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STACI Corporation Appoints New CEO David M. Buckley

LaGrange, OH, August 19, 2014 – STACI Corporation, a premier provider of electronics manufacturing services and supply chain solutions, announced today that David M. Buckley has been named the company’s Chief Executive Officer.  

David BuckleyMr. Buckley comes to STACI Corporation from Cross Match Technologies, Inc., a leading innovator and provider of biometric identity management solutions, where he served as president and CEO. While at Cross Match, he transformed the organization’s focus and operations to exceed customer expectations, leading to a successful sale of the company to private equity.

Prior to Cross Match, Mr. Buckley served as CEO of Vectronix, Inc., a global provider of advanced electro-optics technology. Before joining Vectronix, he led both public and private companies, as well as holding several senior roles at General Electric and Price Waterhouse. Preceding his work in the private sector, Mr. Buckley served as a Surface Warfare Officer in the U.S. Navy.  Over his 30-year career, Mr. Buckley has repeatedly provided the vision, strategy and leadership to position organizations for success.

“We are pleased to have David join STACI and the Centre Lane team.  His experience and leadership abilities will help drive STACI’s continued growth and profitability”, said Kenneth Lau, a member of STACI’s board of directors, and co-founder and Managing Director of Centre Lane Partners. Centre Lane Partners is the controlling private equity shareholder of STACI Corporation.

Mr. Buckley holds a bachelor’s degree from the United States Naval Academy and an MBA from the Wharton School of Business.

For more information about STACI Corporation, please visit www.stacicorp.com.

About STACI Corporation:

STACI is a leading electronics manufacturing services provider of high performance, custom-engineered products and supply chain solutions to customers around the world.  STACI’s suite of component engineering and sourcing services provide a unique turnkey offering including front-end engineering, prototype product development, as well as low-cost, high quality manufacturing.  The company operates two world class manufacturing facilities in LaGrange, Ohio and Dongguan, China, and has sales, customer services and administrative offices in North America, Europe and Asia. 





ZESTRON Announces New Regional Sales Manager

Manassas, VA – August 18, 2014 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce the addition of Mr. Ted Hersey as a Regional Sales Manager.  In his role, Mr. Hersey will focus on growing ZESTRON’s products and services business while expanding the current customer base. “Mr. Hersey is an excellent addition to our global team,” says Todd Scheerer, Executive Vice President, ZESTRON Americas. “This reinforces ZESTRON’s commitment to providing our customer base with the highest quality, technical solutions, services and personnel in order to meet the ever increasing challenges of precision cleaning applications.”

Mr. Hersey joins ZESTRON with over 20 years of sales and technical experience in the electronics assembly industry, most recently working as a Director of Program Management for CR International, Inc.  Mr. Hersey has a proven track record of working with capital equipment and consumable product manufacturers used in the development, manufacture and repair of printed circuit boards.  His industry expertise and understanding of customer needs are essential to expanding ZESTRON's reach within North America.

He earned his Bachelor’s Degree in Industrial Technology from the University of Maryland.  Mr. Hersey also served his country proudly as a member of the Maryland National Guard where he was awarded the National Defense Medal for his service during Operation Desert Storm.

About ZESTRON:

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.





RPS to Display Selective Soldering Line at the 2014 SMTA International Exhibition

RPS Automation Delivers Industry Leading Precision and Reliability with the FRX10 Selective Solderin

logo SPOKANE VALLEY, WA – RPS Automation LLC., a manufacturer of automated precision soldering equipment for electronics assembly and manufacturing, has made plans to display the FRX10 Selective Soldering System at the 2014 SMTA International Exhibition. This unit will introduce exhibition attendees to the innovative simplicity of the systems and solutions offered by RPS Automation.

imageTo learn more, please visit www.rpsautomation.com or contact Kelsey Solberg at ksolberg@rpsautomation.com.

About RPS RPS Automation is a manufacturer of automated selective soldering, lead tinning, and component test equipment for electronics and component manufacturing, assembly, and distribution. RPS has been advancing automated lead finish and soldering technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers for over 20 years. RPS products are designed and manufactured in the USA.

 

 

 

 





Viscom's Business Development Manager Will Present 3D SPI Findings at SMTAI

Jacques L'HeureuxDuluth, GA, August 2014 - Viscom announced today that its Business Development Manager, Jacques L’Heureux, will present the paper titled “Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils with Non-Coated Results” at the upcoming SMTA International exhibition. The presentation will be held during Session PRC2, titled ”Advances in Production Inspection Methods,” and will take place Tuesday, Sept. 30, 2014 from 4-5:30 p.m. in Room 51 at the Donald Stephens Convention Center in Rosemont, IL. The paper was co-authored by Carsten Salewski, Viscom’s President. 
 
Manufacturing the latest electronic designs requires printing ever smaller deposits of solder paste. Once a critical stencil aperture aspect ratio is reached, other means of improving transfer efficiency (TE) must be investigated. A design of experiments was performed to show the effect of stencil nano-coatings on paste volumes and underscreen cleaning intervals. The key to making this type of study possible is having access to a very accurate and repeatable 3D SPI system. Improvements to the TE and longer underscreen cleaning intervals were realized with the nano-coated stencil. Process monitoring tools including 3D SPI make it possible for new technologies, like nano-coatings and solder paste improvements, to be easily and accurately analyzed and validated. 
 
L'Heureux worked for 25 years in the automotive electronics industry before joining Viscom in January as its Business Development Manager for the Americas.  His experience spans SMT process development, manufacturing engineering and global project management for inspection technologies.  His current responsibilities include sales and global key account management for computer, consumer & communications, OEM and EMS.





Keith Sweatman Co-Authors Paper for SMTAI Technical Sessions

Keith SweatmanOSAKA, JAPAN - August 2014 - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition. The presentation will be held during Session MFX6, titled ”Alternate Alloys,” and will take place Wednesday, October 1, 2014 from 2-3 p.m. in Room 49 at the Donald Stephens Convention Center in Rosemont, IL. The paper was written in cooperation with Takatoshi Nishimura, Nihon Superior Co., Ltd. and Dekui Mu, University of Queensland. 
 
