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Umut Tosun, ZESTRON, to Present at SMTA International 2015

Manassas, VA – September 22, 2015 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON Americas, will present “Impact of Multiple Thermal Cycles on the Cleaning Process” at SMTA International 2015.
Printed circuit board manufacturing is a highly complex process and incorporates numerous steps. The soldering process is critical and may include reflow oven and/or wave solder equipment as well as a baking process. PCBs may be single or double-sided in which case multiple thermal cycles are required. There are many opportunities to clean PCBs following a soldering process, either from single, dual or dual and baked thermal cycles. This study was conducted to assess the effects of numerous thermal cycles on the PCB cleaning process. Solder pastes considered included RMA, No Clean and Water Soluble (OA), both leaded and lead-free.
SMTA International 2015 will be held at the Donald Stephens Convention Center in Rosemont, IL from September 29 to September 30. Mr. Tosun will present during the “Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies” session on September 30, at 8:00 AM.  For more information on our process solutions, services and learning opportunities, please visit booth #616.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide Technical Centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit

Gold Circuit Electronics, Ltd. Awarded 2015 Excellence in Technology Alignment by Cisco

Santa Clara, CA – September 9th, 2015 – Gold Circuit Electronics, Ltd (GCE), “Award Winning Advanced Technology, Value Engineered PCB Solutions since 1978- Your Trusted Quality Partner”, today announced that it has received the 2015 Excellence in Technology Alignment award from Cisco®. This prestigious award recognizes GCE for successfully demonstrating leadership and commitment to continuously develop and accelerate leading-edge technologies closely aligned with Cisco product requirements. The distinction was awarded during Cisco's 24th Annual Supplier Appreciation Event, held September 9 at the Santa Clara Convention Center in California. “Our Supplier Appreciation Awards highlight exceptional performances by the very best of our extended supply chain, and gives us the opportunity to recognize all of our trusted partners’ hard work and dedication,” said Gary Cooper, vice president, Global Supplier Management, Cisco. “Our theme this year, ‘Embrace the Pace: Transforming Tomorrow Together’, emphasizes the criticality of flexibility, collaboration and accelerated innovation—all qualities shared by this year’s award recipients.” Cisco presented awards to suppliers in recognition of their contributions to Cisco’s success in fiscal year 2015. At the event, Cisco recognized the dedication and successes of its strategic suppliers and manufacturing partners—a testament to the company’s commitment to close partnership with its supply network to drive industry leadership, accelerated innovation and enhanced customer experience. Gold Circuit Electronics Ltd. is a world leader in the manufacture of advanced technology printed circuit boards of the highest quality and extraordinary customer service. Additional information about GCE can be found at Cisco and the Cisco logo are trademarks or registered trademarks of Cisco and/or its affiliates in the U.S. and other countries. Peter Rogal CEO Gold Circuit Electronics GSS 978-270-8830


Hallmark Circuits Inc. renamed SOMACIS Inc.

We are excited to announce that Hallmark Circuits, Inc., established in 1970, a wholly owned subsidiary of SOMACIS SpA, founded in 1972 in Castelfidardo (AN), Italy, has changed its name into SOMACIS Inc.
After the acquisition in 2012, SOMACIS has invested into equipment, facility and, most important, in additional skilled personnel, in order to expand the capabilities and capacity for the increasing customer requirements. The advanced technology plant in Poway is now fully integrated into the SOMACIS group, which comprises three other production plants in Italy and China. Through a single point of contact, SOMACIS’ customers have access to a global operating company and one of the leading high-tech PCB manufacturers.

SOMACIS Receives Nadcap Merit Status for 24 Months

Once again Nadcap recognizes SOMACIS for its superior performance and commitment to continual improvement in aerospace quality.
SOMACIS announces that once more it has been awarded Nadcap Merit status for Electronics at its Italian facilities, covering rigid and HDI PCBs.

The very first European PCB manufacturer to achieve the Nadcap accreditation, SOMACIS has held the accreditation since 2005.

Having demonstrated ongoing commitment to quality by satisfying customer requirements and industry specifications, the Nadcap Task Group has determined that SOMACIS has earned special recognition. This means that, instead of having their next Nadcap audit in twelve months, SOMACIS has been granted an accreditation that lasts until 2017.

SHENMAO Introduces BGA and Micro BGA Solder Spheres

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations. 
SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test. 
As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

SHENMAO To Give Talk on Void Formation September 24, 2015

IEEE Component, Packaging and Manufacturing Technology Society, Silicon Valley Chapter

Subject: “Void Formation during Soldering” presented by Watson Tseng, General Manager 

Register for the Lunch event:

CPMT Chapter Lunch Meeting
Void Formation during Soldering [more] 
    -- Watson Tseng, General Manager, Shenmao America Inc. 
    -- Thursday, September 24, 2015 
    -- 11:30 AM - 1:30 PM at the TI Auditorium, Santa Clara 

Summary: Understanding the formation of voids in solder joints is important for predicting the long-term reliability of solder interconnects. With decreasing joint sizes, voiding in solder is a leading cause of early failures, such as fatigue and low drop test resistance. The formation of voids in soldering processes including SMT assembly and advanced fine pitch flip chip packaging will be presented. Root causes contributing to void formation are identified and classified. An in-situ observation during reflow is used to reveal the formation mechanism. Materials and process solutions to prevent void formation are suggested in this talk. 
Full information, and to register:

SHENMAO, the World’s Major Solder Materials Provider, produces SMT Solder Paste, Low Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, Semiconductor Packaging Solder Spheres, Liquid/Paste Flux and PV Ribbon.

Aven Micro Lens System with Coaxial Illuminator Is Ideal for Shiny Surfaces

ANN ARBOR, MI – Sept. 10, 2015 – Inspection and imaging of reflective surfaces present challenges that are overcome with Aven’s new Micro Lens System.

This microscope accessory has LED coaxial illumination to reduce glare and provide flat, even lighting without shadows across the full area of electronic components, metal parts, biological specimens or other shiny surfaces. 

“The Micro Lens System is ideal for examining wafers, polished parts and fluids," says Michael Shahpurwala, president of Aven, a global optical equipment supplier. “Its high-contrast lighting displays colors vividly and allows crisp imaging.”

The system also includes a 1x C-mount coupler, 1x objective lens and the LED illuminator with intensity control. Seven detents that let users calibrate the lens for repeated measurements.

Magnification zooms up to 4x with the included parfocal lens, or more with an auxiliary lens. Field of view is 6 mm by 8 mm at low magnification (0.6x) and 0.8 mm by 1.2 mm at high magnification.

Applications include semiconductor quality checks, electronic product inspection, materials analysis and lab microscopy.              

Opportunities for creating a custom system include two CCD lens couplers, a 2x objective lens, adapter plate, two focus mounts, seven stands and four camera models. Different illuminators, such as ring lights and a fiber-optic backlight, also are available.                  

