Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

February 6-9, 2017
Sheraton Poipu Kauai Resort
Kauai, Hawaii

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

2017 Program Finalized

The Pan Pac technical committee has finalized the program for the 2017 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Kauai Resort. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies. The program for the 2017 Pan Pacific Microelectronics Symposium is finalized and now posted.

Click here to view the full schedule!




View the latest Pan Pacific Newsletters!
Pan Pac Newsletter Issue 3
   Pan Pac Newsletter Issue 2



Pan Pac Provides You The Latest Research On

  • 3D/Heterogeneous Integration
  • Emerging Technologies
  • Green Electronics
  • High Performance Low I/O
  • Internet of Things (IoT)
  • Material Advances
  • Nanotechnology
  • Photonics
  • Reliability and Quality
  • Trends, Roadmaps, and more...



  • Steering Committee

    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    Phil Isaacs, IBM Corporation
    Soeren Noerlyng, MICRONSULT
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Jing Zhang, IBM Corporation


    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.