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Kester to Host Advanced Selective Soldering Process Seminar

Kester_Logo_Black10.png ITASCA, IL - June 21, 2016 Contact: Michelle O’Brien, Marketing & Communications Specialist

Kester is hosting an Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL.

The Advanced Selective Soldering Process Seminar will cover flux, cleaning, process and PCB design. Kester’s Global R&D Director, Bruno Tolla, and Technology Manager, Denis Jean, will present flux evaluation for selective soldering applications and no-clean flux reliability. Mike Bixenman from Kyzen, Joe Clure from Ersa and Dale Lee from Plexus will also be presenting.

For more information or to RSVP for the seminar, contact Michelle O’Brien at

### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.



Cirtronics Hosted the Boston Chapter of Surface Mount Technology Association Tuesday, May 24th 2016

Milford, NH, May 25, 2016 - Cirtronics, an onshore manufacturer of boards, assemblies and electromechanical devices, is pleased to have hosted the SMTA Boston chapter meeting on Tuesday, May 24th, 2016. SMTA is an international organization supporting ongoing education and advancement of the electronics industry.
“We truly value our relationships with industry organizations such as SMTA”, says David Patterson, Chief Operating Officer of Cirtronics. “By working closely with the organizations that are central to specific areas of our business—like SMTA-- we are able to take an active role in discussions about best practices, in exploring industry trends, and assessing the technologies and skills and credentials we will need to remain on the leading edge of electronics manufacturing”.
Cirtronics Precision Engagement® Contract Manufacturing
Cirtronics has provided Electronics Manufacturing Services (EMS) since its founding in 1979. Since then, Cirtronics has grown well beyond boards to include assemblies and full product builds (box builds) for a wide range of customers and serves many different industries. One thing remains constant: Precision Engagement®. Dedication to customer-focused service, combined with purposeful, proactive communication is what Cirtronics’ Precision Engagement® is all about.
Again, David Patterson: “Board manufacturing has evolved over the years from through-hole to surface mount, and we have evolved our technology and the education of our employees to make sure we are meeting the needs of our customers”. Patterson continues, “Of course we maintain through-hole capabilities to serve existing customers and specialized projects that require through-hole technology to conform to project specifications. And, at the same time, we are continuing to expand our surface mount capacity through the purchase of additional manufacturing equipment to stay ahead of demand for surface mount manufacturing. EMS—as with all of our manufacturing-- requires precise attention to detail. Since each customer has different needs, our commitment to Precision Engagement® means we don’t force fit projects into pre-defined programs and processes. Instead, we tailor our services to support each customer’s goals and needs.”

Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB

Vision Engineering Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.


The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.

The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit

Hentec/RPS Introduces Next Generation Solderability Test Systems

web__hentecRPS_small.jpgSpokane Valley, Washington - Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of precision soldering automation equipment for electronics assembly and manufacturing, today announced the release of the latest generation of solderability test systems; The Photon Steam Aging System and Pulsar Solderability Test System.

Pulsar Image 1.png

The Photon Steam Aging System is designed to meet military and commercial high reliability specifications of J-STD-002 and other applicable standards for artificial aging of all electronic components and circuit boards. The systems are designed to accommodate all package styles including high density, discrete components, relays, transistors, capacitors, including SMT and axial components.

The Pulsar provides precise handling of electronic components for the automated process of flux and solder dip of component terminations according to the requirements of J-STD-002 and other applicable standards for the “Dip and Look” method. After the flux and solder process, an engineer inspects the terminations to verify proper wetting. If adequate, the component is thereby validated for authenticity and solderability with the selected solder alloy. The Pulsar can tin virtually any component from axial resistors to QFP’s and other leaded and leadless packages.

“The new solderability test systems are the evolution of products developed through 20+ years of process experience and expertise,” said Reid Henry, President of Hentec Industries, Inc. “We are always looking to improve our systems and offer our customers increased process control and durability. These systems do that.”

About Hentec Industries, Inc. Hentec Industries Inc. (formerly RPS Automation) is a manufacturer of automated selective soldering, lead tinning and component test equipment for electronics and component manufacturing, assembly and distribution. Hentec is celebrating over 20 years of automated soldering experience at more than 750 global installations. All products are designed and manufactured by RPS in the USA.

For more information please contact Reid Henry at 509 891-1680 or

Ellsworth Adhesives to Display the Latest in Adhesive Technologies at Sensors Expo