For more information, contact Aven at (734) 973-0099 or 

Visit Aven at Booth 10 during the SMTA International exhibition Sept. 29-30 at the Donald Stephens Convention Center in Rosemont, IL. 
Aven, Inc. manufactures and distributes high-performance precision tools and optical systems for industrial, scientific, medical and education applications. More than 800 products include stereo zoom microscopes, video inspection systems, digital portable scopes, illuminated pocket scopes, magnifying lamps, LED task lights, test and measurement instruments, CMOS and CCD cameras, other microscope accessories and premium hand tools, including stainless steel models. 
An electronics innovator since 1983, Aven is located in a high-tech corridor of Southeast Michigan.   

FCT Assembly to Showcase Comprehensive Product Line and have Major Presence at SMTA International

FCT CompaniesFCT Assembly, well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015, as well as take part in the conference program and live process demonstrations on the show floor.

From booth # 313 over September 29 and 30, the FCT exhibit will play host to the company’s stencil products, solder materials and NanoSlic™ stencil coatings. At its foundation, the company is a chemistry formulation expert and this know-how has informed the development of some major industry breakthroughs, which show delegates are invited to discuss with the FCT team.

A major highlight of the FCT exhibit is its market-leading stencil coating, NanoSlic. The revolutionary product has quickly emerged as the premiere coating technology for improved solder paste transfer efficiency, reduced underscreen cleaning requirements and overall printing yield improvements. Visitors can learn more about NanoSlic’s process advantages and also see a NanoSlic-coated Fine Line stencil in action at the “Inspection Experience”, where live printing and inspection of ultra-fine pitch deposits will take place throughout the two days of the SMTA International exhibit. Located at the show floor entrance, the Inspection Experience’s goal is to guide attendees through the printing, reflow and inspection processes and analyze common print and reflow challenges.


In addition to its show floor presence, FCT will also participate in the event’s conference program, during which findings from its latest development project -- a new flux formulation – will be shared. Tony Lentz, FCT Assembly Field Application Engineer, will present a paper entitled “Formulation of a New Liquid Flux for High Temperature Soldering” as part of the “The How's and Why's of Fluxes in Electronics Assembly” session set to take place on September 29th from 4:00 to 5:30 p.m. The paper underscores the need for fluxes that can accommodate thermally demanding applications where long contact times and soldering temperatures of up to 290°C are the norm, allowing for good hole fill and minimizing bridging and other defects.

For more information or to schedule an appointment, send an e-mail to

SHENMAO Introduces PF606-P26 Halogen Free No Clean Solder Paste

SHENMAO PF606-P26 No-Clean / Zero Halogen Solder Paste are made locally in the USA and with the same quality in 7 other world wide locations. It is said to prevent BGA Non-Wet Opens and Head on Pillow defects if there is oxidation on BGA Balls or PCB Pads. In case BGA components are warped, PF606-P26 thru excellent printability, wetting and solder ability can create highly reliable Solder Joints that greatly reduce their failure rate. 

A Major Chipset Producer is recommending the use of SHENMAO PF606-P26 Solder Paste to achieve ultimately reliable connections to the PCB.
As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.
SHENMAO America, Inc.
Tel: 408-943-1755

Kester Products Pass Bono Tests


ITASCA, IL - August 26, 2015  - Kester is proud to announce three products, NP505-HR, NF372-TB and 985M, passed Bono Testing. Third party laboratory testing certified that all products passed the Bono test criteria with corrosion factor (Fc) values of less than 2.0%, indicating no corrosion in the residues.

Kester 985M has been Kester’s top selling no-clean flux for several years. NP505-HR is a new zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NF372-TB is a new zero-halogen, no-clean, low solids liquid flux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies. “These two new products were each designed to meet the industry’s increased demand for high reliability in demanding applications, and passing the Bono test is another positive endorsement for our innovative portfolio,” stated Dr. Bruno Tolla, Kester’s Global R&D Director.

In the Bono test, the resistance measurements are used to calculate the corrosion factor (Fc) that is given as a percentage. While SIR and ECM tests are recognized by IPC as a way to evaluate paste or flux residue corrosiveness after reflow, the Bono test was developed and implemented in some French companies as an extra qualification criteria. The Bono test also quantifies the corrosion, unlike current SIR or ECM tests. In addition to characterizing solder paste residues, the Bono test can be performed for wave soldering fluxes, repair fluxes, and tacky fluxes using the same method and same board.

For more information on these products, please visit our website or contact your Kester representative.

### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

Ellsworth Adhesives Partners with Henkel Loctite to Sponsor Medical Webcast

GERMANTOWN, WI – August, 2015 – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be partnering with Henkel Loctite to sponsor a live webcast called “Replacing PVC in the Medical Disposable Manufacturing Market”.

The event will be held on Wednesday, September 16, 2015 at 10:00 a.m. Central Daylight Time.  This one-hour webinar event will highlight advancements in the use of PVC alternatives in the design and manufacture of disposable medical devices and introduce adhesive developmental achievements in this area. 

“We’re looking forward to this exciting event. It’s a great opportunity for medical device manufacturers to learn about the latest global regulatory concerns around additives in polymers, and the alternatives to use in the design and assembly of medical devices” commented Roger Lee, Vice President and General Manager of Ellsworth Adhesives North America.

For additional information regarding the upcoming webinar visit Ellsworth Adhesives’ website at

To register for this event click: Medical Webcast

Ellsworth Adhesives Now Supplies the Latest in Reflective Optical Coatings

GERMANTOWN, WI – August 7, 2015 – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they now supply CI-2001 from Dow Corning®, a silicone white reflective conformal coating used in the manufacturing of LED lamps and lighting assemblies.

CI-2001 is a highly reflective optical coating that enhances light output and efficiency in lighting applications with good resistance to the environment. Besides its highly reflective properties and resistance to aging and UV light, CI-2001 has many other characteristics that differentiate it from other reflective materials. Its low viscosity (1500 cP) enhances flow and fills in narrow gaps and spaces, plus it can be applied on a large variety of substrates, such as polycarbonate, aluminum and PMMA. It cures at room temperature to a tough, resilient non-tacky surface.

“CI-2001 is a great addition to our specialty chemical product line for LED assembly,” stated Roger Lee, Vice President and General Manager of Ellsworth Adhesives – North America. “It has some great features that can help transform how lighting is designed and assembled.”

The reflective coating has potential in multiple lighting applications including, but not limited to lightboxes, laser cavities, remote sensing, back panel and back lighting assemblies, digital imaging, and coatings on printed circuit boards. CI-2001 is UL 94V0 recognized. 

For more information on Ellsworth Adhesives or Dow Corning’s CI-2001, visit or call 1.800.888.0698.

LPKF: Weak LDS business puts strain on performance in first half-year

Tualatin, Ore. August 2015 – Garbsen-based laser specialist LPKF today announced that the persistent weakness of its LDS business put a strain on its performance in the first half of the year. At EUR 42.4 million, consolidated revenue for the first six months was down 7% from the previous year’s level. Due to lower revenue figures, a shift in the product mix and a slight rise in costs, EBIT was negative in the first half-year, amounting to EUR -3.2 million. Incoming orders were down significantly from the prior-year period due mainly to weak order intake in the LDS business and a major solar contract posted in the previous year.

