The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly.
The Technical Program Committee invites you to submit your recent results for presentation at the Symposium on any of the following
topics:
Business
- Cross Cultural Management
- Economics & Cost Analysis
- Green Manufacturing (Energy
- Conservation, Pb- & Halogen-free, etc.)
- Manufacturing Management
- Outsourcing Strategies
- Supplier Chain & Operations Management
- Roadmaps
- Supply Chain & Operations Management
Packaging
- 3D and Stacked Packages
- Ball Grid Array
- Chip Scale
- Display Drivers
- Embedded Devices
- Flip Chip
- Integrated Passive Devices (IPDs)
- MCM/SiP
- RF and Microwave
- Thermal Management
- Wafer Level Assembly
Interconnection
- Advanced PWBs
- Co-Fired Ceramics
- Flat Panel Displays
- Flex / Flex Rigid
- High Density Interconnects
- Microvias
- Shaped Circuits
- Thin & Thick Film Materials
- Markets
- Characterizations
- Penetration Strategies
- Segmentation
- Technology Drivers
- Trends and Forecasts
Assembly
- Automation Control
- Component Placement
- Direct Chip Attach
- Materials and Processes
- Repair & Rework
- Test & Troubleshooting
Microsystems & Nanotechnology
- Actuators
- DFX
- MEMS/MOEMS
- Nano Materials
- Nano Systems
- Optoelectronics
- Partitioning Strategies
- Sensors
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Abstracts of 500 words should be submitted by July 20, 2007, with title and author contact information. Press the button below to submit your abstract directly to the SMTA server, where the Pan Pacific Technical Committee will have access to review your information.
Papers will be due by November 9, 2007.
Please be sure to obtain permission to write your paper, as well as attend the symposium, before submitting your abstract.
Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed.
SUBMIT ABSTRACT
ONLINE
-or-
Abstracts may also be submitted to:
JoAnn Stromberg, SMTA
Pan Pacific Microelectronics Symposium
5200 Willson Road, Suite 215
Edina, MN 55424-1316 USA
Phone: 952-920-7682 Fax: 952-926-1819
Email: joann@smta.org
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