International Conference on Soldering and Reliability

Thanks for attending in 2016!

Details of the 2017 event are coming soon.

Technical Program Finalized!

The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.

View the complete technical program


Dr. Michael Osterman Announced as Keynote Speaker

Michael Osterman, Ph.D., University of Maryland

On the morning of Tuesday, May 10, Dr. Michael Osterman, University of Maryland, will deliver the keynote presentation on "Remaining Issues with Pb-Free Electronics." He will review the current risks with RoHS complaint electronics, discuss modeling approaches, and provide guidelines for implementing compliant electronics for critical applications.

Read more about the keynote presentation


Download a promotional flyer about the event!

ICSR Promotional Flyer

2015 Best Paper Goes To Dave Hillman

Dave Hillman Won Best Paper for ICSR 2015

The SMTA is pleased to announce that Dave Hillman, Rockwell Collins, won an award for Best Paper at the 9th Annual International Conference on Soldering and Reliability May 19-21, 2015 in Markham, Ontario, Canada. The winning paper is titled “BGA Solder Joint Integrity: A Case Study.” All papers presented at the conference are featured on the proceedings, available for purchase in the SMTA BookStore.

Hillman's paper describes the testing and results from an assessment of solder joint integrity for one of several Ball Grid Array (BGA) components as requested by a commercial avionics program. The results demonstrate the value of implementing an Electronic Component Management Program (ECMP) assessment which is often required by customers such as Boeing, Airbus, etc. The paper also describes mechanical simulations used to better understand observed solder joint deformations.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.