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SHENMAO Introduces Room Temperature Storable RT Series

Solder Paste at SMTAI Booth # 800 September 27-28, 2016

 

SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc.

of TaoYuan City 328, Taiwan. Shenmao is a global leader of superior solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.

 

As the World’s Major Solder Materials Provider for 43 years, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, LED Die Bonding Solder Paste and PV Ribbon.

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com

 

 

Register: http://www.smta.org/education/registration/pre_registration.cfm?event_id=1204





Beam On Technology launches a new smartphone app for calculating stencil printability

Beam On TechnologySanta Clara, CA - September 21, 2016 - BEAM ON TECHNOLOGY is excited to announce the launching of a new mobile app that provides quick and easy to understand calculations for predicting paste release, solder volumes, and even solder paste powder recommendation. The app works for both Android and iOS platform.

The Area Ratio Calculator app is the only app made specifically for solder paste stencil printing and works for both your smartphone or tablet. The app takes the dimensions of a specific aperture once the shape is selected, then allows the user to select foil thickness. Instantly, an algorithm displays the area ratio, with easy to understand color identifiers that infer solder paste transfer efficiency.

The Area Ratio Calculator also provides supplemental data such as aspect ratio, solder paste volume in cubic mils, as well as suggested solder powder type. This feature is beneficial because it allows for quick reference to any current work being looked into, in an easy to read setting.

The Area Ratio Calculator app by Beam On Technology is now free to download and available through the Apple Store or Google Play.

###

Beam On Technology Corporation was established in October 1992, founded by manufacturing engineers with extensive knowledge and expertise in the assembly process. Our sole purpose was to provide integrated service products to the SMT assembly industry engineered for ease of use while impacting yield, and this continues to be our goal.

 





Kester Launches New Website

Kester_Logo_Black12.png Kester Launches New Website

ITASCA, IL — September 21, 2016 Contact: Michelle O’Brien, Marketing & Communications Specialist

Kester is proud to announce the launch of our new website. Please visit our upgraded website, which provides a responsive and overall more user friendly experience for all visitors, at www.kester.com.

For more information contact Michelle O’Brien at mobrien@kester.com

 

### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

 

 





ZESTRON to Feature VIGON® N 680 at SMTA International

[Manassas, VA – September 19, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, will be featuring our latest pH neutral defluxing agent, VIGON® N 680, at SMTA International 2016.

VIGON® N 680 is an aqueous-based, pH neutral cleaning agent specifically developed for the use in spray-in-air inline and batch equipment. VIGON® N 680 removes a broad range of electronic assembly flux residues with an exceptional ability to penetrate and clean under low standoff components. Additionally, the cleaning agent provides excellent material compatibility, particularly with sensitive metals such as copper.

Visit ZESTRON’s booth #616 at SMTAI to discuss cleaning solutions; or stop by for some free beer, a game of cornhole, and a chance to win a FitBit Fitness wristband! We will be raffling off our prize at the end of each day of the show.





Jigar Patel to Present at SMTA International

[Manassas, VA – September 13, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Evaluating Rinsing Effectiveness in Spray-in-Air Cleaners” at SMTA International 2016.

 

Spray-in-air systems include wash, rinse and dry cycles. Engineered cleaning agents are critical to the process. Given the low standoff heights of components on present day PCBs, low surface tension is required to enable the cleaning agent to penetrate underneath components to contact and solubilize the residue. The rinse cycle is critical to the process for the rinse water must penetrate the same low standoff components in order to remove the residue laden cleaning agent. However, rinsing uses pure DI-water. Given the surface tension of water, how effective is this process? This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner. Test vehicles used were affixed with glass slides at various standoff heights to represent low standoff components.

Mr. Patel's presentation will be on Thursday, September 29th, during session MFX8 – Cleaning: Low Clearance Challenges. To register for this event, please visit smta.org.





SHENMAO Exhibits at SMTA International

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

 

SHENMAO Technology, Inc. introduces Room Temperature Storable RT Series Solder Paste at the show.

 

SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader in solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.

 

As the World’s Major Solder Materials Provider for 43 years, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, LED Die Bonding Solder Paste and PV Ribbon.





