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ZESTRON Releases New Virtual Tour on Website

[Manassas, VA – July 27, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that ZESTRON Americas has a new virtual tour on zestron.com.

 

“We invite customers and industry professionals to take a 360° tour of our state-of-the-art facility,” says Todd Scheerer, Executive Vice President. “As with any of ZESTRON’s seven facilities, our customers can visit and review cleaning equipment alternatives, conduct cleaning trials with the industries’ most innovative engineered cleaning products, and assess cleanliness results in real time.  Visitors can also tour our ZESTRON Academy training and global video conference centers.”

 

As part of ZESTRON’s continuous effort to provide integrated global support, customers can also tour the Technical Centers located in Germany, China and Malaysia as well.  To view our latest virtual tour, visit zestron.com.





Vision Engineering to Hold FREE Webinar Series on Conformal Coating Inspection & Coating Faults

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.
 
The series began on June 16th with Solder Joint Inspection & Process Defects. The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. 
 
During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions
 
The first two webinars are now available on-line and can be viewed at the following links:
 
Solder Joint Inspection & Process Defects
 
Counterfeit Component Inspection & Detection
 
 
Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.
For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





Kester Hosted Successful Advanced Selective Soldering Process Seminar

Kester_Logo_Black11.png Kester hosted an Advanced Selective Soldering Process Seminar, on June 28 at their Global Headquarters in Itasca, IL.

The seminar, which was attended by 30 people, covered topics on flux, cleaning, process and PCB design. Kester’s Global R&D Director, Bruno Tolla, and Technology Manager, Denis Jean, presented flux evaluation for selective soldering applications and no-clean flux reliability. Mike Bixenman from Kyzen, Joe Clure from Ersa and Dale Lee from Plexus also presented.

For more information, contact Michelle O’Brien at mobrien@kester.com.

 

 





UP Media Group Announces PCB West 2016 Exhibition Floor Sold Out

ATLANTA, GA – JULY 12, 2016 – The exhibition floor is sold out for PCB West, the largest conference  and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today. 

PCB West 2016 will be held September 13-15 in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center. 

Now in its 25th year, this year’s show will feature 110 booths, 16% more than the 2015 exhibition.  The event showcases the leading companies in the PCB industry, including all the top CAD and CAM vendors and top names in printed circuit fabrication and electronics assembly.

“This is the fifth straight year we have sold out all available booths,” said UPMG vice president of sales and marketing Frances Stewart. “We are truly looking forward to hosting another great event for the industry in September.”

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The September 2015 event attracted more than 1,900 attendees. 

PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.

For more information about PCB West, visit pcbwest.com or contact Show Manager Alyson Corey at 678-234-9859; acorey@upmediagroup.com. 

About UP Media Group Inc. 
UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FABTM (pcdandf.com) and CIRCUITS ASSEMBLYTM (circuitsassembly.com), as well as the PCB UPdateTM (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB WestTM (pcbwest.com). 





Industry 4.0: Reduce costs through component counting and interconnected technology

Logo_Block.jpg Especially electronics manufacturers in high wage countries face an enormous cost pressure from competitors based in low-wage countries. Time is literally money – therefore, it is more important than ever to automate processes continuously to increase efficiency and to keep the margin. To avoid production stops caused by inventory discrepancies, it is crucial to count the components on reels. To make the tedious counting process feasible VisiConsult replaces the time-consuming manual or optical approach by an innovative solution based on X-ray technology. This reduces the time required per reel from several minutes to less than 10 seconds. The XRHCount is a compact X-ray system to count all common SMD component types on tapes with a diameter of up to 400 mm.

An absolute innovation is the new Counting Cloud. New component types don’t have to be trained locally. Instead the uncountable reels can be directly submitted to the VisiConsult development team. Regularly every plant will receive an automatic update. The already very extensive database is continuously growing through the input of dozens of systems worldwide. This includes big sites such as Flextronics, with a reel volume of several thousand reels per day. Currently the counting accuracy is already above 99.9%, while no component database is required.