GERMANTOWN, WI – June 1, 2016 – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at this year’s Sensor’s Expo at the McEnery Convention Center in San Jose, California June 22-23 in booth 1217.
This year at Sensors Expo, Ellsworth Adhesives is partnering with Moldman™ Systems, a manufacturer of low pressure injection molding machines. Moldman™ Systems will be showcasing one of their latest molding machines, the Mold-Man™ 1050. It’s a benchtop machine with a one ton clamping force and the ability to overmold, encapsulate, protect and seal electronics and cables easily and on demand. Ellsworth Adhesives will also be showcasing TECHNOMELT AS 8998 from Henkel. It’s a hot melt adhesive that brings a new and efficient approach to temporary masking for conformal coating processes. TECHNOMELT AS 8998 is compatible with automated dispensing systems and releases cleanly from various substrates.
For over 30 years, Sensors Expo and Conference is North America’s premier event focused exclusively on sensors and sensor-integrated systems. This event has multiple educational opportunities including five symposiums, two Keynote presentations and over 65 technical conferences covering topics like Energy Harvesting, IoT, Wireless and MEMs innovation.
Ellsworth Adhesives aims to fulfill specialty chemical needs, from initial technical advice through customized product fulfillment. They strive to help their customers achieve maximum productivity with lower total cost in their manufacturing processes by offering valued services and solutions, and delivering quality products from world-class suppliers. Jay Richardson, Director of Sales at Ellsworth Adhesives, commented, “We are very excited to be exhibiting at Sensors Expo. Our Engineering Sales Representatives are ready to answer any questions on projects and applications that require adhesives or specialty chemicals. We invite you to bring in parts, diagrams or sketches on napkins and we’ll help you find the best solution.”
Ellsworth Adhesives understands and appreciates the role they play as an adhesive and specialty chemical supplier. The Glue Doctor®, a registered trademark of Ellsworth Adhesives, represents the technical expertise and unique capabilities of more than 50 Engineering Sales Representatives in North America, and more than 150 Engineering Sales Representatives globally, who specialize in working with customers on engineered assembly processes and implementing adhesive solutions in the manufacturing environment.
For more information on Ellsworth Adhesives, visit or call 1.800.888.0698.

iNEMI Schedules Regional Roadmap Workshops in North America, Europe and Asia

Industry invited to take “first look” and provide input on regional issues

HERNDON, VIRGINIA (May 24, 2016) — The International Electronics Manufacturing Initiative (iNEMI) will hold three regional workshops to review progress on its 2017 Roadmap. These meetings will give the electronics industry a “first look” at the 2017 Roadmap and provide the opportunity for input to ensure that regional concerns are included in the final roadmap.

Participation in the workshops is free, but advance registration is required. See details of each workshop below.

North America Workshop
Tuesday, May 31; 7:45 a.m. - 5:30 p.m. Pacific Daylight Time (US)
(face-to-face meeting held in conjunction with ECTC 2016; also accessible via webinar)

This all-day workshop, held at The Cosmopolitan Hotel of Las Vegas (also the site of ECTC), will include reports from all 21 of the Technology Working Group (TWG) chapters. Anyone interested in participating but unable to attend in person may join the meeting online. Get additional information, including agenda and registration for the onsite and online meetings

Europe Workshop
Thursday, June 9; 3:00-5:00 p.m. CEST

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Automotive Product Emulator Group (PEG)   

·         Packaging & Component Substrates Technology Working Group (TWG)

·         Large Area, Flexible Electronics TWG

·         Interconnect PCB - Organic TWG

Get additional information, including agenda and registration.  


iNEMI Regional Roadmap Workshops

Asia Regional Workshop
Thursday, June 23; 8:00-10:00 a.m. CST (China)

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Board Assembly Technology Working Group (TWG)

·         Test, Inspection and Measurement TWG        

·         Final Assembly TWG 

·         PCB - Organic TWG   

·         Packaging & Component Substrates TWG      

·         Flexible Hybrid Electronics TWG       

Get additional information, including agenda and registration.

About the iNEMI Roadmap

iNEMI has been developing industry roadmaps for more than 20 years. Published biennially, the roadmap is recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.

The 2017 Roadmap plans to feature seven Product Emulator Group (PEG) chapters, which define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. There are also plans for 21 Technology Working Group (TWG) chapters, which cover technology and business/infrastructure areas.

iNEMI membership is not required to participate in roadmap development and, in fact, the more diversified the representatives working on the roadmap, the broader the reach and the more valuable the end product. Each edition is a global collaborative effort that involves individuals who are leading experts in their respective fields and represent all perspectives on the electronics manufacturing supply chain.

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  This industry-led consortium is made up of approximately 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.  For additional information about iNEMI, go to  

Thin film work is poster child for getting research and development to industry

ALBUQUERQUE, N.M. - Sandia National Laboratories researcher Paul Vianco sees his work on thin films as a poster child for the way research and development based on nuclear weapons work can boost U.S. industry.

Since the 1970s, laboratories researchers have taken studies originally performed to support the weapons program and published or presented parts of the work at technical conferences. Vianco calls that passive tech transfer.

“Engineers would just fill rooms. They wanted to hear what we were doing, not only because our research represented the ‘latest-and-greatest,’ but more so because it was applied technology,” he said. “This was information that folks ate up because they could take it back to their companies and put it directly to use on their products.”

Vianco recently won the Surface Mount Technology Association’s 2015 Best of Proceedings award for the paper: “Establishing a Ti-Cu-Pt-Au Thin Film on Low Temperature Co-Fired Ceramic Technology for High-Temperature Electronics.” Co-authors were Jerome Rejent, Alice Kilgo, Bonnie McKenzie and Amy Allen of Sandia; recent Sandia retiree Mark Grazier; and William Price of the Kansas City National Security Campus (KCNSC) and Esteban Guerrero, now retired from KCNSC. The winners of the Best Papers awards will be honored Sept. 27 at the association’s conference in Rosemont, Illinois. Vianco also won the Best of Proceedings paper in 2012.

