SMTA International Conference Proceedings


A PERSPECTIVE ON FLIP CHIP TECHNOLOGIES IN AUTOMOTIVE ELECTRONICS

Author: Richard D. Parker
Company: Delphi Delco Electronics
Date: 09/24/2000   Conference: SMTA International


YINCAE Underfill

Abstract: The automotive environment can be one of the harshest operating environments for electronic products. Applications of electronics can be found in hostile locations such as under the hood (engine bay), on engine, and even in contact with engine or transmission operating fluids. The use of flip chip technology for this type of application has proven itself, in many applications, to be a reliable packaging technology to achieve high density electronics. This paper will describe the utilization of flip chip technology in these harsh environments. It will conclude with a discussion of upcoming technology trends for the future in flip chip applications.

Keywords: Flip chip, automotive, hybrid, packaging, underfill



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