· Taken together, all other product groups are developing in line with expectations
· Development of new technologies is being pursued with great intensity

Revenue in the Electronics Development Equipment and Other Production Equipment segments developed favorably. Recording revenue growth of 5.1%, the business with rapid prototyping systems continued its positive trend of previous years. Together, the Solar and Welding Equipment product groups were able to boost revenue in the Other Production Equipment segment by 25%.

LPKF is working flat out on developing completely new technologies and expects these products to start contributing to revenue from 2016. Demand for LDS systems is also expected to pick up again in the medium term. LPKF believes that a key factor in this context will be entirely new antenna technologies such as MIMO (Multiple Input Multiple Output), which comprises multiple very fine antenna structures capable of transmitting greater amounts of data at considerably faster rates.

The Company’s CEO, Dr. Ingo Bretthauer, therefore sees good reason to be optimistic about the future: “Our markets and our business model are intact. Our main growth driver, the miniaturization of electronic components, is in full swing and requires lasers with greater precision than ever before.”

Maintaining profitability and returning to our growth path are now the Management Board’s most important objectives. Therefore, internally all signs are currently pointing towards saving, streamlining and focusing on core activities. Numerous initiatives are already underway that will lower costs in 2015 and reduce the break-even point to below EUR 100 million in revenue. According to the new guidance published in early July, LPKF aims to generate revenue of EUR 90 to 110 million in 2015.

Despite the current weakness of the LDS business, the Management Board anticipates profitable growth again in the coming years. The forecast for 2016 and subsequent years is being reviewed at present and will be published on November 11 together with the quarterly financial report.

The full half yearly report is available in German at
and in English at

DfR Solutions Releases Sherlock 4.1, Automatically Converts SRS to PSD Curve

Improves visibility into failure risk for aerospace, avionics, military and other critical reliability environments.
Beltsville, MD – August 5, 2015 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the release of the newest version of Sherlock Automated Design Analysis™ software, version 4.1.  This version of Sherlock now translates Shock Response Spectrum (SRS) Analysis into Power Spectral Density (PSD) Curves. The real value to users is the ability to predict random vibration events of electronic hardware more precisely than any tool currently available on the market. Additional enhancements in this version of Sherlock include an updated package manager, improved analysis capabilities, and a modified user interface.
Developed over 80 years ago, shock response spectrum (SRS) is used as an approximation of shock loads (explosion, seismic, launch, landings, etc.) early in the product development process. While SRS has now become the default technique for evaluating large structures in severe environments (like rockets, tanks, and airplanes), it is inadequate in capturing the risk of electronics within these same applications. Sherlock version 4.1automatically converts SRS into much more relevant Power Spectral Density (PSD) Curves. Through an understanding of the likely range of nodal responses, Sherlock allows users to incorporate SRS into the already powerful simulation and modeling capabilities within Sherlock.  Failure risks can be more accurately predicted and Sherlock users can now introduce potential mitigations at the board, box or system level much earlier in the new product development process. 
Additionally, the updated Package Manager now allows for users to create new packages or copy existing packages. Previous versions of the package manager only allowed for properties of existing packages to be modified.  Other updates include improved part validation analysis, life prediction charts, and thermal event analysis.
“Repeated shock is a major concern in many high-risk environments like aerospace, avionics and defense,” stated DfR Solutions CEO Craig Hillman.  “Electronics in these conditions are subject to extreme levels of shock, unlike any other industry. Traditionally, SRS calculations have flowed down from very large structures (such as the rocket tube) to perform to assess this risk,” said Hillman.  ‘But those SRS calculations are a gross approximation and do not take into account the specific mechanical response of the electronics to shock.  This enhancement to Sherlock incorporates our deep knowledge of electronics and provides the designer, manufacturer, and system-integrator with the tools to gain deeper visibility into their risk of failure under real world conditions,” said Hillman.
About Sherlock Automated Design Analysis™ Software
Sherlock is the first-of-its-kind Automated Design Analysis software for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. It is used by the electronics industry across all markets. Sherlock continues to evolve, incorporating new innovations and enhancements allowing users to manage increasingly complex analyses faster and more efficiently than ever before.
About DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit

Discover Viscom's New 3D AOI Unit Designed for Production and Quality at SMTAI

Duluth, GA, August 2015 - Viscom announced today that it will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Viscom’s applications experts will present the company’s new 3D AOI and CCI systems. 

Viscom 3D AOI System
The new S3088 ultra 3D AOI satisfies both production and quality engineers. For the Production Department, the S3088 ultra with the revolutionary vVision interface provides fast, intuitive program generation and the highest inspection speed utilizing the Viscom XM camera module. For the Quality Department, the S3088 ultra provides accurate and reliable inspection down to 03015 and complete fault coverage using nine views plus 3D, offering height measurement of components up to 25 mm height.
Viscom COnformal Coating Inspection SystemConformal Coating Inspection - CCI
The Viscom S3088 Conformal Coating Inspection (CCI) system inspects coatings quickly and reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impurities or splashes. The Viscom S3088 CCI system features an 8M camera module equipped with UV LEDs that reveal visible light emitted by UV fluorescent indicators contained in the transparent protective coating. The S3088 CCI system is now also available with optional angular camera inspection.
For more information, stop by booth #506 at SMTA International or visit 

KYZEN to Celebrate 25 Years of Providing Cleaning Chemistries at SMTAI

NASHVILLE, TN, USA August 24, 2015 - KYZEN announces that it will exhibit in Booth #117 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The KYZEN team will showcase its AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry and celebrate its 25-year anniversary.
Kyzen Cleaning Chemistry
KYZEN has been the innovative pioneer for award-winning, environmentally responsible precision cleaning technologies for electronics, advanced packaging and metal finishing applications since 1990. This year, KYZEN celebrates 25 years and 50 awards for consistently connecting leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
AQUANOX® A4708 rapidly cleans under densely populated, low-gap PCB assemblies and is effective on all flux types, including no-clean and water soluble residues. A4708 is specifically formulated for enhanced metal compatibility and is safe for delicate gold and aluminum bonding pads. The specialized pH chemistry provides bright solder joints, even after multiple wash exposures.
KYZEN® and AQUANOX® are registered trademarks in the United States and other countries.
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit

DEN-ON INSTRUMENTS, CO., LTD. Will Debut the 7th Model Series RD-500V Rework Station at SMTAI

TOKYO, JAPAN - August 2015 - DEN-ON INSTRUMENTS, CO., LTD. is pleased to announce that it will exhibit with Seika Machinery, Inc. in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Seika Machinery, a leading provider of advanced machinery, materials and engineering services, will debut the 7th Model Series of DEN-ON INSTRUMENTS CO., LTD.’s RD-500V Rework Station.

DEN-ON Rework StationThe RD-500V Rework Station features a two mega pixel full HD camera with a 19" LCD display for easy visual alignment. The rework station is equipped with powerful built-in 1000W heaters on both the top-and bottom-side, and an area heater that includes six quick heating 600W IR heaters. Precise profiling including detailed temperature curves can be executed with the ability to closely control up to 30 zones.