Another new feature is the seamless integration with common and specific IT infrastructure. This results in a further increase in speed and better process stability. The counting result can automatically be sent to MES or ERP systems, if desired. Renown systems, such as FUJI Trax, Cogiscan, SAP etc. incl. traceability support are already pre-implemented. For custom systems the XRHCount offers extensive open database interfaces. The target is that the XRHCount can be integrated into every system on the market.

More information: http://visiconsult.de/products/electronics/xrhcount/

System video: https://www.youtube.com/watch?v=r1T_X2PaibQ

 

System_loading.jpg





Seika Machinery Increases Its Technical Support

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that is has expanded its technical support offering. Now, the company has technical service centers at its Atlanta and San Francisco branches. 

The Atlanta branch provides support and repair for McDry dry storage cabinets as well as the Sawa portable ultrasonic stencil cleaners. At the San Francisco branch, Seika provides technical support and basic service including repair and calibration on the Malcomtech viscometers, paste mixers, wetting balance testers, profilers and other products. 

In-depth repairs are handled by the manufacturers for all products; however, many repairs can be handled by Seika Machinery. The company also has a 24-hour Technical Hotline that can be reached at: (888) 734-5278.

For more information, contact Michelle Ogihara at michelle@seikausa.com, or visitwww.seikausa.com.





Kester to Host Advanced Selective Soldering Process Seminar

Kester_Logo_Black10.png ITASCA, IL - June 21, 2016 Contact: Michelle O’Brien, Marketing & Communications Specialist

Kester is hosting an Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL.

The Advanced Selective Soldering Process Seminar will cover flux, cleaning, process and PCB design. Kester’s Global R&D Director, Bruno Tolla, and Technology Manager, Denis Jean, will present flux evaluation for selective soldering applications and no-clean flux reliability. Mike Bixenman from Kyzen, Joe Clure from Ersa and Dale Lee from Plexus will also be presenting.

For more information or to RSVP for the seminar, contact Michelle O’Brien at mobrien@kester.com.

### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

 

 





Cirtronics Hosted the Boston Chapter of Surface Mount Technology Association Tuesday, May 24th 2016

Milford, NH, May 25, 2016 - Cirtronics, an onshore manufacturer of boards, assemblies and electromechanical devices, is pleased to have hosted the SMTA Boston chapter meeting on Tuesday, May 24th, 2016. SMTA is an international organization supporting ongoing education and advancement of the electronics industry.
 
“We truly value our relationships with industry organizations such as SMTA”, says David Patterson, Chief Operating Officer of Cirtronics. “By working closely with the organizations that are central to specific areas of our business—like SMTA-- we are able to take an active role in discussions about best practices, in exploring industry trends, and assessing the technologies and skills and credentials we will need to remain on the leading edge of electronics manufacturing”.
 
Cirtronics Precision Engagement® Contract Manufacturing
Cirtronics has provided Electronics Manufacturing Services (EMS) since its founding in 1979. Since then, Cirtronics has grown well beyond boards to include assemblies and full product builds (box builds) for a wide range of customers and serves many different industries. One thing remains constant: Precision Engagement®. Dedication to customer-focused service, combined with purposeful, proactive communication is what Cirtronics’ Precision Engagement® is all about.
 
Again, David Patterson: “Board manufacturing has evolved over the years from through-hole to surface mount, and we have evolved our technology and the education of our employees to make sure we are meeting the needs of our customers”. Patterson continues, “Of course we maintain through-hole capabilities to serve existing customers and specialized projects that require through-hole technology to conform to project specifications. And, at the same time, we are continuing to expand our surface mount capacity through the purchase of additional manufacturing equipment to stay ahead of demand for surface mount manufacturing. EMS—as with all of our manufacturing-- requires precise attention to detail. Since each customer has different needs, our commitment to Precision Engagement® means we don’t force fit projects into pre-defined programs and processes. Instead, we tailor our services to support each customer’s goals and needs.”





Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB

Vision Engineering Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.

About-Bob-Willis-200px.jpg

The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.

The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





Hentec/RPS Introduces Next Generation Solderability Test Systems

web__hentecRPS_small.jpgSpokane Valley, Washington - Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of precision soldering automation equipment for electronics assembly and manufacturing, today announced the release of the latest generation of solderability test systems; The Photon Steam Aging System and Pulsar Solderability Test System.

Pulsar Image 1.png

The Photon Steam Aging System is designed to meet military and commercial high reliability specifications of J-STD-002 and other applicable standards for artificial aging of all electronic components and circuit boards. The systems are designed to accommodate all package styles including high density, discrete components, relays, transistors, capacitors, including SMT and axial components.

The Pulsar provides precise handling of electronic components for the automated process of flux and solder dip of component terminations according to the requirements of J-STD-002 and other applicable standards for the “Dip and Look” method. After the flux and solder process, an engineer inspects the terminations to verify proper wetting. If adequate, the component is thereby validated for authenticity and solderability with the selected solder alloy. The Pulsar can tin virtually any component from axial resistors to QFP’s and other leaded and leadless packages.

“The new solderability test systems are the evolution of products developed through 20+ years of process experience and expertise,” said Reid Henry, President of Hentec Industries, Inc. “We are always looking to improve our systems and offer our customers increased process control and durability. These systems do that.”

About Hentec Industries, Inc. Hentec Industries Inc. (formerly RPS Automation) is a manufacturer of automated selective soldering, lead tinning and component test equipment for electronics and component manufacturing, assembly and distribution. Hentec is celebrating over 20 years of automated soldering experience at more than 750 global installations. All products are designed and manufactured by RPS in the USA.

For more information please contact Reid Henry at 509 891-1680 or rhenry@rpsautomation.com





Ellsworth Adhesives to Display the Latest in Adhesive Technologies at Sensors Expo

GERMANTOWN, WI – June 1, 2016 – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at this year’s Sensor’s Expo at the McEnery Convention Center in San Jose, California June 22-23 in booth 1217.
 
This year at Sensors Expo, Ellsworth Adhesives is partnering with Moldman™ Systems, a manufacturer of low pressure injection molding machines. Moldman™ Systems will be showcasing one of their latest molding machines, the Mold-Man™ 1050. It’s a benchtop machine with a one ton clamping force and the ability to overmold, encapsulate, protect and seal electronics and cables easily and on demand. Ellsworth Adhesives will also be showcasing TECHNOMELT AS 8998 from Henkel. It’s a hot melt adhesive that brings a new and efficient approach to temporary masking for conformal coating processes. TECHNOMELT AS 8998 is compatible with automated dispensing systems and releases cleanly from various substrates.
 
For over 30 years, Sensors Expo and Conference is North America’s premier event focused exclusively on sensors and sensor-integrated systems. This event has multiple educational opportunities including five symposiums, two Keynote presentations and over 65 technical conferences covering topics like Energy Harvesting, IoT, Wireless and MEMs innovation.
 
Ellsworth Adhesives aims to fulfill specialty chemical needs, from initial technical advice through customized product fulfillment. They strive to help their customers achieve maximum productivity with lower total cost in their manufacturing processes by offering valued services and solutions, and delivering quality products from world-class suppliers. Jay Richardson, Director of Sales at Ellsworth Adhesives, commented, “We are very excited to be exhibiting at Sensors Expo. Our Engineering Sales Representatives are ready to answer any questions on projects and applications that require adhesives or specialty chemicals. We invite you to bring in parts, diagrams or sketches on napkins and we’ll help you find the best solution.”
 
Ellsworth Adhesives understands and appreciates the role they play as an adhesive and specialty chemical supplier. The Glue Doctor®, a registered trademark of Ellsworth Adhesives, represents the technical expertise and unique capabilities of more than 50 Engineering Sales Representatives in North America, and more than 150 Engineering Sales Representatives globally, who specialize in working with customers on engineered assembly processes and implementing adhesive solutions in the manufacturing environment.
 