Lead-free solders based on the tin-copper-nickel system are now well established in the electronics manufacturing industry as a cost-effective alternative to tin-silver-copper alloys where their particular combination of properties provides an advantage. While their compliance and stable intermetallic ensure that they have good resistance to impact loading, increasing demands for even better performance are prompting the investigation of ways in which their mechanical properties can be further enhanced. This paper reports the preliminary results of a study into the effect of trace additions of zinc, indium and gold to tin-copper and tin-copper-nickel eutectic alloys on the microstructure and the resistance to shear impact at speeds of up to 4m/sec. 
 
Sweatman is a graduate in metallurgical engineering who has been involved in the solder industry and soldering technology for more than 40 years. He has been an active participant in several HDPUG and iNEMI consortia projects relating to lead-free solder performance and reliability and is a regular speaker at IPC and SMTA conferences. In connection with the establishment at University of Queensland, Australia of the Nihon Superior Centre for the Manufacture of Electronic Materials, he has been appointed Adjunct Senior Fellow in the Department of Mechanical and Mining Engineering.
 
For more information about Nihon Superior, visit the company on the Web at www.nihonsuperior.co.jp/english.





FCT Assembly's Development Chemist to Present during SMTAI Poster Sessions

Brittney NolanGREELEY, CO - FCT Assembly announces that Development Chemist, Brittney Nolan, will present during the Poster Sessions at SMTA International. The presentation, entitled “The Impacts of the Environment on the Printability of Solder Paste,” will take place Tuesday, Sept. 30, 2014 from 12-2 p.m. in the Exhibit Hall at the Donald Stephens Convention Center in Rosemont, IL.
 
Solder paste is used in a variety of applications across the globe.  The performance of solder paste is crucial in the SMT process; therefore knowing how the environment affects the printing of paste is extremely valuable. It can be challenging for print operators to regulate the variability of working environments. The different environment variables that need to be regulated are temperature, humidity and type of solder paste. This study explores the performance of no-clean and water soluble pastes in environmental conditions such as elevated temperatures, decreased temperatures, and high and low relative humidity. The data gathered throughout this study consists of printed volume measurements with aperture sizes ranging from 0.35 – 0.80 area ratio. Tack force and slump was measured for each test condition.
 
During the completion of her undergraduate degree in Biochemistry at ACU & Baylor University, Nolan conducted research in organometallic chemistry. While working on building a polar carbon nanotube in use for studying catalytic processes, she successfully published three papers throughout her research in the Journal of Cluster Science as well as the Journal of Organometallic Chemistry.  
 
For more information about FCT Assembly, visit www.fctassembly.com.





Field Application Engineer Tony Lentz to Present at SMTAI

Tony LentzGREELEY, CO - FCT Assembly today announced that field application engineer, Tony Lentz, will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition. The presentation will be held during Session SMT4, titled ”Stencil Printing Advances for Today's Electronics,” and will take place Wednesday, October 1, 2014 from 10:30a.m.-12 p.m. in Room 47 at the Donald Stephens Convention Center in Rosemont, IL.
 
Nano coatings are applied to solder paste stencils with the intent of improving the solder paste printing process.  Do they really make a noticeable improvement?  The effect of nano coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.300 to 0.800 area ratio. The effects of nano coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes also was studied. Solder paste print performance for each nano coating was summarized with respect to all of these variables.  
 
Standard industry rules for stencil aperture design suggest that area ratios be kept above 0.66 for acceptable transfer efficiency. The intent of this rule is to ensure that solder paste volume is adequate for an acceptable process window.  Nano coatings; however, are changing this rule. Guidelines for stencil design are recommended based on the performance of nano coatings.
 
Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry. 
 
For more information about FCT Assembly, visit www.fctassembly.com.





CyberOptics' Director of Engineering to Present Advances in Production Inspection at SMTAI

Brendan HinnenkampCyberOptics Corporation (Nasdaq: CYBE) announces that Brendan Hinnenkamp, Director of Engineering, will present the paper titled “Inspection Strategies for More Accurate, Faster and Smarter Inspection” at the upcoming SMTA International exhibition. The presentation will be held during Session PRC2, titled ”Advances in Production Inspection Methods,” and will take place Tuesday, Sept. 30, 2014 from 4-5:3 p.m. in Room 51 at the Donald Stephens Convention Center in Rosemont, IL. Hinnenkamp will discuss the importance of true volume measurement, print process optimization and near-to-zero setup time with advanced modeling techniques. 
 
The presentation will dwell upon accuracy of volume measurement in SPI and its correlation with solder paste defects; automatically optimizing the print process by proactively analyzing trends and how advanced modeling techniques enable quick setup and minimal tuning.
 
Hinnenkamp is the Director of Engineering and OEM Accounts at CyberOptics Corp. He has been with CyberOptics for more than 22 years, in roles ranging from engineering to sales and marketing to operations management. Hinnenkamp has extensive experience in the SMT process, from the perspective of building boards to support CyberOptics' engineering products to building machines that build the SMT circuit boards (CyberOptics OEM sensor business). In his current role, he is responsible for product realization of sensors for the OEM, systems, and semiconductor businesses.





Fred Dimock to Present Solder Reflow Fundamentals Tutorial at SMTAI

Fred DimockNORTH BILLERICA, Mass., August 27, 2014 - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that Fred Dimock will present a tutorial during SMTA International. The tutorial entitled “Solder Reflow Fundamentals” is scheduled to take place Sunday, Sept. 28, 2014, from 8:30 a.m. – 12 p.m. in Room 50 at the Donald Stephens Convention Center in Rosemont, IL. 
 
This class will focus on the fundamentals of solder reflow and reflow oven operation. It is designed for new SMT engineers/technicians or current ones who want a better understanding of the reflow process. Dimock will discuss recipes vs. profiles, heat transfer and oven control, why profiles are shaped the way they are and how to obtain profiles. Additional topics of discussion will include thermocouple accuracy and mounting, profilers, test vehicles, eutectic vs. lead-free process windows and process repeatability.
 
Dimock is the Manager of Process Technology at BTU International in Massachusetts. He holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU. 
 
About BTU International
BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe. Information about BTU International is available at www.btu.com.





