Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Poipu Beach

A Successful Pan Pacific Symposium 2014

The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

"2015 will mark the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA," noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation. "Come join the celebration and network with world leaders from throughout the electronics packaging, interconnect and assembly industry."

2014 Pan Pacific Symposium Proceedings

Technical papers from all sessions are currently featured in the 2014 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.

The 2015 Pan Pacific Microelectronics Symposium will be held February 3-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii. The Technical Committee is currently soliciting abstracts of your latest technical research to be presented in 2015.

Submit an Abstract Today

Pan Pac Provides You The Latest Research On

  • Failure Analysis Tools and Techniques
  • Strategic Directions (Plenary)
  • 3D Structures
  • Advanced Materials
  • Advanced Manufacturing Challenges
  • Trends, Roadmaps, and more...

  • David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.

    Invited Track Leaders:

    New Manufacturing Paradigms Tom Borkes, Jefferson Project
    3D Thermal Management Patrick McCluskey, University of Maryland
    Interposer Assembly Rao Tummala, Georgia Tech PRC
    3D/TSV & Heterogeneous Integration Juergen Wolf, Fraunhofer IZM Power Electronics
    Connection Taxonomy Kyung Wook Paik, KAIST and Keith Sweatman, Nihon Superior
    Embedded Assembly Joseph Fjelstad, Verdant Electronics
    Green Electronics Materials & Processes Alan Rae, NanoMaterials Innovation Center
    JIEP Research Henry Utsunomiya, Interconnection Technologies
    Manufacturing Process Control Horatio Quinones, Hilara
    Nano-Tech in Electronics Systems Bill Brox, Chalmers University of Technology
    Power Electronics Chris Bailey, Greenwich University
    Prognostics & Health Management Shunong Zhang, Ph.D., Beihang University
    Integrated Simulation & Modeling Kirsten Weide-Zaage, Leibniz University and Helene Fremont, IMS University of Bordeaux
    Medical Systems Dale Lee, Plexus and Matthew Hudes, Deloitte
    Roadmaps & Industry Trends Bill Bader, iNEMI
    Eco Design in Electronics Hajime Tomokage, Fukuoka University
    Reliability & Failure Analysis Janet Semmens, Sonoscan

    Steering Committee

    Steering Committee Chair Charles E. Bauer, TechLead
    Administrative Chair David Raby, STI Electronics
    American Chair Dock Brown, DfR Solutions
    Asian Chair Phil Isaacs, IBM Corporation
    European Chair Soren Norlyng, MICRONSULT

    Technical Committee

    Bill Bader, iNEMI
    Bernard Courtois, Ph.D., CMP
    Joseph Fjelstad, Verdant Electronics
    Yu-Jung Huang, Ph.D., I-Shou University
    Eddie Kobeda, Ph.D., IBM Corporation
    Sven Lamprecht, Atotech Deutschland GmbH
    Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
    Charles Lin, Ph.D., Bridge Semiconductor
    Lin Kwang Lung, National Cheng Kung University
    Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
    Tetsuro Nishimura, Nihon Superior Company Ltd.
    Kyung Paik, Ph.D., KAIST
    Michael Pecht, Ph.D., University of Maryland
    Horatio Quinones, Ph.D., Hilara
    Alan Rae, Ph.D., NanoMaterials Innovation Center
    Vern Solberg, STC Madison / Invensas Corporation
    Keith Sweatman, Nihon Superior Company Ltd.
    Rao Tummala, Ph.D., Georgia Institute of Technology
    Henry Utsunomiya, Interconnection Technologies, Inc.
    M. Juergen Wolf, Fraunhofer Institute
    Shunong Zhang, Beihang University
    Jing Zhang, IBM Corporation

    International Advisory Committee

    Chris Bailey, Greenwich University
    Bernard Courtois, CMP
    Alessandro Gandelli, Politecnico di Milano
    Fu Shen Li, I-Shou University
    Ricky Lee, HKUST
    Tetsuro Nishimura, Nihon Superior
    Professor Oh Tae Sung, Hungkik University
    Kyung Wook Paik, KAIST
    Keith Sweatman, Nihon Superior
    Hajime Tomokage, Fukuoka University
    M. Juergen Wolf, Fraunhofer Institute
    Zhu Jian, Alcatel Lucent Shanghai

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