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Luau Sponsor
Welcome Reception Sponsor
Coffee Break Sponsors
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Session THA1: Second Level Assembly
09:00 – 11:00 (9:00am – 11:00am)
Session Chair: M. Juergen Wolf, Fraunhofer Institute
Planning and Implementing a Successful Box Build, a Process FMEA Implementation
Haans Petruschke and Roy Starks, Libra Industries
Implementation of 01005s: A Case Study
Paul Houston, Gary Turpin, and Daniel F. Baldwin., ENGENT, Inc.
Session THA2: Solder Processing and Rework
09:00 – 11:00 (9:00am – 11:00am)
Session Chair: Keith Sweatman, Nihon Superior Co. Ltd.
Heavy Thermal Load Pb-Free Wave Soldering – Getting Top Hole Fillets with +3 oz. Copper Planes
Corey Peterson, Rockwell Automation and Jeff Kennedy, Celestica Inc.
Developing a Reflow Soldering Process for Sn/Cu/Ni Solder Paste
Ursula Marquez de Tino, Linlin Yang, and Denis Barbini, Vitronics Soltec; Brian Roggeman and Mike Meilunas, UNOVIS
Column Grid Array Rework for High Reliability
Atul C. Mehta and Charles J. Bodie, Jet Propulsion Laboratory
Wettable vs. Non-Wettable Nozzles for Lead-Free Selective Soldering
Ursula Marquez de Tino, Denis Barbini, and Linlin Yang, Vitronics Soltec
11:00 – 11:30 (11:00am – 11:30am)
Coffee Break
Session THA3: New Materials and Deposition
11:30 – 14:00 (11:30am – 2:00pm)
Session Chair: Heather McCormick, Celestica Inc.
Jetting Fluids in a Wide Variety of New Electronics and Semiconductor Non Traditional Packaging and Assembly Applications
Alec J. Babiarz, Asymtek
Next Level Requirements for Ultra-fine Pitch Printing
Richard Brooks, Indium Corporation; John Carr and Marty Carr, Great Lakes Engineering
Towards the Development of a Photoresist Processing for Continuous Roll-to-Roll Flexible Electronics
Xiaozhe Hu, Joseph Steiner, Daryl L. Santos, Mark Poliks, and Bahgat Sammakia, Center for Advanced Microelectronics Manufacturing (CAMM), Binghamton University
Development of Low Modulus Conductive Adhesives for MEMS Interconnects
Helge Kristiansen, Conpart AS; Maaike M. V. Taklo, Thor Bakke, Rolf Johannesssen, and Froydis Oldervoll, SINTEF ICT; Jakob Gakkestad and Per Dalsjo, FFI; Vu Hoang Nguyen, Vestfold University College
A Novel Flexible Silver Paste Enables Thin Film Photovoltaic Flex Solar Cells
Hong-Sik Hwang, Ph.D., Lee Kresge, James Slattery, and Ning-Cheng Lee, Ph.D., Indium Corporation
Luau on the Beach Lawn
18:00 – 21:00 (6:00pm – 9:00pm)
Graciously Sponsored
By Libra Industries
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