1 Harsh Environment Challenges With Lead-Free Solder
8:30am - 10:00am
(Room 45)

HE2 Power Electronics Packaging
10:30am - 12:00pm
(Room 45)

HE3 Reliability of Pb-Free Electronics in Harsh Environments
1:30pm - 3:00pm
(Room 45)

HE4 Protecting Your Electronics Under Harsh Environment Conditions
3:30pm - 5:00pm
(Room 45)




EVOLVING TECHNOLOGIES SUMMIT

ET1 Embedded Technology
8:30am - 10:30am
(Room 48)

ET2 How Will Additive Manufacturing Effect Electronics Manufacturing?
11:00am - 12:30pm
(Room 48)

ET Keynote Lunch
12:30pm - 2:00pm
(Room 48)

ET3 Understanding Your Next Generation Adhesives-Using Nano Fillers
2:00pm - 3:00pm
(Room 48)

ET4 Evolving Technologies Panel - FREE!
3:30pm - 5:00pm
(Room 48)




  Tuesday, September 30
FREE SPECIAL EVENT
Opening Keynote Session
The Internet of Everything and the Cisco Connected Supply Chain
8:00am - 10:00am
(Room 46)
Free Breakfast!




TECHNICAL SESSIONS

AAT1 Challenges and Advancements in 2.5D/3D Packaging
11:00am - 1:00pm
(Room 44)

MFX1 Overcome the Challenges of Liquid Soldering Processes
11:00am - 12:30pm
(Room 49)

HE5 Reliability and Qualification Considerations for Today's High Performance Electronic Assemblies
11:00am - 12:30pm
(Room 45)

AAT2 Chip Scale Package Reliability
2:00pm - 3:30pm
(Room 44)

MFX2 Organic Compatibility in Assembly: Effect on Electrical Performance
2:00pm - 3:30pm
(Room 49)

SMT1 BTC Best Practices
2:00pm - 3:30pm
(Room 47)

PRC1 Radiography Techniques for Inspection of Advanced Electronic Packages
2:00pm - 3:30pm
(Room 51)

AAT3 Ceramic Column Grid Array-Optimization and Evaluation
4:00pm - 5:30pm
(Room 44)

MFX3 Polymeric Assembly Materials
4:00pm - 5:30pm
(Room 49)

SMT2 Minimizing Voids Under QFNs, BGAs and Discrete Components
4:00pm - 5:30pm
(Room 47)

PRC2 Advances in Production Inspection Methods
4:00pm - 5:30pm
(Room 51)

SPOTLIGHT SESSIONS! FREE!

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 1 - Preview of Selected Highlights From The iNEMI 2015 Roadmaps
11:00am - 12:00pm
(Exhibit Hall Theatre)

SPOTLIGHT 2 - 3D Electroform Stencils for Two Level PCB
12:30pm - 1:00pm
(Exhibit Hall Theatre)

SPOTLIGHT 3 - Panel: Surface Finishes, Old and New: Issues and Defects Perspectives
1:30pm - 3:00pm
(Exhibit Hall Theatre)




FREE Lunch!
12:00pm - 2:00pm, Exhibit Hall

Poster Session
12:00pm - 2:00pm | Exhibit Hall




CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 55)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 57)







  Wednesday, October 1
TECHNICAL SESSIONS

AAT4 Next Generation of Package-on-Package Challenges
8:00am - 9:30am
(Room 44)

MFX 4 Solder Cleaning Process Selection and Control
8:00am - 10:00am
(Room 49)

SMT3 PCB Component/Connector Rework-From Small to Large
8:00am - 9:30am
(Room 47)

SUB1 Solderable Final Finishes
8:00am - 9:30am
(Room 45)

AAT5 BGA Solder Joint Reliability
10:30am - 12:30pm
(Room 44)

MFX5 Adhesive Applications
10:30am - 12:00pm
(Room 49)

SMT4 Stencil Printing Advances for Today's Electronics
10:30am - 12:00pm
(Room 47)

SUB2 PCB Technology: Assembly Challenges and Defects Resulting from PCB Design
10:30am - 12:00pm
(Room 45)

AAT6 Failure Analysis and Characterization Methods
2:00pm - 3:30pm
(Room 44)

MFX6 Alternate Alloys
2:00pm - 3:30pm
(Room 49)

SMT5 Tools for Sustainable Stencil Printing
2:00pm - 3:30pm
(Room 47)

SUB3 New PCB Finishes
2:00pm - 3:30pm
(Room 45)

EMS1 Supply Chain Conflicts Mineral Compliance
4:00pm - 5:30pm
(Room 51)

AAT7 Fluxes, Standards and Contaminants Face Off With Reliability
4:00pm - 5:30pm
(Room 44)

MFX7 Lead-Free Alloys End Use-Application Reliability
4:00pm - 5:30pm
(Room 49)

SMT6 Extreme SMT Challenges and Questions
4:00pm - 5:30pm
(Room 47)

SUB4 Impact of Surface Finishes on Reliability of Interconnects
4:00pm - 5:30pm
(Room 45)

SPOTLIGHT SESSIONS

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 4 - ESD Sources in a Production Line (SMT) and Solutions
10:00am - 10:30am
(Exhibit Hall Theatre)

SPOTLIGHT 5 - Manufacturing Cost Simulation and Analysis
11:00am - 11:30am
(Exhibit Hall Theatre)

SPOTLIGHT 6 - A New Approach to Compare Weibull Curves
12:00pm - 12:30pm
(Exhibit Hall Theatre)

SPOTLIGHT 7 - Counterfeits: Risks In the Supply Chain, Reporting Requirements, Authentication and Testing Techniques
1:00pm - 3:00pm
(Exhibit Hall Theatre)

FREE Lunch!

12:00pm - 2:00pm, Exhibit Hall




SPECIAL EVENT

Corporate USERS Solution Session
12:00pm
Chapter Officer Lounge in the Exhibit Hall




CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 55)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 57)







  Thursday, October 2
LEAD-FREE SOLDERING SYMPOSIUM

LF1 Material Evaluation for High Reliability Applications: A.R.E.A. Consortium
8:00am - 9:30am
(Room 49)

LF2 On-Going Leaf-Free Research, Development, and Knowledge Sharing Priorities
10:00am - 11:30pm
(Room 49)

LF3 Tin Whisker Research and Mitigation
12:30pm - 2:30pm
(Room 49)

LF4 Lead-Free Solder Joint Reliability
3:00pm - 5:00pm
(Room 49)



TUTORIAL

T19 Reliability 360: How to Verify Design Robustness Early In the Process
FREE for Members!
8:30am - 12:00pm
(Room 47)



CERTIFICATION

SMT Process Certification
8:30am - 5:00pm
(Room 55)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 57)



SMTA GOLF TOURNAMENT
Shotgun start
8:30am | White Pines Golf Club

SMTAI on Facebook! Twitter @SMTAIntl #smtainternational SMTAI Videos on Youtube SMTA LinkedIn Page



What you are saying:

SMTA International is an outstanding opportunity to network with industry peers on manufacturing issues and obtain leading edge technical data that can have a significant impact on product designs. This year the co-location of the IPC Technical Standards Committee meetings will add even more value by including the industry specification creation process, a key ingredient to the electronics assembly/product design process.

Dave Hillman
Rockwell Collins

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