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SMTA Welcomes New Board Members

 The SMTA is pleased to announce its election results for the Board of Directors for the term beginning during SMTA International (September 25 - 29, 2016). Jeff Kennedy, Celestica, Inc., was elected President. Sal Sparacino, ZESTRON Americas, was elected VP Communications. Richard Henrick, Sanmina Corporation, was re-elected as Secretary. Matt Kelly, P.Eng, MBA, IBM Corporation, and Martin Anselm, Ph.D., Rochester Institute of Technology, were re-appointed to the Strategic Development Committee.

Those remaining on the SMTA Board of Directors include: Treasurer, Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.; VP Expos, Debbie Carboni, KYZEN Corporation; VP Membership, Eileen Hibbler, TEK Products; VP Technical Programs, Raiyomand Aspandiar, Ph.D., Intel Corporation; Strategic Development Committee members include: Richard Coyle, Ph.D., Nokia; Tim Jensen, Indium Corporation and Scott Priore, Cisco Systems, Inc.

 

The SMTA bids a fond farewell to departing President, Bill Barthel, Plexus Corporation, and VP Communications, Michelle Ogihara, Seika Machinery, Inc. They are congratulated for a job well done and given thanks for the years of dedication to the SMTA.





SMTA China Presents Best-Paper/Presentation Awards at SMTA China South 2016 Conference

SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Recption, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the Nepcon South China Show.

IBM Procurement China Limited’s Robin Hou was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge and Solution for Rework of Array Components”

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference Two for the paper titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process”

Pacrim Technology Inc.’s Dr. Wayne Koh was received the award for The Best Presentation of Technology Conference One for the presentation titled “Package Warpage Control and SMT Solder Joint Defects”

Flex’s Henley Zhou was received the award for The Best Presentation of Technology Conference Two for the presentation titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process”

Jason Chan, from Kyzen Corporation, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Video Analysis of Solder Paste Release From Stencils”

Jason Chuah, from Kirsten Soldering AG received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Breakthrough of THT Soldering Solution”

Dragon Zhang, from BPM Microsystems received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The Landmark Innovation for Device Programming”

Kirsten, received the award for The Best Emerging Exhibit of the Year 2016 China South with the product of “Modula The Soldering System” , Model of “ The Modula Wave®

BTU received the award for The Best Exhibit Technology of the Year 2016 China South with the product of “Reflow Oven”, Model of “Pyramax 125N”

SMTA China 2016 Best Papers

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn





SMTA China Celebrates the 10th Anniversary

SMTA China held its 10th Anniversary Celebration Reception and Long Service Awards presentation at the show floor of NEPCON South China 2016, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center.  Founding officers and members were being recognized with the Long Service Award.

Abby Tsoi, Managing Director, Kasion Automation Limited

Zhu Jian, Vice Manager, Shanghai Fu Shan Precision Manufacturing Co., Ltd.

Zheng Zeping, Asia Pacific Director, BTU International Inc.

Zhang Zemin, Vice General Manager, Manufacturing Dept. Eastem Comunications Ltd.

Alex Choi, Vice President, Shenzhen Kaifa Technology Limited

Dr. Pan Kai Lin, Prof. and Ph.D, Guilin University of Electronic Technology School of Mechanical & Electroinc Engineering

Dr. Danny Li, Vice President-Operations Item Industries Limited

Mr. Maverick Luk, Public Relations Manager Electronic Technoloyg Publishing Group

Ms. Peggy Chan, Executive Administrator, SMTA China

Ms. Megan Wendling, President, MW Associations

Mr. Su Man Bo, Seretary-General, Guangdong Electronic Institute Commitee

Mr. Michael Wong, Senior Director, Manufacturing Engineering, Asia Operations, Embedded Computing and Power, Artesyn Embedded Technologies

Mr. Sam Leung, Vice President of SMTA Hong Kong Chapter

Mr. Simon Wong, Director, The Refined Industry Co., Ltd.

Mr. Ivan Leung, Vice President of SMTA Hong Kong Chapter

Mr. Simon Lam, General Manager, Qantas Technology Limted

Mr. John Lau, Vice President of SMTA Hong Kong Chapter 

SMTA China 10th Anniversary Long Service Awards 2016

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn





SMTA China Announces Winners of the 2016 Annual Awards at SMTA China 10th Anniversary Reception

SMTA China held its annual awards presentation at the SMTA China 10th Anniversary Reception, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center.

Lin Dong, Section Manager, SMT Engineering of Artesyn Embedded Technologies, was named Officer of the Year. Lin Dong has provided a great support for the SMTA China Conference for many years, he has been the Conference Chairman of Technology Conference for years.

