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Thursday
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THA1: Process Advancement
09:30 – 13:00 (9:30am – 1:00pm)
Chair: Rod Howell, Libra Industries
Fluid Flow Kinetics for Encapsulation Processes in Small and Anisotropic Electronic Packages
Horatio Quinones, Ph.D., Weiwei Li, Yuriy Suhinin, Nordson ASYMTEK
Towards Large Area Roll-to-Roll (R2R) Flexible Multilayer Electronics
Denisse E. Yepez, Daryl L. Santos, Ph.D., Baghat Sammakia, Ph.D., Binghamton University; Mark Poliks, Ph.D., Endicott Interconnect Technologies, Inc.
REFRESHMENT BREAK
10:30 – 11:00 (10:30am – 11:00am)
THA1: Process Advancement - Continued
Electroless Plating Process on Glass Substrate
Satoshi Kawashima, Ph.D., Meltex Inc.
Automated Precision Assembly High Volume HB LEDs
Donald Beck, Ph.D., Jessica Sylvester, Palomar Technologies Inc.
*** Session Keynote ***
SMART Commercialization Center for Microsystems - A New Model to Drive Industry Development
Chris Mather, SMART Center-Lorain Community College
THA2: Green Technologies
09:30 – 12:30 (9:30am – 12:30pm)
Chair: Kazuhiro Nogita, Ph.D., University of Queensland
Silver-Polyaniline-Epoxy Electrical Conductive Adhesives – A Percolation Threshold Analysis
Alex Chen, Celestica Inc.; Sarang P. Gumfekar, Boxin Zhao, University of Waterloo
Recent Advances in Anisotropic Conductive Adhesives (ACAs) Technology
Kyung W. Paik, Ph.D., Korea Advanced Institute of Science and Technology (KAIST)
Low Temperature Processing Conductive Adhesives for High Temperature Applications
Binghua Pan, Chee Keng Yeo, Su Liang Chan, Delphi Automotive Systems Singapore Pte Ltd.
REFRESHMENT BREAK
10:30 – 11:00 (10:30am – 11:00am)
THA2: Green Technologies - Continued
*** Session Keynote ***
Sustainable Electronics
Alan Rae, Ph.D., TPF Enterprises LLC
LUNCH BREAK
12:30 – 13:00 (12:30pm – 1:00pm)
THP1: Roadmap Interposers
13:00 – 17:00 (1:00pm – 5:00pm)
Chair: Wei Koh, Ph.D., Pacrim Tech
Material Selection and Parameter Optimization for Reliable TMV PoP Assembly
Denis Barbini, Ph.D., Brian Roggeman, David Vicari, Universal Instruments Corporation; Lee Smith, Ahmer Syed, Amkor Technology, Inc.
TSV Technology - Updated Status
M. Juergen Wolf, Fraunhofer Institute IZM
Equipment and Process Solutions for Low Cost High Volume Manufacturing of 3D Integrated Devices
Marcus Wimplinger, EVG
Technology Alternatives Towards Low-Cost and High-Speed Interconnect Manufacturing
Fred Roozeboom, Eindhoven Institute of Technology; G. Oosterhuis, TNO Eindhoven; M. Mueller, ALSI; A. Huis in't Veld, TNO Eindhoven, Twente University; J. Bullema, P. Bressers, B. Kniknie, A.M. Lankhorst, G. Winands, N. Koster, P. Poodt, TNO Eindhoven; G. Dingemans, W. Keuning, W.M.M. Kessels, Technical University Eindhoven
REFRESHMENT BREAK
15:00 – 15:30 (3:00pm – 3:30pm)
3D Contactless Capacitive Coupled Interconnection Circuit Design
Yu-Jung Huang, Ph.D., Shen-Li Fu, Ph.D., I-Shou University; Yi-Lung Lin, Ming-Kun Chen, Ph.D., Advanced Semiconductor Engineering Test RD
Silicon Interposer Design for a 12X10 Gb/s Electro-Optical Engine
Terry Bowen, Richard Miller, TE Connectivity
The Post-secondary Training Gap in the EMS Industry
Chris Mather, SMART Center-Lorain Community College
LUAU
18:00 – 21:00 (6:00pm – 9:00pm)
Graciously Sponsored
By Indium Corporation
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