Viscom to Showcase Advanced SPI, X-ray and 3D AOI Portfolio at SMTAI

Duluth, GA, August 2014 – Viscom announced today that it will exhibit in Booth #434 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Viscom’s inspection experts will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market. The 3D function for Viscom’s AOI high-performance camera module XM is the latest step in the company’s continual improvement of the 3D performance spectrum.
Viscom Scanning
3D AOI XM camera module
Viscom’s XM module will be displayed with the addition of a structured light projector to the existing orthogonal and angular cameras, totaling more than 60 Megapixels. With an image acquisition rate of up to 1.8 gigapixels/second, the new XM module is extremely fast with simultaneous image acquisition. Its 3D inspection is up to four times faster compared to other systems with multiple projectors and consecutive imaging.   
 
S3088 ultra with 3D XM camera module
The existing S3088 platform, with newly designed mechanics, and the addition of the 3D XM module, offers the fastest inspection speed with the best defect detection capability. 
 
Further improvement of maintenance and service features allow reliable and economical machine operation. The addition of 3D AOI inspection to the new S3088 ultra presents a future proof inspection system for all AOI tasks conceivable today.
 
Conformal Coating Inspection – CCI
The new Viscom S3088 Conformal Coating Inspection (CCI) system inspects coatings quickly and reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impurities or splashes. The Viscom S3088 CCI system features an 8M camera module equipped with UV LEDs that reveal visible light emitted by UV fluorescent indicators contained in the transparent protective coating. The S3088 CCI system is available immediately.
 
Quality Uplink
In SMT electronic assembly production, 3D SPI has established itself as the additional inspection point to complement optical or X-ray inspection. The key task is detecting unacceptable paste deposits in terms of volume, form, smearing and offset. In addition to providing defect detection, the Viscom 3D SPI can accomplish much more. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results. 
 
About Viscom
Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3-D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, visit www.viscom.com.





Virtual Industries to Demonstrate ESD Safe Vacuum Handling Tools at SMTAI

COLORADO SPRINGS, CO - August 2014 - Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, today announced that it will exhibit in Booth #735 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The SMD-VAC-HP and TWEEZER-VAC systems will be demonstrated during the two-day exhibition.
Virtual Industries
The SMD-VAC-HP System with Foot Switch, Vacuum Pens, Small Parts Tips and Magnifier (V8100A-AP8-BD-MAG1) runs on 12 VDC @ 500mA w/ solenoid. With a precision pump and motor that generates more than 15" of mercury, this tool provides additional pick-up power for handling small to very large size components. The compact tower design takes up a small footprint on the bench. 
 
The TWEEZER-VAC System with Small Parts Tips and Lighted Magnifier (TV-1000-SP8-BD-MAG1) is a general purpose vacuum handling tool that plugs directly into 110 Volt 50/60 Hz. This compact unit will handle a wide variety of parts used in the industry today. This kit includes rubber tips for larger items and a set of small parts tips that handle items as small as 150 microns.  The long-life diaphragm vacuum pump generates up to 10" of mercury with an open air flow of 2.3 lpm. 
 
For more information about any of Virtual Industries’ advanced equipment, stop by Booth #735 or visit www.virtual-ii.com.





STI to Exhibit One-Stop Contract Manufacturing and Training Services at SMTAI

MADISON, AL - August 2014 - STI Electronics, Inc., a full service organization providing training services, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly,  announces that it will exhibit in Booth #412 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will discuss STI’s Engineering Services and Training Services divisions.
STI Electronics 
STI's Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry. From product design and manufacturability analysis to pre-production prototype and development, STI's Prototype and Development Lab is a full-service design review and preproduction facility. STI’s Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).
 
STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications. STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and cable harness to NASA-STD-8739.1, .2, .3 and .4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials ranging from chip scale and BGA to through-hole and terminal attachments. 
 
For more information about STI Electronics, Inc., visit www.stielectronicsinc.com.





Speedprint to Showcase New Features for the SP710 Screen Printer at SMTAI

TAMPA, FL - August 2014 - Speedprint Technology will showcase the award-winning SP710avi Screen Printer in Booth #825 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Speedprint
The SP710 will be equipped with a dual syringe Advanced Dispense unit for precise deposition of solder paste or adhesive materials.  The award-winning screen printer includes a significant list of standard machine features as well as inherent benefits such as SMarT-Cal, Speedprint’s unique product-based machine calibration that maintains the largest process window to manage today’s most sophisticated application challenges. Also, attendees will learn why Speedprint can boast of the lowest maintenance and ownership costs in the industry.    
 
Also on display, the Advanced Dispense Unit + (ADu+) significantly increases the flexibility of the SP710. The unit has been enhanced for use with a wider range of materials, improved accuracy for smaller component deposition and new applications for stencil-less prototyping and on-the-fly engineering changes. This further saves operational costs and provides a competitive time-to-market advantage for Speedprint customers.
 
Additionally, the Velocity Plus throughput enhancement delivers best-in-class speed while further enhancing Speedprint’s value by delivering extraordinary productivity and functionality at reasonable price points.  With Velocity Plus enhancement, the SP710 is the fastest printer in its class with a six second core cycle time. 
 
For more information, stop by Booth #825 at the show or visit www.speedprint-tech.com.





Seika Machinery to Debut RD-500V All-In-One Rework Station at SMTAI

TORRANCE, CA - August 2014 - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #835 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The all-in-one advanced technology SMT rework station is compatible with all kinds of rework and SMT component types, including 01005s.
Seika
The RD-500V features a two mega pixel full HD camera with a 19" LCD display for easy visual alignment. It samples the data in very small intervals of 0.1 sec, allowing extremely accurate temperature control. The RD-500V is equipped with powerful built-in 1000W heaters on both the top- and bottom-side, and an area heater that includes six quick heating 600W IR heaters. Precise profiling including detailed temperature curves can be executed with the ability to closely control up to 30 zones. 
 
The system supports industrial large-scale and small-scale circuit boards, including 01005 components. Additional features include two pressure sensors, contact-less cleaning, control of the Z-axis, reduced temperature difference in the fuselage and on-the-fly profile programming. 
 
For more information about the RD-500V Rework Station, contact Michelle Ogihara at michelle@seikausa.com or visit www.seikausa.com.





SEHO's SelectLine to Provide a PLUS in Flexible Soldering at SMTAI

SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, will showcase the new SEHO SelectLine selective soldering system in booth #339 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The SEHO SelectLine product family features a PLUS in flexibility and efficiency, resulting in a remarkable increase in productivity.
SEHO
The SelectLine machine concept is consistently modular, thus ensuring clear cost benefits. The fluxer module, various preheat modules and soldering modules may be equipped individually, and depending on the requirements, they can be configured into a complete manufacturing line. Even the smallest version, SelectLine-C, which is designed for stand-alone operation in the basic configuration, may be expanded with fluxer and preheat modules at any time to be used in inline processes.
 
