Schedule At-A-Glance

Tuesday	Wednesday	Thursday
MORNING	MORNING	MORNING
TA1:  Package on Package TA2:  Area Array	WA1:  Mechanical Integrity of Assemblies WA2:  Degenerative Solder Effects WA2:  Degenerative Solder Effects (cont.) WA3:  Advanced Low I/O Packages	THA1:  Sensors and Sensor Networks THA2:  Reliability Enhancement THA3:  Coating and Encapsulation
AFTERNOON	AFTERNOON	AFTERNOON
TP1:  Stacked Die and TSV  TP2:  Solderability TP1:  Stacked Die and TSV (cont.) TP3:  High Density Substrate Advances	WP1:  System/Subsystem Packaging WP2:  Manufacturing Systems and Strategies WP3: System/Subsystem Reliability WP4:  Solder Assembly Challenges
EVENING	EVENING	EVENING
Keynote Presentation 1	Keynote Presentation 2	Luau