Charles Hutchins Educational Grant
The SMTA is accepting applications for the 2015 Charles Hutchins Educational Grant. This $5000 grant, given in memory of Charles Hutchins, past president of the SMTA, educator, mentor, and distinguished industry colleague, was established in 1998 to encourage graduate students to pursue careers in the electronics industry, by developing closer ties between student research and the needs of the electronics industry.
The Hutchins grant, co-sponsored by SMTA and Circuits Assembly magazine, has been awarded annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. The grant is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary. More than $95,000 has been awarded to grant recipients since 1998!
View the list of current grant donors.
In August of 2015, Christine will receive her Ph.D. in Mechanical Engineering degree from Georgia Institute of Technology, where she has also previously received her Masters in Mechanical Engineering degree. Christine also earned her Bachelors of Science degree in Mechanical Engineering from Auburn University in 2008.
The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, IL, September 28 - October 2. The 2015 grant will be presented at SMTAI in Rosemont, IL, September 27 - October 1, 2015.PAST RECIPIENTS:
Andrew Daya, Rochester Institute of Technology (RIT)
Paper: "Package on Package: A Comprehensive Study of the Profile Requirements, Alloy Combinations, Location Influence, and Reliability Performance"
Where is he now? Continuing his graduate studies
Xian Qin, Georgia Institute of Technology
Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections"
Where is she now? Continuing her graduate studies
Pylin Sarobol, Purdue University (West Lafayette, IN)
Paper: "Growth Mechanisms for the Formation of Tin Whiskers"
Where is she now? R&D Scientist and Engineer, Sandia National Laboratories
Jonathon Tucker, Purdue University (West Lafayette, IN)
Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders"
Where is he now? Reliability Engineer, Microsoft
Zhaozhi Li (George), Auburn University (Auburn, AL)
Paper: "Design, Processing and Reliability Characterizations of 3D Wafer Level Chip Scale Packaging Technology"
Where is he now? Senior Process Technology Development Engineer, Intel ATTD
Lei Nie, Ph.D., CALCE @ University of Maryland (College Park, MD)
Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Where is she now? Hardware Reliability Engineer, Lab126
Gayatri Cuddalorepatta, University of Maryland (College Park, MD)
Paper: "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
Where is she now? Continuing her graduate studies
Sungchul Joo, Georgia Institute of Technology (Atlanta, GA)
Paper: "Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
Where is he now? Research Scientist, Cree, Inc.
Leila Janessari Ladani, Ph.D., University of Maryland (College Park, MD)
Paper: "Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
Where is she now? Professor, University of Alabama
Brian McAdams, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
Where is he now? Manager Global Products, W.L. Gore
Andrew Perkins, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
Where is he now? R&D Process Engineer, Aptina Imaging
Arun Gowda, Ph.D., Binghamton University (Binghamton, NY)
Paper: "High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
Where is he now? Electronics Packaging & Miniaturization Lab Manager, GE Global Research
Renzhe Zhao, Ph.D., Auburn University (Auburn, AL)
Paper: "Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
Where is he now? Chief Technologist, Huawei Technologies Co.
Jennifer Venton Muncy, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Flip Chip on Flex for Low Cost Electronic Packaging"
Where is she now? Technology Development Manager, IBM Semiconductor Research and Technology Center
Anita Sargent, Binghamton University (Binghamton, NY)
Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
Where is she now? OB/GYN Resident, Yale Medical Center
Daniel Lewis, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Solidification of Ternary Alloys"
Where is he now? Professor, Rensselaer Polytechnic Institute
R. Wayne Johnson, Ph.D., Chair, Tennessee Tech University
Scott J. Anson, Ph.D., P. Eng., LeTourneau University
Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Corporation
Andrew Daya, Schlumberger
Li Jiang, Texas Instruments, Inc.
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Steven Lustig, The Coca Cola Company
Luu T. Nguyen, Ph.D., Texas Instruments Inc.
Andrew Perkins, Ph.D., Aptina Imaging
(2003 Hutchins Grant Recipient)