Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

2016 Program Finalized

The program for the 2016 Pan Pacific Microelectronics Symposium is finalized and now posted.

Click here to view the full schedule!


Save the Date for Pan Pac 2017!

Plan to join us next year at the Sheraton Kauai Resort
Kauai, Hawaii
February 6-9, 2017

Pan Pac 2017 Call for Abstracts

Start planning now to present your research next year. Abstracts of 500 words should be submitted with title and author contact information.

Submit an abstract today!



View the latest Pan Pacific Newsletters!
Pan Pac Newsletter Issue 2
   Pan Pac Newsletter Issue 1



Pan Pac Provides You The Latest Research On

  • 3D/Heterogeneous Integration
  • Emerging Technologies
  • Green Electronics
  • High Performance Low I/O
  • Internet of Things (IoT)
  • Material Advances
  • Nanotechnology
  • Photonics
  • Reliability and Quality
  • Trends, Roadmaps, and more...



  • Steering Committee

    Charles E. Bauer, TechLead Corporation
    Ross Berntson, Indium
    Dock Brown, DfR Solutions
    Phil Isaacs, IBM Corporation
    Soeren Noerlyng, MICRONSULT
    Yasumitsu Orii, Ph.D., IBM Research Tokyo
    David Raby, STI Electronics
    Jing Zhang, IBM Corporation


    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.