The Pan Pacific Microelectronics Symposium promotes International technical
interchange and provides a premier forum for extensive networking among
microelectronics professionals and business leaders throughout the Pacific
Basin. Participants come from Australia, China, India, Japan, Korea, North America,
Southeast Asia, and Taiwan as well as Europe!
The Pan Pacific Microelectronics Symposium focuses on the critical business markets
and technologies of microelectronic packaging, interconnection, microsystems
technology and assembly. The Program Committee invites you to submit your recent
results for presentation at the Symposium on any of the following topics.
For a PDF copy of the Pan Pac 2008 Call for Papers, please click here
Business
Cross Cultural Management
Economics and Cost Analysis
Green Manufacturing (Energy Conservation, Pb- and Halogen-free, etc.)
Manufacturing Management
Outsourcing Strategies
Supplier Chain and Operations Management
Roadmaps
Supply Chain and Operations Management
Packaging
3D and Stacked Packages
Ball Grid Array
Chip Scale
Display Drivers
Embedded Devices
Flip Chip
Integrated Passive Devices (IPDs)
MCM/SiP
RF and Microwave
Thermal Management
Wafer Level Assembly
Interconnection
Advanced PWBs
Co-Fired Ceramics
Flat Panel Displays
Flex / Flex Rigid
High Density Interconnects
Microvias
Shaped Circuits
Thin and Thick Film Materials
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Markets
Characterizations
Penetration Strategies
Segmentation
Technology Drivers
Trends and Forecasts
Assembly
Automation Control
Component Placement
Direct Chip Attach
Materials and Processes
Repair and Rework
Test and Troubleshooting
Microsystems and Nanotechnology
Actuators
DFX
MEMS/MOEMS
Nano Materials
Nano Systems
Optoelectronics
Partitioning Strategies
Sensors
See below for an on-line abstract submission method.
Abstracts may also be submitted to:
JoAnn Stromberg, SMTA
Pan Pacific Microelectronics Symposium
5200 Willson Road, Suite 215
Edina, MN 55424-1316 USA
Phone: 952-920-7682 Fax: 952-926-1819
Email: joann@smta.org
Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.
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Abstracts of 500 words should be submitted by July 20, 2007, with title and author contact information. Press the button below to submit your abstract directly to the SMTA server, where the Pan Pacific Technical Committee will have access to review your information.
Papers will be due by November 9, 2007.
Please be sure to obtain permission to write your paper, as well as attend the symposium, before submitting your abstract.
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TECHNICAL PROGRAM COMMITTEE
General Chair
Zhu Jian,
Alcatel Shanghai Bell Co., Ltd.(China)
Technical Chairs
Soren Norlyng
MICROCONSULT (Denmark)
Alan Rae, Ph.D.,
NanoDynamics (USA)
M. Juergen Wolf,
Fraunhofer Institute (Germany)
North American Coordinator
Charles E. Bauer, Ph.D.
TechLead Corporation, USA
Australia/New Zealand
Neil Douglas, SMS Ltd.
China
Zhou Xin, Huawei Technologies
Japan
Yoshikazu Nakamura, Ph.D., Future Package Technology
Masahide Tsukamoto, Ph.D., Masashi Engineering
Korea
Kim Il Ung, Ph.D., Samsung
Kyung Wook Paik, Ph.D., KAIST
Singapore
Charles Lin, Ph.D., Bridge Semiconductor
Taiwan
Shen-Li Fu, Ph.D., I-Shou University
Charles Lin, Ph.D., Bridge Semiconductor
USA
Ken Gilleo, Ph.D., ET-Trends
Horatio Quinones, Asymtek
Paul Wang, Ph.D., Microsoft (USA)
Administrative Chair
JoAnn Stromberg, SMTA
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