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Download Webinars On-Demand
Recorded webinars (videos and slides) are available for instant download for only $75 for members and $150 for non-members. Don't forget to also check out the upcoming webinars and webtorials which you can attend live this year! Members: log on now to receive your discounted member pricing. Not a member? Purchase a membership to receive the discounted Member pricing. Sort By: Date Title
YEAR	TITLE	AUTHOR	VIEW	PURCHASE

2013	Voiding Control and Reliability of Solder Joints with Backward Compatibility \| Bonus Presentation: Technical Communication - Strategies for Success	Dr. Ning-Cheng Lee and Chrys Shea	Abstract
2012	Design For Environment (DfE): 8 Proven Strategies for Developing Superior, Cost Efficient, & Environmentally Compliant Products	Graham Adams, BSc. Ceng.MlechE, PlesTech Ltd.; Pamela J. Gordon, Technology Forecasters Inc. (TFI.); and Harvey Stone, Ph.D	Abstract
2012	Lead-Free Soldering Technology Symposium	SMTA International	Abstract
2012	Package On Package (PoP) Design and Assembly	Bob Willis	Abstract
2012	Implementing TSV for 3D Semiconductor Packaging	Vern Solberg	Abstract
2012	PCB Inspection and Inspection Strategies	Tammy Grefkowicz and Bob Wettermann	Abstract
2012	Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere	Ning-Cheng Lee, Ph.D.	Abstract
2012	A Study of Surface Finishes for IC Substrates and Wire Bond Applications	Lenora Toscano	Abstract
2012	Troubleshooting the Stencil Printing Process	Chrys Shea	Abstract
2012	RoHS Product Eco-compliance - with all the changes, where do we stand now?	Krista Crotty	Abstract
2012	PCB Depaneling with Lasers: A Comparison of Laser to Traditional Depaneling Methods	Josh Brown	Abstract
2012	Material and Process Optimization for Head-in-Pillow Elimination	Timothy Jensen	Abstract
2011	Developing a Counterfeit Testing Program	Cathy Moritz	Abstract
2011	Critical Considerations for Conformal Coating Reliability	Jason Keeping, P. Eng.	Abstract
2010	Root Cause Failure Analysis of Printed Circuit Board Assemblies Through Analysis of Product and Tooling Design	Dale Lee	Abstract
2010	Go Greener in Your Cleaner! - Cleaning Process Benchmarking	Dr. Harald Wack	Abstract
2010	Mechanical and Thermal Reliability of Package on Package	Heather McCormick	Abstract
2010	Status of the Proliferation of Lead-Free Alloys: 2010	Ronald Lasky, Ph.D., P.E.	Abstract
2010	Reducing Head-in-Pillow with Tin-Lead and Lead-Free Solder Paste Development	Jasbir Bath	Abstract
2009	Practical Guidelines for Moisture Sensitive Component Handling	Mumtaz Bora	Abstract
2009	Methods for Reworking Leadless Packages - LGA, QFNs and More	Bob Wettermann and Ray Cirimele	Abstract
2009	Why Switch From Pure DI-Water To Chemistry?	Naveen Ravindran, M.S.Chem.Eng.	Abstract
2009	Process Controls in Classifying, Handling, Storing and Baking Devices and PWBs	Steven Martell and Mumtaz Bora	Abstract
2009	Inspecting, Detecting and Rejecting Counterfeit and Reworked Electronic Components in the Open Marketplace	Art Ogg	Abstract
2009	Mixed Alloy BGA Assembly: Low-Silver Lead Free BGA Spheres into Tin-Lead & LF Assembly Processes	Chrys Shea, Quyen Chu, and Ken Hubbard	Abstract
2009	Cleaning, Coating and Functional Climatic Reliability	Ravi Parthasarathy, M.S.Chem.Eng.	Abstract
2008	Design for Manufacturing (DfM): What Can No Longer Be Ignored	Dale Lee	Abstract
2008	MSD Controls for PWBs	Joelle Arnold and Mumtaz Bora	Abstract

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