LGA vs. BGA: WHAT IS MORE RELIABLE? A 2ND LEVEL RELIABILITY COMPARISONAuthors: Ahmer Syed and Robert Darveaux
Company: Amkor Technology
Date: 09/24/2000 Conference: SMTA International
This paper examines the effect of this “ball-less” package on the bend and thermal fatigue reliability. Board level reliability tests (bend and thermal cycle) as well as simulations were performed comparing the LGAs with their BGA counterparts.
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