CONSIDERATION IN THE DEVELOPMENT OF THE 01005 COMPONENT ASSEMBLY PROCESSAuthors: Joe Belmonte and Srinivasa Aravamudhan
Company: Speedline Technologies
Date: 09/25/2005 Conference: SMTA International
The use of such a miniature component presents several significant challenges to the Surface Mount Technology (SMT) Manufacturing Process. Significant process issues include solder paste selection (what powder size is required, etc.), determining the optimum printed circuit board pad size, the optimum stencil aperture design, component placement nozzle selection and maintenance, solder paste printing and component placement accuracy requirements and reflow oven profile, etc.
One particularly significant issue is designing a stencil that will optimize the printing of the 01005 components while still providing sufficient solder paste volume for the larger components on the same assembly. If the product is using both 01005 components and Pin in Paste Technology for any through hole components the stencil design issues is even more prevalent.
In conjunction with the use of 01005 components many operations are introducing lead free materials. We know that the lead free materials do not solder or wet as well as the tin lead materials. How does the introduction of lead free materials impact the development and optimization of the 01005-assembly process?
This paper will use the latest available information and our experience to explore the issues with the development and optimization of the 01005-assembly process.
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