Pan Pacific Microelectronics Symposium
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
A Successful Pan Pacific Symposium 2014
The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
"2015 will mark the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA," noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation. "Come join the celebration and network with world leaders from throughout the electronics packaging, interconnect and assembly industry."
Technical papers from all sessions are currently featured in the 2014 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.
The 2015 Pan Pacific Microelectronics Symposium will be held February 3-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii.
The Technical Committee is currently soliciting abstracts of your latest technical research to be presented in 2015.
Pan Pac Provides You The Latest Research OnFailure Analysis Tools and Techniques
Strategic Directions (Plenary)
Advanced Manufacturing Challenges
Trends, Roadmaps, and more...
Invited Track Leaders:
New Manufacturing Paradigms Tom Borkes, Jefferson Project
3D Thermal Management Patrick McCluskey, University of Maryland
Interposer Assembly Rao Tummala, Georgia Tech PRC
3D/TSV & Heterogeneous Integration Juergen Wolf, Fraunhofer IZM
Connection Taxonomy Kyung Wook Paik, KAIST and Keith Sweatman, Nihon Superior
Embedded Assembly Joseph Fjelstad, Verdant Electronics
Green Electronics Materials & Processes Alan Rae, NanoMaterials Innovation Center
JIEP Research Henry Utsunomiya, Interconnection Technologies
Manufacturing Process Control Horatio Quinones, Hilara
Nano-Tech in Electronics Systems Bill Brox, Chalmers University of Technology
Power Electronics Chris Bailey, Greenwich University
Prognostics & Health Management Shunong Zhang, Ph.D., Beihang University
Integrated Simulation & Modeling Kirsten Weide-Zaage, Leibniz University and Helene Fremont, IMS University of Bordeaux
Medical Systems Dale Lee, Plexus and Matthew Hudes, Deloitte
Roadmaps & Industry Trends Bill Bader, iNEMI
Eco Design in Electronics Hajime Tomokage, Fukuoka University
Reliability & Failure Analysis Janet Semmens, Sonoscan
Steering Committee Chair Charles E. Bauer, TechLead
Administrative Chair David Raby, STI Electronics
American Chair Dock Brown, DfR Solutions
Asian Chair Phil Isaacs, IBM Corporation
European Chair Soren Norlyng, MICRONSULT
Bill Bader, iNEMI
Bernard Courtois, Ph.D., CMP
Joseph Fjelstad, Verdant Electronics
Yu-Jung Huang, Ph.D., I-Shou University
Eddie Kobeda, Ph.D., IBM Corporation
Sven Lamprecht, Atotech Deutschland GmbH
Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
Charles Lin, Ph.D., Bridge Semiconductor
Lin Kwang Lung, National Cheng Kung University
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Tetsuro Nishimura, Nihon Superior Company Ltd.
Kyung Paik, Ph.D., KAIST
Michael Pecht, Ph.D., University of Maryland
Horatio Quinones, Ph.D., Hilara
Alan Rae, Ph.D., NanoMaterials Innovation Center
Vern Solberg, STC Madison / Invensas Corporation
Keith Sweatman, Nihon Superior Company Ltd.
Rao Tummala, Ph.D., Georgia Institute of Technology
Henry Utsunomiya, Interconnection Technologies, Inc.
M. Juergen Wolf, Fraunhofer Institute
Shunong Zhang, Beihang University
Jing Zhang, IBM Corporation
International Advisory Committee
Chris Bailey, Greenwich University
Bernard Courtois, CMP
Alessandro Gandelli, Politecnico di Milano
Fu Shen Li, I-Shou University
Ricky Lee, HKUST
Tetsuro Nishimura, Nihon Superior
Professor Oh Tae Sung, Hungkik University
Kyung Wook Paik, KAIST
Keith Sweatman, Nihon Superior
Hajime Tomokage, Fukuoka University
M. Juergen Wolf, Fraunhofer Institute
Zhu Jian, Alcatel Lucent Shanghai
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