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Pan Pacific Microelectronics Symposium
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The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
Your 2012 Roadmap Starts at Pan Pac
Response to last year's Roadmap Session encouraged SMTA to greatly expand the 2012 Roadmap program into a Global Summit on Electronics Industry Roadmaps. Three dedicated sessions include roadmap reviews from iNEMI, IPC, JISSO and IBM will also discuss why roadmaps are important to product competitiveness.
Two Outstanding Keynote Addresses:
EU Electronics Research and Development Direction
by Christopher Bailey, Greenwich University
Pushing the Limits of Lead-Free Soldering
by Tetsuro Nishimura, Nihon Superior Co. Ltd.
Pan Pac Provides You The Latest Research On
Industry Roadmaps
Pb Free Advancements
3D Integrated Circuits
Evaluation and Failure Analysis
Strategic Manufacturing
Failure Modeling and Design
Process Advancement
and Green Technologies...
Promote Your Company:
Promotional package and sponsorship opportunities are available; please link to www.smta.org/panpac/sponsor.cfm for full information.
 "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference." David Raby, STI Electronics
General Conference Chair:
Abby Tsoi, Kasion Automation Ltd.
American Chair:
Phil Isaacs, IBM Corporation
Asian Chair:
Shen Li Fu, Ph.D., I-Shou University
European Chair:
Soren Norlyng, MICRONSULT
Committee:
Bill Bader, iNEMI
Charles Bauer, Ph.D., TechLead Corporation
Tom Chung, Ph.D., ASTRI
Bernard Courtois, Ph.D., CMP
Krista Crotty, Alberi EcoTech
Joseph Fjelstad, Verdant Electronics
Yu-Jung Huang, Ph.D., I-Shou University
Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
Charles Lin, Ph.D., Bridge Semiconductor
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Tetsuro Nishimura, Nihon Superior Company Ltd.
Kyung Paik, Ph.D., KAIST
Michael Pecht, Ph.D., University of Maryland
Peter Pooh, Ph.D.
Horatio Quinones, Ph.D., Nordson ASYMTEK
Alan Rae, Ph.D., TPF Enterprises LLC
Vern Solberg, Solberg Technical Consulting
Keith Sweatman, Nihon Superior Company Ltd.
Rao Tummala, Ph.D., Georgia Institute of Technology
Henry Utsunomiya, Interconnection Technologies, Inc.
M. Juergen Wolf, Fraunhofer Institute
With special appreciation to Richard Otte, Promex Industries, Inc., for his suggestions and contributions to the development of a roadmap track at Pan Pac 2012.
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