Pan Pacific Microelectronics Symposium
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
A Successful 2013 Pan Pacific Symposium
The 18th Annual Pan Pacific Microelectronics Symposium that took place January 22-24, 2013, at the Makena Beach and Golf Resort in Maui, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
As rated by the attendees, the Best Presentation Award went to Rolf Aschenbrenner, Ph.D., Fraunhofer Institute for Reliability and Microintegration, for his paper titled, "Panel Level Packaging - A Manufacturing Solution for Cost Effective Systems."
Technical papers from all sessions are currently featured in the 2013 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.
Next year the symposium will be held February 11-13, 2014 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The call for papers will be posted in early March. For more information on the Pan Pacific Microelectronics Symposium, contact SMTA administrator JoAnn Stromberg at 952-920-7682 or firstname.lastname@example.org.
Pan Pac Provides You The Latest Research On
Failure Analysis Tools and Techniques
Strategic Directions (Plenary)
Advanced Manufacturing Challenges
Trends, Roadmaps, and more...
Promote Your Company:
Corporate promotional packages are available; please link to www.smta.org/panpac/promo.cfm to find out how your company can reach these key decision-makers.
Invited Track Leaders:
New Manufacturing Paradigms Tom Borkes, Jefferson Project
Interposer Assembly Rao Tummala, Georgia Tech PRC
3D/TSV & Heterogeneous Integration Juergen Wolf, Fraunhofer IZM
Connection Taxonomy Kyung Wook Paik, KAIST
Embedded Assembly Joseph Fjelstad, Verdant Electronics
Green Electronics Materials & Processes Tom Forsythe, Kyzen Corp.
Prognostics & Health Management Shunong Zhang, Ph.D., Beihang University
Statistics & Probability in Electronics Yu Jung Huang, I Shou University
Integrated Simulation & Modeling Chris Bailey, University of Greenwich
Medical Systems Dale Lee, Plexus
Roadmaps & Industry Trends Bill Bader, iNEMI
Eco Design in Electronics Hajime Tomokage, Fukuoka University
Reliability & Failure Analysis Janet Semmens, Sonoscan
Steering Committee Chair Charles E. Bauer, TechLead
Administrative Chair David Raby, STI Electronics
Marketing Chair Tom Forsythe, Kyzen Corporation
American Chair Dock Brown, Medtronic (Emeritus)
Asian Chair Phil Isaacs, IBM Corporation
European Chair Soren Norlyng, MICRONSULT
Bill Bader, iNEMI
Tom Chung, Ph.D., CTC
Bernard Courtois, Ph.D., CMP
Joseph Fjelstad, Verdant Electronics
Yu-Jung Huang, Ph.D., I-Shou University
Eddie Kobeda, IBM Corporation
Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
Charles Lin, Ph.D., Bridge Semiconductor
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Tetsuro Nishimura, Nihon Superior Company Ltd.
Kyung Paik, Ph.D., KAIST
Michael Pecht, Ph.D., University of Maryland
Peter Pooh, Ph.D.
Horatio Quinones, Ph.D., Nordson ASYMTEK
Alan Rae, Ph.D., NanoMaterials Innovation Center
Vern Solberg, STC Madison / Invensas Corporation
Keith Sweatman, Nihon Superior Company Ltd.
Rao Tummala, Ph.D., Georgia Institute of Technology
Henry Utsunomiya, Interconnection Technologies, Inc.
M. Juergen Wolf, Fraunhofer Institute
Shunong Zhang, Beihang University
International Advisory Committee
Chris Bailey, Greenwich University
Bernard Courtois, CMP
Fu Shen Li, I-Shou University
Ricky Lee, HKUST
Tetsuro Nishimura, Nihon Superior
Kyung Wook Paik, KAIST
Keith Sweatman, Nihon Superior
Hajime Tomokage, Fukuoka University
M. Juergen Wolf, Fraunhofer Institute
Zhu Jian, Alcatel Lucent Shanghai