 |
|
|
Corporate Package Sponsor:
Conference Sponsor:
Luau Sponsor:
Golf Sponsor:
Refreshment Break Sponsor:
Media Sponsors:
|
|
Wednesday
|
WA1: Evaluation and Failure Analysis
09:30 – 12:30 (9:30am – 12:30pm)
Chair: Luo Daojun, China Ceprei Lab
Investigation on Root Cause for Via with Solder Bubble
Wang Yang, Luo Daojun, China CEPREI Laboratory
Evaluation of Molded Underfill Packages Using Acoustic Micro Imaging
Janet E. Semmens, Sonoscan, Inc.
REFRESHMENT BREAK
11:00 – 11:30 (11:00am – 11:30am)
WA1: Evaluation and Failure Analysis - Continued
Investigation on Pad Crater Failure of BGA Solder Joints
Luo Daojun, Zou Yabin, He Guanghui, China CEPREI Laboratory
*** Session Keynote ***
Investigation of Factors That Influence Creep Corrosion
Haley Fu, iNEMI; Cherie Chen, IST-Integrated Service Technology, Inc.; Prabjit Singh, Jing Zhang, IBM Corporation; Anil Kurella, Intel Corporation; Xu Chen, Xiaodong Jiang, Alcatel-Lucent; Jennifer Burlingame, Cisco Corporation; Simon Lee, The Dow Chemical Company
WA2: Strategic Manufacturing
09:30 – 12:00 (9:30am – 12:00pm)
Chair: Bing Kawashima, Meltex Inc.
Solder Paste Printing and Solder Paste Inspection Optimization Strategy for the PCBA SMT Process
Phil Isaacs, Wayne Zhang, IBM Corporation; Alec Chen, Hill Liu, Tracy Cai, Wistron Corporation
Dielectrics for the Embedding of Active and Passive Devices
Norbert Galster, Atotech Deutschland GmbH
Methods of Micro Ball Bumping for Wafer Level and 3D Applications Using Solder Sphere Transfer and Solder Jetting
Thomas Oppert, Andrew Strandjord, Thorsten Teutsch, Ghassem Azdasht, Elke Zakel, Pac Tech
REFRESHMENT BREAK
11:00 – 11:30 (11:00am – 11:30am)
WA2: Strategic Manufacturing - Continued
Copper Pillar Bump Process Characterization on 300mm Wafers
Wei Koh, Ph.D., Pacrim Technology
*** Session Keynote ***
Printed Electronics-The Evolution of a Once and Future Technology
Joseph Fjelstad, Verdant Electronics
LUNCH BREAK
12:30 – 13:30 (12:30pm – 1:30pm)
WP1: Failure Modeling and Design
13:30 – 16:00 (1:30pm – 4:00pm)
Chair: Dock Brown, Medtronic
An Evaluation of the Neville Distribution for Studying the Brittle Failure Mode in Microelectronics Drop Testing Studies
Vikram Venkatadri, Pushraj Tumne, Krishnaswami Srihari, Daryl L. Santos, Ph.D., Binghamton University
Critical Parameter Leads to Failure of Lead-Free under Thermal Cycling
Yung-Wen Wang, National Sun Yat-sen University
REFRESHMENT BREAK
14:30 – 15:00 (2:30pm – 3:00pm)
WP1: Failure Modeling and Design - Continued
Stress Analysis of Multilayered Printed Circuit Board Under Mechanical Loading
Jia-Shen Lan, National Sun Yat-sen University
*** Session Keynote ***
PCB Dynamic Co-Planarity at Lead-Free SMT Temperatures (iNEMI)
John Davignon, Intel Corporation; Ken Chiavone, Jiahui Pan, Akrometrix; James Henzi, Cisco Systems, Inc.; David Mendez, Ron Kulterman, Flextronics International
WP2: Roadmap Application
13:30 – 16:00 (1:30pm – 4:00pm)
Chair: Denis Barbini, Ph.D., Universal Instruments
Developing the iNEMI Research Plan
Alan Rae, Ph.D., TPF Enterprises LLC
Plenty of Room at the Bottom; Nanomaterials Emerge as an Electronics Powerhouse
Herbert Neuhaus, Ph.D., TechLead Corporation
REFRESHMENT BREAK
14:30 – 15:00 (2:30pm – 3:00pm)
WP2: Roadmap Application - Continued
Roadmaps for ESD (Electrostatic Discharge) – True Prospects of Just Interests of the Industrial Enterprises
Hartmut Berndt, B.E. Stat European Competence Centre
*** Session Keynote ***
Silicon and Packaging Technology Trends in High Performance Networking
Judy Priest, Cisco Systems Inc.
Mai Tai Bar and Networking
16:15 – 17:00 (4:15pm – 5:00pm)
SYMPOSIUM KEYNOTE II
17:00 – 17:45 (5:00pm – 5:45pm)
Chair: Phil Isaacs, IBM Corporation
Pushing the Limits of Lead-Free Soldering
Tetsuro Nishimura, Nihon Superior Co. Ltd.
|
|