Sandia National Laboratories researcher Paul Vianco works on thin films

Sandia National Laboratories researcher Paul Vianco works on thin films, nanometer-thick layers of metal that can be defined into precision electrical circuits. He won the Surface Mount Technology Association’s 2015 Best of Proceedings award and will be honored with other winners at the association’s meeting in September. (Photo by Randy Montoya) 

Thin films are nanometer-thick layers of metal that can be defined into precision electrical circuits similar to traditional printed circuit boards. Instead of a laminated or built-up copper conductor circuit, a thin film is patterned into a circuit through photolithography techniques. The benefit is miniaturization with finer lines and spaces, so the electronic component can be made smaller and do more at the same time.

“Smaller components weigh less and use less power,” said Vianco, who works in Sandia’s metallurgy and materials joining group. “We reduce what industry refers to as ‘SWaP,’ or size, weight and power.”

Data could be used to further develop components

Sandia’s paper provides the electronics industry with data that can be used to further develop thin film-on-low temperature co-fired ceramic (LTCC) components — called hybrid microcircuits — for high-temperature electronics. Vianco envisions a new generation of such LTCC components that will combine miniaturization, functionality and the ability to withstand harsh environments, and which are fabricated by commonly used photolithography processes.

“The solder interconnection reliability data will enable use of these products in applications that include down-hole oil and gas exploration as well as renewable energy development,” Vianco said. Such hybrid microcircuits also have significant potential for sensors and communications electronics in space probes, he said.

Sandia has been collaborating with the Kansas City National Security Campus since its breakthrough development of LTCC technology on thin film a few years ago. The research was funded by the nuclear weapons life extension program at Sandia as well as Sandia’s and KCNSC’s Enhanced Surveillance Campaigns, which support stockpile stewardship. KCNSC built the LTCC and deposited the thin films, while Sandia developed and implemented test procedures and used its advanced microanalysis capabilities for failure mode analyses.

Vianco praised the collaboration.

“It’s really a case where we took the application, understood what information was needed to ensure producibility and reliability of the solder interconnections and developed a test in collaboration with our KCNSC partners. The result was strength and failure analysis information that significantly enhanced the ability of Sandia to design new components and of KCNSC to fabricate them into high-reliability products,” he said. “We’ve sort of come full circle: We identified the need, developed an experiment and obtained test data that supported the application. Publishing the results made the data available to the U.S. electronics industry.”

Work offers electronics industry new applied technology

The award-winning study evaluated the mechanical properties of solder joints made to a thin film conductor pattern deposited on the surface of an LTCC substrate. Co-fired means individual layers, stacked on one another, are fired together at high temperatures to create the internal, multilayer circuitry and interconnections that are hallmark LTCC technology. Vianco and colleagues developed a standard method to assess solder joint strength on the advanced thin film circuits. The approach provides a way to define assembly processes and determine the long-term reliability of solder interconnections for critical, high-frequency components.

“Thin film conductors are not a new circuit technology, but they are still in relative infancy within the high-reliability electronics industry,” Vianco said. “A lot of hybrid microcircuits still rely upon the old thick film conductor technology, which uses screen or stencil printing to define the electrical circuit. We’ve used it for years on high-frequency components. But it’s limited in terms of achieving better SWaP for those products because we can’t miniaturize it very much more than we’ve already done.”

The electronics industry wants to improve product performance, but often hasn’t fully appreciated the intricacies of interconnections-plus-thin films as a materials system, he said. “It’s been kind of a mystery in terms of how solder joints made to thin film conductors stay attached to the LTCC substrate, but I think they now see that what we’re doing is valuable in furthering this technology. For those who never thought of using thin film-on-LTCC, those folks are saying, ‘Maybe now we do know enough about this technology to try it on our products.’”

Sandia National Laboratories is a multi-program laboratory operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corp., for the U.S. Department of Energy’s National Nuclear Security Administration. With main facilities in Albuquerque, N.M., and Livermore, Calif., Sandia has major R&D responsibilities in national security, energy and environmental technologies and economic competitiveness.

Jabil Recognized for Use of Real-Time Visibility, Actionable Analytics and Unique Visualization

ST. PETERSBURG, Fla. – May 17, 2016 – Jabil Circuit, Inc. (NYSE: JBL) today announced that Gartner has named the Jabil InControl™ supply chain visualization and analytics platform a winner in its “Supply Chainnovator” awards during the Annual Gartner Supply Chain Executive Conference. Jabil garnered the top spot in Gartner’s high-tech manufacturing category for driving the transformation of its global digital supply chain through the use of unconventional, innovative and high-impact approaches.

The Jabil InControl™ platform was built from the ground up to deliver real-time visibility and actionable insights over the company’s massive global supply chain, which encompasses 17,000 suppliers, 700,000 part numbers and 102 manufacturing plants in 28 countries. The platform features predictive modeling and proprietary mobile visualization to improve cross-functional collaboration while making it easier to quickly identify and take action to address areas of supply chain concern, risk and opportunity. As a result, Jabil has reduced inventory by more than $300 million over several years while elevating customer service levels by more than 20 percent.

“The Jabil InControl™ platform provides the supply chain ecosystem and its customers worldwide with unique and holistic views of the complex material flow from raw material manufacturers to the delivery of end products,” said Virginia Howard, research director, Gartner Supply Chain Research. “As an early adopter of innovative supply chain visibility tools and intelligent analytics, Jabil is making major strides in optimizing its working capital while automating supply chain decision making.”