The machine’s temperature control system can sample the data in very small intervals of 0.1 sec, allowing extremely accurate temperature control. The latest RD500 series with all-in-one in technology brings tools advanced for technology of the future, including:

       Three Point Auto Profiling

       New On-the-Fly Profiling

        Programmable Height for Z Axis

        Programmable Placement Force

        New Programmable Placement Speed Control

        New Product Tracker

        New Alignment Vision Save

        New Self Contained Nitrogen Generator

For more information, contact Michelle Ogihara at or visit, or Raymond LaFleur at or visit

Canadian Company & Others Selling Excess SMT Manufacturing Assets

EMS provider Canadian Inc. Energy Group in Laval, Quebec; Canada will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on August 10, 2015 and the closing will begin at 1:00pm EST on August 12, 2015. 
The items in this event include a DEK Horizon 01 Screen Printer; Yestech YTV-BX Bench Top AOI; Universal 4688A “GSM2” Machines & Feeders; BMW 750 Li; Chrysler 300 Limo; Ford F450 Ambulance; Jeep and Volvo SUVs; Mancorp “Lead-Free” Wave Solder; Vitronics Reflow Oven; BTU Paragon 150 Reflow Oven; Glenbrook RTX-113 X-Ray; Nicolet X-Ray; Sierra Summit 1000 Rework; CR Technology PCB Inspection; Thermotron & Espec Environmental Chambers; Seho 3250 Selective Solder; PAS Ultrasonic Welders; Air-Vac & Amistar Rework Stations; QMT 100 Tape & Reel; Austin American Stencil Cleaner;  Dry Storage Boxes; Conveyors; Workbenches and Much More...
To view the complete line of items currently up for auction; please select the following link.
Any questions about the event can be directed to Arlin Horsley at 1-813-992-2437.

Vi TECHNOLOGY to Exhibit the Latest Generation of SPI and Sigma Review Software at SMTAI

Saint-Egrève, France, August 2015 - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth #808 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate its complete SMT inspection solutions, including the PI series (SPI), K series (AOI) and Sigma Link software suite. 
Vi Technology
PI, Vi TECHNOLOGY's award-winning SPI generation system, has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. PI's 360° Moiré technology offers a unique textural review image and outstanding performance through unambiguous Z referencing and compensation.
PI is the only inspection system to program automatically. Inspection quality is therefore independent of programmers' training.
Vi TECHNOLOGY’s 2K SPECTRO, with its effective footprint for PCB sizes not exceeding 14"x14", is the smallest system of the Vi TECHNOLOGY K-Series. The series provides a wide range of AOI equipment, suitable for inspecting a wide range of applications, from post-print through to post-wave, from small boards to very large and heavy boards, including dual-lane applications. The 2K, with its reduced foot print and best-in-class cycle time is suited for the high volume manufacturing for consumer products. 
The Sigma Link software platform is a solution that centralizes all the data needed for programming or generated by the inspection machines in the line. Operators can create new programs, reviews and analyze inspection data of multiple machines from the same station. Web-based, Sigma Link provides the ability to access data from anywhere and at any time. Designed to manage several user profiles, Sigma Link is the perfect tool for anyone involved in manufacturing, from operators, programmers to process engineers or quality manager.

Specialty Coating Systems to Show the Precisioncoat V and Parylene Conformal Coatings at SMTAI

August 2015 (Indianapolis, IN) – Specialty Coating Systems (SCS) is pleased to announce that it will exhibit in two booths at at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL.  The SCS team will showcase the Precisioncoat V in booth #434 as well as Parylene conformal coating services and technologies in booth #941.
Specialty Coating Systems
The SCS Precisioncoat V’s conformal coating and dispense valves move smoothly along the three axis system, with an option to add fully programmable fourth and fifth axes for tilt and rotation capabilities. The system’s multi-valve technology allows for the application of dots, lines, fills, glob tops and spray coat areas. The redesigned Precisioncoat provides more than a dependable layer of protection, it is a total system solution that ensures accuracy, repeatability and high throughput for a wide range of automated material application, all in a smaller footprint to maximize valuable production floor space. 
SCS also will exhibit ultra-thin, pinhole-free Parylene conformal coatings, which offer superior moisture, chemical and dielectric barrier protection to a host of components, including circuit boards and assemblies, sensors, MEMS, LEDs and wafers, to name a few.
SCS is the leader in Parylene coating services and technologies with eleven coating facilities around the world, including six in the Americas, three in Europe and two in Asia. Additionally, the company has more than 40 years of applications experience in the electronics, automotive, medical device and defense industries.
For more information about SCS and how Parylene conformal coatings can protect your advanced technologies, contact SCS at +1.317.244.1200 or visit the company online at 

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

OSAKA, JAPAN - August 2015 - Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior PasteDuring the show, the company will showcase newly developed products that offer solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining, and lead-free die attach.  

SN100CVTM P506 D4 is a lead-free, no-clean solder paste with its basic composition of (Sn-Cu-Ni-Ge). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CVTM gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CVTM P506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes. The long open time ensures trouble-free performance in production processes.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces make it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure. 
For more information about Nihon Superior’s new solder pastes and lead-free products, meet company representatives in Booth #419 at the show or visit the company at

Cogiscan to Discuss Its Scalable TTC Solution at SMTAI

BROMONT, CANADA, August 2015 - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, will discuss its scalable platform in Booth #1038 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL.
The Cogiscan platform enables users to gain larger and more profitable contracts, reduce production costs, and improve quality through the deployment of TTC solutions that yield the following benefits:
- Increase machine utilization; gain more from existing assets
- Accelerate inventory turns and reduce component losses
- Attain real-time visibility of products and components in WIP
- Eliminate human errors
- Achieve complete and accurate traceability
For the past 15 years Cogiscan has been widely recognized as the industry-leading expert in TTC solutions for PCBAs. During this time, the scope and depth of the Cogiscan application modules have grown to the point where Cogiscan now offers a TTC solution for the complete assembly of electronic products, including box build. For more information, visit

See STI Electronics in Booth #2907 at the SMTA International Electronics Exhibition

MADISON, AL - July 2015 - STI Electronics, Inc., a full service organization providing training services, analytical and failure analysis, prototyping, and small-to-medium volume PCB assembly, will exhibit in Booth #609 at the SMTA International Electronics Exhibition, scheduled to take place Sept. 29-30, 2015 at the Donald E. Stephens Convention Center in Rosemont, IL. Company representatives will discuss STI’s Engineering Services and Training Resources divisions.
STI Electronics Inc.
STI's Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry. From product design and manufacturability analysis to pre-production prototype and development, STI's Prototype and Development Lab is a full-service design review and preproduction facility. STI’s Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).
STI Electronics Inc. Training
STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications. STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and training to the requirements of NASA-STD-8739.1, .2, .3 and .4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials including Fine Pitch Lead Free Solder Training Kits. STI also is an approved distributor for IPC training materials and videos.  
For more information about STI Electronics, Inc., visit

