International Conference on Soldering & Reliability

International Conference on Soldering and Reliability

2015 Best Paper Goes To Dave Hillman

Dave Hillman Won Best Paper for ICSR 2015

The SMTA is pleased to announce that Dave Hillman, Rockwell Collins, won an award for Best Paper at the 9th Annual International Conference on Soldering and Reliability May 19-21, 2015 in Markham, Ontario, Canada. The winning paper is titled “BGA Solder Joint Integrity: A Case Study.” All papers presented at the conference are featured on the proceedings, available for purchase in the SMTA BookStore.

Hillman's paper describes the testing and results from an assessment of solder joint integrity for one of several Ball Grid Array (BGA) components as requested by a commercial avionics program. The results demonstrate the value of implementing an Electronic Component Management Program (ECMP) assessment which is often required by customers such as Boeing, Airbus, etc. The paper also describes mechanical simulations used to better understand observed solder joint deformations.

ICSR Concludes Successfully

The technical conference featured 28 presentations on topics including lead-free solders, materials as different as graphene, nanofibers and coatings, stencils for disparate-sized components, and prevention of defects like tin whiskers and head-in-pillow. Speakers represented companies including BAE Systems, Celestica, Creation Technologies, Intel Corporation, Jabil Circuit, Rockwell Collins, Verdant Electronics, and schools including University of Singapore, University of Waterloo, University of Toronto, and SUNY Binghamton.

On Wednesday, May 20, Bill Bader, CEO of iNEMI, delivered the Keynote Presentation on "Electronic Industry Collaboration - Critical 21st Century Supply Chain Tools."

Half-day workshops on Tuesday, May 19, included Effective Strategies for Selecting and Qualifying Assembly Process Material, Manufacturing Wrong: Case Studies in Nonconformance, Electrochemical Migration and Conductive Anodic Filament (CAF) Formation, and Ruggedization with Focus on Conformal Coating.

The SMTA Toronto Expo and Tech Forum ran in conjunction with the ICSR program on Thursday, May 21.

Technical Committee:

Program Chair:
Bev Christian, Ph.D., BlackBerry

Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
Peter Arrowsmith, Ph.D., Ops A La Carte
Matthew Kelly, P.Eng, MBA, IBM Corporation
Polina Snugovsky, Ph.D., Celestica, Inc.
Tim Luke, Alpha

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.