The soldering area of the SelectLine scores highly thanks to its outstanding precision and flexibility. Two electro-magnetic soldering units for mini-wave processes may be integrated. Especially two new and unique features that are patented by SEHO ensure a remarkable increase in productivity.
 
Of course, the SEHO SelectLine features a complete hardware and software package for automatic process control. It monitors the fluxing process, including the actually applied amount, provides automatic position correction and z-height correction, controls the wave height, and ensures MES integration. A unique feature is the possibility to integrate an AOI system for solder joint inspection directly after the soldering process.
 
Additionally, SEHO will be part of the Power and High Temperature Electronics Manufacturing Experience. SEHO invests consistently in research and development. Besides the continuous refinement of its range of soldering systems, SEHO’s activities are focused on future-oriented technologies, such as nano-technology or high temperature applications, often in cooperation with international research committees and industry partners. SMTA International 2014 will host the first feature area in the exhibit hall dedicated to Power Electronics and High Temperature.
 
For further information about SEHO, please visit www.seho.de.





Nordson YESTECH to Debut FX-940 AOI with 3D Capability at SMTAI

Full inspection and traceability capabilities at today’s fastest line speeds

Carlsbad, CA - August 2014 - Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will debut the FX-940 AOI In-line PCB inspection system in Booth #606 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. 
Nordson YESTECH
The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. Offering advanced Fusion Lighting and a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms, the FX-940 is unsurpassed in defect detection. 
 
With Nordson YESTECH's advanced “capture-on-the-fly” imaging technology, the system offers high-speed inspection at over 30 sq. inches per second or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at today’s fastest line speeds. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield management solution.
 
For more information about Nordson YESTECH, visit www.nordsonyestech.com.





Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

OSAKA, JAPAN - August 2014 - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase a range of newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection and process yields. NIHON Superior

The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste that can be stored at room temperature for more than 150 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability.
 
In the development of SN100C P604 D4 lead-free and completely halogen-free solder paste, Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive. SN100C P604 D4 not use any chemicals requiring special registration under the EU REACH legislation without compromising performance and reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.

SN100C (031) is a general purpose flux-cored lead-free solder wire that offers improved productivity. The alloy and cored flux combination provides excellent wetting for components with poor solderability. SN100C (031) solder wire provides fast wetting, resulting in faster soldering. In addition to high first pass yields offering good wetting and spread, SN100C (031) features low flux spattering, high insulation resistance and fast sequential soldering for high reliability and productivity.

Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in Nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure. 
 
For more information about Nihon Superior’s new solder pastes and lead-free products, meet company representatives in Booth #504 at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.





MIRTEC To Demonstrate Award Winning 2D/3D In-Line and Desktop AOI Systems at SMTA International

August 2014 - MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #112 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the award-winning MV-7 OMNI 2D/3D In-Line AOI Machine and MV-3L Desktop AOI system.
MIRTEC
The MV-7 OMNI 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION® 2D/3D inspection technology that combines an exclusive 15MP CoaXPress 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies.  The MV-7 OMNI machine also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. 
 
Also on display, the MV-3L Desktop AOI system is the industry’s most widely accepted five camera desktop AOI system.  This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. 
 
“MIRTEC has earned a solid reputation in the Electronics Manufacturing Industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division.  “We look forward to welcoming visitors to our booth during the two day event.” 





Kyzen to Exhibit Ultra Low VOC Stencil Cleaning Agent at SMTAI

NASHVILLE - August 2014 - Kyzen will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Kyzen’s cleaning experts will showcase the AQUANOX® A8830 Low VOC Aqueous Stencil Cleaning Agent. 
Kyzen
AQUANOX® A8830 is an ultra-low VOC, environmentally progressive formulation that is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures. A8830 is a low odor cleaner that operates in open systems. The state-of-the-art environmental properties of A8830 make it an ideal option for areas where air emissions are highly regulated.
 
A8830 meets the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the industry. Providing increased performance adds real value with better prints and modern, green technology that is better for the environment.
 
AQUANOX® A8830 is available in one, five and 55 gallon containers. 
 
Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.





KIC to Showcase Automatic Systems at SMTAI

KIC's K2 is the latest technology in thermal profiling

San Diego - August 2014 - KIC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system and K2 new generation profile setter in Booth #439 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. KIC will be co-located with Heller at the two-day exhibition.
KIC
The ProBot automatically measures the profile for each PCB and verifies whether each PCB is processed to specification in the reflow oven.  The suspect PCBs are identified and may be isolated.  One method to enhance the use of an X-ray system is to have these boards then be sent off to batch X-ray.  Since the typical batch X-ray machine only inspects less than one percent of all assembled PCBs, the ProBot allows for a more effective sampling.
 
The ProBot also complements AOI inspection as these machines cannot see the solder joints hidden below BGA and PoP component bodies. The ProBot’s software will store the relevant solder paste and component temperature tolerances and check that each PCB was processed in accordance with these process windows. 
 
 The K2 new generation profile setter is the latest technology in thermal profiling. The K2 is available both as a standard “passive” profiler as well as an “active” profiler in one unit.  The passive profiler measures and displays the myriad of time/temperature data for the profile on a PCB and displays it in an easily accessible manner. The standard Mobile Profile View App transmits the information wirelessly to a mobile device for the ultimate in viewing convenience and accessibility. Designed to be robust and compact, the K2 will fit through the tight, heated chambers often found in lead-free production and is priced competitively for the mid-range market. The K2 also is available with automatic prediction software that suggests the best oven recipe to position the profile deep inside the established process limits.  
 
For more information, meet with company representatives at SMTA International or visit www.kicthermal.com.





Juki Sets the Standard in Mini-Wave Solder Systems and High-Speed Chip Shooters at SMTAI

MORRISVILLE, NC - August 2014 - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, will exhibit in Booth #616 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Juki representatives will showcase the following products: KE-2080 Flexible Mounter, CUBE.460 Dual Nozzle Selective Soldering System, RX-7 High-Speed Chip Shooter and the GL Fully Automatic Screen Printer.
JUKI
A KE-2080 flexible mounter will be on display featuring a linear fluxer and new LNC60 high resolution laser for on-the-fly laser centering which results in high-speed, high accurate placement. The system has a six nozzle head with a placement range from 01005 (0402 metric) to 33.5 mm2 and a rated IPC9860 speed of 16,700 CPH.
 
