10 - 12 February 2009
Big Island of Hawaii
 
Conference
At-A-Glance
Tuesday
Wednesday
Thursday
Special Events
Exhibitors
Last Year's Event
Register Now
Accommodations


Wearing Hawaii

08:30 - 10:00 (8:30AM - 10:00AM)
Registration

08:30 - 10:00 (8:30AM - 10:00AM)
Exhibitor Set Up

10:00 - 11:30 (10:00AM - 11:30AM)
Session TA1: Environmental Sensitivity
Session TA2: Market Directions and Trends


11:30 - 13:00 (11:30AM - 1:00PM)
Lunch Break


13:00 – 15:00 (1:00pm – 3:00pm)
Session TP1: Solderability and Reliability
Session TP2: Logistics and Prognostics


15:00 - 15:30 (3:00PM - 3:30PM)
Coffee Break


15:30 - 17:00 (3:30PM - 5:00PM)
Session TP3: Test and Measurement
Session TP4: High Frequency Challenges


Keynote Address I:
17:15 – 18:00 (5:15pm – 6:00pm)
Cleaning Relevance in Electronics Assembly, the Value Proposition
Thomas M. Forsythe and Michael L. Bixenman, Kyzen Corporation


Welcome Reception
18:00 – 19:00 (6:00pm – 7:00pm)











Hang loose 09:00 – 10:30 (9:00am – 10:30am)
Session WA1: 3D Assembly
Session WA2: Unusual Soldering Challenges


10:30 - 11:00 (10:30AM - 11:00AM)
Coffee Break With Exhibitors


11:00 – 12:30 (11:00am – 12:30pm)
Session WA1: 3D Assembly (Continued)
Session WA2: Unusual Soldering Challenges (Continued)


12:30 – 14:00 (12:30pm – 2:00pm)
Lunch Break


14:00 – 16:00 (2:00pm – 4:00pm)
Session WP1: Assembly Strategies and Processes
Session WP2: Pb Free Solders and Reliability


16:00 – 16:30 (4:00pm – 4:30pm)
Coffee Break


16:30 – 17:30 (4:30pm – 5:30pm)
Session WP1: Assembly Strategies and Processes (Continued)
Session WP2: Pb Free Solders and Reliability (Continued)


Keynote Address II:
17:45 - 18:30 (5:45PM - 6:30PM)
High Tech Investing in Difficult Economic Times
Mario Ferrario, Redifin Italy


Recognition Reception
18:30 – 19:30 (6:30pm – 7:30pm)








Thumbs up 09:00 – 11:00 (9:00am – 11:00am)
Session THA1: Second Level Assembly
Session THA2: Solder Processing and Rework


11:00 – 11:30 (11:00am – 11:30am)
Coffee Break


11:30 – 13:30 (11:30am – 1:30pm)
Session THA3: Device Packaging
Session THA4: New Materials and Deposition


Luau
18:00 – 21:00 (6:00pm – 9:00pm)
Graciously Sponsored
By Libra Industries
Luau sponsor Libra Industries









Home | Top

Copyright © 1999-2008 SMTA, All rights reserved.
Reproduction in whole or in part without permission is prohibited.
SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819