Pan Pacific Microelectronics Symposium

Call for Papers

The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.

Pan Pacific Call for Papers

Abstract Deadline: 15 June 2015

Abstracts of 500 words should be submitted with title and author contact information. Let us know if you want an official letter in support of management approval for your paper submission!

You will be notified by September 2015 if your abstract has been accepted and scheduled for presentation. All accepted papers will be published in the conference proceedings, SMTA Knowledge Base and submitted to the IEEE Xplore Digital Library.

We solicit your submissions in any topical area including the following:

3D/Heterogeneous Integration

  • Build Up/Blind & Buried Via PWBs
  • Cu Pillars & Posts
  • MCM/SiP Advances
  • Module Stacking Origami Flex Packages
  • Package on Package (PoP) Shaped Circuits
  • Thru Si Vias (TSV)

    Emerging Technologies

  • Advanced Connectors
  • Embedded Assembly (Passive & Active)
  • Interposer Technologies (Si, Glass, etc.)
  • Thermal Management
  • Printed Electronics
  • Wearable Electronics
  • Structural Electronics

    Green Electronics

  • Environmental Impact Analysis
  • Green Manufacturing (Pb/Halogen-free, etc.)
  • Large Area/Module Assembly
  • Photovoltaics
  • Power Control/Conversion/Distribution
  • Power Packaging
  • Solar Thermal Conversion

    High Performance Low I/O

  • Chip on Glass (CoG)
  • Compact Florescent Systems
  • Display Drivers
  • Flat Panel Processes
  • LED Packaging & Assembly
  • Lighting & Displays OLED Developments

  • Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.

    Steering Committee

    Charles E. Bauer, TechLead Corporation
    Dock Brown, DfR Solutions
    Phil Isaacs, IBM Corporation
    Soeren Noerlyng, MICRONSULT
    David Raby, STI Electronics
    M. Juergen Wolf, Fraunhofer Institute
    Jing Zhang, IBM Corporation