ZESTRON Introduces Latest pH Neutral Defluxing Agent

[Manassas, VA - September 12, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to introduce our latest pH neutral defluxing agent, VIGON® N 680.

 

“We are excited to launch the latest addition to our pH neutral product family of defluxing cleaning agents,” said Eric Strating, Director of Sales, ZESTRON.  “VIGON® N 680 provides exceptional cleaning performance, specifically targeting low standoff component cleanliness.”

 

VIGON® N 680, based on the MPC® Technology (Micro Phase Cleaning), is an aqueous-based, pH neutral cleaning agent specifically developed for the use in spray-in-air inline and batch equipment.

 

VIGON® N 680 removes a broad range of electronic assembly flux residues with an exceptional ability to penetrate and clean under low standoff components. Additionally, the cleaning agent provides excellent material compatibility, particularly with sensitive metals such as copper. 

 

VIGON® N 680 will be featured at ZESTRON’s booth at SMTA International 2016. For more information, please visit booth #616.





Kester to Exhibit and Present at SMTA International 2016

ITASCA, IL - Kester will be exhibiting (booth #500) at Surface Mount Technology Association International (SMTAI) 2016, which will take place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.
 
Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products, including SELECT-10 a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process; and NP545 a zero-halogen, lead-free, no-clean solder paste with a 1 year (in both refrigerated and room temperature conditions) shelf life.
 
In addition to exhibiting, Kester will have multiple papers being presented. On Tuesday, September 27 at:
  • 11:30am-noon: Paul Groome (Digitaltest), and Kester’s Denis Jean and Bruno Tolla will present Breaking Through Flux Residues to Provide Reliable Probing on PCBAs
  • 2-2:30pm: Kester’s Bruno Tolla will present Surface Insulation Resistance of No-clean Flux Residues Under Various Surface Mount Components
  • 3-3:30pm: Mike Bixenman (Kyzen) and Kester’s Bruno Tolla will present Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components Can Cause Leakage Currents to Form
  • 3-3:30pm: Kester’s Hemal Bhavsar will present Improved Reliability Performance of Jet Dispensable Polymeric Coating Material 
On Wednesday, September 28 from 3-3:30pm, Kester’s Chad Showalter will present A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System. 
To learn more about these sessions, please click here. 
 
To schedule an appointment with a member of our R&D or sales team or if you have any questions, please contact Michelle O’Brien.
 
 
###
Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.





Vision Engineering continues FREE Electronics Academy Webinar Series to help identity and rectify PC

New Electronics Webinar Series by Vision Engineering

Bob-Willis-landing-page-1000px.jpg Due to an overwhelming response to the first Electronics Academy Webinar Series, Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a second free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.

The series begins on September 15th with Crimp Connector Inspection & Quality Control. During this webinar participants will learn how to inspect wire and crimp terminations, set up inspection standards and identify common defects and corrective actions On October 12th Printed Circuit Board Inspection & Quality Control will be broadcasted. Attendees will learn about different PCB types, how to identify common problems and understand the causes of product failure.

The 3 part series closes on November 10th with Inspection of Conductive Adhesive Joints. This webinar will teach viewers about the use of conductive adhesive joints and the importance of understanding joint reliability and inspection criteria. Attendees will also learn how to inspect, identify process defects and corrective actions when inspecting conductive adhesive joints. Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.

For more information on the Electronics Academy Webinar or to register visit http://www.visioneng.com/electronics-academy-webinar-series

Company Details Vision Engineering Inc. designs and manufactures a patented range of ‘eyepiece-less’ microscopes for industrial and laboratory applications. Established in 1958, more than 300,000 systems have been installed worldwide for inspection and measurement tasks. Company headquarters are based in Woking, UK with manufacturing facilities in the US and UK. Regional offices are located throughout North America, Europe and Asia.

 

PCB-application-feature-250px.jpg





LPKF makes up a lot of ground in the second quarter

Tualatin, OR, August 2016 - Business growth at LPKF Laser & Electronics AG accelerated considerably in the second quarter 2016. Sales grew by almost 20% compared to the same quarter of the previous year, EBIT results were positive at EUR 0.7 million. However, due to a very weak first quarter, sales and EBIT results after six months stayed below the previous year’s figures. Sales in the first half year reached almost EUR 40 million, EBIT stayed negative at EUR -3.7 million.