The CUBE.460 sets the new standard for dual nozzle mini-wave soldering systems. The unique CUBE.460 batch platform offers excellent flexibility for through-hole applications.  The CUBE.460 can be configured with a single nozzle or dual nozzle for increased flexibility. The system comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles including wetted nozzle tips and non-wetted nozzles, a live viewing camera and fast reacting Quartz IR bottom side pre-heater to name a few.
 
The RX-7 utilizes two of Juki’s brand new compact rotary heads (Super Rotary Head), capable of 16 nozzles per head. This is a high-speed chip-shooter with high placement accuracy of ±40µm (Cpk > 1) that meets the specification for production of smart phones and many other high-density electronic applications. In combination with the newly released RX-6 flexible mounter, Juki is now able to offer  greater cost efficient production lines, resulting in high yield productivity for various industries whether high-mix, low-volume or high-volume production.
 
Also on display, the popular GL Fully Automatic Screen Printer is designed for printed circuit boards (PCB) with a maximum size of 510 x 510 mm. The printer comes standard with many advanced features such as automated 2D paste inspection, Stencil Position Memory (SPM), auto PCB thickness adjustment, a combination of top/side PCB clamping function and bottom-side PCB support pins locating guidance system.
 
For more information about Juki Automation Systems, visit www.jukiamericas.com.





Inovaxe to Expand its Suite of Handling Solutions at SMTA International

InovaxeDEERFIELD BEACH, FL - August 2014 - Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will exhibit in Booth #313 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The Inovaxe team will debut a brand new product and highlight its full suite of material handling solutions.
 
The ultra-lean total material handling and storage solution addresses the challenges of dealing with SMT parts and kits within the stockroom and WIP locations.
 
The industry favorite InoKit Carriers in combination with the InoView software also will be displayed. InoKit carriers are an ultra lean solution for the storage and kitting of prototype parts for engineers and SMT manufacturers. InoKit carriers are organized, efficient, state-of-the-art, single package-single location material storage carriers, which house small, medium, and large SMT reels, or any type of mechanical parts and printed circuit boards. Additionally, Inovaxe’s InoView software is an excellent tool for managing parts and kits within the stockroom and WIP.  Part locations and kit requirements can quickly be identified with accuracy and traceability.  
 
Inovaxe’s patented InoCart MSD is a true solution for managing moisture sensitive devices through its innovative individual cell design that stores multiple reel sizes and waffle trays. Included with each InoCart MSD is the revolutionary MSD tracking and timing software solution.
 
For more information about how Inovaxe’s innovative material handling systems and services can improve your inventory accuracy and reduce your labor costs, meet company representatives at SMTA International or visit www.inovaxe.com.





FCT Assembly to Demonstrate NanoSlic® Gold Stencil at SMTAI

REELEY, CO - FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Company representatives will be on site to answer any questions about FCT’s stencils and its new coating technology.
 
The NanoSlic® technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic® minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.
 
The new NanoSlic® Gold stencil is the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic® Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic® Gold is thermally cured and is a permanent coating. 
 

Also on display, FCT Assembly’s Step and Relief Stencils offer variable stencil thickness in specific areas to accommodate reduced volume (step down) or increased volume (step up). The stencils are ideal for controlling paste deposits on PCBs with both standard and fine-pitch SMT as well as intrusive reflow/paste-in-hole components. Steps are chemically etched into the squeegee side of the foil, yet all apertures are laser cut.

FCT

 
For more information, contact your local representative or visit www.fctassembly.com.





Fancort Industries to Exhibit Desktop Soldering Robots with EAP at SMTAI

MERIDIAN, IDAHO - August 2014 - Fancort Industries, Inc., a global supplier of cost-effective solutions to electronics manufacturers, will exhibit with Electronic Assembly Products (EAP), Ltd. in Booth #807 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Japan UNIX Desktop Selective Soldering Robots.
Fancort
The 410S Series is available with a high precision feeder, offering a 15 percent improvement in speed. The system is ideal for manufacturers that require fast, precise operation. The 410S Series is available in two slim versions, allowing customers to choose the best robot to fit their objectives. Both are available with many options such as the clean cut feeder, XYT tip correction mechanism, camera system, fume extractor, wire preheater, N2 generator for lead-free applications and lock-on mechanism for the feeder.
 
The best-selling 410 Series sets the global standard for selective soldering robots. Easy-to-install, the 410 Series enables users to instantly automate soldering – from cellular to in-line manufacturing and more. The Series offers super-rigid and dust-proof construction.
 
The desktop robots are available in compact, mid-size or wide area versions. For higher production requirements, other robot platforms are available for in-line or rotary table processing. For more information about the systems and options, visit www.fancort.com. 





Europlacer to Demonstrate iineo II SMT Pick-and-Place Platform at SMTAI

EuroplacerTampa, FL - August 2014 - Europlacer, a manufacturer of market-leading flexible SMT placement machines, announces that it will showcase the iineo II SMT pick-and-place platform in Booth #907 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
 
The award-winning iineo II is widely configurable for numerous requirements. The platform offers the industry’s largest board size (24" W x 63"L) under ‘one roof’, along with expansive feeder capacity up to 264 x 8 mm + trays. With two placement heads, 24 nozzles, odd-form capability and enough capacity for a broad range of presentation media including tape and reel, trays, tubes, cut tapes and POP, the iineo II can be employed to achieve optimal production efficiency on complex boards and higher volumes, with ease.  Europlacer will be demonstrating their new ii-Feed system, which highlights a 15 second unit load-time, along with sub-$300 unit price for fully ‘intelligent’ assembly planning and production.
 
For more information, schedule a meeting with company representatives in Booth #907 at SMTA International or visit www.europlacer.com. 





World’s First SMT Assembler with Integrated Solder Paste Jet Printer at SMTAI

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it will highlight the Paraquda 2 with integrated solder paste jet printer in Booth #640 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Essemtec has merged its dispensing and pick-and-place know-how from the Scorpion and Paraquda machines into a SMT production centre.
Essemtec Paraquda
Paraquda combines two different production steps within one   platform (solder paste jetting and SMD assembly). The Paraquda meets all of the requirements of a modern, highly flexible production system: changeover without downtime, component management, and the integration of jet printing of solder paste or glue.
 
