International Conference on Soldering and Reliability
About ICSRElectronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacing and increased functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers to be creative in planning for the future. Assembly process challenges include the use of finer metal powders in solder pastes and novel components and packaging technologies. Due to cost considerations, new low silver or silver-free solder alloys are being evaluated. Use of alloys tailored to the application, wider variety of alloy choices, and smaller passive components are among the challenges being addressed. The engineers and scientists involved in the design and manufacture of many types of electronics equipment are now also concerned with the RoHS 2 requirements. The compliance dates are July 2014 (already past) for medical devices, monitoring and control instruments; 2016 for in-vitro diagnostic medical devices; 2017 for industrial monitoring and control equipment; and 2019 for electrical and electronic equipment, which were exempt from the original RoHS Directive. Materials, process, quality and reliability professionals need to come together to share their knowledge and vision for addressing these challenges.
Technical Committee:Program Chair:
Bev Christian, Ph.D., BlackBerry,
Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
Peter Arrowsmith, Ph.D., Ops A La Carte
Matthew Kelly, P.Eng, MBA, IBM Corporation
Polina Snugovsky, Ph.D., Celestica, Inc.
Tim Luke, Alpha
Order the 2014 Proceedings from the SMTA BookStoreNon-Member Price: $60.00
Member Price: $50.00
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-15, 2014, at the Four Points by Sheraton Toronto Airport Hotel in Toronto, ON, Canada. There are 25 technical papers on topics ranging from Tin Whisker testing and micro-Alloying to Bottom Termination Component voiding and High Temperature, High Reliability lead-free solder issues. Research was compiled from a variety of companies including Alpha, BAE International, BlackBerry, Celestica Inc., DfR Solutions, IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several renowned universities, and more.