For more information on Ellsworth Adhesives, visit www.ellsworth.com or call 1.800.888.0698.





iNEMI Schedules Regional Roadmap Workshops in North America, Europe and Asia

Industry invited to take “first look” and provide input on regional issues

HERNDON, VIRGINIA (May 24, 2016) — The International Electronics Manufacturing Initiative (iNEMI) will hold three regional workshops to review progress on its 2017 Roadmap. These meetings will give the electronics industry a “first look” at the 2017 Roadmap and provide the opportunity for input to ensure that regional concerns are included in the final roadmap.

Participation in the workshops is free, but advance registration is required. See details of each workshop below.

North America Workshop
Tuesday, May 31; 7:45 a.m. - 5:30 p.m. Pacific Daylight Time (US)
(face-to-face meeting held in conjunction with ECTC 2016; also accessible via webinar)

This all-day workshop, held at The Cosmopolitan Hotel of Las Vegas (also the site of ECTC), will include reports from all 21 of the Technology Working Group (TWG) chapters. Anyone interested in participating but unable to attend in person may join the meeting online. Get additional information, including agenda and registration for the onsite and online meetings

Europe Workshop
Thursday, June 9; 3:00-5:00 p.m. CEST

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Automotive Product Emulator Group (PEG)   

·         Packaging & Component Substrates Technology Working Group (TWG)

·         Large Area, Flexible Electronics TWG

·         Interconnect PCB - Organic TWG

Get additional information, including agenda and registration.  

 

iNEMI Regional Roadmap Workshops

Asia Regional Workshop
Thursday, June 23; 8:00-10:00 a.m. CST (China)

The two-hour webinar will review select roadmap chapters. The preliminary agenda includes:

·         Board Assembly Technology Working Group (TWG)

·         Test, Inspection and Measurement TWG        

·         Final Assembly TWG 

·         PCB - Organic TWG   

·         Packaging & Component Substrates TWG      

·         Flexible Hybrid Electronics TWG       

Get additional information, including agenda and registration.

About the iNEMI Roadmap

iNEMI has been developing industry roadmaps for more than 20 years. Published biennially, the roadmap is recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.

The 2017 Roadmap plans to feature seven Product Emulator Group (PEG) chapters, which define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. There are also plans for 21 Technology Working Group (TWG) chapters, which cover technology and business/infrastructure areas.

iNEMI membership is not required to participate in roadmap development and, in fact, the more diversified the representatives working on the roadmap, the broader the reach and the more valuable the end product. Each edition is a global collaborative effort that involves individuals who are leading experts in their respective fields and represent all perspectives on the electronics manufacturing supply chain.

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  This industry-led consortium is made up of approximately 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.  For additional information about iNEMI, go to http://www.inemi.org  





Thin film work is poster child for getting research and development to industry

ALBUQUERQUE, N.M. - Sandia National Laboratories researcher Paul Vianco sees his work on thin films as a poster child for the way research and development based on nuclear weapons work can boost U.S. industry.

Since the 1970s, laboratories researchers have taken studies originally performed to support the weapons program and published or presented parts of the work at technical conferences. Vianco calls that passive tech transfer.

“Engineers would just fill rooms. They wanted to hear what we were doing, not only because our research represented the ‘latest-and-greatest,’ but more so because it was applied technology,” he said. “This was information that folks ate up because they could take it back to their companies and put it directly to use on their products.”

Vianco recently won the Surface Mount Technology Association’s 2015 Best of Proceedings award for the paper: “Establishing a Ti-Cu-Pt-Au Thin Film on Low Temperature Co-Fired Ceramic Technology for High-Temperature Electronics.” Co-authors were Jerome Rejent, Alice Kilgo, Bonnie McKenzie and Amy Allen of Sandia; recent Sandia retiree Mark Grazier; and William Price of the Kansas City National Security Campus (KCNSC) and Esteban Guerrero, now retired from KCNSC. The winners of the Best Papers awards will be honored Sept. 27 at the association’s conference in Rosemont, Illinois. Vianco also won the Best of Proceedings paper in 2012.

