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Ivan Castellanos Instructs Record-Breaking SMT Processes Certification Class in Honduras

Indium Corporation’s Ivan Castellanos, Technical Services Manager, Latin America, recently hosted the highest-attended SMT Processes Certification course ever, with 34 attendees. Making this accomplishment even more remarkable, this class, taught in Honduras, was delivered with instruction in both English and Spanish.


Castellanos is SMTA’s primary Spanish-speaking instructor, offering native-language, high-quality instruction to those throughout Central and South America. He has also assisted the SMTA with Spanish translations, and collaborates on ideas for reaching new markets and ways to make the certification program stronger.


“We are very appreciative of the contributions and support from Ivan and Indium Corporation,” said Jenny Ng, SMTA’s Conference and Education Manager. “Ivan is instrumental in the SMTA Certification Program. He brings many years of experience in the manufacturing industry and expertise in SMT Processes and Six Sigma Green Belt.”


Castellanos supports Indium Corporation’s electronics assembly, semiconductor fabrication and packaging, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 15 years of experience in electronics assembly manufacturing, including SMT production troubleshooting.


Castellanos has a Diploma in Electronics and Communications Engineering and is an SMTA Certified SMT Process Engineer (CSMTPE). He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. Ivan has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico.

SMTA International 2016 Concludes Successfully

SMTA International Conference and Exhibition, which took place September 25 – 29, 2016 at the Donald E. Stephens Convention Center in Rosemont, IL, concluded successfully.

The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Emerging Technologies Summit at the beginning of the week received much praise as it covered key technologies such as Alternate Alloys, Printed Electronics, Additive Manufacturing, and other innovative technologies. The Harsh Environments Symposium keynote presentation on Advances in Autonomous Driving by Delphi’s Dwight Howard was well-received by attendees.

A first-ever SMTA technical session made up of entirely women presenters brought some impressive insight on conformal coating technology to the highly-anticipated Women’s Leadership Program on Monday afternoon. The session opened with a keynote presentation by Intel’s Milena Vujosevic, Ph.D., and closed with a panel and reception featuring Technical Accomplishments of Women Engineers in electronics manufacturing.

A crowd filled the Opening Keynote Session until it was standing-room-only on Tuesday morning to hear Seagate Technology’s VP of Engineering, Daniel Kuhl, give an impressive look at future trends in storage technology.

The Lead-Free Soldering Technology Symposium as well as the expanded Manufacturing Excellence track sessions kept the meeting rooms packed until the very end of the conference on Thursday.

The SMTA International show floor experienced a 10% increase in booth space. Over 170 exhibiting companies filled the expanded exhibit hall bringing more equipment than before. The co-located Sensors Midwest added 60 more exhibiting companies focused on component-level technology and many attendees walked both shows. Traffic on the show floor was noticeably higher this year.

Mick Austin from Vitronics Soltec remarked, “The show floor felt busier this year than in past years.”

Once again the Tech Tour program featured distinguished tour guides leading groups of attendees to exhibiting companies demonstrating printing and dispensing systems or placement equipment.

Over 250 guests attended the Woodstock Party on Tuesday evening. Many party-goers dressed up in 60s-inspired fashion and enjoyed music provided by special guest DJ and long-time SMTA supporter, Tom Borkes from The Jefferson Project.

Next year the SMTA International Conference and Exhibition will be held September 17 - 21, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The IPC Fall Standards Development Committee Meetings will again be co-located.


For more information on SMTA International please contact Tanya Martin: or 952-920-7682 or visit

The 2016 SMTA International Conference Proceedings are available in the SMTA Bookstore.

Opening Session at SMTA International
View photos from the show here

SMTA Welcomes New Board Members

 The SMTA is pleased to announce its election results for the Board of Directors for the term beginning during SMTA International (September 25 - 29, 2016). Jeff Kennedy, Celestica, Inc., was elected President. Sal Sparacino, ZESTRON Americas, was elected VP Communications. Richard Henrick, Sanmina Corporation, was re-elected as Secretary. Matt Kelly, P.Eng, MBA, IBM Corporation, and Martin Anselm, Ph.D., Rochester Institute of Technology, were re-appointed to the Strategic Development Committee.

Those remaining on the SMTA Board of Directors include: Treasurer, Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.; VP Expos, Debbie Carboni, KYZEN Corporation; VP Membership, Eileen Hibbler, TEK Products; VP Technical Programs, Raiyomand Aspandiar, Ph.D., Intel Corporation; Strategic Development Committee members include: Richard Coyle, Ph.D., Nokia; Tim Jensen, Indium Corporation and Scott Priore, Cisco Systems, Inc.


The SMTA bids a fond farewell to departing President, Bill Barthel, Plexus Corporation, and VP Communications, Michelle Ogihara, Seika Machinery, Inc. They are congratulated for a job well done and given thanks for the years of dedication to the SMTA.

SMTA China Presents Best-Paper/Presentation Awards at SMTA China South 2016 Conference

SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Recption, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the Nepcon South China Show.

