| Time |
|
Activity |
|
Speaker |
09:00-11:00
9:00am-11:00am |
|
Session THA1:
Sensors and Sensor Networks |
|
|
Membrane Type Pressure Sensitive Sensor |
|
Kiwako Ohmori, Akinobu Ono, Tetsuya
Kawahira, Wataru Abo, and Atsutoshi Takano, Fujikura
|
|
|
Shape Analysis and Efficiency of Arrays
of Microstrip Patch Antennas for Wireless Sensor Networks
|
|
A. Gandelli, D. Monopoli, A. Pirisi, and R.E. Zich, Politecnico di Milano |
|
|
Vibration Sensor for Wireless Condition Monitoring |
|
Maaike M. V. Taklo, Thor Bakke, Andreas Vogl, and Dag T. Wang, SINTEF ICT; Frank Niklaus, KTH- Royal Institute of Technology; Lennart Balgård, Automation Technologies Corporation Research |
|
|
Session THA2:
Reliability Enhancement |
|
|
Electrical and Thermal Interface
Materials |
|
Rob Emery and Tanawan Chaowasakoo, Celestica, Inc. |
|
|
Thermal Management of Disk Drives Using
Silicone-Free Thermal Interface Materials |
|
Bill Rugg, Seagate Technology; Radesh Jewram and Sanjay Misra, The Bergquist Company
|
|
|
Full Metal TIMs |
|
Ross
Berntson, Indium
Corporation
|
|
|
Design and Optimization of Multilayer
Shield of Dielectric
|
|
D. Monopoli, M. Mussetta, A. Gandelli,
and R. Zich, Politecnico di Milano |
11:00-11:30
11:00am-11:30am |
|
Coffee Break With Exhibitors
|
|
|
11:30-12:30
11:30am-12:30pm |
|
Session
THA3:
Coating and Encapsulation |
|
|
Silicone-Phosphor Encapsulation for
High Power White LEDs |
|
Horatio Quinones, Alec Babiarz, and
Brian Sawatsky, Asymtek
|
|
|
Evaluating the Manufacturability and
Operational Costs for New Conformal Coating Processes
|
|
Jason Keeping, Celestica, Inc. |
11:30-14:00
11:30am-2:00pm |
|
Exhibit Take Down
|
|
|
18:00-21:00
6:00pm-9:00pm |
|
Luau |
|
|