Discover the Industry's Best Screen Printer Warranty from Speedprint at SMTAI

TAMPA, FL - August 2015 - Speedprint Technology will showcase the award-winning SP710 Screen Printer in Booth #821 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Speedprint prides the SP710 for low ownership costs, flexibility and ease of maintenance.  Having achieved outstanding reliability, each Speedprint unit is backed by the industry’s best warranty with five-years on parts and two-years on labor.
Speedprint Screen Printer
The SP710 is equipped with a dual syringe Advanced Dispense unit for precise deposition of solder paste, adhesive and other materials. The award-winning screen printer includes a significant list of standard machine features as well as inherent benefits such as SMarT-Cal, Speedprints unique product-based machine calibration that maintains the largest process window to manage today’s most sophisticated application challenges. Also, attendees will learn why Speedprint can boast of the lowest maintenance and ownership costs in the industry.    
Also on display, the Advanced Dispense Unit + (ADu+) significantly increase the flexibility of the SP710. The unit has been enhanced to deliver the best accuracy of any printer based dispenser.  It can be used with a wider range of materials and new applications for stencil-less prototyping and on-the-fly engineering changes. This further saves operational costs and provides a competitive time-to-market advantage for Speedprint customers.
Additionally, the Velocity Plus throughput enhancement delivers best-in-class speed while further enhancing Speedprints value with extraordinary productivity and functionality at reasonable price points.  With Velocity Plus enhancement, the SP710 is the fastest printer in its class with a six second core cycle time. 
Speedprint’s Universal SPI Communications system is fully configurable to communicate and function alongside SPI equipment using standard network protocols. The system is easily implemented using preinstalled templates allowing users to create customized profiles.  Additionally, Speedprint’s product verification setup will be displayed that can minimize changeover time and help eliminate setup errors.
To learn more about how to decrease your annual maintenance and decrease costs, stop by Booth #821 at the show or visit

Seika Machinery Will Exhibit the Latest SMT Solutions at SMTAI

TORRANCE, CA - August 2015 - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Seika RD
The RD-500V Rework Station features a two mega pixel full HD camera with a 19" LCD display for easy visual alignment. It samples the data in very small intervals of 0.1 sec, allowing extremely accurate temperature control. The RD-500V is equipped with powerful built-in 1000W heaters on both the top- and bottom-side, and an area heater that includes six quick heating 600W IR heaters. Precise profiling including detailed temperature curves can be executed with the ability to closely control up to 30 zones. 
The UC-250M-CV Board Cleaner adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system. The UC-250M-CV has the ability to clean the top surface of PCB even chip components attached on the bottom side. Additionally, the cleaner features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on the top surface of the PCB. 
The MALCOM SPS Solder Paste Mixer is a non-contaminating mixer that utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform paste consistency regardless of operator skill. The paste temperature rises due to friction, enabling control over the solder paste viscosity. Now, a solder paste can be pulled from the refrigerator and ready on the stencil, in 10 minutes.
The MALCOM PCU-200 Digital Viscometer features a patented spiral-pump sensor that provides quick, easy and repeatable measurements. It provides continuous measurement of newtonian and non-newtonian fluids with constant shear rate and shear time. Additionally, the system features automatic control of measurement according to JIS standards (PCU-203,205). Application includes solder pastes, thick film pastes, solder resists, liquid resists, inks, etc.
Also at the show, company representatives will highlight the MALCOM RCX-1 Reflow Monitoring System and Hioki Flying Probe among other equipment.
For more information about any of the advanced equipment from Seika Machinery, contact Michelle Ogihara at or visit

The Smart Entry into Selective Soldering: SEHO Ensures Higher Productivity at SMTAI

SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight the new GoSelective-LS selective soldering machine in Booth #635 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. SEHO continues to release new technologies to ensure higher productivity in electronic productions with flexible and innovative machines.  
Electronic productions face new manufacturing challenges more and more frequently. Besides high quality requirements at low production costs, there also are an increasing number of product variants and flexible reactions to fluctuation in demand. With the new GoSelective-LS, SEHO has introduced an innovative system that represents the smart entry into selective soldering. Featuring an outstanding ROI, the GoSelective-LS efficiently replaces manual soldering processes.
The GoSelective-LS is particularly designed for stand-alone production of small and medium sized volumes and it scores highly with its very compact design. To ensure an ergonomical work flow and the shortest cycle times, the GoSelective-LS is equipped with a loading and unloading station for carriers up to 500 x 500 mm that is mounted in front of the machine. This station incorporates a manually moved cross transfer that allows users to comfortably slide the carriers from left to right and vice versa. Therefore, it is possible to assemble boards in one carrier while a second carrier is being processed in the machine.
While loading and unloading of the system is performed manually, all process steps are completely automated. The machine features a precise axis system that reliably positions the drop jet fluxer, preheat unit and soldering unit during the process.
Depending on the requirements, the electro-magnetic soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times.
Of course, SEHO’s demand for 100 percent process control applies to the GoSelective-LS, with fiducial recognition for automated position correction, flux monitoring, wave height control, process visualization, mcServer and many more value-added features. In doing so, the GoSelective-LS provides the same uncompromising superior accuracy and soldering quality as high-end systems from SEHO.
Innovations from SEHO focus on one point: To continuously increase the system's productivity. This also includes reduction of maintenance times. Maximum machine availability is ensured with the automatic ultrasonic cleaning for mini-wave solder nozzles that are patented by SEHO. Besides significant time savings in terms of maintenance, this unique feature provides an absolutely stable soldering process. 
For further information, please visit SEHO at SMTAI 2015 at Booth #635 or online at

MIRTEC to Demonstrate the Latest Advancements in Their Award Winning 3D AOI & SPI Systems at SMTAI

August 2015 – MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #407 at SMTA International, scheduled to take place Sep. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the latest advancement MIRTEC's award-winning 3D AOI and SPI systems during the two-day event.
“We at MIRTEC are extremely excited to present what is unquestionably the inspection industry's most technologically advanced AOI system at this year's SMTAI event,” stated Brian D'Amico, president of MIRTEC's North American Sales and Service Division.  The ALL NEW MV-6 OMNI 3D In-Line AOI Machine is configured with  MIRTEC's exclusive OMNI-VISION® 3D inspection technology which combines the award-winning 15 Mega Pixel CoaXPress Vision System with MIRTEC's revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost-effective platform. 
MIRTEC's 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with the company's complete product range of 3D inspection systems. MIRTEC's Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors.  This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.  Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.
Also on display, MIRTEC's ALL NEW MS-11E 3D In-Line SPI Machine is configured with MIRTEC's exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. 
The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC's MV-6 OMNI Series. 
“MIRTEC has earned a solid reputation in the electronics manufacturing industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” added D'Amico.  “We look forward to welcoming visitors to our booth during the two-day event.”

