10 - 12 February 2009
Big Island of Hawaii
 
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Wednesday afternoon lunch Session WA1: 3D Assembly
09:00 – 10:30 (9:00am – 10:30am)
  • 3D Integration: Future Perspectives
    M. Juergen Wolf, Fraunhofer Institute
  • 3D All Silicon Systems Technology - A Disruptive Systems Technology
    Rao Tummala, Georgia Institute of Technology
  • 3D-LSI Technology for the Image Sensor Devices
    Makoto Motoyoshi, Hirofumi Nakamura, and Manabu Bonkohara, ZyCube Co., Ltd.



  • Session WA2: Unusual Soldering Challenges
    09:00 – 10:30 (9:00am – 10:30am)
  • Resolution of Solder Voids in Pin-in-Hole Product
    Condia Yu, Eddie W. Tang, and Jack To, Elec and Eltek; Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor, and Kaspar Tsang, IBM Corporation
  • Impact of PCB Pad Site Dress Methods on Pad Array Damage
    Laurence A. Harvilchuck and Brian Roggeman, Unovis Solutions; Raiyo F. Aspandiar and James M. Wade, Intel Corporation
  • Performance Evaluation of Surface Finish and Solder Alloy Configurations for BGA Solder Joint Reliability
    Hugh Roberts, Atotech USA Inc.; Sven Lamprecht, Atotech Deutschland GmbH; Mark Bachman, John Osenbach, and Kishor Desai, LSI Corporation; Ron Huemoeller, Yoon-Ha Jung, and Robert Darveaux, Amkor Technology



  • 10:30 - 11:00 (10:30AM - 11:00AM)
    Coffee Break


    Session WA1: 3D Assembly (Continued)
    09:00 – 10:30 (9:00am – 10:30am)
  • PoP (Package on Package): An EMS Perspective on Assembly, Rework and Reliability
    Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell, and Roden Cortero, Celestica, Inc.
  • Advanced Electrodeposition Technologies for 3D Integration
    Rozalia Beica and Paul Siblerud, Semitool, Inc.
  • Copper Electroplating Process for Next Generation Core Through-Via Filling
    Stephen Kenny and Bernd Roelfs, Atotech Deutschland GmbH



  • Session WA2: Unusual Soldering Challenges (Continued)
    09:00 – 10:30 (9:00am – 10:30am)
  • On the Use of 3 Thermocouples to Verify a Printed Circuit Board Profile During the Reflow Operation
    Daryl L. Santos and Arun Ramasubramanian, Systems Science and Industrial Engineering (SSIE) Department Binghamton University; Laurence A. Harvilchuck, Unovis Solutions
  • Development and Characterization of Metal Coated Polymer Balls for CSP Application
    Helge Kristansen, and Keith Redford, Conpart AS; David Whalley, Conpart and Loughborough University; Hallvard Tyldum, NTNU; Maaike M.V. Taklo, SINTEF
  • Electrostatic Discharge (ESD) and the Requirements for Personnel and Machines
    Hartmut Berndt, B.E. STAT European ESD



  • 12:30 – 14:00 (12:30pm – 2:00pm)
    Lunch Break


    Session WP1: Assembly Strategies and Processes
    14:00 – 16:00 (2:00pm – 4:00pm)
  • Optimization of Complex Assembly in Electronic Manufacturing
    A. Gandelli and D. Monopoli, Politecnico di Milano
  • AXI Management and Process Improvement
    James Ziegler, Hung Le, Stephen Chen, Elliott Le, and Zhen (Jane) Feng, Flextronics International Inc.
  • Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting
    Y.S. Chan and S.W. Ricky Lee, Hong Kong University of Science and Technology
  • Lead-Free Assembly of Server Class PCBAs: Qualification Trial Results
    Matthew Kelly, Marie Cole, Jim Wilcox, and David Braun, IBM Corporation



  • Session WP2: Pb Free Solders and Reliability
    14:00 – 16:00 (2:00pm – 4:00pm)
  • Reliability Assessment of Alternative Lead-Free Alloys Used During Wave and Rework
    Craig Hamilton, Polina Snugovsky, Mario Moreno, Teng Hoon Ng, and Juthathip Fangkangwanwong, Celestica, Inc.; Matthew Kelly and Jim Bielick, IBM Corporation
  • A Novel Lead-Free Solder Alloy and Its Characterization
    Jusheng Ma, Tsinghua University
  • The Effect of Variations in the Silver Level and Microalloying on the Impact Strength of Tin-Silver-Copper BGA Spheres
    Keith Sweatman, Shoichi Suenaga, Masuo Koshi, and Tetsuro Nishimura, Nihon Superior Co. Ltd.
  • TBD



  • 16:00 – 16:30 (4:00pm – 4:30pm)
    Coffee Break


    Session WP1: Assembly Strategies and Processes (Continued)
    16:30 – 17:30 (4:30pm – 5:30pm)
  • The Assembly Technology Research of FPC
    Dianmei Li, Huawei Technologies
  • Using Design for Six Sigma (DFSS) for Failure Analysis in a Server Manufacturing Enterprise
    Aaron Young, Sreekanth Ramakrishnan, and Aubrey Dennis, IBM Corporation



  • Session WP2: Pb Free Solders and Reliability (Continued)
    16:30 – 17:30 (4:30pm – 5:30pm)
  • Predict the Life of Lead-Free Solder Joints Through Quantified Microstructure Evolution Process
    Yun Hua Tu, Huawei Technologies
  • Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array (PBGA 196) and Micro Lead Frame (MLF) Components in Lead-Free Processes
    Simin Bagheri, Polina Snugovsky, Zohreh Bagheri, Craig Hamilton, and Heather McCormick, Celestica, Inc.



  • Keynote Address II
    17:45 - 18:30 (5:45PM - 6:30PM)
    High Tech Investing in Difficult Economic Times
    Mario Ferrario, Redifin Italy


    Recognition Reception
    18:30 – 19:30 (6:30pm – 7:30pm)





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