Jetting of solder paste instead of printing saves costs for stencils, eliminates printing errors and enhances production flexibility especially for lower to midsize volumes. Essemtec’s solder jet printer is fast (up to 80,000 dots/hr), very precise (51µm @3s) and suitable for 0201 components. It opens the range of pastes to most common solder paste type 4, 5, 6 or 7. Essemtec’s solder paste jet valve can be installed on existing machines platforms, such as the Scorpion high-speed jet dispenser or the Paraquda component placer.  Production is fully automated, and solder paste application and component placement are seamlessly integrated while process monitoring ensures high-quality results. 
 
For more information about Essemtec's SMT production center, visit the company in booth #640 at the SMTA International or on the Web at www.essemtec.com.
 





Ersa to Exhibit the New HR 600 Hybrid Rework System

Plymouth, WI - August 2014 - Kurtz Ersa North America, a leading supplier of electronics production equipment, will exhibit the HR 600 hybrid rework system in Booth #134 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The HR 600 hybrid rework system unifies all essential process steps in one system and offers every option from manual operation, to automatic soldering, desoldering and placement, requiring only little action from the operator.
KURTZ ERSA
The HR 600 is equipped with a highly dynamic and efficient heating technology with the bottom-side heating (2,400 W) divided into three independent heating zones. The newly developed hybrid top-side emitter provides 800 W of heating power and combines the advantages of infrared heating with those of a convection heater. In order to thermally control the rework process, the HR 600 uses proven closed-loop technology. The component temperature is measured and can be controlled exactly. With the HR 600, non-contact temperature measurement is even more precise due to a digital infrared sensor (pyrometer).
 
Additionally, the ERSAScope 2 and i-CON VARIO 4 will be showcased as part of the Power and High Temperature Electronics Manufacturing Experience. SMTA International 2014 will be hosting the first feature area in the exhibit hall dedicated to Power Electronics and High Temperature.
 
For more information about Kurtz Ersa North America, visit www.ersa.com. 





CyberOptics to Debut Its Conformal Coating Inspection Solution at SMTA International

CyberOptics Corporation (Nasdaq: CYBE) announces that it will launch its CX150i™ Conformal Coating Inspection system in Booth #218 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. The multi-award winning SE600™ 3D SPI system will also be displayed at the show. All CyberOptics’ inspection solutions come with the assurance of quality, accuracy and speed.
CyberOptics
The new CX150i™ system offers simple, fast and reliable conformal coating inspection using a brand-new UV Strobed Inspection Module (SIM). Designed with an 80 Megapixel sensor, CX150i™ offers white light illumination for component presence/absence inspection and UV illumination for conformal coating inspection. Powered by AI2 (Autonomous Image Interpretation) technology, CX150i™ enables faster, simpler and smarter programming. Conformal coating inspection plays a critical role in ensuring consistency and quality conformal coating.
 
The SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection. CyberPrint OPTIMIZER™, a unique value-add program, that automatically optimizes your printing process is part of the SE600™ software portfolio.
 





The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

May 2014 - The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services.
Balver Zinn
OT2 is Cobar’s latest halide and halogen free solder paste technology that is specially developed to meet continuously increasing customer requirements. The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.
 
Also at the show, the Balver Zinn Group will debut the new Cobar WW50 water soluble solder paste. The paste is compatible with the following alloys: Sn62, Sn63, SAC305 and SN100C, all with Type 3 powder. The rosinous halide-free nature of WW50 is unique, with paste rheology, solder-ability and water wash-ability conferred by carefully selected surface chemistry and activators. With the new WW50 branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the residues can be easily removed with de-ionized water.
 
Balver Zinn and Cobar offer solder bar, solder wire, solder flux, gel flux, cleaner and solder paste. For more information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com





BTU to Highlight the Industry’s Best Performing Reflow Oven at SMTAI

NORTH BILLERICA, Mass., August 2014 - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will exhibit in booth #834 at SMTA International, scheduled to take place Sept. 30 - Oct. 1, 2014, at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will discuss the industry-leading PYRAMAX™ and award-winning DYNAMO™.  
BTU Dynamo
BTU representatives will highlight the PYRAMAX convection reflow oven – the benchmark for performance in the industry.  The PYRAMAX features a maximum temperature of 400°C and a comprehensive menu of options. PYRAMAX systems, featuring BTU’s exclusive closed-loop convection technology, provide optimized lead-free processing for the ultimate in productivity and efficiency. 
With 8, 10, and 12 zone air or nitrogen models available, DYNAMO represents BTU’s commitment to quality and reliability. DYNAMO’s simplified configuration delivers 24/7, with high uptime and reduced cost of ownership.
Both products are backed by BTU’s worldwide network of service and applications professionals. For more information, meet with company representatives at SMTA International or visit www.btu.com.
 
About BTU International
BTU International is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.





Get Dual Mode AOI / SPI Inspection from ASC International at SMTAI

MEDINA, MINNESOTA - August 2014 - ASC International, a leading manufacturer of 3-D solder paste inspection and automated optical inspection (AOI) systems, today announced that will exhibit in Booth #516 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the new LineMaster DM platform, VisionPro AP500 and VisionPro M Series (SP3D / M500) SPI systems. 
ASC International
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance.  The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing.   Combining both inspection capabilities within one platform, the LineMaster DM  detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and the most accurate and repeatable true 3D volumetric measurements for SPI.  System features include real-time SPC, customized data reports, offline CAD / Gerber programming and defect repair station.  All wrapped together with an affordable price tag similar to purchasing both inspection capabilities for the same price of as one solution alone.
 
The VisionPro AP500 SPI system incorporates the most advanced, rapid 3-D inspection technology within a stylish vibration-free, fully automated platform. Designed with feature-rich software including onboard real-time SPC, customized data reports and simple-to-use GerberProTM conversion programming software, the VisionPro AP500 has become the industry standard for fully automated, offline SPI around the globe. 
 