Metcal to Display the Scarab Site Cleaning System at SMTAI

GARDEN GROVE, CA - August 2015 - Metcal today announced plans to exhibit in Booth #816 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the MX-5200 Soldering & Rework System and HCT2-120 Hot Air Pencil.
Metcal Scarab
The Scarab ensures accurate and repeatable cleaning of the component pad in one user-friendly system. It redefines performance and addresses the technical demands presented by component manufacturers today. Additionally, the Scarab addresses the industry needs with an automated system capable of cleaning components pads without contact. 
The MX-5200 features a dual-simultaneous use option, meaning that two hand-pieces can work from one power supply at the same time. The dynamic option enables the two hand-pieces to share 80 watts output power based on demand, adding even more application flexibility and speed.  Four different hand-pieces and a comprehensive range of soldering and rework cartridges support the MX-5200 Series simultaneous dual operation. These include the Metcal Advanced™ Hand-Piece for SMD rework, a Metcal Ultra-Fine™ Hand-Piece for fine access, a Precision Tweezer capable of removing a range of components from 0201 chips to 28mm SOICs, and a Desoldering Gun for safely removing through-hole components.
Metcal’s HCT2-120 Hot Air Pencil is ideally suited for applications that use smaller components and integrated circuits. As component miniaturization continues, the ergonomics of a pencil allow a user more freedom to access and rework components on the board, without affecting adjacent parts. The HCT2-120 features a 120 watt ceramic heater and dual stage air pump, digital airflow and temperature controls, fast response and performance, standby mode and universal power supply. 
For more information about any of Metcal’s bench tool solutions, visit

Discover Efficient Oven Setup with KIC's Auto-Focus Power at SMTAI

San Diego - August 2015 - KIC today announced that it will showcase the KIC Auto-Focus Power in Booth #338 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The KIC Auto-Focus Power provides a recommended oven setup for a new assembly before running a single profile. 
The KIC Auto-Focus Power leads to much faster oven setup for new assemblies and it lowers the risk of damaging the PCB during the first profile run.  A manual profile can still be performed to verify an in-spec profile or for further fine-tuning.  In addition to the quick oven setup, the Navigator Power can automatically search for a profile deep in spec or the oven recipe that uses the least amount of electricity.
This easy-to-use product enables technicians of all levels to achieve expert process results and quickly solve that oven setup puzzle. For more information, meet with company representatives during SMTA International or visit

Juki Will Show the Latest Advancements in High-Volume Production at SMTAI

MORRISVILLE, NC - August 2015 - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, today announced that it will exhibit in Booth #718 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. JAS, Inc. will showcase several updated flexible solutions designed for both high-volume and high mix environments, including:   
Juki Cube
The ISM1100 Citadel Intelligent Storage Solution keeps components safe while allowing for easy and intelligent management of component inventory. With a maximum total capacity of 1100 7" reels, the Citadel is the optimal solution for anyone who needs to speed up warehouse management retrieval and storage while maintaining a small footprint. Designed to support 7" reels from 8mm to 16mm in
height, the Citadel uses a patented multiple outlet system that allows for the simultaneous extraction and insertion of up to 27 reels at a time. Juki also can now support up to 72mm tape on the ISM2000.  
The CUBE.460 selective solder system sets the new standard for dual nozzle mini-wave soldering systems. The unique CUBE.460 batch platform offers excellent flexibility for through-hole applications.  The CUBE.460 can be configured with a single nozzle or dual nozzle for increased flexibility. The system comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles and an exchangeable pot system to support both leaded / unleaded alloys.  
The fully automatic GL Plus Automatic Screen Printer is now TÜV SÜD certified for both the United States and Canada. GKG’s most popular GL Series is designed for printed circuit boards (PCB) with a maximum size of 510 x 510 mm. Additionally, the GL features a rigid and stable machine body base structure to perform accurate paste printing for 01005 (0201) components. The printer provides numerous benefits to users including a core cycle time of less than 8.5 seconds, and intuitive operation for quick and easy model changeover. 
The RX-6 Flexible Placement Machine is now available in a 6x6 version (six heads front / rear) for high speed and the 6x3 version (high speed front / flexible rear).  All machines include both standard and high resolution front / rear cameras for added speed, accuracy and flexibility. The RX-6 also includes two feeder trolleys – additional are optional.  The system supports the new smaller TR8 Matrix Tray Changer that takes up less feeder space while allowing for maximum capacity.  See attached brochures. 
For more information about Juki Automation Systems, visit

Inovaxe Will Showcase Its Intelligent Ultra-Lean Total Material Handling & Storage Solution at SMTAI

DEERFIELD BEACH, FL - August 2015 - Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will exhibit in Booth #713 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The company will highlight its Intelligent Ultra-Lean Total Material Handling and Storage Solution that addresses the challenges of dealing with SMT parts and kits within the stockroom and WIP locations.
Inovaxe will showcase its SMART InoAuto Storage Systems. The InoAuto Two Bay stores 1,120 7" SMT reels and the InoAuto Single Bay stores 560 7" SMT reels. Both systems are equipped with sensors and LED indicator lights, along with the InoAuto Locator software, and respond as if the reels have RFID on them. The operator will simply barcode scan the part number and quantity on a reel and place it into an empty Single Package Single Location slot. The InoAuto will report the position of the part to its database automatically.  
The user can quickly enter a part number or a pick list into the InoAuto computer and a LED will light up indicating each part location within the cart. The user can either have all of the locations required light up at one time, or just one location at a time to prioritize the pick list pull for a very quick reel pull to direct feeder location. As the user picks the parts, the InoAuto will identify the part number for the part that was removed on the screen.  As a result, kitting function is reduced from hours to seconds. Additionally, the InoAuto SMART Cart eliminates the need to scan locations.
The cart is mobile, ESD compliant, 5 ½ feet tall, and has a small 5 ½ ft2 print, which is a fraction of the size of robotic towers with five times the throughput. The InoAuto SMART Cart can pay for itself within three to six months. 
Inovaxe’s patented InoCart MSD is a true solution for managing moisture sensitive devices through its innovative individual cell design that stores multiple reel sizes and waffle trays. Included with each InoCart MSD is the revolutionary MSD tracking and timing software solution.
The industry favorite InoKit Carriers will be displayed in combination with the InoView software. InoKit carriers are an ultra-lean solution for the storage and kitting of prototype parts for engineers and SMT manufacturers. InoKit carriers are organized, efficient, state-of-the-art, single package-single location material storage carriers that house small, medium and large SMT reels, or any type of mechanical parts and printed circuit boards (PCBs). Additionally, Inovaxe’s InoView software is an excellent tool for managing parts and kits within the stockroom and WIP.  Part locations and kit requirements can quickly be identified with accuracy and traceability.  The InoKit carriers also can be upgraded to SMART carriers.
For more information about how Inovaxe’s innovative material handling systems and services can improve your inventory accuracy and reduce your labor costs, meet company representatives at SMTA International in Booth #713 or visit

FSInspection to Unveil a Versatile & Portable High-Magnification Visual Inspection System at SMTAI

