International Conference on Soldering and Reliability
Submit an abstract for 2016!
The Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is February 1st, 2016. Show off your company's expertise by presenting a paper. Abstracts can be submitted quickly and easily from the Call for Papers page.
2015 Best Paper Goes To Dave Hillman
The SMTA is pleased to announce that Dave Hillman, Rockwell Collins, won an award for Best Paper at the 9th Annual International Conference on Soldering and Reliability May 19-21, 2015 in Markham, Ontario, Canada. The winning paper is titled “BGA Solder Joint Integrity: A Case Study.” All papers presented at the conference are featured on the proceedings, available for purchase in the SMTA BookStore.
Hillman's paper describes the testing and results from an assessment of solder joint integrity for one of several Ball Grid Array (BGA) components as requested by a commercial avionics program. The results demonstrate the value of implementing an Electronic Component Management Program (ECMP) assessment which is often required by customers such as Boeing, Airbus, etc. The paper also describes mechanical simulations used to better understand observed solder joint deformations.