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LPKF makes up a lot of ground in the second quarter

Tualatin, OR, August 2016 - Business growth at LPKF Laser & Electronics AG accelerated considerably in the second quarter 2016. Sales grew by almost 20% compared to the same quarter of the previous year, EBIT results were positive at EUR 0.7 million. However, due to a very weak first quarter, sales and EBIT results after six months stayed below the previous year’s figures. Sales in the first half year reached almost EUR 40 million, EBIT stayed negative at EUR -3.7 million.

Orders received in the first half of the year amounted to almost EUR 60 million, almost 40% higher than those received during the first half of the previous year. Orders in hand on the reporting date were over 80% higher than the figures re-ported during the same period of the previous year. The book-to-bill ratio reached a value of 1.5.
 
The most significant drivers of growth in the first six months included laser systems for plastic welding. A large solar contract for EUR 17 million was a major contributor to the orders received in the second quarter. Orders in the other two segments remained below expectations for the first half of the year.

The announced cost-saving program made good progress in the second quarter. The planned reduction of 100 full-time equivalents in the LPKF-Group is on schedule. Until mid-August a capacity reduction of eighty-six full-time equivalents has been contractually agreed. The Board of Directors therefore believes that the company is in a good position to bring the break-even point for 2017 to below EUR 90 million.
 
“Despite the continued weakness in LDS business, we have taken a substantial step forward in the second quarter", says Dr. Ingo Bretthauer, CEO of LPKF AG. “Both the sales trends and cost-saving measures are going according to plan. We are confident that we will be able to achieve our goals for 2016 on both fronts.”
 
For 2016, the Board of Directors expects to achieve sales of EUR 90 to 110 mil-lion and an EBIT margin of between -3% and +6%, if the global economy remains stable. These include estimated restructuring costs of approx. EUR 2 million. For 2017, the board expects an increase in sales and a clearly positive result.
 
The complete half-year financial report is available in German at www.lpkf.de/investor-relations/news-publikationen/finanzberichte/index.htm and in English at www.lpkf.com/investor-relations/financial-reports/index.





ZESTRON Releases New Virtual Tour on Website

[Manassas, VA – July 27, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that ZESTRON Americas has a new virtual tour on zestron.com.

 

“We invite customers and industry professionals to take a 360° tour of our state-of-the-art facility,” says Todd Scheerer, Executive Vice President. “As with any of ZESTRON’s seven facilities, our customers can visit and review cleaning equipment alternatives, conduct cleaning trials with the industries’ most innovative engineered cleaning products, and assess cleanliness results in real time.  Visitors can also tour our ZESTRON Academy training and global video conference centers.”

 

As part of ZESTRON’s continuous effort to provide integrated global support, customers can also tour the Technical Centers located in Germany, China and Malaysia as well.  To view our latest virtual tour, visit zestron.com.





Vision Engineering to Hold FREE Webinar Series on Conformal Coating Inspection & Coating Faults

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.
 
The series began on June 16th with Solder Joint Inspection & Process Defects. The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. 
 
During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions
 
The first two webinars are now available on-line and can be viewed at the following links:
 
Solder Joint Inspection & Process Defects
 
Counterfeit Component Inspection & Detection
 
 
Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.
For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





UP Media Group Announces PCB West 2016 Exhibition Floor Sold Out

ATLANTA, GA – JULY 12, 2016 – The exhibition floor is sold out for PCB West, the largest conference  and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today. 

PCB West 2016 will be held September 13-15 in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center. 

Now in its 25th year, this year’s show will feature 110 booths, 16% more than the 2015 exhibition.  The event showcases the leading companies in the PCB industry, including all the top CAD and CAM vendors and top names in printed circuit fabrication and electronics assembly.

“This is the fifth straight year we have sold out all available booths,” said UPMG vice president of sales and marketing Frances Stewart. “We are truly looking forward to hosting another great event for the industry in September.”

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The September 2015 event attracted more than 1,900 attendees. 

PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.

For more information about PCB West, visit pcbwest.com or contact Show Manager Alyson Corey at 678-234-9859; acorey@upmediagroup.com. 