Billy Shen, Area Sales Manager of JBC Soldering Tools (Shanghai) Trading Co., Ltd. was awarded Individual Member of the Year. Billy Shen has been a very active member and has been the Conference Chairman of Vendor Conference for years.

Megan Wendling, President of MW Associate, was named Councilor of the Year. Megan has provided much support over the years to all events including conferences for SMTA China and has solicited sponsors to SMTA China.

Kyzen Corporation was named Member Sponsor of the Year.  Kyzen has joined SMTA as International Corporate Member for 23 years and provided a great sponsorship to SMTA China and events including conferences, golf tournament, with many complimentary supports in teaching and organization for the conferences and training of SMTA China for many years.

Reed Exhibitions (China) Ltd., Shanghai Branch was awarded Partner Sponsor of the Year. Reed Exhibitions has sponsored SMTA China Conferences and Meetings in conjunction with the NEPCON shows at Shanghai and Shenzhen for years. Reed is one of the premium sponsors of SMTA China to date.

SMT China Magazine was named Media Sponsor of the Year. SMT China Magazine has provided a big support in the SMTA China Conference Program and promote the technology conferences, vendor conferences, training courses, annual reception and dinner as well as annual golf tournament sponsorship with the official Nepcon show daily publications. 

SMTA China Annual Awards 2016

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn





SMTA 2016 Chapter of the Year Award Winners Announced

The SMTA proudly announces the winners of its "Chapter of the Year" award in recognition of the accomplishments made by local SMTA chapters. This year the SMTA Atlanta Chapter won the title of "Chapter of the Year."

Several chapters were recognized for specific achievements, as runners up, and for honorable mention. The Oregon Chapter won 2nd Place and the Dallas Chapter claimed 3rd Place. For the fourth year in a row, the Penang Chapter won the International Chapter of the Year.

Outstanding achievement awards went to the Michigan, Mexico (Guadalajara), and Intermountain Chapters for Top Chapter Membership. Puget Sound won the Outstanding Development Award for most improved chapter. Massachusetts, Toronto, and Wisconsin Chapters all received honorable mention.

Awards will be presented during the Annual Chapter Officer's Meeting held during SMTA International in Rosemont, IL on Tuesday, September 27 at 12:30 p.m.

More information about SMTA Chapters and a list of the winners can be found online at: http://www.smta.org/chapters/chapters.cfm

For more information about the SMTA Chapter of the Year, contact Karen Frericks at 952-920-7682 or karenchapters@smta.org. 





International Wafer-Level Packaging Conference (IWLPC) Workshops

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC).  On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California. 

 

WS1: Introduction to Fan-Out Wafer-Level Packaging

Beth Keser, Ph.D., Qualcomm

8:30am-12:00pm

Fan-Out Wafer-Level Packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for over 8 years. FO-WLP has matured enough that it has come to a crossroads where it has the potential to change the electronic packaging industry by eliminating wirebond and bump interconnections, substrates, leadframes, and the traditional flip chip or wirebond chip attach and underfill assembly technologies across multiple applications. This course will cover the advantages of FO-WLP, potential application spaces, package structures available in the industry, process flows, material challenges, design rule roadmap, reliability, and benchmarking. This course has been updated with over 10% new material compared to the first time it was offered last year at IWLPC.

 

WS2:   Wafer-Level Packaging for the Functional Integration of MEMS and ICS

Chip Spangler, Ph.D., Aspen Microsystems, LLC

8:30am-12:00pm

The development of Wafer-Level Packaging (WLP) has been a major driving force for the size and cost reduction for integrated circuits as well as MEMS, microsystems, micro-optical and microfluidic products. Collectively referred to as MEMS, these devices require highly specialized packages that protect the fragile microstructures and still allow the desired signals, both electric and non-electric, to pass through the package to the die. The challenges and costs associated with MEMS packaging has, since the 1970’s, driven the development of Wafer-Level Packaging and associated technologies such as silicon and glass interposers, through wafer vias, wafer bonding and die stacking. Cost and size demands have since lead to the widespread adaptation of these MEMS-based WLP technologies by the integrated circuit package community. More recently the demand for multi-sensor products, greater levels of sensor intelligence and the connectivity requirements of IoT applications has driven the complex integration of MEMS and ICs through the use of WLP technologies.

 

WS3:   Choosing the Right IC Packaging

Chet Palesko, SavanSys Solutions LLC and Jan Vardaman, TechSearch International, Inc.