Orders received in the first half of the year amounted to almost EUR 60 million, almost 40% higher than those received during the first half of the previous year. Orders in hand on the reporting date were over 80% higher than the figures re-ported during the same period of the previous year. The book-to-bill ratio reached a value of 1.5.
 
The most significant drivers of growth in the first six months included laser systems for plastic welding. A large solar contract for EUR 17 million was a major contributor to the orders received in the second quarter. Orders in the other two segments remained below expectations for the first half of the year.

The announced cost-saving program made good progress in the second quarter. The planned reduction of 100 full-time equivalents in the LPKF-Group is on schedule. Until mid-August a capacity reduction of eighty-six full-time equivalents has been contractually agreed. The Board of Directors therefore believes that the company is in a good position to bring the break-even point for 2017 to below EUR 90 million.
 
“Despite the continued weakness in LDS business, we have taken a substantial step forward in the second quarter", says Dr. Ingo Bretthauer, CEO of LPKF AG. “Both the sales trends and cost-saving measures are going according to plan. We are confident that we will be able to achieve our goals for 2016 on both fronts.”
 
For 2016, the Board of Directors expects to achieve sales of EUR 90 to 110 mil-lion and an EBIT margin of between -3% and +6%, if the global economy remains stable. These include estimated restructuring costs of approx. EUR 2 million. For 2017, the board expects an increase in sales and a clearly positive result.
 
The complete half-year financial report is available in German at www.lpkf.de/investor-relations/news-publikationen/finanzberichte/index.htm and in English at www.lpkf.com/investor-relations/financial-reports/index.





ZESTRON Releases New Virtual Tour on Website

[Manassas, VA – July 27, 2016] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that ZESTRON Americas has a new virtual tour on zestron.com.

 

“We invite customers and industry professionals to take a 360° tour of our state-of-the-art facility,” says Todd Scheerer, Executive Vice President. “As with any of ZESTRON’s seven facilities, our customers can visit and review cleaning equipment alternatives, conduct cleaning trials with the industries’ most innovative engineered cleaning products, and assess cleanliness results in real time.  Visitors can also tour our ZESTRON Academy training and global video conference centers.”

 

As part of ZESTRON’s continuous effort to provide integrated global support, customers can also tour the Technical Centers located in Germany, China and Malaysia as well.  To view our latest virtual tour, visit zestron.com.





Vision Engineering to Hold FREE Webinar Series on Conformal Coating Inspection & Coating Faults

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.
 
The series began on June 16th with Solder Joint Inspection & Process Defects. The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. 
 
During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions
 
The first two webinars are now available on-line and can be viewed at the following links:
 
Solder Joint Inspection & Process Defects
 
Counterfeit Component Inspection & Detection
 
 
Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.
For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





UP Media Group Announces PCB West 2016 Exhibition Floor Sold Out

ATLANTA, GA – JULY 12, 2016 – The exhibition floor is sold out for PCB West, the largest conference  and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today. 

PCB West 2016 will be held September 13-15 in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center. 

Now in its 25th year, this year’s show will feature 110 booths, 16% more than the 2015 exhibition.  The event showcases the leading companies in the PCB industry, including all the top CAD and CAM vendors and top names in printed circuit fabrication and electronics assembly.

“This is the fifth straight year we have sold out all available booths,” said UPMG vice president of sales and marketing Frances Stewart. “We are truly looking forward to hosting another great event for the industry in September.”

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The September 2015 event attracted more than 1,900 attendees. 

PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.

For more information about PCB West, visit pcbwest.com or contact Show Manager Alyson Corey at 678-234-9859; acorey@upmediagroup.com. 

About UP Media Group Inc. 
UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FABTM (pcdandf.com) and CIRCUITS ASSEMBLYTM (circuitsassembly.com), as well as the PCB UPdateTM (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB WestTM (pcbwest.com). 