About UP Media Group Inc. 
UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FABTM (pcdandf.com) and CIRCUITS ASSEMBLYTM (circuitsassembly.com), as well as the PCB UPdateTM (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB WestTM (pcbwest.com). 





Industry 4.0: Reduce costs through component counting and interconnected technology

Logo_Block.jpg Especially electronics manufacturers in high wage countries face an enormous cost pressure from competitors based in low-wage countries. Time is literally money – therefore, it is more important than ever to automate processes continuously to increase efficiency and to keep the margin. To avoid production stops caused by inventory discrepancies, it is crucial to count the components on reels. To make the tedious counting process feasible VisiConsult replaces the time-consuming manual or optical approach by an innovative solution based on X-ray technology. This reduces the time required per reel from several minutes to less than 10 seconds. The XRHCount is a compact X-ray system to count all common SMD component types on tapes with a diameter of up to 400 mm.

An absolute innovation is the new Counting Cloud. New component types don’t have to be trained locally. Instead the uncountable reels can be directly submitted to the VisiConsult development team. Regularly every plant will receive an automatic update. The already very extensive database is continuously growing through the input of dozens of systems worldwide. This includes big sites such as Flextronics, with a reel volume of several thousand reels per day. Currently the counting accuracy is already above 99.9%, while no component database is required.

Another new feature is the seamless integration with common and specific IT infrastructure. This results in a further increase in speed and better process stability. The counting result can automatically be sent to MES or ERP systems, if desired. Renown systems, such as FUJI Trax, Cogiscan, SAP etc. incl. traceability support are already pre-implemented. For custom systems the XRHCount offers extensive open database interfaces. The target is that the XRHCount can be integrated into every system on the market.

More information: http://visiconsult.de/products/electronics/xrhcount/

System video: https://www.youtube.com/watch?v=r1T_X2PaibQ

 

System_loading.jpg





Seika Machinery Increases Its Technical Support

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that is has expanded its technical support offering. Now, the company has technical service centers at its Atlanta and San Francisco branches. 

The Atlanta branch provides support and repair for McDry dry storage cabinets as well as the Sawa portable ultrasonic stencil cleaners. At the San Francisco branch, Seika provides technical support and basic service including repair and calibration on the Malcomtech viscometers, paste mixers, wetting balance testers, profilers and other products. 

In-depth repairs are handled by the manufacturers for all products; however, many repairs can be handled by Seika Machinery. The company also has a 24-hour Technical Hotline that can be reached at: (888) 734-5278.

For more information, contact Michelle Ogihara at michelle@seikausa.com, or visitwww.seikausa.com.





Kester to Host Advanced Selective Soldering Process Seminar

Kester_Logo_Black10.png ITASCA, IL - June 21, 2016 Contact: Michelle O’Brien, Marketing & Communications Specialist

Kester is hosting an Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL.

The Advanced Selective Soldering Process Seminar will cover flux, cleaning, process and PCB design. Kester’s Global R&D Director, Bruno Tolla, and Technology Manager, Denis Jean, will present flux evaluation for selective soldering applications and no-clean flux reliability. Mike Bixenman from Kyzen, Joe Clure from Ersa and Dale Lee from Plexus will also be presenting.

For more information or to RSVP for the seminar, contact Michelle O’Brien at mobrien@kester.com.

### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

 

 





Cirtronics Hosted the Boston Chapter of Surface Mount Technology Association Tuesday, May 24th 2016

Milford, NH, May 25, 2016 - Cirtronics, an onshore manufacturer of boards, assemblies and electromechanical devices, is pleased to have hosted the SMTA Boston chapter meeting on Tuesday, May 24th, 2016. SMTA is an international organization supporting ongoing education and advancement of the electronics industry.
 
“We truly value our relationships with industry organizations such as SMTA”, says David Patterson, Chief Operating Officer of Cirtronics. “By working closely with the organizations that are central to specific areas of our business—like SMTA-- we are able to take an active role in discussions about best practices, in exploring industry trends, and assessing the technologies and skills and credentials we will need to remain on the leading edge of electronics manufacturing”.
 