1:30pm-5:00pm

In this course, we will analyze the performance and size characteristics of traditional (lead frame options, wire bond PBGA, flip chip PBGA) and advanced packaging (Wafer-Level Packaging, Fan-Out WLP options, embedded die, 2.5D/interposer-based packaging, 3D packaging with through silicon vias). For each packaging technology, this course also provides a detailed cost analysis including the manufacturing process flow to fabricate and assemble the package and the dominant technology cost drivers.

This course will also examine how OEMs and suppliers can collaborate to develop a model which optimizes product manufacturing cost for IC packages. This modeling approach has been successfully used by a number of major OEMs and suppliers in North America, Europe, and Asia to match design technology choices with supplier competencies. Yields are improved and cost reduction is achieved across the entire supply chain.

 

WS4: Recent Advances and New Trends in Semiconductor Packaging

John Lau, Ph.D., ASM Pacific Technology

1:30pm-5:00pm

Recent advances in, e.g., Fan-Out Wafer/Panel Level Packaging (TSMC’s InFO-WLP and IZM’s FO-PLP), 3D IC packaging (TSMC’s InFO_PoP vs. Samsung’s ePoP), through-silicon vias (TSVs), microbumps, 3D IC integration (Hynix/Samsung’s HBM for AMD/NVIDIA’s GPU vs. Micron’s HMC for Intel’s Knights Landing CPU), 2.5D IC Integration (TSV-less interconnects and interposers), embedded 3D hybrid integration (of VCSEL, driver, serializer, polymer waveguide, etc.), 3D CIS/IC integration, 3D MEMS/IC integration, thin-wafer Handling, thermal management, semiconductor and packaging for IoTs are examined, and their new trends will be discussed in this lecture. The patents impacting the semiconductor packaging the most (so far) will be mentioned first and the patent issues of Fan-Out Wafer/Panel-Level will be discussed and some recommendations will be made.

 

Visit www.iwlpc.com for more information. 

Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.





Cleaning and Conformal Coating Conference Program Finalized

The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Session topics on October 26-27 include Processes for Achieving Reliability and Ruggedization, Cleaning Materials, Rinsing and Process Control, Conformal Coating, Customer Cleaning Challenges and Needs, Ultra-Thin or Nanocoatings in Electronics Assembly Operations.

Siva Sivasankar, Quality & Reliability Engineer at Google, will deliver the Wednesday morning keynote presentation titled “Building Reliable Hardware.” On Thursday morning, Dock Brown from DfR Solutions will deliver a keynote presentation on “Requirements for Cleaning and Coating to Building Reliable Medical Hardware.”

The Expo will be held October 26-27.  Conference participants may attend the expo at no charge.

If you have any questions please contact Jenny Ng, Conference and Education Manager jenny@smta.org

For more information or to register visit: go to www.ipc.org/cleaning





New SMTA Scholarship Rewards Student Leaders, Honors JoAnn Stromberg

The SMTA unveiled an annual scholarship for undergraduate students pursuing a degree in electronics and actively involved in the SMTA. In honor of the nearly 30 years of service dedicated by former Executive Administrator, JoAnn Stromberg, a $3000 Student Leader Scholarship was established following her retirement in 2015. The purpose of the scholarship is to encourage undergraduate students to take on more leadership opportunities and strengthen the connection between students and the electronics industry.

SMTA President Bill Barthel commented, “This scholarship is intended to pay tribute to all JoAnn has done for the Association and industry.  As a former teacher this aligns with her and the Association’s values.”

Officers from the Dallas, Houston, and Austin SMTA Chapters played a critical role taking this effort from vision to reality, including criteria definition and financial support for the first five years.  

More information can be found online at: http://www.smta.org/scholarship/





SMTA International 2015 Papers Now Available in SMTA Knowledge Base

The Technical Conference Proceedings from the SMTA International Conference and Exhibition (SMTAI) 2015 are now available for download from the SMTA Knowledge Base, it is announced today.

“This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, and more,” stated Ryan Flaherty, SMTA Director of Communications, in making the announcement. “You can download more than 130 papers that were presented in the technical sessions last Fall at SMTA International, including papers from the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.”

The proceedings can be browsed directly in the online Knowledge Base here:

http://www.smta.org/knowledge/proceedings_list.cfm?event_id=1130

Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but PDF downloads are accessible for free only to SMTA members. Non-members can purchase individual articles for $10 each, or easily become an SMTA member for real-time access to the Knowledge Base.

The SMTA International Conference and Exhibition (SMTAI) 2016 will be held September 25 - 29, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The SMTA International technical conferences continue the tradition of being the strongest in the electronics assembly industry.