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The Pan Pacific Microelectronics Symposium promotes International technical
interchange and provides a premier forum for extensive networking among
microelectronics professionals and business leaders throughout the Pacific
Basin. Participants come from Australia, China, India, Japan, Korea, North America,
Southeast Asia, and Taiwan as well as Europe!
The Pan Pacific Microelectronics Symposium focuses on the critical business markets
and technologies of microelectronic packaging, interconnection, microsystems
technology and assembly. The Program Committee invites you to submit your recent
results for presentation at the Symposium on any of the topics listed below.
For a PDF copy of the Pan Pac 2010 Call for Papers, please click here
Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.
Abstracts of 500 words should be submitted with title and author contact information. Extended deadline date of August 28th. Click the "Submit Abstract" button below to submit your abstract directly to the SMTA server, for review by the the Pan Pacific Technical Committee.
You will be notified by September 11, 2009 if your abstract has been accepted and scheduled for presentation.
Business
Cross Cultural Management
Economics and Cost Analysis
Green Manufacturing (Energy Conservation, Pb- and Halogen-free, etc.)
Manufacturing Management
Outsourcing Strategies
Supplier Chain and Operations Management
Roadmaps
Supply Chain and Operations Management
Packaging
3D and Stacked Packages
Ball Grid Array
Chip Scale
Display Drivers
Embedded Devices
Flip Chip
Integrated Passive Devices (IPDs)
MCM/SiP
Power Packaging
RF and Microwave
Thermal Management
Wafer Level Assembly
Interconnection
Advanced PWBs
Co-Fired Ceramics
Embedded Passives
Flat Panel Displays
Flex / Flex Rigid
High Density Interconnects
Microvias
Shaped Circuits
Thin and Thick Film Materials
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Markets
Characterizations
Penetration Strategies
Segmentation
Technology Drivers
Trends and Forecasts
Assembly
Automation Control
Component Placement
Direct Chip Attach
Materials and Processes
Repair and Rework
Test and Troubleshooting
Microsystems and Nanotechnology
Actuators
DFX
MEMS/MOEMS
Nano Materials
Nano Systems
Optoelectronics
Partitioning Strategies
Sensors
Solar Electronics
Materials and Processes
Photovoltaic Devices and Packaging
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