The VisionPro M Series of SPI systems incorporates the most advanced, rapid 3-D inspection technology coupled with an intuitive Windows® 7 OS and packaged in a rugged, bench-top platform.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M500 an exceptional value for electronics manufacturers concerned with improving production yields. Designed with feature-rich software, including onboard real-time SPC run charts, customized data reports, simple-to-use GerberProTM conversion programming software and two sensor technology options, laser and structured white light, the VisionPro M Series is the price to performance leader for offline SPI solutions available on the market today. 
 
For more information about ASC International, visit www.ascinternational.com.





Akrometrix LLC to Demonstrate 2D/3D Statistical Review Software at SMTAI - Interface Analysis

ATLANTA, GA - August 2014 - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Interface Analysis software that allows allow high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Akrometrix
Surface-mount components may warp during the reflow process, as well as the associated land area.  This warpage between components and the land area can contribute to defects such as Head-on-Pillow, shorts and opens. Fully understanding the critical interface between surfaces is more important than ever. 
 
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
 
For more information, meet company representatives in Booth #541 at SMTAI or visit www.akrometrix.com. 





ACD to Exhibit PoP Assembly and Functional Test Services at SMTAI

RICHARDSON, TX - August 2014 - ACD, a leading supplier to the electronics industry and leader in Package-on-Package (PoP) assembly, will exhibit in Booth #636 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
ACD
For more than 30 years, ACD has supported the printed circuit board (PCB) industry in a variety of ways; from design to laser photoplotting, to supporting engineering software, to final test. The company offers the support required to get products to market as quickly as possible. ACD’s assembly business model is geared toward supporting high-mix, high-technology assembly from prototypes through low-to-mid volume production. With a focus on high-end technology, ACD is staffed with two shifts to respond to a variety of products, markets and deliveries.
 
With single- and double-sided flying probe testers, ACD offers its customers confidence in receiving quality, defect free assemblies. ACD’s functional testing verifies that each of the various product capabilities defined in the design specification or test specification meet customer requirements. This is instrumental to providing ACD's customers with quality, defect free assemblies. ACD works closely with its customers and the Functional Test Department to develop an accurate test for each assembly. 
 
For more information about ACD’s design and contract assembly services, or the company's world-class quality management system, meet company representatives in Booth #636 at SMTA International or visit www.ACDUSA.com.





Kimball Electronics Group & Others Selling Excess Assets

EMS provider Kimball Electronics in Tampa, Florida will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for the "SEALED BID" auction will be closing promptly at 5pm EST on this Thursday (August 7, 2014). 
 
Note: The "Sealed Bid" auction format is different than the standard "eBay Style" format. 
 
The items in this event include a Teradyne 8855 Spectrum In-Circuit Tester, Agilent 3070 HDD cards, 2009 Aquastorm 200 Wash, Siemens SIPLACE Pick & Place machines, an EMC Stencil Cleaner,  numerous component former machines &  accessories, an Electrovert OMNI 7 Reflow Oven, conveyors and more...
 
To view the complete line of items currently up for auction and register to start bidding visit www.BajaBid.com.
 
Questions about the event can be directed to Arlin Horsley at 1-813-992-2437.
 





V-TEK International Completes Acquisition of Royce Instruments

Combined company to deliver broader experiences and market access

MANKATO, MN—V-TEK International of Mankato, MN is pleased to announce the acquisition of Royce Instruments, of Napa, CA.

Since 1985, V-TEK has earned a solid reputation as a global leader in developing and delivering electronic component packaging solutions. Known for reliability, performance, service and innovation, V-TEK will now combine forces with Royce Instruments, to offer additional choices of products and services for an expanded global clientele.

“The acquisition supports our strategy to grow by expanding our electronic component market presence while also increasing overall share," explains Larry Haberman, President of V-TEK. "Royce’s line of bond testers and die sorting equipment compliments V-TEK's current technology and improves customer access. The combined firm will strengthen our ability to innovate and expand our existing product lines."

Founded by Dennis and Vivian Siemer, V-TEK designs, builds and markets capital equipment sold globally to test, inspect, handle, and package electronic components. The company distributes consumable packaging supplies and also provides inspection, test and packaging services at its headquarters in Mankato, MN, as well as two locations in Mexico. Royce is a global leader in designing precision assembly tools and high-accuracy, low-force bond test equipment for the semiconductor industry. 

V-TEK and Royce have thrived in their respective markets over the past 30 years. As Royce founders Malcolm and Diane Cox begin a transition to retirement, blending the two successful businesses offers a future filled with new opportunities brought about by synergies of product scope, engineering talent, and skilled personnel.

“We plan to continue our tradition of maximizing value for our customers by offering products and services that consistently conform to customers’ requirements while exceeding expectations, " said Haberman. "Royce's unique combination of engineering acumen and market knowledge built the company into an internationally respected manufacturer of testing and handling equipment. V-TEK intends to preserve and extend the Royce brand throughout the transition.”

With a combined total of more than 55 global distribution sites, localized technical service, and a dedicated sales organization delivered through a global network of alliances, the acquisition of Royce makes V-TEK poised to take innovative technologies to new markets and continue growth worldwide.





KS TECHNOLOGIES AND LINEAR MANUFACTURING COLLABORATE ON MOBILE HARDWARE ACCESSORIES

logo KS Technologies, LLC (KST) and Linear Manufacturing, Inc. have teamed up to combine hardware engineering, mobile app development, and world-class manufacturing based solely in the USA. Located just miles from each other, the two Colorado Springs based companies are collaborating on several joint projects, including Bluetooth Low Energy-based indoor proximity sensors.

Beyond Bluetooth Low Energy, KST and Linear are developing hardware accessories for iOS and Android which include the design and development of apps utilizing Classic Bluetooth, USB, and Lightning Connector-based devices.

Bob Kressin, President of KST, said, “Combining KST’s engineering expertise with Linear’s manufacturing excellence is a perfect and sensible match. The collaborative spirit between the companies is strong, giving us a unique competitive advantage. By building locally, we’re able to reduce ship times to our clients while offering rapid prototyping solutions in a very dynamic and exciting market.”

Jay Palace, President of Linear, said, “Partnering with KST puts us in a position that is right at the top of cutting edge technology. It is an exciting time and these kinds of projects are exactly why I started Linear. Employing some of the top people in the electronics manufacturing industry gives us an opportunity to shine.”

