Pan Pacific Microelectronics Symposium

Call for Papers

The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.

Abstract Deadline Extended: 31 August 2014

Abstracts of 500 words should be submitted with title and author contact information. Let us know if you want an official letter in support of management approval for your paper submission!


You will be notified by September 2014 if your abstract has been accepted and scheduled for presentation.


We solicit your submissions in any topical area including the following:

3D/Heterogeneous Integration

  • Build Up/Blind & Buried Via PWBs
  • Cu Pillars & Posts
  • MCM/SiP Advances
  • Module Stacking Origami Flex Packages
  • Package on Package (PoP) Shaped Circuits
  • Thru Si Vias (TSV)

    Emerging Technologies

  • Advanced Connectors
  • Embedded Assembly (Passive & Active)
  • Interposer Technologies (Si, Glass, etc.)
  • Thermal Management

    Green Electronics

  • Environmental Impact Analysis
  • Green Manufacturing (Pb/Halogen-free, etc.)
  • Large Area/Module Assembly
  • Photovoltaics
  • Power Control/Conversion/Distribution
  • Power Packaging
  • Solar Thermal Conversion

    High Performance Low I/O

  • Chip on Glass (CoG)
  • Compact Florescent Systems
  • Display Drivers
  • Flat Panel Processes
  • LED Packaging & Assembly
  • Lighting & Displays OLED Developments
  • MEMS/MOEMS

  • Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.

    Steering Committee

    Steering Committee Chair Charles E. Bauer, TechLead Corporation
    Administrative Chair David Raby, STI Electronics
    American Chair Dock Brown, DfR Solutions
    Asian Chair Phil Isaacs, IBM Corporation
    European Chair Soren Norlyng, MICRONSULT

    Technical Committee

    Bernard Courtois, Ph.D., CMP
    Joseph Fjelstad, Verdant Electronics
    Yu-Jung Huang, Ph.D., I-Shou University
    Eddie Kobeda, Ph.D., IBM Corporation
    Sven Lamprecht, Atotech Deutschland GmbH
    Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
    Charles Lin, Ph.D., Bridge Semiconductor
    Lin Kwang Lung, National Cheng Kung University
    Kyung Paik, Ph.D., KAIST
    Michael Pecht, Ph.D., University of Maryland
    Horatio Quinones, Ph.D.
    Alan Rae, Ph.D., NanoMaterials Innovation Center
    Rao Tummala, Ph.D., Georgia Institute of Technology
    Henry Utsunomiya, Interconnection Technologies, Inc.
    M. Juergen Wolf, Fraunhofer Institute
    Shunong Zhang, Beihang University
    Jing Zhang, IBM Corporation

    International Advisory Committee

    Chris Bailey, Greenwich University
    Bernard Courtois, CMP
    Alessandro Gandelli, Politecnico di Milano
    Fu Shen Li, I-Shou University
    Ricky Lee, HKUST
    Professor Oh Tae Sung, Hungkik University
    Kyung Wook Paik, KAIST
    Hajime Tomokage, Fukuoka University
    M. Juergen Wolf, Fraunhofer Institute
    Zhu Jian, Alcatel Lucent Shanghai