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SMTA International 2016 Best Papers Announced

Minneapolis, MN- The SMTA is pleased to announce the Best Papers from SMTA International 2016. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, Best International Paper, as well as a $500 award for Best Student Paper.

The winner from SMTA International 2016 for the Rich Freiberger Best of Conference Award is Mike Bixenman, DBA, KYZEN Corporation for his presentation entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes.” The award is based on the conference attendees’ rating of each speaker at the technical session.

Paul Vianco, Ph.D., from Sandia National Laboratories won the Best of Proceedings category for the paper “Predicting the Reliability of Package-on-Package-on-Package (PoPoP) Interconnections Based on Accelerated Aging Experiments and Computational Modeling.”  

Mathias Nowottnick, Ph.D., University of Rostock, won the Best International Paper category for the paper entitled “Comparison of Active and Passive Temperature Cycling.” This award and the Best of Proceedings are selected by the SMTA International Technical Committee.

Mohammed Genanu, Binghamton University, was awarded Best Student Paper for his paper “Microstructure and Performance of Micro Cu Pillars Assemblies.”

The authors will formally be presented their awards at the Opening Ceremony during SMTA International on September 19, 2017 in Rosemont, Illinois. For information on participating in the 2017 SMTA International Conference, visit the Call for Papers page at http://www.smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly online and will be accepted through January 27, 2017.

The papers are available in the conference proceedings available in the SMTA Bookstore at http://www.smta.org/store/book_store.cfm.

For more information on SMTA International please contact SMTA Administrator Tanya Martin: tanya@smta.or or 952-920-7682 or visit http://smta.org/smtai/.

 





Hutchins Grant Award Winner Announced

Minneapolis, MN - During the 2016 Annual Meeting at SMTA International, the SMTA announced that Kate Reeve, a graduate student at Purdue University, has been selected as the recipient of the 2016 Charles Hutchins Educational Grant.  The SMTA Grant Committee selected her project entitled "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys." 

Kate expects to graduate from Purdue University with her Ph.D. in May of 2018, after which she plans to pursue a career in academics, conducting research and teaching within topics of materials science. Kate graduated from Iowa State University in 2013 with a bachelor's degree in Materials Engineering and dual minors in Nuclear Engineering and Economics.

The Charles Hutchins Educational Grant, co-sponsored by the SMTA and Circuits Assembly magazine, was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The $5000 grant has been presented annually since 1998 to a full time graduate-level student pursuing a degree and working on thesis research in electronics assembly, electronics packaging, or a related field.

The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, IL, September 25 - 29. The 2017 grant will be presented at SMTAI in Rosemont, IL, September 17 - 21, 2017.

View details at the website: http://www.smta.org/hutchins/hutchins.cfm.  Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions.





Highlights from the 2016 International Wafer-Level Packaging Conference (IWLPC)

Bridging the Interconnect Gap

San Jose, CA – November 8, 2016 - A highly regarded annual technical conference that covers leading edge advancements in the area of Wafer-Level technologies, the 2016 IWLPC conference was a great success welcoming more than 750 attendees. Three major themes were woven into the technical sessions: 1) Fan-out Wafer-Level Chip Scale Packaging, 2) 2.5 and 3D IC packaging, 3) MEMS packaging and a newly formed Manufacturing sub-track.

This year’s conference hosted Keynote addresses on Advanced Technology Platforms for Next Generation of Smart Systems by Klaus-Dieter Lang, Ph.D. of Fraunhofer IZM and The Promise and Future of Embedding and Fan-Out Technologies presented by Rao R. Tummala, Ph.D., Georgia Institute of Technology.

Engaging panel presentations provided an effective backdrop for discussions on these topics with a broad range of industry experts working in these areas. In particular, the targeted panel discussions chaired by Jan Vardaman, TechSearch International Inc., on the Role for Large-Area Panel Processing in the Quest for Low-Cost FOWLP provided a comprehensive perspective and highlighted how both processes are vying for next-generation advanced packaging applications and a second day panel session on Chip-Package Interaction (CPI) Challenges and Solutions for WLP and FOWLP moderated by Urmi Ray of Qualcomm.

