Sponsored jointly by the SMTA and Chip Scale Review magazine, The sixth annual IWLPC will explore cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
2008 IWLPC attendance reached an all-time high! Attendees came from over 15 countries from around the world, including Austin, China, France, Germany, Hong Kong, Japan, Liechtenstein, Malaysia, Morrocco, Norway, Republic of Korea, Singapore, Sweden, Switzerland, Taiwan and the US.
EXHIBITOR DETAILS
The price to exhibit includes a draped table and two chairs, basic electrical outlet, lunch each day, one conference pass, one Keynote Dinner ticket, an electronic attendee list, show directory listing, company sign, and the 2009 IWLPC Proceedings on CD.
PLEASE NOTE: Pop-up displays can only be placed around the perimeter of the room and a limited number of these spaces are available on a first-come first-served basis. The additional exhibit spaces in the center of the room can hold literature, signs, easels etc.
Past (2008) IWLPC Exhibitors
AGC Electronics America
AI Technology, Inc.
Air Products
Amkor Technology Inc.
BEST Inc.
Brewer Science
Buckling Beam
CAD Design Software
ChipScale Review Magazine
CPS Technologies
Cyber Technologies Inc.
Dage Precision Industries Inc.
Diemat, Inc.
Electronic Trend Publications
EV Group
Finetech
Frontier Semiconductor
FRT of America
Heidelberg Instruments
Heraeus
Indium Corporation
Infinite Graphics
Ironwood Electronics
Kyzen Corporation
Liberty Research Co.
MCSP
Microfab Technologies
Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C.
Mirror Semiconductor
Muhlbauer Inc.
Nemotek Technologie
Pac Tech USA
Pacific Gate Technologies
Phoenix X-ray Systems and Services
Photo Etch Technology
Polyset Company, Inc.
Polar Twin Advance (PTA)
Promex Industries Inc.
Service Support Specialties
Silex Microsystems
Solid State Equipment Corporation
Spectra-Mat, Inc.
Surface Technology Systems
TechSearch International
Tegal Corporation
Tessera, Inc.
UMICORE
Uyemura International Corporation
WLCSP Forum
