International Conference on Soldering and Reliability
About ICSRElectronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. This EU directive officially required that it be made into national laws by January 2, 2013 and these two new categories of electronics must become compliant by July 22, 2014. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.
Keynote Address: A View of the Electronics Industry Process, Reliability, and Materials Research LandscapeMay 14, 2014
Martin Anselm, Ph.D., Manager AREA Consortium, Universal Instruments Corporation
Today, the electronic industry's OEMs and CMs are forced to comply with market trends in technologies - due to part availability or cost, and reliability testing for validation. The term "reliability" is often misused, since these tests are evaluation or qualification tests - based upon internal or customer driven standard practices, or on industry accepted standards which do not always provide pass/fail criterion. These tests are employed as best guesses for the reliability of products in the field. This condition is primarily a consequence of limited materials understanding.
We cannot ignore the current state of the economy and the evolution of business practices over the past two decades, paired with significant legislative changes, which contributes to the rate at which leaps in our understanding are being achieved. As a result OEMs and CMs have little time to perform fundamental research and often spend more time in support of individual product needs. As new materials and components become mainstream, manufacturing and "reliability" testing becomes less and less effective in producing predictable results in yield and reliability. The more fundamental research to understand the fundamentals of mechanics of failures, reliability and material properties falls on academia and consortia. Martin will discuss the current mainstream North American research landscape, reviewing some of the research groups in the industry and how each fits into the electronics market. Specific research topics will be used as examples to illustrate value for each program.
Technical Committee:Laura Turbini, Ph.D., International Reliability Consultant, Program Chair
Martin Anselm, Ph.D., Universal Instruments
Bev Christian, Ph.D., BlackBerry
Matthew Kelly, P.Eng, MBA, IBM Corporation
Polina Snugovsky, Ph.D., Celestica, Inc.
Tim Luke, Cookson Electronics Assembly Materials