New for the 2016 IWLPC was the debut of interactive presentations (posters) showcasing current research, case histories and projects from authors. Attendees interacted with authors directly on topics including 3D packaging, Manufacturing Challenges, MEMS and WLP.

The final day of IWLPC provided application-oriented and structured workshops to combine field experience with scientific research to solve everyday problems. These included Introduction to Fan-Out Wafer-Level Packaging, Wafer-Level Packaging for the Functional Integration of MEMS and ICs, Choosing the Right IC Packaging and Recent Advances and New Trends in Semiconductor Packaging.

Here are some of the conference and expo highlights:

·         788 attendees

·         65 exhibiting companies

·         19 countries represented

·         48 technical papers

 

IWLPCs venue in the heart of Silicon Valley provides attendees with a great opportunity to network and meet with industry experts. The 14th Annual IWLPC will return to San Jose from October 24-26, 2017. The deadline for submission of abstracts for the program is April 10, 2017.

Visit www.iwlpc.com for more information. 

Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.





SMTA Members of Distinction Award Winners Announced

Minneapolis, MN - During the 2016 Annual Meeting at SMTA International, the SMTA honored members who have shown exceptional service to the association and the electronics assembly industry.

The FOUNDER'S AWARD honoring members who have made exceptional contributions to the industry as well as support and service to the SMTA, was presented to Gary Tanel, McDonald Technologies. SMTA and the electronics industry have benefited immensely from Gary’s ardent support and leadership over the years. His contributions of leadership as a chapter officer, committee member, and as a past member of the Board of Directors have truly set the standard for SMTA.

The MEMBER OF TECHNICAL DISTINCTION AWARD recognizes individuals who have made significant and continuing technical contributions to the SMTA. This year the Awards Committee selected Viswam Puligandla, Ph.D., Nokia (Retired) as the recipient of this prestigious award. He has been a key contributor to the advancement of packaging technologies for more than 25 years including three books, 125 papers, nine patents, and work on several technical committees including training and journal review.

The EXCELLENCE IN LEADERSHIP AWARD honors SMTA members who stand out as strong leaders in the Association. The 2016 recipient of this award is Bob Baker. Bob has been 100% dedicated to the success of the SMTA. Much of the Austin CTEA Chapter's success can be credited to Bob's hard work. SMTA has always been able to depend on him to get the job done. Bob is a great role model for future leaders... an active member and volunteer for over 30 years!

The EXCELLENCE IN INTERNATIONAL LEADERSHIP AWARD is presented to members who have provided outstanding support and leadership to the SMTA's international members, chapters, or educational programs. The 2016 recipient of this award is Jason Keeping, Celestica. Jason has been dedicated to the success of the SMTA and the Toronto chapter for several years. While serving as the VP of Technical Programs, as well as Chapter President, it has been apparent that we can always depend on Jason to get the job done! He is an integral part of the Students and Young Professionals Committee and supports several student chapters in Canada. Jason also chairs the ICSR Conference.

The SMTA+ CORPORATE PARTNERSHIP AWARD was presented to Nordson Corporation. As a corporate SMTA member, Nordson has shown support at every level of the association from supporting chapter and board leadership positions to technical contributions for our conferences, committees, and most importantly their willingness to share technical knowledge with others in our industry. They embody our mission by encouraging employees to become members, attend meetings, and share their knowledge. Nordson is most deserving of this honor.

The CHAPTER OF THE YEAR AWARD recognizes an SMTA chapter that has shown exemplary commitment to the SMTA active objective of "Sharing the Knowledge."  The 2016 Chapter of the Year Award was presented to the Atlanta Chapter. The 2nd Place runner up was the Oregon Chapter.  The 3rd Place runner up was the Dallas Chapter.

SMTA has recognized exceptional individual and corporate members for their immeasurable contributions to the Association since 1994. Next year's winners will be recognized at the Annual Meeting during the 2017 SMTA International Conference in Rosemont, Illinois.

View details at the website: http://smta.org/awards/awards.cfm

Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions.





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