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Session WA1: 3D Assembly
09:00 – 10:30 (9:00am – 10:30am)
3D Integration: Future Perspectives
M. Juergen Wolf, Fraunhofer Institute
3D All Silicon Systems Technology - A Disruptive Systems Technology
Rao Tummala, Georgia Institute of Technology
3D-LSI Technology for the Image Sensor Devices
Makoto Motoyoshi, Hirofumi Nakamura, and Manabu Bonkohara, ZyCube Co., Ltd.
Session WA2: Unusual Soldering Challenges
09:00 – 10:30 (9:00am – 10:30am)
Resolution of Solder Voids in Pin-in-Hole Product
Condia Yu, Eddie W. Tang, and Jack To, Elec and Eltek; Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor, and Kaspar Tsang, IBM Corporation
Impact of PCB Pad Site Dress Methods on Pad Array Damage
Laurence A. Harvilchuck and Brian Roggeman, Unovis Solutions; Raiyo F. Aspandiar and James M. Wade, Intel Corporation
Performance Evaluation of Surface Finish and Solder Alloy Configurations for BGA Solder Joint Reliability
Hugh Roberts, Atotech USA Inc.; Sven Lamprecht, Atotech Deutschland GmbH; Mark Bachman, John Osenbach, and Kishor Desai, LSI Corporation; Ron Huemoeller, Yoon-Ha Jung, and Robert Darveaux, Amkor Technology
10:30 - 11:00 (10:30AM - 11:00AM)
Coffee Break
Session WA1: 3D Assembly (Continued)
09:00 – 10:30 (9:00am – 10:30am)
PoP (Package on Package): An EMS Perspective on Assembly, Rework and Reliability
Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell, and Roden Cortero, Celestica, Inc.
Advanced Electrodeposition Technologies for 3D Integration
Rozalia Beica and Paul Siblerud, Semitool, Inc.
Copper Electroplating Process for Next Generation Core Through-Via Filling
Stephen Kenny and Bernd Roelfs, Atotech Deutschland GmbH
Session WA2: Unusual Soldering Challenges (Continued)
09:00 – 10:30 (9:00am – 10:30am)
On the Use of 3 Thermocouples to Verify a Printed Circuit Board Profile During the Reflow Operation
Daryl L. Santos and Arun Ramasubramanian, Systems Science and Industrial Engineering (SSIE) Department Binghamton University; Laurence A. Harvilchuck, Unovis Solutions
Development and Characterization of Metal Coated Polymer Balls for CSP Application
Helge Kristansen, and Keith Redford, Conpart AS; David Whalley, Conpart and Loughborough University; Hallvard Tyldum, NTNU; Maaike M.V. Taklo, SINTEF
Electrostatic Discharge (ESD) and the Requirements for Personnel and Machines
Hartmut Berndt, B.E. STAT European ESD
12:30 – 14:00 (12:30pm – 2:00pm)
Lunch Break
Session WP1: Assembly Strategies and Processes
14:00 – 16:00 (2:00pm – 4:00pm)
Optimization of Complex Assembly in Electronic Manufacturing
A. Gandelli and D. Monopoli, Politecnico di Milano
AXI Management and Process Improvement
James Ziegler, Hung Le, Stephen Chen, Elliott Le, and Zhen (Jane) Feng, Flextronics International Inc.
Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting
Y.S. Chan and S.W. Ricky Lee, Hong Kong University of Science and Technology
Lead-Free Assembly of Server Class PCBAs: Qualification Trial Results
Matthew Kelly, Marie Cole, Jim Wilcox, and David Braun, IBM Corporation
Session WP2: Pb Free Solders and Reliability
14:00 – 16:00 (2:00pm – 4:00pm)
Reliability Assessment of Alternative Lead-Free Alloys Used During Wave and Rework
Craig Hamilton, Polina Snugovsky, Mario Moreno, Teng Hoon Ng, and Juthathip Fangkangwanwong, Celestica, Inc.; Matthew Kelly and Jim Bielick, IBM Corporation
A Novel Lead-Free Solder Alloy and Its Characterization
Jusheng Ma, Tsinghua University
The Effect of Variations in the Silver Level and Microalloying on the Impact Strength of Tin-Silver-Copper BGA Spheres
Keith Sweatman, Shoichi Suenaga, Masuo Koshi, and Tetsuro Nishimura, Nihon Superior Co. Ltd.
TBD
16:00 – 16:30 (4:00pm – 4:30pm)
Coffee Break
Session WP1: Assembly Strategies and Processes (Continued)
16:30 – 17:30 (4:30pm – 5:30pm)
The Assembly Technology Research of FPC
Dianmei Li, Huawei Technologies
Using Design for Six Sigma (DFSS) for Failure Analysis in a Server Manufacturing Enterprise
Aaron Young, Sreekanth Ramakrishnan, and Aubrey Dennis, IBM Corporation
Session WP2: Pb Free Solders and Reliability (Continued)
16:30 – 17:30 (4:30pm – 5:30pm)
Predict the Life of Lead-Free Solder Joints Through Quantified Microstructure Evolution Process
Yun Hua Tu, Huawei Technologies
Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array (PBGA 196) and Micro Lead Frame (MLF) Components in Lead-Free Processes
Simin Bagheri, Polina Snugovsky, Zohreh Bagheri, Craig Hamilton, and Heather McCormick, Celestica, Inc.
Keynote Address II
17:45 - 18:30 (5:45PM - 6:30PM)
High Tech Investing in Difficult Economic Times
Mario Ferrario, Redifin Italy
Recognition Reception
18:30 – 19:30 (6:30pm – 7:30pm)
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