LGA vs. BGA: WHAT IS MORE RELIABLE? A 2ND LEVEL RELIABILITY COMPARISONAuthors: Ahmer Syed and Robert Darveaux
Company: Amkor Technology
Date Published: 9/24/2000 Conference: SMTA International
This paper examines the effect of this “ball-less” package on the bend and thermal fatigue reliability. Board level reliability tests (bend and thermal cycle) as well as simulations were performed comparing the LGAs with their BGA counterparts.
Cost to download:
Members: Free! (Log on to receive the member rate)