ST. PETERSBURG, FL - August 2015 - FSInspection will debut the new VERSAMag® High-Magnification HD Inspection System in Booth #946 at SMTA International (SMTAI). SMTAI will be held September 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The new VERSAMag combines the accurate measurement capabilities of a high-resolution inspection camera with a flexible design to meet the industry’s diverse visual inspection needs.
VERSAMag has a multi-axis, high-resolution camera that tilts and rotates for multiple angle inspection with an adjustable Z-height arm for the versatility to inspect objects of various shapes and sizes. This lightweight and flexible inspection system has magnification up to 96x and includes real-time video inspection, flexible working heights and intuitive controls.
The VERSAMag is an ergonomically designed, high-quality visual inspection system with measurement and annotation capabilities when paired with FSInspection Software. FSInspection Software is an easy-to-use measurement and image processing platform that enables the VERSAMag operator to provide detailed inspection, documentation and reporting. Operators can capture, annotate, store and share images, including dimensional measurement of objects, for quality control and audit tracking. FSInspection Software and VERSAMag form a powerful measurement and image processing inspection system, making this an invaluable tool throughout the production area and warehouse.
Designed for today’s industrial markets, the FSInspection series also includes the HDMag® High-Definition Inspection Station, X-Mag™ High-Magnification Workstation and PKMag® 50 Portable Visual Inspection Device. FSInspection high-magnification visual inspection systems are easy-to-use and more ergonomic and cost-effective than traditional microscopes. For more information, visit

Discover Europlacer's IINEO SMT Pick-and-Place Platform at SMTAI

Tampa, FL - July 2015 - Europlacer, a manufacturer of market-leading flexible SMT placement machines, announces that it will showcase the iineo II SMT pick-and-place platform in Booth #637 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL
Europlacer iineo
The award-winning iineo II is widely configurable for numerous requirements. The platform offers the industry’s largest board size (24" W x 63"L) along with expansive feeder capacity up to 264 x 8 mm + trays. With two placement heads, 24 nozzles, Electrical Test Verification, odd-form capability and enough capacity for a broad range of presentation media including tape-and-reel, trays, tubes, cut tapes and POP, the iineo II can be employed to achieve optimal production efficiency on complex boards, complex applications and higher volumes with ease.  
Europlacer also will demonstrate the new ii-Feed system that highlights a 15 second unit load-time, along with sub-$300 unit price for fully ‘intelligent’ assembly planning and production.
For more information, schedule a meeting with company representatives in Booth #637 at SMTA International or visit 

Essemtec to Exhibit Flexible SMT Production Equipment at SMTA International

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced that it will exhibit in Booth #335 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Parquda G2 multifunctional center and Cubus storage system.
3-in-1 Multifunctional Center
Paraquda G2 is the world’s first machine that combines three different processes within one platform (jetting of solder paste, jetting of glue and placing of SMD components). The multifunctional center meets all of the requirements of a modern, highly flexible production system – quick changeover, intuitive operation and the combined usage of jet and/or needle valves. With this unique combination, the Paraquda G2 allows an unprecedented flexibility in the market. Being able to complete various processes with one machine eliminates the need of separate machines and reduces the investment costs dramatically. Set up is done directly from imported CAD data using an integrated medium library. 
Next-Generation SMT Storage System
Cubus innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully user configurable and hence adapts to the dynamic manufacturing needs. There are no limitations in terms of reel sizes, reel widths or JEDEC trays. With its flexible shelf configuration, foolproof operation and easy line integration, it easily adapts to the ever-changing manufacturing environments. Thanks to its small footprint and high storage capacity (up to 932 reels), Cubus can be positioned close to any SMT manufacturing line. Cubus interfaces easily with pick-and-place machines and, thus, greatly reduces kitting time and errors as well as machine interruptions due to missing or misplaced material. Configure – Operate – Integrate!
For more information about Essemtec, visit

Ersa Will Highlight the Smartflow 2020 and HR600 at SMTA International

Plymouth, WI - August 2015 - Kurtz Ersa North America, a leading supplier of electronics production equipment, will exhibit in Booth #539 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will highlight the Smartflow 2020 selective soldering system and HR600 hybrid rework system.
Ersa SMartflow
The Smartflow 2020 selective soldering system requires less than 3 m² of space, thus fitting optimally into cell production environments. In all process steps the automatic Smartflow system uses the same successful and proven Ersa selective soldering technology as the large Ersa VERSAFLOW systems without compromising quality and accuracy. With the Smartflow, ERSA finally closes the gap from its high-end Versaflow platform to an entry level machine. Due to its universal pallet fastening, the Smartflow can handle PCB sizes up to 508 x 508 mm [20” x 20”]. 
The HR 600 is an automated rework system featuring fully automatic component placement, thus eliminating the risk of human error during the alignment and placement process. The system is equipped with a highly dynamic and efficient heating technology with the bottom-side heating (2,400 W) divided into three independent heating zones. The newly developed hybrid top-side emitter provides 800 W of heating power and combines the advantages of infrared heating with those of a convection heater. In order to thermally control the rework process, the HR 600 uses proven closed-loop technology. The component temperature is measured and can be controlled exactly. The HR 600, non-contact temperature measurement is even more precise due to a digital infrared sensor (non-contact pyrometer). 
For more information about Kurtz Ersa North America, visit

Computrol to Discuss High-Mix Manufacturing and Lot Traceability at SMTAI

MERIDIAN, IDAHO - July 2015 - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs will exhibit in Booth #938 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Computrol representatives will discuss its complete line of electronics manufacturing services, including high-mix electronic manufacturing and lot traceability capabilities.
Utilizing state-of-the-art manufacturing equipment and processes, Computrol focuses on prototyping and low to medium volume, high-mix production of PCB, box build, cable harness and backplane assemblies. The company’s world-class team has the experience to make any design project a success. 
Computrol is certified to ISO 13485 specific to medical device quality systems, ISO 9001-2008 and AS9100, IPC class II and III and J-Std certified as well as being ITAR registered and lead-free RoHS compliant. For more information, visit

BTU Will Show the PYRAMAX™ with ENERGY PILOT Software at SMTAI

NORTH BILLERICA, Mass., August 2015 - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will exhibit in Booth #734 at SMTA International, scheduled to take place Sept. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the proven PYRAMAX™ with the new ENERGY PILOT software, designed to reduce the consumption of electrical power and process gas.
BTU Pyramax
BTU’s PYRAMAX convection reflow oven is the benchmark for performance in the industry.  The PYRAMAX features a maximum temperature of 400°C and a comprehensive menu of options. PYRAMAX systems, featuring BTU’s exclusive closed-loop convection technology, provide optimized lead-free processing for the ultimate in productivity and efficiency. 
ENERGY PILOT is a feature in the latest release of BTU’s windows-based WINCON™ operating system. The ENERGY PILOT software saves manufacturers money whenever the oven is idle.  Standby mode can save more than 25 percent. Sleep mode can be used for longer interruptions saving more than 40 percent. Long idle periods fully shut down the oven using hibernate mode.  Recovery times are minimized using remote product sensors and SMEMA.  Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption.  The feature is easily upgradeable on older BTU reflow ovens.

