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08:30 - 10:00 (8:30AM - 10:00AM)
Registration
08:30 - 10:00 (8:30AM - 10:00AM)
Exhibitor Set Up
Session TA1: Environmental Sensitivity
10:00 – 11:30 (10:00am – 11:30am)
Eco-Compliance - Who, What, When, Where and Why
Krista Botsford, Botsford EcoTech Partners LLC
A Hybrid Approach for Energy Optimization of Wireless Sensor Network Devices
D. Caputo, A. Gandelli, F. Grimaccia, M. Mussetta, and R.E. Zich, Politecnico di Milano
Session TA2: Market Directions and Trends
10:00 – 11:30 (10:00am – 11:30am)
Leading Open Innovation Across Global Strategic Alliances
Mike Bixenman, Kyzen Corporation
Solid State Drive (SSD) Technology and Market Trends
Wei Koh, Pacrim Technology Inc.
Counterfeit Electronics: Threats, Risks and Prevention Practices
Lev Shapiro, Component Master Ltd.
11:30 – 13:00 (11:30am – 1:00pm)
Lunch Break
Session TP1: Solderability and Reliability
13:00 – 15:00 (1:00pm – 3:00pm)
Investigation on Speeding Up Isolation Reliability Testing
Wataru Urano, NEC Corporation; Hironori Ohta, Jisso Research Laboratories (NEC); and Toshiya Suzuki, NEC Toppan Circuit Solutions
Effects of Storage Procedures and Pre-Baking on the Solderability
Paul Vianco, Edwin P. Lopez, Sam Lucero, and Alice Kilgo, Sandia National Laboratories
Long Term Reliability Analysis of Lead-Free and Halogen Free Electronic Assemblies
Sammy Shina, University of Massachusetts Lowell; Greg Morose, Massachusetts Toxics Use Reduction Institute; Richard Anderson and Helena Pasquito, Tyco Electronics; Paul Bodmer, Bob Farrell, John Goulet, Philip Lauziere, and James Brinkman, Benchmark Electronics; Don Longworth, Dynamic Details Inc.; Ken Degan, Teradyne Inc.; Donald Abbott, Texas Instruments; David Pinsky, Karen Walters, and Amit Sarkhel, Raytheon Company
Studies on Solder Electromigration in the Pb Free Flip Chip Joints System
Kimihiro Yamanaka, Takayuki Nejime, and Yutaka Tsukada, Kyocera SLC Technologies Corporation
Session TP2: Logistics and Prognostics
13:00 – 15:00 (1:00pm – 3:00pm)
Prognostics-Based Product Qualification
Michael Pecht, University of Maryland
Application of Reverse Logistics to Failure Analysis of Electronic Products
A. Gandelli and A. Caliri, Politecnico di Milano
Data Management and Eco-Compliance: Best Practices from Industry
Krista Botsford, Botsford EcoTech Partners LLC
Cost Analysis for an Integrated iTSV Line by EMC3D
Paul Siblerud, Semitool Inc.
DOE for Process Validation Involving Numerous Assembly Materials and Test Methods
Renee Michalkiewicz and Gaylon Morris, Trace Laboratories, Inc.
Towards the Development of a Photoresist Process for Continuous, Roll-to-Roll Flexible Electronics
Xiaozhe Hu, Joseph Steiner, Daryl L. Santos, and Bahgat Sammakia, Center for Advanced Microelectronics Manufacturing (CAMM) Binghamton University; Mark Poliks, Endicott Interconnect Technologies
15:00 - 15:30 (3:00pm – 3:30pm)
Coffee Break
Session TP3: Test and Measurement
15:30 – 17:00 (3:30pm – 5:00pm)
Reliability of Socket in Final Testing of High-Speed BGA Packages
Ming-Kun Chen, Yu-Jung Huang, and Shen-Li Fu, I-Shou University
Quality Assurance of Stacked Components Using QuickScan CT
Friedhelm Maur, YXLON International Inc.
Strain Gage Testing: The Delta Effect of Thermal Cycle Testing
Mark McMeen, STI Electronics Inc.
Session TP4: High Frequency Challenges
15:30 – 17:00 (3:30pm – 5:00pm)
A Novel Multi-Layer Patch Configuration for Multi-Band Reflectarray Antennas
P.T. Cong, M. Mussetta, and P. Pirinoli, Politecnico di Torino; A. Pirisi and R.E. Zich, Politecnico di Milano
Super High Density Two Metal Layer Ultra-thin Organic Substrates for Next Generation System-on-Package (SOP), SIP, and Ultra Fine Pitch Flip Chip Packages
Venky Sundaram, Hunter Chan, Fuhan Liu and Rao Tummala, Georgia Institute of Technology; Hugh Roberts, Atotech USA Inc.; Sven Lamprecht and Kai Matejat, Atotech Deutschland GmbH; Scott Kennedy, John Dobrick and Dirk Baars, Rogers Corporation
Performance and Reliability Study of Advanced Substrate Technologies for High Speed Networking Applications
Judy Priest, John Savic, Percy Aria, Real Pomerleau, Nicholas Dugbartey, Jie Xue, and BJ Shanker, Cisco Systems, Inc.
Keynote Presentation
17:15 – 18:00 (5:15pm – 6:00pm)
Cleaning Relevance in Electronics Assembly, the Value Proposition
Thomas M. Forsythe and Michael L. Bixenman, Kyzen Corporation
Welcome Reception
18:00 – 19:00 (6:00pm – 7:00pm)
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