Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

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Pan Pac Newsletter

A Successful Pan Pacific Symposium 2015

The 20th Annual Pan Pacific Microelectronics Symposium that took place February 2-5, 2015, at the Sheraton Kauai Resort on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Over fifty papers were presented to attendees from fourteen countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

As selected by the Technical Committee, the Best Paper Award went to Binghamton University for their paper titled "Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints" presented by Peter Borgesen, Ph.D.

Technical papers from all sessions are featured in the 2015 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.

"2015 marked the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA," noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation.

Next year the symposium will be held January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. For more information on the Pan Pacific Microelectronics Symposium, contact Tanya Martin at 952-920-7682 or

Abstract Deadline: 15 June 2015

Abstracts of 500 words should be submitted with title and author contact information.

Submit an abstract today!

Pan Pac Provides You The Latest Research On

  • Failure Analysis Tools and Techniques
  • Strategic Directions (Plenary)
  • 3D Structures
  • Advanced Materials
  • Advanced Manufacturing Challenges
  • Trends, Roadmaps, and more...

  • Steering Committee

    Charles E. Bauer, TechLead Corporation
    Dock Brown, DfR Solutions
    Phil Isaacs, IBM Corporation
    Soeren Noerlyng, MICRONSULT
    David Raby, STI Electronics
    M. Juergen Wolf, Fraunhofer Institute
    Jing Zhang, IBM Corporation

    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.