BGA Solder Joint Integrity: A Case StudyAuthors: Dave Hillman and Ross Wilcoxon
Company: Rockwell Collins
Date Published: 5/19/2015 Conference: ICSR (Soldering and Reliability)
Abstract: Avionics equipment manufacturers are often required by customers such as Boeing, Airbus, etc. to have an Electronic Component Management Program (ECMP). The goal of the ECMP is to demonstrate that electronic components in the avionics equipment are selected and assembled in controlled processes and that reliability requirements will be met. One of these reliability requirements is the analysis/assessment of the solder joint integrity of electronic components. As part of a new design, a commercial avionics program requested an ECMP assessment of solder joint integrity for several Ball Grid Array (BGA) components. This paper describes the testing and results for one of those BGA components to illustrate the value of implementing an ECMP assessment. The paper also describes mechanical simulations used to better understand observed solder joint deformations.
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