Pan Pacific Microelectronics Symposium

Welcome to Pan Pacific 2015

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

New for 2015 - Expanded Monday Session!

Book your flight one day earlier to make sure you don't miss these great keynote presentations.

"2015 will mark the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA," noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation. "Come join the celebration and network with world leaders from throughout the electronics packaging, interconnect and assembly industry."

The 2015 Pan Pacific Microelectronics Symposium will be held February 2-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii.

Pan Pac Provides You The Latest Research On

  • Failure Analysis Tools and Techniques
  • Strategic Directions (Plenary)
  • 3D Structures
  • Advanced Materials
  • Advanced Manufacturing Challenges
  • Trends, Roadmaps, and more...

  • David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.

    Steering Committee

    Steering Committee Chair Charles E. Bauer, TechLead Corporation
    Administrative Chair David Raby, STI Electronics
    American Chair Dock Brown, DfR Solutions
    Asian Chair Phil Isaacs, IBM Corporation
    European Chair Soren Norlyng, MICRONSULT

    Technical Committee

    Bernard Courtois, Ph.D., CMP
    Joseph Fjelstad, Verdant Electronics
    Yu-Jung Huang, Ph.D., I-Shou University
    Eddie Kobeda, Ph.D., IBM Corporation
    Sven Lamprecht, Atotech Deutschland GmbH
    Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
    Charles Lin, Ph.D., Bridge Semiconductor
    Lin Kwang Lung, National Cheng Kung University
    Kyung Paik, Ph.D., KAIST
    Michael Pecht, Ph.D., University of Maryland
    Horatio Quinones, Ph.D.
    Alan Rae, Ph.D., NanoMaterials Innovation Center
    Rao Tummala, Ph.D., Georgia Institute of Technology
    Henry Utsunomiya, Interconnection Technologies, Inc.
    M. Juergen Wolf, Fraunhofer Institute
    Shunong Zhang, Beihang University
    Jing Zhang, IBM Corporation

    International Advisory Committee

    Chris Bailey, Greenwich University
    Bernard Courtois, CMP
    Alessandro Gandelli, Politecnico di Milano
    Fu Shen Li, I-Shou University
    Ricky Lee, HKUST
    Professor Oh Tae Sung, Hungkik University
    Kyung Wook Paik, KAIST
    Hajime Tomokage, Fukuoka University
    M. Juergen Wolf, Fraunhofer Institute
    Zhu Jian, Alcatel Lucent Shanghai