| General Chair |
Technical Chairs |
North American Coordinator |
Zhu Jian,
Alcatel Shanghai Bell Co.
Ltd.(China) |
Soren Norlyng
MICROCONSULT
(Denmark)
|
Dr. Charles Bauer,
TechLead Corporation
(USA) |
|
Alan Rae, Ph.D.,
NanoDynamics
(USA)
|
|
|
M. Juergen Wolf,
Fraunhofer Institute
(Germany)
|
|
| Technical Program Committee |
Australia/New Zealand
Neil Douglas, SMS Ltd. |
Japan
Yoshikazu Nakamura, Ph.D.,
Future Package Technology
Masahide Tsukamoto, Ph.D.,
Masashi Engineering |
Taiwan
Shen-Li Fu, Ph.D., I-Shou University
Charles Lin, Ph.D., Bridge Semiconductor
|
China
Zhou Xin, Huawei Technologies |
Singapore
Charles Lin, Ph.D.,
Bridge Semiconductor |
USA
Ken Gilleo, Ph.D., ET-Trends
Horatio Quinones, Asymtek
Paul Wang, Ph.D., Microsoft (USA)
|
Korea
Kim Il Ung, Ph.D., Samsung
Kyung Wook Paik, Ph.D., KAIST |
|
Administrative Chair
JoAnn Stromberg, SMTA |
|
|
|