Jabil customers, including many of the world’s biggest brands and leading high-tech manufacturers, benefit from the company’s ability to elevate collaborative decision-making and proactively protect against supply chain disruption. Moreover, the Jabil InControl™ platform gives customers the ability to optimize use of Jabil’s massive manufacturing and distribution footprint to minimize total landed product costs.

“Mass globalization, shortening product lifecycles, disruptive competition, challenging economic conditions and geopolitical threats make it very difficult to rely on traditional supply chain practices,” said Don Hnatyshin, senior vice president and chief supply chain and procurement officer at Jabil. “We’re thrilled that Gartner has recognized our efforts to push the envelope in maximizing Jabil’s intelligent digital supply chain with the Jabil InControl™ platform.”

The Jabil InControl™ platform was chosen from a field of more than 15 competing supply chain solutions. Jabil plans to expand the platform to leverage machine learning, cognitive analysis and complex event processing in support of the driverless, piloted supply chain of the future. 

Annual Ultrapure Water Micro Conference to Focus on Enduser Needs

Ultrapure Water Micro brings together the semiconductor manufacturing industry’s leading high purity-water production, facility management, wastewater treatment and reuse experts for a day and a half of technical engagement on breakthroughs and updates in the field.

UltraPure Water Micro ConferenceAUSTIN, Texas (PRWEB) May 5, 2016 -- The preliminary program for the 19th annual UPW Micro conference is now posted online. Due to the success of the second track in 2015, this year’s event will again feature an expanded agenda, covering both UPW production and facility water management. Ultrapure Water Micro brings together the semiconductor manufacturing industry’s leading high purity-water production, facility management, wastewater treatment and reuse experts for a day and a half of technical engagement on breakthroughs and updates in the field. The agenda can be viewed here and you can register here. The event is at the Omni Southpark in Austin, TX, June 7-8, 2016. There will be a Young Professional & STEM Student Networking Reception on Monday, June 6 at 5 pm.

This year’s attendees will have the opportunity to listen to engaging keynote speakers, hear presentations from leaders in the field, and sit at stimulating roundtables sessions lead by system and process innovators. Greg Meszaros, Director of Austin Water, will open the conference up on Day 1 discussing the utility side of supplying water to a fab, and on Day 2, Mark Thirsk, Managing Partner at Linx Consulting, will update the conference with forward looking insights on semiconductor industry trends. Both tracks and the roundtables are full of equally impressive speakers and roundtable hosts for UPW Micro 2016.

The technical program for UPW Micro 2016 spans issues and applications across the whole facility. The UPW Track is co-moderated by Slava Libman, Air Liquide, Dan Wilcox, Samsung Austin Semiconductor, and Bernie Zerfas, GlobalFoundries. This track will feature sessions on the following: Technology Needs; Particles Control; Innovation in UPW Metrology; and Innovations and Continuous Improvement. The Water Management Track is co-moderated by Alan Knapp, Evoqua Water Technologies, Season Hill, Samsung Austin Semiconductor, and John Morgan, H2Morgan. This track will feature sessions on the following: Water Management; Waste Treatment Application and Monitoring; and Cu Treatment and Cooling Water Management.

With co-moderation, presentations, and roundtables hosted by engineers from more than 7 semiconductor manufacturing companies, UPW Micro 2016 will focus on what challenges endusers confront at fabs, how they are dealing with these issues, and what they need from suppliers to increase efficiency and maximize uptime.

UPW Micro 2016 will start off on the evening of Monday 6th with a Young Professionals and STEM students networking reception. Young Professionals from Samsung Austin Semiconductor and Lanxess will be present to have an informal discussion about their experience entering the semiconductor manufacturing business through water management and try to address the lack of information available to young people and graduating students. After short and informal presentations, representatives from these organizations will be available  to answer questions and for casual conversation. There will be a live band playing after the presentation, and both alcoholic and non-alcoholic drinks will be provided.

UPW Micro 2016 is co-located with UPW Pharma 2016 for the first time. UPW Pharma 2016 will have technical presentations, workshops and roundtables concurrently with UPW Micro and delegates will be able to attend both events at a heavily discounted rate. The meals, networking events and exhibits are in common areas will see companies and individuals with cross-focuses.

Conference delegates will also be able to meet with key players and suppliers of equipment and solutions in microelectronics water and wastewater treatment products and services in the exhibition areas, which are expanded in 2016. Sponsoring companies include Samsung Austin Semiconductor, Evoqua Water Technologies, Harrington Industrial Plastics, 3M, Aquafine, Asahi/America, Gemu, Heraeus, Meco, Nalco, Ovivo, Watts Water Technologies, and exhibiting companies include Balazs Nano Analysis, B&D Plastic, BWT Pharma & Biotech, Chemtrace, Chemwest, Elemental Scientific, GE Power & Water, Georg Fischer, Heateflex, Itochu, KanomaxFMT, Kurita, Levitronix, Lighthouse Worldwide Solutions, Mettler Toledo Thornton, Mycometer, Neotech Aqua Solutions, Organo, Osti, Pacific Ozone, Particle Measuring Systems, Plast-O-Matic Valves, Prince Rubber & Plastics, Suez, Swan Analytical Instruments, and Ultrapure.