Sandia National Laboratories researcher Paul Vianco works on thin films

Sandia National Laboratories researcher Paul Vianco works on thin films, nanometer-thick layers of metal that can be defined into precision electrical circuits. He won the Surface Mount Technology Association’s 2015 Best of Proceedings award and will be honored with other winners at the association’s meeting in September. (Photo by Randy Montoya) 

Thin films are nanometer-thick layers of metal that can be defined into precision electrical circuits similar to traditional printed circuit boards. Instead of a laminated or built-up copper conductor circuit, a thin film is patterned into a circuit through photolithography techniques. The benefit is miniaturization with finer lines and spaces, so the electronic component can be made smaller and do more at the same time.

“Smaller components weigh less and use less power,” said Vianco, who works in Sandia’s metallurgy and materials joining group. “We reduce what industry refers to as ‘SWaP,’ or size, weight and power.”

Data could be used to further develop components

Sandia’s paper provides the electronics industry with data that can be used to further develop thin film-on-low temperature co-fired ceramic (LTCC) components — called hybrid microcircuits — for high-temperature electronics. Vianco envisions a new generation of such LTCC components that will combine miniaturization, functionality and the ability to withstand harsh environments, and which are fabricated by commonly used photolithography processes.

“The solder interconnection reliability data will enable use of these products in applications that include down-hole oil and gas exploration as well as renewable energy development,” Vianco said. Such hybrid microcircuits also have significant potential for sensors and communications electronics in space probes, he said.

Sandia has been collaborating with the Kansas City National Security Campus since its breakthrough development of LTCC technology on thin film a few years ago. The research was funded by the nuclear weapons life extension program at Sandia as well as Sandia’s and KCNSC’s Enhanced Surveillance Campaigns, which support stockpile stewardship. KCNSC built the LTCC and deposited the thin films, while Sandia developed and implemented test procedures and used its advanced microanalysis capabilities for failure mode analyses.

Vianco praised the collaboration.

“It’s really a case where we took the application, understood what information was needed to ensure producibility and reliability of the solder interconnections and developed a test in collaboration with our KCNSC partners. The result was strength and failure analysis information that significantly enhanced the ability of Sandia to design new components and of KCNSC to fabricate them into high-reliability products,” he said. “We’ve sort of come full circle: We identified the need, developed an experiment and obtained test data that supported the application. Publishing the results made the data available to the U.S. electronics industry.”

Work offers electronics industry new applied technology

The award-winning study evaluated the mechanical properties of solder joints made to a thin film conductor pattern deposited on the surface of an LTCC substrate. Co-fired means individual layers, stacked on one another, are fired together at high temperatures to create the internal, multilayer circuitry and interconnections that are hallmark LTCC technology. Vianco and colleagues developed a standard method to assess solder joint strength on the advanced thin film circuits. The approach provides a way to define assembly processes and determine the long-term reliability of solder interconnections for critical, high-frequency components.

“Thin film conductors are not a new circuit technology, but they are still in relative infancy within the high-reliability electronics industry,” Vianco said. “A lot of hybrid microcircuits still rely upon the old thick film conductor technology, which uses screen or stencil printing to define the electrical circuit. We’ve used it for years on high-frequency components. But it’s limited in terms of achieving better SWaP for those products because we can’t miniaturize it very much more than we’ve already done.”

The electronics industry wants to improve product performance, but often hasn’t fully appreciated the intricacies of interconnections-plus-thin films as a materials system, he said. “It’s been kind of a mystery in terms of how solder joints made to thin film conductors stay attached to the LTCC substrate, but I think they now see that what we’re doing is valuable in furthering this technology. For those who never thought of using thin film-on-LTCC, those folks are saying, ‘Maybe now we do know enough about this technology to try it on our products.’”


