Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

8:30AM
Registration opens

The SMTA Michigan Chapter would like to invite you to attend two technical presentations from renowned technical instructor Phil Zarrow of ITM Consulting.

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.

9:00AM – 10:30AM
The 10 Deadly Sins of SMT and Lead Free Assembly

During the course of our assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, "do-over". This presentation identifies the "deadly sins" of SMT assembly, both for Pb-free and "leaded" processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor

2:00PM - 4:00PM
Low Volume – High Mix Electronic Manufacturing

In many regards, Low Volume electronic assembly can be far more demanding than manufacturing high volume of a product. Add to this a high mix of products and the challenges involved in maintaining quality and efficiency become very perplexing. Sadly, many low volume – high mix manufacturers succumb to the difficulties and this becomes apparent at the bottom line. This presentation examines the complications of low volume assembly and presents concepts and adaptations that work.

2:00PM
Raffle on Exhibit Floor - Special thanks to our raffle sponsors:

The SMTA Michigan show is SOLD OUT! If you are interested in getting on the waiting list please contact SMTA Director of Exhibitions Emmy Garner .

Important Exhibitor Materials:

Contact Patti for available booth space. 952-920-7682 or patti@smta.org

Please note that exhibit traffic will be minimal while symposium is in session.
Full conference info is available here.

Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to:

Download a hard copy of the registration form

Cost to exhibit:

Booth type	CALCE/SMTA Members	Non-Members
One table includes access to Electrical Outlet	$450	$550
One table no access to Electrical Outlet	$400	$500

Sponsorship Opportunities:
Click here to download more information.

Coffee Break Sponsor - $500 (per day)

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

9:00AM
Registration opens

The SMTA Upper Midwest Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:30AM – 10:15AM
Determine Critical Cleaning Process Parameters for QFN's
Jigar Patel, M.S. Chemical Engineer, ZESTRON

QFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm.

11:00AM – 11:45AM
Boundary Scan Integration on Flying Probe Testers
Zinnour Soultanov, Principal Test Applications Engineer, SPEA America

Boundary Scan Test integration into Flying Probe Testers has been a long sought after capability in the Electronics Industry. The most recent integration is the latest generation flying probe system that includes latest generation boundary scan hardware and software. The boundary scan hardware uses synchronously the TAP port and the flying probes to drive and sense signals on the board. The two technologies exchange information through shared DLL’s and software to ensure the test flow is optimized and the test coverage is maximized.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor

2:00PM - 2:45PM
Options for Printing Fine Features and Breaking Though the Traditional .66 Area Ratio
Mike Burgess, DEK Printing Machines

Component miniaturization continues to pushthe limits of industry accepted manufacturing guidelines and the capabilities of modern printing machines. Breaking through the boundaries of traditional stencil design area ratios of 0.66is now necessary to assemble common everyday circuit boards. Achieving acceptable solder paste release with high transfer efficiency can be a challenge. Advancements in stencil materials, laser cutting machines and solder paste certainly aid the process, but are they enough?

Special thanks to our Technical Session Sponsor:

2:00PM
Raffle on Exhibit Floor

The SMTA Upper Midwest show is SOLD OUT! If you are interested in getting on the waiting list please contact SMTA Director of Exhibitions Emmy Garner .

Current Exhibitor List:

AIM All Flex Flexible Circuits & Heaters Amitron Corporation Apex Factory Automation ASC International, Inc. Ascentec Engineering Ayrshire Electronics Batten & Allen Benchside Technologies BEST Inc. Burton Industries Circuit Check Inc. Cobar Solder Products, Inc. Conductive Containers, Inc. Coridian Technologies, Inc. DEK USA Digitaltest, Inc. E-Tool E-tronix Electronic Systems Inc. Electrotek Corporation Ellsworth Adhesives EPTAC Corporation FCT Assembly FocalSpot, Inc. IDENTCO International

Indium Corporation JMW Enterprises, Inc. JW Sales Krayden, Inc. Kyzen Corporation LaserJob Inc. Multicircuits Nikon Metrology Nordson DAGE Nordson YESTECH Omni-Tronics, Inc. Panasonic Factory Solutions of America Production Automation (P.A.C.) PROMATION, Inc. Prototron Circuits Inc. REStronics Northland Seika Machinery, Inc. SPEA America Stanley Supply & Services StenTech Ltd. Syntek, Inc. Texmac/Takaya Inc. Tonka Electronics, Inc. Universal Instruments VI Technology Viasystems ZESTRON Corporation

Companies in bold are SMTA corporate members

Coming Soon!

Free Technical Program & Schedule:

9:00AM
Registration opens

The SMTA Philadelphia Chapter would like to invite you to attend the following technical presentations from four renowned technical speakers.

9:30AM – 10:15AM
Avoiding Counterfeits When Addressing Component Obsolescence
David Steele, Da-Tech

11:00AM – 11:45AM
TBD
Chrys Shea, Shea Engineering Services

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor

1:00PM - 1:45PM
PCB Cleaning After Rework (Some Spot Clean Better than Others)
Debbie Carboni, Kyzen Corporation

Most assembly houses have various forms of spot cleaning or bench top cleaning in at least one stage. Whether it is an aerosol cleaning solvents, IPA in a pump bottle, or a pan with some chemistry, brush, swab, or wipe: Assemblers’ seem to always struggle achieving consistent results with a manual cleaning process. Do you wonder why your IPA doesn’t seem to work like it did 5 years ago? Do you know what causes contamination relocation? Do you how to determine what the best cleaning agent is at the bench? These are just a few of the questions that will be reviewed. This presentation will discuss the influencing factors for inconsistency in cleaning as well as the precautions you can take to improve spot cleaning methods.

2:00PM - 2:45PM
Conformal Coating Compatibility with No-clean Fluxes
Mitch Holtzer, Alpha

Special thanks to our Technical Session Sponsor:

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

TBD

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitons Emmy Garner with questions or for additional information.

Free Technical Program & Schedule:

Coming Soon!

Exhibitor Floorplan

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.

Please note that exhibit traffic will be minimal while symposium is in session.

Exhibit space at the Medical Electronics Symposium entitles you to:

Coming Soon!

Important Exhibitor Materials:
Coming Soon!

Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.