For conference registration, click here. For questions about the conference, contact Yana Nazarova at yana.nazarova(at) or +1 512 879 4208 and for sponsorship opportunities, contact Mary Rose Watts at maryrose.watts(at) or +1 512 364 0542. For information about and for inquiries and submissions of technical material for publication, contact Mike Henley, mike(at) or +1 303 745 3980.

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Laser soldering method becomes attractive in the packaging and assembly of surface-mounted devices and microelectronics. The method transfers laser energy for reflow process with a non-contact procedure and determines the soldering location precisely. It is critical to consider formulated solder paste due to the amount of heat absorbed by flux and alloys when applying the method to reliable joints. A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering SMD components on circuit boards with minimal flux residue and no splash or solder balling issues. Cross-sectional studies showed the reduction of intermetallic formation in well-formed solder joints. In addition, the joints have high shear strength due to lower thermal stress during the process. This new solder paste was proved to be suitable for repair of electronic components and manufacturing electronic parts that cannot be soldered in a conventional reflow oven.

SMTA International Conference of Soldering and Reliability
Date: May 9 -11, 2016 Click:
Venue: Hilton Toronto/Markham Suites Conference Centre,
8500 Warden Avenue, Markham, ON, L6G 1A5, Canada 1-905-470-8500
Presentation: Tuesday, May 10 – Technical Program / 4:15 PM to 4:45 PM
Topic: A New Dispensing Solder Paste for Laser Soldering Technology
Speaker: Watson Tseng, General Manager, SHENMAO America, Inc., San Jose, CA 95131

Co-Authors: Hsiang-Chuan Chen, Jen-Yio Shiu, Chang-Meng Wang, Roderick Chen, Watson Tseng

Speaker Biography
For the last 3 years, Watson Tseng is the General Manager of Shenmao America, Inc. He worked in the Shenmao Micro Material Institute for 6 years as a group leader in charge of solder paste development and set up and ran European Operations for 5 years. He has 14 years of experience in failure analysis of SMT and packaging applications. Watson received his M.S. in Chemical Engineering from National Taiwan University, Taiwan.

ZESTRON Announces REStronics Northern California as New Sales Representative


Manassas, VA – May 3, 2016 ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that REStronics Northern California is now representing its complete line of cleaning process solutions and services within Northern California and Northern Nevada.


REStronics Northern California assists customers with best practices, process improvement and information on the latest technology in the electronics manufacturing market place. Their philosophy of working closely with engineering personnel, assisting in overcoming production problems and helping to improve process efficiencies has proven to be an excellent mission.


“By adding ZESTRON’s innovative cleaning agents and services to its line of products, REStronics Northern California demonstrates its commitment to represent the latest technologies from worldwide leading suppliers to the electronics and semiconductor manufacturing industries,” says Eric Strating, Director of Sales, ZESTRON Americas.  “Coupled with ZESTRON’s application technology engineers and R&D support, REStronics Northern California will broaden our sales coverage and improve our service and distribution support to our ever growing customer base.”


To learn more about ZESTRON’s cleaning process solutions, services and learning opportunities through ZESTRON Academy, please visit

Kester Launches NF372-TB Flux-Pen® and RF550 Rework Flux

Kester_Logo_Black9.png ITASCA, IL — April 27, 2016 Contact: Michelle O’Brien, Marketing & Communications Specialist

Kester is proud to announce the launch of NF372-TB Flux-Pen® and RF550 Rework Flux. These products were formulated to compliment Kester’s high-reliability, no-clean product line.

NF372-TB Flux-Pen® is a zero-halogen, no-clean, low solids flux available as a Flux-Pen® for rework of conventional and surface mount circuit board assemblies. Kester NF372-TB flux passes IPC SIR testing in a raw or unheated state, ensuring Kester NF372-TB Flux-Pen®s can be safely used in rework applications, specifically those with high reliability requirements. NF372-TB Flux-Pen® residues are minimal, clear and non-tacky for improved cosmetics. NF372-TB Flux-Pen® is classified as ROL0 flux under IPC J-STD-004B. For additional information on this product including technical and safety data sheets, please visit:

RF550 Rework Flux is a high-reliability, zero-halogen, no-clean rework flux designed for electronic component rework and repair applications. RF550 has a gel-like consistency and is packaged in syringes for easy dispensing. RF550 can be precisely dispensed onto specific areas that require flux. After being dispensed, RF550 stays in place until soldering occurs. RF550 has excellent performance in applications requiring high reliability. RF550 is the ideal choice for QFP or BGA semi-auto¬mated rework applications, and is well suited for use with through-hole repair. For additional information on this product including technical and safety data sheets, please visit:

For any questions or additional information, please contact: Lynnette Colby, Global Product Manager


Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.



Ellsworth Adhesives Partners with Dow Corning to Sponsor Live Consumer Electronics Webinar

Ellsworth Adhesives.jpg GERMANTOWN, WI - April, 2016 - Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be partnering with Dow Corning to sponsor a live and interactive webinar through Design World Magazine called “Consumer Electronics: Designing with Flexibility for Reliability”.