Sandia National Laboratories is a multi-program laboratory operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corp., for the U.S. Department of Energy’s National Nuclear Security Administration. With main facilities in Albuquerque, N.M., and Livermore, Calif., Sandia has major R&D responsibilities in national security, energy and environmental technologies and economic competitiveness.





Jabil Recognized for Use of Real-Time Visibility, Actionable Analytics and Unique Visualization

ST. PETERSBURG, Fla. – May 17, 2016 – Jabil Circuit, Inc. (NYSE: JBL) today announced that Gartner has named the Jabil InControl™ supply chain visualization and analytics platform a winner in its “Supply Chainnovator” awards during the Annual Gartner Supply Chain Executive Conference. Jabil garnered the top spot in Gartner’s high-tech manufacturing category for driving the transformation of its global digital supply chain through the use of unconventional, innovative and high-impact approaches.

The Jabil InControl™ platform was built from the ground up to deliver real-time visibility and actionable insights over the company’s massive global supply chain, which encompasses 17,000 suppliers, 700,000 part numbers and 102 manufacturing plants in 28 countries. The platform features predictive modeling and proprietary mobile visualization to improve cross-functional collaboration while making it easier to quickly identify and take action to address areas of supply chain concern, risk and opportunity. As a result, Jabil has reduced inventory by more than $300 million over several years while elevating customer service levels by more than 20 percent.

“The Jabil InControl™ platform provides the supply chain ecosystem and its customers worldwide with unique and holistic views of the complex material flow from raw material manufacturers to the delivery of end products,” said Virginia Howard, research director, Gartner Supply Chain Research. “As an early adopter of innovative supply chain visibility tools and intelligent analytics, Jabil is making major strides in optimizing its working capital while automating supply chain decision making.”

Jabil customers, including many of the world’s biggest brands and leading high-tech manufacturers, benefit from the company’s ability to elevate collaborative decision-making and proactively protect against supply chain disruption. Moreover, the Jabil InControl™ platform gives customers the ability to optimize use of Jabil’s massive manufacturing and distribution footprint to minimize total landed product costs.

“Mass globalization, shortening product lifecycles, disruptive competition, challenging economic conditions and geopolitical threats make it very difficult to rely on traditional supply chain practices,” said Don Hnatyshin, senior vice president and chief supply chain and procurement officer at Jabil. “We’re thrilled that Gartner has recognized our efforts to push the envelope in maximizing Jabil’s intelligent digital supply chain with the Jabil InControl™ platform.”

The Jabil InControl™ platform was chosen from a field of more than 15 competing supply chain solutions. Jabil plans to expand the platform to leverage machine learning, cognitive analysis and complex event processing in support of the driverless, piloted supply chain of the future. 





SHENMAO Presents Technical Paper at SMTA/ICSR Conference

SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Laser soldering method becomes attractive in the packaging and assembly of surface-mounted devices and microelectronics. The method transfers laser energy for reflow process with a non-contact procedure and determines the soldering location precisely. It is critical to consider formulated solder paste due to the amount of heat absorbed by flux and alloys when applying the method to reliable joints. A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering SMD components on circuit boards with minimal flux residue and no splash or solder balling issues. Cross-sectional studies showed the reduction of intermetallic formation in well-formed solder joints. In addition, the joints have high shear strength due to lower thermal stress during the process. This new solder paste was proved to be suitable for repair of electronic components and manufacturing electronic parts that cannot be soldered in a conventional reflow oven.