Industry 4.0: Reduce costs through component counting and interconnected technology

Logo_Block.jpg Especially electronics manufacturers in high wage countries face an enormous cost pressure from competitors based in low-wage countries. Time is literally money – therefore, it is more important than ever to automate processes continuously to increase efficiency and to keep the margin. To avoid production stops caused by inventory discrepancies, it is crucial to count the components on reels. To make the tedious counting process feasible VisiConsult replaces the time-consuming manual or optical approach by an innovative solution based on X-ray technology. This reduces the time required per reel from several minutes to less than 10 seconds. The XRHCount is a compact X-ray system to count all common SMD component types on tapes with a diameter of up to 400 mm.

An absolute innovation is the new Counting Cloud. New component types don’t have to be trained locally. Instead the uncountable reels can be directly submitted to the VisiConsult development team. Regularly every plant will receive an automatic update. The already very extensive database is continuously growing through the input of dozens of systems worldwide. This includes big sites such as Flextronics, with a reel volume of several thousand reels per day. Currently the counting accuracy is already above 99.9%, while no component database is required.

Another new feature is the seamless integration with common and specific IT infrastructure. This results in a further increase in speed and better process stability. The counting result can automatically be sent to MES or ERP systems, if desired. Renown systems, such as FUJI Trax, Cogiscan, SAP etc. incl. traceability support are already pre-implemented. For custom systems the XRHCount offers extensive open database interfaces. The target is that the XRHCount can be integrated into every system on the market.

More information: http://visiconsult.de/products/electronics/xrhcount/

System video: https://www.youtube.com/watch?v=r1T_X2PaibQ

 

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Seika Machinery Increases Its Technical Support

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that is has expanded its technical support offering. Now, the company has technical service centers at its Atlanta and San Francisco branches. 

The Atlanta branch provides support and repair for McDry dry storage cabinets as well as the Sawa portable ultrasonic stencil cleaners. At the San Francisco branch, Seika provides technical support and basic service including repair and calibration on the Malcomtech viscometers, paste mixers, wetting balance testers, profilers and other products. 

In-depth repairs are handled by the manufacturers for all products; however, many repairs can be handled by Seika Machinery. The company also has a 24-hour Technical Hotline that can be reached at: (888) 734-5278.

For more information, contact Michelle Ogihara at michelle@seikausa.com, or visitwww.seikausa.com.





Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB

Vision Engineering Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.

About-Bob-Willis-200px.jpg

The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.

The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Enabling Chemistry Further Validated with Global Technology Award, Expanded Licensing Agreements

FCT Assembly NanoSlic November 17, 2015 -- At last week's Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.

NanoSlic

Introduced to the electronics market in 2014, NanoSlic is a proprietary coating chemistry that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance.   FCT has developed not only the breakthrough chemistry, but also the equipment and coating process that provide a turnkey coating solution. Though used in multiple markets for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

"NanoSlic has quickly emerged as the most robust stencil coating technology for modern electronics assembly processes," says Brent Nolan, Vice President of FCT Assembly.  "As apertures become smaller - and area ratios more challenging - new techniques are necessary to accommodate the material deposition obstacles of miniaturization.  Because of its novel chemistry and its ability to coat both inside the aperture walls and the stencil underside, NanoSlic is enabling transfer efficiency improvements of as much as 40%, while reducing required understencil cleaning frequencies for cost savings and greater process stability.  It's gratifying to have the Global Technology Award judging panel recognize NanoSlic's market impact; we are grateful to Global SMT & Packaging magazine for sponsoring this contest."

The requirement for improved print performance for today's challenging device dimensions has accelerated the use of NanoSlic-coated stencils and this demand has initiated expansion of NanoSlic licensing worldwide.  There are currently three authorized NanoSlic licensees globally, and several more exploring opportunities with FCT.   Likewise, customers have discovered the unique capabilities of NanoSlic-coated stencils and have noted marked print process improvements.   

Harris Corporation Engineer, Nazeeh Chaudry, says the company has had striking results through the use of NanoSlic-coated stencils.  "Our yield on 15.7 mil (0.4 mm) pitch QFNs went to 100% just by changing to NanoSlic-coated stencils," he explains.  "Solder paste deposits have brick-like definition and are precise and repeatable on QFNs and other fine-pitch components."

 "The growth of NanoSlic has been incredible," comments Nolan in summary, "and this is just the tip of the iceberg.  While the coating chemistry is making a huge difference for PCB assembly processes, NanoSlic's applications extend far outside the confines of the electronics industry.  It's going to be an exciting journey."