SMTA International Conference Proceedings


LGA vs. BGA: WHAT IS MORE RELIABLE? A 2ND LEVEL RELIABILITY COMPARISON

Authors: Ahmer Syed and Robert Darveaux
Company: Amkor Technology
Date: 09/24/2000   Conference: SMTA International


Alpha

Abstract: A recent trend in portable electronics application is towards the use of Land Grid Arrays (BGAs without balls). While the Land Grid Array (LGA) package, with solder joint height of only 2 to 3 mils, offers the advantage of reduced mounted height for the package, the primary driver for its usage is the potential improvement in board level bend and drop performance. However, because of the reduced solder joint height, it is also expected that the thermal cycle performance of this package would degrade substantially compared to a similar package with balls.

This paper examines the effect of this “ball-less” package on the bend and thermal fatigue reliability. Board level reliability tests (bend and thermal cycle) as well as simulations were performed comparing the LGAs with their BGA counterparts.



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