2016 Conference At-A-GlanceConference sessions are 1.5-2 hour programs in which three or four technical papers are presented under the direction of a chairperson. Each paper is presented by the author on a topic related to the main subject of the session, and is followed by audience questions. The objective of a technical session is to bring new scientific and technical developments to light. Emphasis is placed on original, previously unpublished papers.
Session tracks and symposiums:
Advanced Packaging Technology (APT)
Emerging Technologies (ET)
Flux, Solder, Adhesives (FSA)
Harsh Environment Applications (HE)
Inspection Technologies (INS)
Lead-Free Soldering Technology (LF)
Manufacturing Excellence (MFX)
Substrates/PCB Technology (SUB)
View the full conference at-a-glance in PDF format.
Sunday, September 25, 2016Sunday Workshops (WS1-WS10)
Monday, September 26, 2016Monday Workshops (WS11-WS20)
Monday Tech Sessions (Includes Evolving Technology Summit and Harsh Environments Symposium)