ASC to Launch Speed Improvements for Dual Mode AOI / SPI Inspection at SMTAI

MEDINA, MINNESOTA - August 2015 - ASC International, a leading manufacturer of 3-D solder paste inspection and automated optical inspection (AOI) systems, today announced that will exhibit in Booth #518 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. ASC will exhibit the VisionPro M500, VisionPro AP500 and the LineMaster DM with the latest larger FOV - PSI 1000 sensor.  The new PSI sensor provides inspection speed improvements of 5X over previous PSI sensors. The combination of 2D AOI along with the newly added higher speed SPI elevates the LineMaster to an integrated inspection platform all on its own.

ASC Line MasterThe new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance.  The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing.   Combining both inspection capabilities within one platform, the LineMaster DM  detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and the most accurate and repeatable true 3D volumetric measurements for SPI.  System features include real-time SPC, customized data reports, offline CAD / Gerber programming and defect repair station.  All wrapped together with an affordable price tag similar to purchasing both inspection capabilities for the same price of as one solution alone.

The VisionPro AP500 SPI system incorporates the most advanced, rapid 3-D inspection technology within a stylish vibration-free, fully automated platform. Designed with feature-rich software including onboard real-time SPC, customized data reports and simple-to-use GerberProTM conversion programming software, the VisionPro AP500 has become the industry standard for fully automated, offline SPI around the globe.

The VisionPro M Series of SPI systems incorporates the most advanced, rapid 3-D inspection technology coupled with an intuitive Windows® 7 OS and packaged in a rugged, bench-top platform.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M500 an exceptional value for electronics manufacturers concerned with improving production yields. Designed with feature-rich software, including onboard real-time SPC run charts, customized data reports, simple-to-use GerberProTM conversion programming software and two sensor technology options, laser and structured white light, the VisionPro M Series is the price to performance leader for offline SPI solutions available on the market today.

For more information about ASC International, visit

Discover 2D/3D Interface Analysis Software from Akrometrix LLC at SMTAI

ATLANTA, GA - July 2015 - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #134 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Akrometrix Shape Matching
Surface-mount components may warp during the reflow process, as well as the associated land area. This warpage between components and the land area can contribute to defects such as Head-on-Pillow, shorts and opens. Fully understanding the critical interface between surfaces is more important than ever. 
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
For more information, meet company representatives in Booth #134 during SMTA International or visit

Acculogic Will Display Automatic Test Equipment at SMTAI

Markham, ON - July 2015 - Acculogic Inc., a global leader in electronic production test solutions, announces that it will exhibit in Booth #327 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will be available to discuss the following equipment:
Acculogic FLS980 Test Equipment
- The FLS980 Series III with the Ultimate Accuracy Package Option along with high throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution, MircoScan miniature image observation and testing solutions, and LaserScan, which contributes to accurate targeting of test points also will be featured.
- The powerful suite of PC-based hardware and software tools specially designed for testing of electronic devices, boards and systems using the IEEE1149.1 and IEEE1149.6 standards.
- The SCORPION iCT7000 In-Circuit Tester is the ideal tester for those requiring a larger test node capacity. This system offers the same functionality and options as the FiS 640 tester but with an expandable pin count to 8,192 pins. Larger configurations require a more spacious rack or, a desk style configuration. 
- The SCORPION Briz Automated Test & In-System Programming station is a compact, totally customizable, all-in-one test station, that can be configured to perform in-circuit, functional & boundary testing, and in-system programming. As a result, in one manufacturing stage users can achieve the highest level of test coverage and perform device programming with a high throughput. 
Acculogic's test engineering services can help customers at critical phases of product verification and test strategy, and shorten time to market. The company's Test Engineering division offers a comprehensive range of turnkey services that range from in-circuit test fixture and program development to sophisticated application development on custom functional test platforms. For more information about Acculogic, visit

ZESTRON Introduces New Enhanced Maintenance Cleaner, VIGON® RC 303

Manassas, VA - July 8, 2015 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics industry, is pleased to introduce VIGON® RC 303, a new water-based cleaning agent specifically developed for the removal of baked-on fluxes in reflow ovens and wave solder systems.  It also removes re-condensed fluxes and emissions from condensation traps and heat exchangers.

VIGON® RC 303’s new formulation offers improved cleaning across a wide range of lead-free and lead-based solders and reduced VOC emissions. VIGON® RC 303 does not have a flashpoint, therefore it can be directly applied to warm surfaces as well as safely operated in wave solder systems. This environmentally friendly cleaning agent is available in a 1 liter spray bottle, as well as 5, 25 and 200 liter containers.

For more information on ZESTRON’s complete maintenance cleaning process solutions, please email or visit  Our expert team is available to provide comprehensive solutions to your cleaning needs.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. 

Atotech increases its equipment manufacturing capacity with a brand new facility in Guangzhou, China

Built on an area of 63,000 sqm, the new plant is estimated to create close to 200 jobs locally (over the next three years) and expand the manufacturing capacity of Atotech's production equipment serving the PCB, IC Substrate and Semiconductor industries.

BERLIN, Germany/ GUANGZHOU, China July 7, 2015: Atotech, a global leader in specialty plating chemicals, equipment and services today held the inauguration of its second equipment manufacturing facility in Guangzhou, China to meet the growing demand for its plating equipment. Globally this is Atotech's third facility dedicated to manufacturing production equipment for the electronics industry. The plant, built on an area of 63,000 sqm leaving space for further expansion and will generate close to 200 local jobs over the next three years. State-of-the-art machines and processes have been deployed to ensure greater precision, accuracy and efficiency in the production of next generation PCB, IC Substrate and Semiconductor manufacturing equipment.

Commenting on the development, Mr. Reinhard Schneider, President of Atotech said:

"The opening of this facility in Guangzhou marks a new milestone for Atotech and our commitment to China. The new plant is a direct response to our customers' trust in our pioneering technology and sharply rising demand for our manufacturing equipment. In-line with our corporate priority, the facility meets latest technology and quality standards, as well as rigorous sustainability norms."
Atotech is an unrivaled supplier to the PCB and IC Substrate industries backed with over two decades of experience, a strong focus on R&D and cost-optimized manufacturing. The company's flagship brands Uniplate and Horizon are market-leading horizontal systems serving the global leaders in PCB and IC Substrate manufacturing. The Uniplate systems provide production solutions for desmear, through hole metallization and electrolytic copper processing and the Horizon systems production solutions for final finishing using immersion tin, and for surface treatment e.g. bonding enhancement and permanent non-etching adhesion processes. Both brands have been driving Atotech's success for several years now.

Phase 1 of the new investment (33 M US$) will ramp up the production capacity of Uniplate and Horizon, as well as the newly introduced local platform for manufacturing equipment. Phase 2 will further expand the production capacity of the facility to include semiconductor equipment part manufacture and assembly to serve the increasing demand for new advanced packaging production solutions.

With the new facility Atotech aims to react faster to the rapidly changing and highly demanding markets and cater to individual customers’ demands.

The new facility will effectively support Atotech's customers' next generation manufacturing programs. Furthermore, it will contribute significantly to the local economy and its development within the technology industry.

About Atotech
Atotech is one of the world’s leading manufacturers of specialty plating chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of $ 1.3 billion and is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech is a division of the Total Group, and has its headquarters in Berlin, Germany. The company employs around 4,100 people in more than 40 countries.