The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.
Abstract Deadline: 16 June 2014
Abstracts of 500 words should be submitted with title and author contact information.
Let us know if you want an official letter in support of management approval for your paper submission!
You will be notified by September 2014 if your abstract has been accepted and scheduled for presentation.
We solicit your submissions in any topical area including the following:
Build Up/Blind & Buried Via PWBs
Cu Pillars & Posts
Module Stacking Origami Flex Packages
Package on Package (PoP) Shaped Circuits
Thru Si Vias (TSV)
Embedded Assembly (Passive & Active)
Interposer Technologies (Si, Glass, etc.)
Environmental Impact Analysis
Green Manufacturing (Pb/Halogen-free, etc.)
Large Area/Module Assembly
Solar Thermal Conversion
High Performance Low I/O
Chip on Glass (CoG)
Compact Florescent Systems
Flat Panel Processes
LED Packaging & Assembly
Lighting & Displays OLED Developments
Connections (Adhesives, Solders, etc.)
Integrated Passive Devices
Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
Nano Materials & Applications
Phosphors & Light Absorption
Thermal Interface Materials (TIMs)
Thin & Thick Film Systems
Strategic Direction/ Industry Roadmaps
Economics & Cost Analysis
Health & Prognostics
Manufacturing Management & Control
Supply Chain & Operations Management
Trends, Forecasts & Roadmaps
Test & Measurement
Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.
Invited Track Leaders:
New Manufacturing Paradigms Tom Borkes, Jefferson Project
Interposer Assembly Rao Tummala, Georgia Tech PRC
3D/TSV & Heterogeneous Integration Juergen Wolf, Fraunhofer IZM
Connection Taxonomy Kyung Wook Paik, KAIST
Embedded Assembly Joseph Fjelstad, Verdant Electronics
Green Electronics Materials & Processes Tom Forsythe, Kyzen Corp.
Prognostics & Health Management Shunong Zhang, Ph.D., Beihang University
Statistics & Probability in Electronics Yu Jung Huang, I Shou University
Integrated Simulation & Modeling Chris Bailey, University of Greenwich
Medical Systems Dale Lee, Plexus
Roadmaps & Industry Trends Bill Bader, iNEMI
Eco Design in Electronics Hajime Tomokage, Fukuoka University
Reliability & Failure Analysis Janet Semmens, Sonoscan
Steering Committee Chair Charles E. Bauer, TechLead
Administrative Chair David Raby, STI Electronics
Marketing Chair Tom Forsythe, Kyzen Corporation
American Chair Dock Brown, Medtronic (Emeritus)
Asian Chair Phil Isaacs, IBM Corporation
European Chair Soren Norlyng, MICRONSULT
Bill Bader, iNEMI
Tom Chung, Ph.D., CTC
Bernard Courtois, Ph.D., CMP
Joseph Fjelstad, Verdant Electronics
Yu-Jung Huang, Ph.D., I-Shou University
Eddie Kobeda, IBM Corporation
Wei Koh, PacRim Technologies
Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
Charles Lin, Ph.D., Bridge Semiconductor
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Tetsuro Nishimura, Nihon Superior Company Ltd.
Kyung Paik, Ph.D., KAIST
Michael Pecht, Ph.D., University of Maryland
Peter Pooh, Ph.D.
Horatio Quinones, Ph.D., Hilara
Alan Rae, Ph.D., NanoMaterials Innovation Center
Vern Solberg, STC Madison / Invensas Corporation
Keith Sweatman, Nihon Superior Company Ltd.
Rao Tummala, Ph.D., Georgia Institute of Technology
Henry Utsunomiya, Interconnection Technologies, Inc.
M. Juergen Wolf, Fraunhofer Institute
Shunong Zhang, Beihang University
International Advisory Committee
Chris Bailey, Greenwich University
Bernard Courtois, CMP
Fu Shen Li, I-Shou University
Ricky Lee, HKUST
Tetsuro Nishimura, Nihon Superior
Kyung Wook Paik, KAIST
Keith Sweatman, Nihon Superior
Hajime Tomokage, Fukuoka University
M. Juergen Wolf, Fraunhofer Institute
Zhu Jian, Alcatel Lucent Shanghai