The event will be held on Wednesday, May 11, 2016 at 1:00pm Central Daylight Time and will feature Ryan Schneider, Dow Corning’s Application Engineer and Technical Service (AETS) Specialist, and Jason McGough, Ellsworth Adhesives’ Engineering Sales Representative. Schneider and McGough will discuss how a new silicone technology is helping many of the world’s leading innovators in the consumer electronics industry make their next generation products more durable and reliable. After the live event the webinar will be archived, and can be viewed on demand. A PDF file of the presentation and an MP4 file of the audio portion will also be available for download.

“We’re looking forward to this exciting event. It’s a great opportunity for manufacturers to learn about the latest silicone products available for the consumer electronics industry” commented Roger Lee, Vice President and General Manager of Ellsworth Adhesives North America.

For additional information regarding the upcoming webinar visit Ellsworth Adhesives’ website at or Design World Magazine at

To register for this event click:

About Ellsworth Adhesives Ellsworth Adhesives is a distributor of adhesive products and equipment and a value added supplier of adhesives, sealants, coatings, encapsulants, tapes, releases and lubricants from leading international manufacturers including 3M, Bostik, Dow Corning, Dymax, Fisnar, Henkel Loctite, Lord, Permabond, Techcon and many others and offers the most comprehensive level of technical expertise available.



Kester Launches SELECT-10™ Selective Solder Flux

logo image Kester SELECT-10™ is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10TM residues are non-tacky for improved cosmetics. SELECT-10TM is classified as ROL0 flux under IPC J-STD-004B.

Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.



Creative Electron Acquires FocalSpot

San Marcos, CA – Creative Electron, Inc., a leading American manufacturer of x-ray inspection systems announced today the acquisition of the legacy MXI service business (including services for FocalSpot, Nicolet, and Faxitron system brands) from Nordson-MatriX-FocalSpot.

This acquisition makes Creative Electron the only authorized service provider for all legacy systems, thus consolidating the company’s leadership position as an x-ray technology and service provider. "Current owners of FocalSpot, Nicolet, and other legacy x-ray machines will now experience the Creative Electron customer support infrastructure," said Dr. Bill Cardoso, President of Creative Electron. "Furthermore, our growing refurbished business will give customers the ability to maximize the value of their current x-ray machine towards the acquisition of a new TruView x-ray system."

Creative Electron acquired the complete customer list, all technical documentation and drawings, and the existing supply of legacy service parts and refurbished machines. “We’re confident that Creative Electron’s dedicated and competent team will continue to provide the same excellent level of support to our customers as they have experienced so far,” said Mr. Frank Silva, Business Development Manager North-America with Nordson-MatriX.

For more information about this acquisition and to learn how you can request service for your x-ray machine, please contact Creative Electron at 760.752.1192, email us at, or contact us online at

Uyemura Appoints Tech Service Specialist

April 13, 2016. Southington, CT. April LaBonte is Uyemura’s new Tech Service Engineer for Southern California. Her responsibilities include line audits, troubleshooting, installations and a full complement of customer service tasks.
LaBonte holds a Bachelor of Science, Chemical Engineering from the University of California San Diego. She was formerly a Wet Process Engineer for Viasystems/ TTM, where she worked with product design and process methodology, monitored process operations, performed root cause analyses and provided ongoing support for manufacturing operations.
LaBonte has a special interest in Thermodynamics, Chemical Reaction Engineering, and Environmental Chemistry. Her prior position was as a Field Engineer for Schlumberger.
Contact Uyemura International Corporation, 240 Town Line Road • Southington, CT 06489. (800) 243-3564.

Barry Lee Cohen Launches Marketing and Communications Company

Industry Veteran Offers Public Relations, Branding, Events and More

WEST HAVEN, Connecticut, USA, April 11, 2016 - Barry Lee Cohen today announced the official opening of Launch Communications. With extensive background in marketing advanced technologies, specialty chemicals, coatings and materials to the electronics, automotive, building hardware and surface finishing industries, the full-service company provides strategic public relations, marketing, communications, branding, and events that differentiate, delight, and deliver positive, memorable, and measurable results.
With three decades of “roll up the sleeves,” experience directing the marketing communications for an international corporation and trade associations Cohen said, “Whether your needs include programs as robust as a multimedia product launch and turnkey conference planning, or more targeted quick turn projects, Launch knows it’s all about your brand, your mission, your customers --- and your bottom line. Your program is our passion and privilege. Delivering high performance is not an expectation, but the requirement.” The company offers strategic, creative and functional expertise in delivering engaging voice of customer and call to action content for both traditional and new media. For a comprehensive list of Launch services, please visit
Prior to opening what Cohen has dubbed his “new wonderful,” he was the Global Director of Marketing Communications for Enthone. During his tenure, Cohen was the first two-time recipient of the company’s President’s Award for operational excellence and leadership for marketing programs that achieved measurable, ROI results. He has been acknowledged as the driving and creative force behind dozens of marketing campaigns for the former company’s electronics (printed circuit board, semiconductor, connector/leadframe, photovoltaic) and performance coatings (wear resistant, corrosion protection, decorative coatings) divisions. Cohen has a proven, established and trusted track record of building beneficial and strong relationships with key media stakeholders and decision makers.
Cohen was privileged to have served as a past Chairman of the National Association for Surface Finishing (NASF) SUR/FIN technical conference and exhibition. In 2012, the association membership recognized his “meritorious service and achievement to the surface finishing industry.” Cohen also served as the Vice President of Communications and Board of Directors member of the Surface Mount Technology Association (SMTA). During his tenure, Cohen rebranded all materials, including the launch of the association’s logo that continues to elevate the brand and reinforce member mindshare since its 1998 introduction.