KST was founded in 2003 in Colorado Springs, Colorado, with engineering expertise in mobile hardware accessory and application development. Engineers on staff have specific technical knowledge in iOS & Android Development, UI / UX Engineering, Hardware Engineering, Embedded Systems Development, and System Architecture.

Linear Manufacturing has been based in Colorado Springs since 1995. Linear is an ISO 9001:2008 certified contract manufacturer for electronics and serves clients in many market segments for original equipment manufacturers (OEM’s).

 

 

 





Aculon Hosts Webinar on Understanding SMT Stencil NanoCoatings

Aculon recently hosted a webinar "Understanding SMT Stencil NanoCoatings and How They Influence the Solder Paste Printing Process." 

Listeners will:

• Understand nanocoatings, how they work, and their cost/payback

• See the performance difference between treated and untreated stencils

• Review real-world data on stencil printing improvements

• Get up to date on the current research

 

Who benefits:

• Production engineers and technicians

• Quality and Supplier Quality professionals

• Advanced Manufacturing Technology and New Product Introduction personnel

Listen to the webinar here: http://www.aculon.com/videos/june-webinar.wmv





OneChip Photonics Assets - All Remaining Assets Being Sold

OneChip Photonics will be selling all of the remaining assets at their site in Kanata; Ontario, Canada. This is a short notice sale and lots will begin closing at 11:00am EST on June 19, 2014.

Below is a brief list of some of the items included in this sale.

• Agilent 86100C Infiniium DCA-J • Spirent SPT-2U TestCenter • Wafer Bar Tester Apparatus • (3) Keithley 2602A • Tektronix DSA 8200 • (2) JDSU MLCS-A1208P-M100-MFA • (6) Test Equity 1007S Chambers • (5) Newport ESP301-3G • (5) Terra Universal 1610-33A • Agilent 83402C Lightwave Source • Complete Fiber Optic Test System • Fiber Optic / Electronic Components • Micropositioner Probe Stations and more…..

To view the complete line of items currently up for auction and register to start bidding visit www.bajabid.com/auctions now.

Questions about the event can be directed to Arlin Horsley at 1-813-992-2437 or Nick Jimenez at 1-203-733-7191.





Enthone Six Sigma Black Belt Graduation Marks 10th Graduating Class in Americas

More Than $10 Million USD in Customer Financial Benefits Achieved

WEST HAVEN, Connecticut, USA, June 11, 2014 – Enthone Inc. is proud to announce the upcoming graduation of the company’s 2014 Six Sigma Black Belt Class. The graduating class marks the tenth black belt training certification held in the Americas and the twenty-third class worldwide since the inception of the company-wide program in 2001. 

In the past thirteen years, there have been over forty customer-focused Enthone Black Belt projects that have reaped in excess of $10,000,000 USD in customer financial benefits derived through higher operational efficiencies, increased production yields, and enablement of next generation manufacturing designed to meet OEM specifications. Each customer black belt project has yielded $150,000 to well over $1,000,000 in savings. 

Today there are more than seventy active Enthone Black Belts which are supported by 450 Green Belts from all sectors of the company, including technical applications engineers and research scientists, as well as operations, sales and marketing professionals. Since the program’s inception, more than 750 Enthone employees have been completed Black Belt or Green Belt training. 

Jason Maupin, Vice President – Enthone Americas, said, “For more than a decade, Enthone has continued a deliberate and highly disciplined approach to expanding the company’s focus and resources on investing in our greatest resource – the Enthone Team---by driving a Six Sigma culture throughout the organization, and most especially to our technical application and sales engineers. No other chemical supplier in the surface finishing and electronics industries offers a Six Sigma program to enhance the company’s overall skill set, while providing direct value to customers.”

The initial focus of Enthone Six Sigma was on improving internal business and manufacturing processes and yielded several million dollars in improvements in the first five years. In 2007, Enthone differentiated itself from its competition in a way that further enhanced value to its customers by utilizing the methodology to develop joint projects targeting improvements in yield, productivity and cost reduction at customers’ facilities. In 2010, the program was formally expanded as the Enthone Customer Value Six Sigma (CVSS) program to offer a differentiated value to customers. In support of the program, Enthone has been training and certifying its technical service engineers as Six Sigma Black Belts. 

For further information on Enthone Customer Value Six Sigma (CVSS) and how it can create value at your company, contact Gary Sutcliffe, Manager of Customer Value Six Sigma at gsutcliffe@enthone.com or your local Enthone representative.

About Enthone
Enthone Inc., an Alent plc company, is a global and leading supplier of high performance specialty chemicals and coatings. Enthone creates customer value by providing innovative and cost-effective technology solutions to the automotive, building hardware, energy, aerospace, jewelry, industrial finishes, printed circuit board and semiconductor industries. For more information, please visit enthone.com





Brady Announces Cost of an Ineffective Traceability System Webinar

Brady & Cogiscan to host free webinar on the importance of traceability in manufacturing

MILWAUKEE, Wis. (June 3, 2014) — Brady (NYSE:BRC), a global leader in industrial and safety printing systems and solutions, today announced it will host a free webinar on the “Cost of an Ineffective Traceability System” in partnership with Cogiscan, Inc. The webinar will take place live on Thursday, June 12, 2014 at 11 a.m. CDT. It will focus on what traceability is and the importance of implementing a system, key considerations, including data processes, common hardware, software and marking components, and more.

What: “Cost of an Ineffective Traceability System” Webinar

Brady Presenters: Robert Prosser and David Walmsley, global product managers

Guest Presenter: Francois Monette, co-president, sales & marketing, and co-founder, Cogiscan, Inc.,

Date/Time*: Thursday, June 12, 2014 at 11 a.m. CDT

Access Recording: 

*Can’t attend the live session? Access the recording at the link above.

About Brady Corporation: http://bit.ly/traceability-webinar

Brady Corporation (NYSE: BRC) is an international manufacturer and marketer of complete solutions that identify and protect premises, products and people. Its products include high-performance labels and signs, safety devices, printing systems and software, and precision die-cut materials. Founded in 1914, the company has millions of customers in electronics, telecommunications, manufacturing, electrical, construction, education, medical and a variety of other industries. Brady is headquartered in Milwaukee and employs 6,900 people at operations in the Americas, Europe and Asia/Pacific. Brady’s fiscal 2013 sales were approximately $1.15 billion. More information about Brady Corporation is available at www.bradycorp.com.