Cirtronics Precision Engagement® Contract Manufacturing
Cirtronics has provided Electronics Manufacturing Services (EMS) since its founding in 1979. Since then, Cirtronics has grown well beyond boards to include assemblies and full product builds (box builds) for a wide range of customers and serves many different industries. One thing remains constant: Precision Engagement®. Dedication to customer-focused service, combined with purposeful, proactive communication is what Cirtronics’ Precision Engagement® is all about.
 
Again, David Patterson: “Board manufacturing has evolved over the years from through-hole to surface mount, and we have evolved our technology and the education of our employees to make sure we are meeting the needs of our customers”. Patterson continues, “Of course we maintain through-hole capabilities to serve existing customers and specialized projects that require through-hole technology to conform to project specifications. And, at the same time, we are continuing to expand our surface mount capacity through the purchase of additional manufacturing equipment to stay ahead of demand for surface mount manufacturing. EMS—as with all of our manufacturing-- requires precise attention to detail. Since each customer has different needs, our commitment to Precision Engagement® means we don’t force fit projects into pre-defined programs and processes. Instead, we tailor our services to support each customer’s goals and needs.”





Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB

Vision Engineering Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.

About-Bob-Willis-200px.jpg

The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.

The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





Ellsworth Adhesives to Display the Latest in Adhesive Technologies at Sensors Expo

GERMANTOWN, WI – June 1, 2016 – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at this year’s Sensor’s Expo at the McEnery Convention Center in San Jose, California June 22-23 in booth 1217.
 
This year at Sensors Expo, Ellsworth Adhesives is partnering with Moldman™ Systems, a manufacturer of low pressure injection molding machines. Moldman™ Systems will be showcasing one of their latest molding machines, the Mold-Man™ 1050. It’s a benchtop machine with a one ton clamping force and the ability to overmold, encapsulate, protect and seal electronics and cables easily and on demand. Ellsworth Adhesives will also be showcasing TECHNOMELT AS 8998 from Henkel. It’s a hot melt adhesive that brings a new and efficient approach to temporary masking for conformal coating processes. TECHNOMELT AS 8998 is compatible with automated dispensing systems and releases cleanly from various substrates.
 
For over 30 years, Sensors Expo and Conference is North America’s premier event focused exclusively on sensors and sensor-integrated systems. This event has multiple educational opportunities including five symposiums, two Keynote presentations and over 65 technical conferences covering topics like Energy Harvesting, IoT, Wireless and MEMs innovation.
 
Ellsworth Adhesives aims to fulfill specialty chemical needs, from initial technical advice through customized product fulfillment. They strive to help their customers achieve maximum productivity with lower total cost in their manufacturing processes by offering valued services and solutions, and delivering quality products from world-class suppliers. Jay Richardson, Director of Sales at Ellsworth Adhesives, commented, “We are very excited to be exhibiting at Sensors Expo. Our Engineering Sales Representatives are ready to answer any questions on projects and applications that require adhesives or specialty chemicals. We invite you to bring in parts, diagrams or sketches on napkins and we’ll help you find the best solution.”
 
Ellsworth Adhesives understands and appreciates the role they play as an adhesive and specialty chemical supplier. The Glue Doctor®, a registered trademark of Ellsworth Adhesives, represents the technical expertise and unique capabilities of more than 50 Engineering Sales Representatives in North America, and more than 150 Engineering Sales Representatives globally, who specialize in working with customers on engineered assembly processes and implementing adhesive solutions in the manufacturing environment.
 
For more information on Ellsworth Adhesives, visit www.ellsworth.com or call 1.800.888.0698.





iNEMI Schedules Regional Roadmap Workshops in North America, Europe and Asia

Industry invited to take “first look” and provide input on regional issues

HERNDON, VIRGINIA (May 24, 2016) — The International Electronics Manufacturing Initiative (iNEMI) will hold three regional workshops to review progress on its 2017 Roadmap. These meetings will give the electronics industry a “first look” at the 2017 Roadmap and provide the opportunity for input to ensure that regional concerns are included in the final roadmap.

Participation in the workshops is free, but advance registration is required. See details of each workshop below.