Ellsworth Adhesives Appoints K. Shawn McClarnon as New General Sales Manager

GERMANTOWN, WI - April, 2016 - Ellsworth Adhesives is pleased to announce the addition of K. (Keith) Shawn McClarnon as the General Sales Manager for the East Region. In his new role, Shawn will be responsible for sales management of the Engineered Sales Representatives (ESRs), and expanding Ellsworth Adhesives’ presence in his region.
With 35 years of industry experience, Shawn brings a depth of sales, distribution and channel management knowledge to Ellsworth Adhesives. Shawn’s background includes 34 years with Dow Corning Corporation where he served a range of Sales, Marketing and Business Management roles in various business units including Electronics and Engineered Materials. Shawn has been recognized for many achievements and has earned multiple sales and marketing awards. Shawn is an alumnus of Indiana University. Shawn is a current member of the Board of Directors of United Way. Shawn will report directly to Jay Richardson, Director of Sales for the ESR Group at Ellsworth Adhesives.
“Shawn’s industry knowledge and expertise will be an asset in helping Ellsworth Adhesives to develop new business. Shawn not only brings a wealth of experience, but innovative ideas that can assist in the growth of Ellsworth Adhesives as a whole. Shawn has a strong and proven track record of growing sales teams while increasing new business opportunities. We are excited to add him as a new member of our growing team.” stated Jay Richardson, Director of Sales.
For more information on Ellsworth Adhesives, visit or call 1.800.888.0698.
About Ellsworth Adhesives
Ellsworth Adhesives is a distributor of adhesive products and equipment and a value added supplier of adhesives, sealants, coatings, encapsulants, tapes, releases and lubricants from leading international manufacturers including 3M, Bostik, Dow Corning, Dymax, Fisnar, Henkel Loctite, Lord, Permabond, Techcon and many others and offers the most comprehensive level of technical expertise available.
Ellsworth Corporation operates sales offices and warehouses in the United States, Canada, Mexico, United Kingdom, France, Spain, Germany, Sweden, Finland, Denmark, Brazil, Australia, China, Hong Kong, Malaysia, India, Taiwan, Vietnam, Indonesia, Singapore, Philippines, and Thailand. Ellsworth Adhesives can be contacted directly at 1-800-888-0698 or by visiting

Free Surface Cleanliness Assessment Webinar Presented by ZESTRON Academy


Manassas, VA – April 6, 2016 ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that the second installment of ZESTRON Academy’s 2016 Cleaning Webinar Series, “Surface Cleanliness Assessment” will be held on April 21st, at 1:30 PM EDT.


How clean is clean? When manufacturing electronic assemblies, impurities left on the board surface or underneath the components may lead to in-field failures. This webinar provides an overview of the methodologies available to properly assess the cleanliness of post-clean assemblies.


For more information about our learning opportunities or to register for any of our FREE 2016 Cleaning Webinars, please visit ZESTRON Academy.  Registration is required for all webinars.

Electronic Systems Inc. Wins 2016 Circuits Assembly SEA Award for Highest Overall Customer Rating

SIOUX FALLS, S.D. -- Electronic Systems, Inc. is pleased to announce that it has won the Circuits Assembly Service Excellence Award for Highest Overall Customer Rating for EMS companies in the $20 million to $100 million revenue range.
The 2016 Service Excellence Awards program is sponsored by Circuits Assembly, the leading trade publication for the Electronics Assembly industry. Companies that received the highest customer service ratings, as judged by their own customers, received the awards during a ceremony at the IPC Apex Expo in Las Vegas, NV.
The Overall Highest Customer Rating is the Top Award, reflecting the highest scores in all categories including Quality, Technology, Value for Price, Responsiveness, and Dependability/Timely delivery. ESI has consistently won several individual categories in recent years and this is their second occurrence of winning the highest overall award.
This award is a confirmation of the commitment and hard work that the associates of Electronic Systems Inc. have put into ensuring a high level of service throughout our business processes. Electronic Systems Inc. accepted this on behalf of our associates and the customers that have made this award possible by taking the time to provide this important feedback required for winning this award.
“We are extremely pleased to be recognized with the Highest Overall Customer Rating by our customers again this year. This award validates our culture to not only meet, but exceed our customer’s expectations”, said Gary Larson, President. “We have a passion for providing Legendary Service as a reflection of our company values. We are truly honored to receive this type of feedback from our customers”.
“We pride ourselves in resilient customer service and solid customer relationships at every level of our organization”, added Holly Olsen, Business Development Coordinator. “We’re continually focused on doing the right thing for our customer each and every day at ESI.” Electronic Systems, Inc. ( is headquartered in Sioux Falls, SD and operates three facilities there. The company offers complete EMS (Electronic Manufacturing Services) for PCB assembly through final system-level assemblies including supply chain management and order fulfillment. Customers include OEM’s in the Industrial, Commercial, Energy, Medical, and HVAC markets. The company is ISO 9001:2008 and ISO 13485:2003 (Medical) certified and ITAR registered.