IBM Procurement China Limited’s Robin Hou was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge and Solution for Rework of Array Components”

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference Two for the paper titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process”

Pacrim Technology Inc.’s Dr. Wayne Koh was received the award for The Best Presentation of Technology Conference One for the presentation titled “Package Warpage Control and SMT Solder Joint Defects”

Flex’s Henley Zhou was received the award for The Best Presentation of Technology Conference Two for the presentation titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process”

Jason Chan, from Kyzen Corporation, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Video Analysis of Solder Paste Release From Stencils”

Jason Chuah, from Kirsten Soldering AG received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Breakthrough of THT Soldering Solution”

Dragon Zhang, from BPM Microsystems received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The Landmark Innovation for Device Programming”

Kirsten, received the award for The Best Emerging Exhibit of the Year 2016 China South with the product of “Modula The Soldering System” , Model of “ The Modula Wave®

BTU received the award for The Best Exhibit Technology of the Year 2016 China South with the product of “Reflow Oven”, Model of “Pyramax 125N”

SMTA China 2016 Best Papers

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail:

SMTA China Celebrates the 10th Anniversary

SMTA China held its 10th Anniversary Celebration Reception and Long Service Awards presentation at the show floor of NEPCON South China 2016, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center.  Founding officers and members were being recognized with the Long Service Award.

Abby Tsoi, Managing Director, Kasion Automation Limited

Zhu Jian, Vice Manager, Shanghai Fu Shan Precision Manufacturing Co., Ltd.

Zheng Zeping, Asia Pacific Director, BTU International Inc.

Zhang Zemin, Vice General Manager, Manufacturing Dept. Eastem Comunications Ltd.

Alex Choi, Vice President, Shenzhen Kaifa Technology Limited

Dr. Pan Kai Lin, Prof. and Ph.D, Guilin University of Electronic Technology School of Mechanical & Electroinc Engineering

Dr. Danny Li, Vice President-Operations Item Industries Limited

Mr. Maverick Luk, Public Relations Manager Electronic Technoloyg Publishing Group

Ms. Peggy Chan, Executive Administrator, SMTA China

Ms. Megan Wendling, President, MW Associations

Mr. Su Man Bo, Seretary-General, Guangdong Electronic Institute Commitee

Mr. Michael Wong, Senior Director, Manufacturing Engineering, Asia Operations, Embedded Computing and Power, Artesyn Embedded Technologies

Mr. Sam Leung, Vice President of SMTA Hong Kong Chapter

Mr. Simon Wong, Director, The Refined Industry Co., Ltd.

Mr. Ivan Leung, Vice President of SMTA Hong Kong Chapter

Mr. Simon Lam, General Manager, Qantas Technology Limted

Mr. John Lau, Vice President of SMTA Hong Kong Chapter 

SMTA China 10th Anniversary Long Service Awards 2016

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail:

SMTA China Announces Winners of the 2016 Annual Awards at SMTA China 10th Anniversary Reception

SMTA China held its annual awards presentation at the SMTA China 10th Anniversary Reception, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center.

Lin Dong, Section Manager, SMT Engineering of Artesyn Embedded Technologies, was named Officer of the Year. Lin Dong has provided a great support for the SMTA China Conference for many years, he has been the Conference Chairman of Technology Conference for years.

Billy Shen, Area Sales Manager of JBC Soldering Tools (Shanghai) Trading Co., Ltd. was awarded Individual Member of the Year. Billy Shen has been a very active member and has been the Conference Chairman of Vendor Conference for years.

Megan Wendling, President of MW Associate, was named Councilor of the Year. Megan has provided much support over the years to all events including conferences for SMTA China and has solicited sponsors to SMTA China.

Kyzen Corporation was named Member Sponsor of the Year.  Kyzen has joined SMTA as International Corporate Member for 23 years and provided a great sponsorship to SMTA China and events including conferences, golf tournament, with many complimentary supports in teaching and organization for the conferences and training of SMTA China for many years.

Reed Exhibitions (China) Ltd., Shanghai Branch was awarded Partner Sponsor of the Year. Reed Exhibitions has sponsored SMTA China Conferences and Meetings in conjunction with the NEPCON shows at Shanghai and Shenzhen for years. Reed is one of the premium sponsors of SMTA China to date.

SMT China Magazine was named Media Sponsor of the Year. SMT China Magazine has provided a big support in the SMTA China Conference Program and promote the technology conferences, vendor conferences, training courses, annual reception and dinner as well as annual golf tournament sponsorship with the official Nepcon show daily publications. 

SMTA China Annual Awards 2016

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail:

SMTA 2016 Chapter of the Year Award Winners Announced

The SMTA proudly announces the winners of its "Chapter of the Year" award in recognition of the accomplishments made by local SMTA chapters. This year the SMTA Atlanta Chapter won the title of "Chapter of the Year."

Several chapters were recognized for specific achievements, as runners up, and for honorable mention. The Oregon Chapter won 2nd Place and the Dallas Chapter claimed 3rd Place. For the fourth year in a row, the Penang Chapter won the International Chapter of the Year.

