International Conference on Soldering and Reliability

About ICSR

Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component s are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. This EU directive officially required that it be made into national laws by January 2, 2013 and these two new categories of electronics must become compliant by July 22, 2014. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.

Keynote Address: Solder Assembly Solutions for 3D IC Packaging

May 15, 2013
Charles G. Woychik, Ph.D., Director of 3D Technology and Marketing, Invensas Corporation

3D IC packaging is transitioning from the lab to commercial adoption. The arrival of the first commercial 2.5D (silicon interposer) product challenges us to question "which parts of the process and supply chain are maturing, and which parts are ripe for reinvention" Invensas has been developing HVM fine-node 2.5D interposer technology in partnership with AllVia, in conjunction with advanced micro-bumped die that accommodate interconnect schemes exceeding 10,000 I/O. Modeling of the assembly process has been used to evaluate different process flows in order to develop a high yielding, and reliable 3D package design. An overview will be given of this development activity, as well as a brief discussion of the remaining "choke-points", those areas in need of reengineering and reinvention.

Technical Committee:

Laura Turbini, Ph.D., International Reliability Consultant, Program Chair
Bev Christian, Ph.D., BlackBerry
Matthew Kelly, P.Eng, MBA, IBM Corporation
Polina Snugovsky, Ph.D., Celestica, Inc.
Tim Luke, Cookson Electronics Assembly Materials

What a Great Conference!

Thanks to everyone that participated in ICSR 2012. Attendance reached an all-time high! The conference was a resounding success and we look forward to seeing everyone next year. Please check back for details on the 2013 conference.

Order the 2012 Proceedings from the SMTA BookStore.

Non-Member Price: $60.00
Member Price: $50.00

This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 15-18, 2012, at the Crowne Plaza Hotel, Toronto, ON, Canada. There are 30 presentations on topics ranging from BGA Voids to Conformal Coating to Design for Manufacturability and Package on Package assembly issues. Research was compiled from a variety of companies including Celestica, Cookson Electronics, Creation Technologies, IBM, Indium Corporation, Intel Corporation, Nihon Superior Co., Rockwell Collins, Sandia National Laboratories, several reknowned universities, and more.