In memoriam: a legend, and a life well lived

1932-2016 Gene Selven, Publisher, Chip Scale Review 1999-2008

 Those who were fortunate to have known Gene Selven recall a passionate, remarkable person in both business and leisure. His presence would fill a room—there was no escaping it. He was also passionate in everything he did. If you are new to the industry and didn’t know Gene, there are many still around from the “good old” days that worked with him. “Gene was a terrific icon in the electronics industry,” notes Mary Ann Olsson, an industry analyst who was introduced to Gene through industry colleagues. “One of my first bosses always told me to call Gene for the right answers. He was always sweet and helpful to me during the early years of my electronics research. He was a good soul!”

Born in Chicago, Illinois, Gene received his Bachelor of Science degree in Electrical Engineering from the University of Illinois in 1954, and then served in the U.S. Army from 1954-1956, stationed in Japan. Beginning his early career at IBM, he moved out of state to California as Manager of Product Marketing at Texas Instruments in the Semiconductor division. In 1969, he moved his residence to beautiful Portola Valley in Northern California where he began working as the Director of Product Marketing at Fairchild. In 1971, he joined the Semiconductor Division of Raytheon as Director of Marketing.
In 1976, Gene successfully started and grew his own company and expanded into publishing—purchasing the magazine Chip Scale Review from Tessera in 1999. His daughter, Kim, continues that legacy today. An early admirer of Gene, Tom Di Stefano of Centipede Systems remembers Gene as always generous and considerate. “Gene Selven built several publications into industry standards in his lifetime,” said Di Stefano. “In his most recent endeavor, he grew Chip Scale Review to a leading position in the semiconductor industry. As an advisor to the magazine, I was always delighted by Gene’s wisdom and insight in handling the many challenges that arose.”
Gene will be remembered as a true gentleman who kept his cool and resolve at all times—a true leader. Andrea Roberts of AR Marketing, says, “He was a wonderful man—and so passionate about the industry and communicating about it. I would always brighten up when I’d see him at a trade show. He was an institution in the industry, and although he was away from the industry for a number of years, he will be missed.”
Having traveled the world several times, Gene was an international traveler both in business and his personal life. An avid fisherman, he loved to fish on Lake Tulloch, and often traveled to Alaska over the years to catch halibut and salmon. Golf was another passion. The San Francisco 49ers and Giants were his favorite teams and he was a season ticket holder of both for many years. Having grown up with the Chicago White Sox, however, it bears “special mention” that he also considered that team to be his roots.
Gene is survived by his two daughters, Kimberly Newman of Campbell, California, and Karen Williams of San Jose, California, grandson James Newman of Campbell, and his sister, Shirley Jensen of Lawton, Michigan. Service is planned for March 30th. Donations can be made in Gene’s honor on the Alzheimer’s website on the (donate) tribute page under Gene Selven (

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

FCT Assembly

FCT Assembly (, a leader in the development and manufacturing of high performance solders and advanced fluxes; has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys. With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.


FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys. With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.

FCT’s 159HF Water Soluble Flux provides excellent ionic cleanliness after water cleaning and has been formulated to minimize foaming in the wash process. In addition to high volume application, 159HF can also be used for surface mount rework and touch-up soldering operations. To take advantage of this flexible Water Soluble Flux, please contact your local FCT Sales Representative or visit our website at


FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Enabling Chemistry Further Validated with Global Technology Award, Expanded Licensing Agreements

FCT Assembly NanoSlic November 17, 2015 -- At last week's Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® ( This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.


Introduced to the electronics market in 2014, NanoSlic is a proprietary coating chemistry that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance.   FCT has developed not only the breakthrough chemistry, but also the equipment and coating process that provide a turnkey coating solution. Though used in multiple markets for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

"NanoSlic has quickly emerged as the most robust stencil coating technology for modern electronics assembly processes," says Brent Nolan, Vice President of FCT Assembly.  "As apertures become smaller - and area ratios more challenging - new techniques are necessary to accommodate the material deposition obstacles of miniaturization.  Because of its novel chemistry and its ability to coat both inside the aperture walls and the stencil underside, NanoSlic is enabling transfer efficiency improvements of as much as 40%, while reducing required understencil cleaning frequencies for cost savings and greater process stability.  It's gratifying to have the Global Technology Award judging panel recognize NanoSlic's market impact; we are grateful to Global SMT & Packaging magazine for sponsoring this contest."

The requirement for improved print performance for today's challenging device dimensions has accelerated the use of NanoSlic-coated stencils and this demand has initiated expansion of NanoSlic licensing worldwide.  There are currently three authorized NanoSlic licensees globally, and several more exploring opportunities with FCT.   Likewise, customers have discovered the unique capabilities of NanoSlic-coated stencils and have noted marked print process improvements.   

Harris Corporation Engineer, Nazeeh Chaudry, says the company has had striking results through the use of NanoSlic-coated stencils.  "Our yield on 15.7 mil (0.4 mm) pitch QFNs went to 100% just by changing to NanoSlic-coated stencils," he explains.  "Solder paste deposits have brick-like definition and are precise and repeatable on QFNs and other fine-pitch components."

 "The growth of NanoSlic has been incredible," comments Nolan in summary, "and this is just the tip of the iceberg.  While the coating chemistry is making a huge difference for PCB assembly processes, NanoSlic's applications extend far outside the confines of the electronics industry.  It's going to be an exciting journey."