SMTA International Conference of Soldering and Reliability
Date: May 9 -11, 2016 Click: http://www.smta.org/icsr/register_now.cfm
Venue: Hilton Toronto/Markham Suites Conference Centre,
8500 Warden Avenue, Markham, ON, L6G 1A5, Canada 1-905-470-8500
Presentation: Tuesday, May 10 – Technical Program / 4:15 PM to 4:45 PM
Topic: A New Dispensing Solder Paste for Laser Soldering Technology
Speaker: Watson Tseng, General Manager, SHENMAO America, Inc., San Jose, CA 95131

Co-Authors: Hsiang-Chuan Chen, Jen-Yio Shiu, Chang-Meng Wang, Roderick Chen, Watson Tseng

Speaker Biography
For the last 3 years, Watson Tseng is the General Manager of Shenmao America, Inc. He worked in the Shenmao Micro Material Institute for 6 years as a group leader in charge of solder paste development and set up and ran European Operations for 5 years. He has 14 years of experience in failure analysis of SMT and packaging applications. Watson received his M.S. in Chemical Engineering from National Taiwan University, Taiwan.





ZESTRON Announces REStronics Northern California as New Sales Representative

 

Manassas, VA – May 3, 2016 ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that REStronics Northern California is now representing its complete line of cleaning process solutions and services within Northern California and Northern Nevada.

 

REStronics Northern California assists customers with best practices, process improvement and information on the latest technology in the electronics manufacturing market place. Their philosophy of working closely with engineering personnel, assisting in overcoming production problems and helping to improve process efficiencies has proven to be an excellent mission.

 

“By adding ZESTRON’s innovative cleaning agents and services to its line of products, REStronics Northern California demonstrates its commitment to represent the latest technologies from worldwide leading suppliers to the electronics and semiconductor manufacturing industries,” says Eric Strating, Director of Sales, ZESTRON Americas.  “Coupled with ZESTRON’s application technology engineers and R&D support, REStronics Northern California will broaden our sales coverage and improve our service and distribution support to our ever growing customer base.”

 

To learn more about ZESTRON’s cleaning process solutions, services and learning opportunities through ZESTRON Academy, please visit www.zestron.com.





FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Enabling Chemistry Further Validated with Global Technology Award, Expanded Licensing Agreements

FCT Assembly NanoSlic November 17, 2015 -- At last week's Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.

NanoSlic

Introduced to the electronics market in 2014, NanoSlic is a proprietary coating chemistry that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance.   FCT has developed not only the breakthrough chemistry, but also the equipment and coating process that provide a turnkey coating solution. Though used in multiple markets for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

"NanoSlic has quickly emerged as the most robust stencil coating technology for modern electronics assembly processes," says Brent Nolan, Vice President of FCT Assembly.  "As apertures become smaller - and area ratios more challenging - new techniques are necessary to accommodate the material deposition obstacles of miniaturization.  Because of its novel chemistry and its ability to coat both inside the aperture walls and the stencil underside, NanoSlic is enabling transfer efficiency improvements of as much as 40%, while reducing required understencil cleaning frequencies for cost savings and greater process stability.  It's gratifying to have the Global Technology Award judging panel recognize NanoSlic's market impact; we are grateful to Global SMT & Packaging magazine for sponsoring this contest."

The requirement for improved print performance for today's challenging device dimensions has accelerated the use of NanoSlic-coated stencils and this demand has initiated expansion of NanoSlic licensing worldwide.  There are currently three authorized NanoSlic licensees globally, and several more exploring opportunities with FCT.   Likewise, customers have discovered the unique capabilities of NanoSlic-coated stencils and have noted marked print process improvements.   

Harris Corporation Engineer, Nazeeh Chaudry, says the company has had striking results through the use of NanoSlic-coated stencils.  "Our yield on 15.7 mil (0.4 mm) pitch QFNs went to 100% just by changing to NanoSlic-coated stencils," he explains.  "Solder paste deposits have brick-like definition and are precise and repeatable on QFNs and other fine-pitch components."

 "The growth of NanoSlic has been incredible," comments Nolan in summary, "and this is just the tip of the iceberg.  While the coating chemistry is making a huge difference for PCB assembly processes, NanoSlic's applications extend far outside the confines of the electronics industry.  It's going to be an exciting journey."