North America Workshop
Tuesday, May 31; 7:45 a.m. - 5:30 p.m. Pacific Daylight Time (US)
(face-to-face meeting held in conjunction with ECTC 2016; also accessible via webinar)

This all-day workshop, held at The Cosmopolitan Hotel of Las Vegas (also the site of ECTC), will include reports from all 21 of the Technology Working Group (TWG) chapters. Anyone interested in participating but unable to attend in person may join the meeting online. Get additional information, including agenda and registration for the onsite and online meetings

Europe Workshop
Thursday, June 9; 3:00-5:00 p.m. CEST

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Automotive Product Emulator Group (PEG)   

·         Packaging & Component Substrates Technology Working Group (TWG)

·         Large Area, Flexible Electronics TWG

·         Interconnect PCB - Organic TWG

Get additional information, including agenda and registration.  

 

iNEMI Regional Roadmap Workshops

Asia Regional Workshop
Thursday, June 23; 8:00-10:00 a.m. CST (China)

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Board Assembly Technology Working Group (TWG)

·         Test, Inspection and Measurement TWG        

·         Final Assembly TWG 

·         PCB - Organic TWG   

·         Packaging & Component Substrates TWG      

·         Flexible Hybrid Electronics TWG       

Get additional information, including agenda and registration.

About the iNEMI Roadmap

iNEMI has been developing industry roadmaps for more than 20 years. Published biennially, the roadmap is recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.

The 2017 Roadmap plans to feature seven Product Emulator Group (PEG) chapters, which define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. There are also plans for 21 Technology Working Group (TWG) chapters, which cover technology and business/infrastructure areas.

iNEMI membership is not required to participate in roadmap development and, in fact, the more diversified the representatives working on the roadmap, the broader the reach and the more valuable the end product. Each edition is a global collaborative effort that involves individuals who are leading experts in their respective fields and represent all perspectives on the electronics manufacturing supply chain.

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  This industry-led consortium is made up of approximately 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.  For additional information about iNEMI, go to http://www.inemi.org  





FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Enabling Chemistry Further Validated with Global Technology Award, Expanded Licensing Agreements

FCT Assembly NanoSlic November 17, 2015 -- At last week's Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.

NanoSlic

Introduced to the electronics market in 2014, NanoSlic is a proprietary coating chemistry that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance.   FCT has developed not only the breakthrough chemistry, but also the equipment and coating process that provide a turnkey coating solution. Though used in multiple markets for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

"NanoSlic has quickly emerged as the most robust stencil coating technology for modern electronics assembly processes," says Brent Nolan, Vice President of FCT Assembly.  "As apertures become smaller - and area ratios more challenging - new techniques are necessary to accommodate the material deposition obstacles of miniaturization.  Because of its novel chemistry and its ability to coat both inside the aperture walls and the stencil underside, NanoSlic is enabling transfer efficiency improvements of as much as 40%, while reducing required understencil cleaning frequencies for cost savings and greater process stability.  It's gratifying to have the Global Technology Award judging panel recognize NanoSlic's market impact; we are grateful to Global SMT & Packaging magazine for sponsoring this contest."

The requirement for improved print performance for today's challenging device dimensions has accelerated the use of NanoSlic-coated stencils and this demand has initiated expansion of NanoSlic licensing worldwide.  There are currently three authorized NanoSlic licensees globally, and several more exploring opportunities with FCT.   Likewise, customers have discovered the unique capabilities of NanoSlic-coated stencils and have noted marked print process improvements.   

Harris Corporation Engineer, Nazeeh Chaudry, says the company has had striking results through the use of NanoSlic-coated stencils.  "Our yield on 15.7 mil (0.4 mm) pitch QFNs went to 100% just by changing to NanoSlic-coated stencils," he explains.  "Solder paste deposits have brick-like definition and are precise and repeatable on QFNs and other fine-pitch components."

 "The growth of NanoSlic has been incredible," comments Nolan in summary, "and this is just the tip of the iceberg.  While the coating chemistry is making a huge difference for PCB assembly processes, NanoSlic's applications extend far outside the confines of the electronics industry.  It's going to be an exciting journey."