Outstanding achievement awards went to the Michigan, Mexico (Guadalajara), and Intermountain Chapters for Top Chapter Membership. Puget Sound won the Outstanding Development Award for most improved chapter. Massachusetts, Toronto, and Wisconsin Chapters all received honorable mention.

Awards will be presented during the Annual Chapter Officer's Meeting held during SMTA International in Rosemont, IL on Tuesday, September 27 at 12:30 p.m.

More information about SMTA Chapters and a list of the winners can be found online at:

For more information about the SMTA Chapter of the Year, contact Karen Frericks at 952-920-7682 or 

International Wafer-Level Packaging Conference (IWLPC) Workshops

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC).  On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California. 


WS1: Introduction to Fan-Out Wafer-Level Packaging

Beth Keser, Ph.D., Qualcomm


Fan-Out Wafer-Level Packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for over 8 years. FO-WLP has matured enough that it has come to a crossroads where it has the potential to change the electronic packaging industry by eliminating wirebond and bump interconnections, substrates, leadframes, and the traditional flip chip or wirebond chip attach and underfill assembly technologies across multiple applications. This course will cover the advantages of FO-WLP, potential application spaces, package structures available in the industry, process flows, material challenges, design rule roadmap, reliability, and benchmarking. This course has been updated with over 10% new material compared to the first time it was offered last year at IWLPC.


WS2:   Wafer-Level Packaging for the Functional Integration of MEMS and ICS

Chip Spangler, Ph.D., Aspen Microsystems, LLC


The development of Wafer-Level Packaging (WLP) has been a major driving force for the size and cost reduction for integrated circuits as well as MEMS, microsystems, micro-optical and microfluidic products. Collectively referred to as MEMS, these devices require highly specialized packages that protect the fragile microstructures and still allow the desired signals, both electric and non-electric, to pass through the package to the die. The challenges and costs associated with MEMS packaging has, since the 1970’s, driven the development of Wafer-Level Packaging and associated technologies such as silicon and glass interposers, through wafer vias, wafer bonding and die stacking. Cost and size demands have since lead to the widespread adaptation of these MEMS-based WLP technologies by the integrated circuit package community. More recently the demand for multi-sensor products, greater levels of sensor intelligence and the connectivity requirements of IoT applications has driven the complex integration of MEMS and ICs through the use of WLP technologies.


WS3:   Choosing the Right IC Packaging

Chet Palesko, SavanSys Solutions LLC and Jan Vardaman, TechSearch International, Inc.


In this course, we will analyze the performance and size characteristics of traditional (lead frame options, wire bond PBGA, flip chip PBGA) and advanced packaging (Wafer-Level Packaging, Fan-Out WLP options, embedded die, 2.5D/interposer-based packaging, 3D packaging with through silicon vias). For each packaging technology, this course also provides a detailed cost analysis including the manufacturing process flow to fabricate and assemble the package and the dominant technology cost drivers.

This course will also examine how OEMs and suppliers can collaborate to develop a model which optimizes product manufacturing cost for IC packages. This modeling approach has been successfully used by a number of major OEMs and suppliers in North America, Europe, and Asia to match design technology choices with supplier competencies. Yields are improved and cost reduction is achieved across the entire supply chain.


WS4: Recent Advances and New Trends in Semiconductor Packaging

John Lau, Ph.D., ASM Pacific Technology


Recent advances in, e.g., Fan-Out Wafer/Panel Level Packaging (TSMC’s InFO-WLP and IZM’s FO-PLP), 3D IC packaging (TSMC’s InFO_PoP vs. Samsung’s ePoP), through-silicon vias (TSVs), microbumps, 3D IC integration (Hynix/Samsung’s HBM for AMD/NVIDIA’s GPU vs. Micron’s HMC for Intel’s Knights Landing CPU), 2.5D IC Integration (TSV-less interconnects and interposers), embedded 3D hybrid integration (of VCSEL, driver, serializer, polymer waveguide, etc.), 3D CIS/IC integration, 3D MEMS/IC integration, thin-wafer Handling, thermal management, semiconductor and packaging for IoTs are examined, and their new trends will be discussed in this lecture. The patents impacting the semiconductor packaging the most (so far) will be mentioned first and the patent issues of Fan-Out Wafer/Panel-Level will be discussed and some recommendations will be made.


Visit for more information. 

Contact Jenny Ng at 952-920-7682 or with questions.

New SMTA Scholarship Rewards Student Leaders, Honors JoAnn Stromberg

The SMTA unveiled an annual scholarship for undergraduate students pursuing a degree in electronics and actively involved in the SMTA. In honor of the nearly 30 years of service dedicated by former Executive Administrator, JoAnn Stromberg, a $3000 Student Leader Scholarship was established following her retirement in 2015. The purpose of the scholarship is to encourage undergraduate students to take on more leadership opportunities and strengthen the connection between students and the electronics industry.

SMTA President Bill Barthel commented, “This scholarship is intended to pay tribute to all JoAnn has done for the Association and industry.  As a former teacher this aligns with her and the Association’s values.”

Officers from the Dallas, Houston, and Austin SMTA Chapters played a critical role taking this effort from vision to reality, including criteria definition and financial support for the first five years.  

More information can be found online at: