Upcoming Expos

SMTA Expos

Local Expos and Tech Forums have become one of the great benefits of local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

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All 2014 Shows Added!

August 12, 2014 Philadelphia Expo & Tech Forum
August 14, 2014 West Penn Expo & Tech Forum
September 9, 2014 Capital Expo & Tech Forum
September 18 - 19, 2014 Medical Electronics Sponsorship and Table Top Exhibit
September 18, 2014 Empire Expo & Tech Forum
October 14, 2014 Austin CTEA Expo & Tech Forum
October 15, 2014 Long Island Expo & Tech Forum
October 22, 2014 Connecticut Expo & Tech Forum
September 30 - 1, 2014 SMTA International Electronics Exhibition
October 23, 2014 Intermountain (Utah) Expo & Tech Forum
November 6, 2014 LA/Orange County Expo & Tech Forum
November 11 - 12, 2014 IWLPC- Wafer-Level Packaging Conference & Exhibition
November 18 - 20, 2014 High-Reliability Cleaning and Conformal Coating Conference - Expo
November 19, 2014 Arizona Expo & Tech Forum
December 4, 2014 Tampa Bay and Space Coast Expo & Tech Forum







Philadelphia Expo & Tech Forum

Tuesday August 12, 2014
Location: Crowne Plaza Philadelphia Cherry Hill
2349 Marlton Pike West
Cherry Hill, NJ 08002
Show Hours: 10:00am - 3:00pm

Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule

9:30am – 10:00am
Enabling Technologies for Broadband Printing
Chrys Shea - President, Shea Engineering Services

Tom FoleySuccessful broadband stencil printing must produce consistent solder paste deposits for an extensive mix of electronic components all on the same PCB. Miniaturized packages typically use thinner stencils, whereas larger or PTH components require thicker stencils. These contradictory demands often result in process tradeoffs, secondary paste deposition processes, hand-soldering or other cost/quality compromises. Elements of broadband printing are continuously being researched and improved. This presentation reviews the latest advances in stencil technologies to enable better print quality, yields and overall effectiveness. Topics include transfer efficiency, stencil design and stepping, BTC/QFN considerations, preforms, stencil alloy and manufacturing processes, and the effect of nanocoatings. It summarizes the results of recent research and development projects to provide a practical reference for the current state of broadband printing technologies.

11:15am – 12:00pm
Underfill Encapsulants and Edgebond Adhesives for Enhancing on Board Level Reliability
Karl Loh - President and Co-Founder, Zymet, Inc.

Phil IssacsWith the proliferation of area array packages in consumer, enterprise, military, and automotive electronics, a wide range of board level underfills and edgebond adhesives, reworkable and non-reworkable, have been developed to ruggedize these components. While these materials are used to enhance drop test, bend test, and vibration test performance, their use can affect thermal cycle performance, negatively or positively. The trade-offs between process performance, rework, and reliability, along with advances to overcome the trade-offs are discussed.

12:00PM - 1:00PM
Free Lunch on Show Floor!

1:00pm – 1:45pm
Design for Cleaning
Debbie Carboni - Mid-Atlantic Regional Manager, Kyzen Corporation

Michael HavenerDesign complexities and functionality requirements are continually decreasing spacing between conductors. As devices decrease in size, contamination can lead to unavoidable and unwanted malfunctions. Contamination trapped under components can result in electro-chemical migration, leakage currents and stray capacitance in an electronic circuit due to high voltage and frequency. Cleaning is used on many designs to mitigate this issue. However, very little to no consideration is accounted for this during the product development process to address the cleaning process. Cleaning process is almost always a throw it over the wall issue for manufacturing to address as part of their process design. Factors such as the density of components, component layout, thermal heat requirements, and standoff height/clearance are key considerations. This presentation will highlight research performed on passive, BGA and QFN packages to identify the effects of solder mask clearance and land pattern design on ability to remove flux residues and improve cleanliness of solder electronic assembly.

2:15pm – 3:00pm
A Thick Film Solution to HOT Problems in Electronics
Ryan Persons - Technical Service Engineer, Heraeus

Michael HavenerWhen it comes to light emitting diode (LED) technology, thermal management is typically one of the top issues in regards to reliability concerns over their lifetimes. An LED’s output is roughly 15-20% light, while the remaining 80-85% is solely heat generation. Unlike an incandescent light this heat must be removed by conduction through the fixture, not radiated through the lens. For every 10C increase in an LED’s junction temperature, the life time and lumens flux typically decreases by roughly half. To combat these thermal management issues, thick film materials can be used to provide reliable circuitry on substrates with high thermal conductivities like Aluminum Nitride, Beryllium Oxide, and aluminum metal. These thick film materials have proven to be robust and reliable for LED circuits while providing decreased thermal resistance and streamlined processing. This presentation will discuss the advantages and disadvantages of a variety of thick film LED substrate solutions, including traditional thick film techniques and unique thick film materials on aluminum metal substrates. The paper will include not only technical attributes but also processing and cost comparisons. There are many ways to deal with the issues regarding thermal management of LED’s, but thick film materials are quickly taking a front seat to managing this HOT issue.


Current Exhibitor List:

AIM
Alpha
Apex Factory Automation
Ascentec Engineering
AVID Associates Inc.
Bare Board Group
BOFA Americas
BROCK Electronics
Conductive Containers, Inc. (CCI)
Dynamic & Proto Circuits
Eltek USA Inc.
FCT Assembly
Glavin Industries, Inc.
Indium Corporation
K&L Services Group Inc.
Kyzen Corporation
MatriX-FocalSpot
MET Associates
Nikon Metrology, Inc.
Nordson Test and Inspection
PACE Worldwide
PFC Flexible Circuits Limited
Phoenix United Associates, Inc.
PNC Inc.
Prototron Circuits
REStronics
RS Simmons Co., LLC
Seika Machinery, Inc.
Stanley Supply & Services
StenTech Ltd.
The Test Connection, Inc.
Trace Laboratories, Inc.
UTZ Technology
W. J. Murphy Associates, Inc.
Weller
Wurth Electronics Midcom
ZESTRON America
Zymet, Inc.

Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on July 25th, 2014!

Important Exhibitor Materials:

  • Exhibitor Floorplan
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    West Penn Expo & Tech Forum

    Thursday August 14, 2014
    Location: DoubleTree Monroeville
    101 Mall Plaza Blvd.
    Monroeville, PA 15146
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    9:30am – 10:15am
    Balancing PCB Reliability and Signal Performance
    Andy Cameron - Field Application Engineering Manager, TTM Technologies North America

    Tom Foley

  • Dielectric Materials – Testing CAF, Delamination Resistance
  • Glass Fabric Styles
  • Copper Distribution – Dielectric Thickness Variation
  • Signal Thickness and Width Characteristics
  • Signal Roughness Characteristics
  • Interconnect Backdrilling
  • Insertion Loss Testing in Fabrication

  • 11:15am – 12:00pm
    Concentration Monitoring & Closed Loop Control – A Technological Advancement
    Ravi Parthasarathy - Senior Process Engineer, ZESTRON America

    Phil IssacsAs with every process on the production floor, in order to ensure a reliable, repeatable and cost efficient cleaning process, it is vital that all process parameters be monitored and ultimately controlled. Equipment suppliers have done their part to ensure that parameters such as temperature, pressure, flow rate, and process exposure time are accurately controlled but wash bath cleaning agent concentration has until today been a challenge given the available monitoring technology. Historically refractive index, either in the form of hand held devices or automated systems, has been the tool of choice to measure concentration of a solute in an aqueous solution. With fresh wash bath, refractive index is very accurate. However, as the wash bath becomes contaminated, that is accumulates impurities including flux residue resulting from the cleaning process, the refractive index reading will be skewed yielding an erroneous measurement, resulting in a false correction and ultimately an unstable process.

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    2:00pm – 2:45pm
    The Role of Highly Accelerated Reliability Testing in Product Design, Manufacturing, and Counterfeit Design
    Neill Doertenbach - Senior Applications Engineer, Qualmark

    Michael HavenerThere are two opportunities to introduce failure modes in a product. The first is during design, inadequate design margins will cause higher field failure rates. The second is in manufacturing, process variability will introduce faulty and marginal product to be shipped to the customer. Today’s reliability processes have allowed the electronics industry to meet very high levels of product reliability using newer available tools such as the current generation of analytics and Highly Accelerated Stress Testing. Today’s market place demands shorter time to market while also demanding higher reliability. All of this with reduced resources. Engineers are wearing multiple hats and trying to meet shorter deadline.


    Current Exhibitor List:

    Argo/Zeta Company
    Ascentech LLC - GEN3 SYSTEMS Ltd.
    Ascentech LLC - Optillia Instruments AB
    Bisco Industries Inc.
    BOFA Americas, Inc.
    Brock Electronics Ltd.
    Conductive Containers, Inc. (CCI)
    Conformance Technologies
    Electronic Assembly Products, Ltd.
    Electrotek Corporation
    Eltek USA Inc.
    EPTAC Corporation
    ERSA North America
    FCT Assembly
    Glavin Industries, Inc.
    Indium Corporation
    KOKI Solder America
    Kyzen Corporation
    Lynn Associates
    Matric Group
    MatriX-FocalSpot
    Midwest Circuit Technology
    Murray Percival Company
    PACE Worldwide
    Panasonic Factory Solutions Company of America
    PFC Flexible Circuits Limited
    Phoenix United Associates, Inc.
    Photo Etch Technology
    PNC Inc.
    RBB Systems
    RS Simmons Co., LLC
    Seika Machinery, Inc.
    Smart Splice LLC
    StenTech Ltd.
    TAGARNO USA
    Test Research Inc.
    The Test Connection, Inc.
    ZESTRON America

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on July 24th, 2014!

    Important Exhibitor Materials:

  • Exhibitor Floorplan

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Capital Expo & Tech Forum

    Tuesday September 9, 2014
    Location: Johns Hopkins University/Applied Physics Lab
    11100 Johns Hopkins Rd.
    Laurel, MD 20723
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    9:30am – 10:00am
    Between Stimulus and Response There is a Space
    Mark Young - Master Instructor, EPTAC Corporation

    Mark YoungWhy are we doing what we do? Is it to discover substandard/counterfeited parts? Is it to reveal the latest trend or technique in counterfeiting? Is it to insure that our supply lines continue with authenticity? Or is there a nobler reason in why we do what we do? Counterfeiting detection techniques continue to evolve as does the counterfeiters. There have been and will continue to be great strides made in the advancement of detection of the newest counterfeiter's techniques. I trust that this presentation will not only bolster our resolve in pursuing our customer's confidence in these areas, but ultimately, the trust we each have placed in those relationships.

    11:15am – 12:00pm
    Design for Reliability
    Craig Hillman - CEO and Managing Partner, DfR Solutions

    Craig HillmanWhy Design for Reliability? The foundation of a reliable product is a robust design which provides margin, mitigates risk from defects, and satisfies the customer. Ensuring reliability of electronic designs is becoming increasingly difficult due to:

  • Increasing complexity of electronic circuits
  • Increasing power requirements
  • Introduction of new component and material technologies
  • Introduction of less robust components
    This results in multiple potential drivers for failure.

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    1:00pm – 1:45pm
    The New In-Circuit Test - How ICT Systems Have Changed and Expanded Their Roles to Keep Pace with Modern PCB Manufacturing Test Challenges
    Alan Albee - Product Manager, Teradyne, Inc.

    Alan AlbeeIn-Circuit Testing, first introduced more than 30 years ago, is considered a mature technology that is part of the manufacturing test toolkit of most quality conscious PCB manufacturers. Many manufacturers that are still successfully utilizing in-circuit test systems that were acquired years ago on their production floors may not realize the numerous advancements and capabilities available in the new brand of in-circuit test systems that have kept them relevant in the face of constantly changing PCB manufacturing test challenges. This presentation will discuss how new in-circuit test systems differ from their predecessors with expanded test roles that incorporate innovative electrical test techniques, adaptive test strategies that take advantage of built in test PCB capabilities and design constraints and scalable performance flexibility to meet the industry demands for faster, smarter, safer, smaller, and more cost effective systems.

    2:15pm – 3:00pm
    Top Five Leading Trends in Test and Automation
    James Ramsey - Account Manager, National Instruments
    Josh Liu -Field Engineer, National Instruments

    National InstrumentsNational InstrumentsWith over 30,000 customers in the test and measurement industry, National Instruments, through corporate partnerships and customer feedback, has identified five leading trends in the global automated test market in 2014. Come join us to learn about these trends, their impact on the industry, and how National Instruments software designed instruments meet these challenges.


    Current Exhibitor List:

    AIM
    Ascentech LLC - GEN3 SYSTEMS Ltd.
    Ascentech LLC - Optilia Instruments AB
    Colonial Circuits Inc.
    Conecsus LLC
    Easy Braid Company
    Electrotek Corporation
    Fablicator 3D Printer - K&L Services Group Inc.
    FCT Assembly
    Gardner & Meredith Inc.
    Indium Corporation
    INVENTEC Performance Chemicals
    Ironwood Electronics
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Nikon Metrology, Inc.
    Nordson Test and Inspection
    Panasonic Factory Solutions Company of America
    Prototron Circuits
    RS Simmons Co., LLC
    Smart Splice LLC
    The Test Connection, Inc.
    Trace Laboratories, Inc.
    Weller
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on August 22nd, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Medical Electronics Sponsorship and Table Top Exhibit Medical Electronics Sponsorship and Table Top Exhibit

    Thursday September 18, 2014 - Friday September 19, 2014
    Location: Marylhurst University
    Portland, OR


    Current Exhibitor List:
    Air-Vac Engineering Company
    Business Oregon
    Corfin Industries
    CORWIL Technology Corporation
    Delphon
    Ellsworth Adhesives
    ELTEK, Ltd.
    Fotofab LLC
    Integra Technologies
    INVENTEC Mexico
    LaserJob Inc.
    LPKF Laser & Electronics
    Manufacturing Services Inc.
    Micro Systems Technologies
    Nikon Metrology, Inc.
    NyeLubricants
    ONAMI
    Optiprint AG
    Palomar Technologies, Inc.
    PFC Flexible Circuits Limited
    Promex Industries
    Qualicent Analytics
    Silex Microsystems
    Silicon Forest Electronics
    Sonoscan, Inc.
    The Pentagon Company
    TPP (Total Parts Plus)
    Valtronic USA
    Yxlon FeinFocus

    Companies in bold are SMTA corporate members
    Exhibitors

    Sponsorship Information

    Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the Sponsorship Benefits link below. For more information contact Gina Edwards at MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Sponsorship Benefits

    Table Top Exhibitor Information - Sold Out!*

    *A few tables are still available but are being held for sponsorships. There may be a possibility that some additional spaces will be added for exhibitors but we won’t know for a couple of weeks due to some reconfiguration of the exhibit area currently underway. Please e-mail Patti Coles to be put on a waiting list for the exhibits at patti@smta.org or 952-920-7682; and for sponsorship information please contact Gina Edwards, MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings
  • Exhibit Pricing:

    Member* Before 8/1/2014 After 8/1/2014
    (*iNEMI/MEPTEC/OregonBio/SMTA) $795 $895
     
    Non-member: $895 $995


    Exhibit Hours:
    September 18: 10:00am – 5:00pm
    September 19: 10:00am – 1:00pm

    Please note that exhibit traffic will be minimal while symposium is in session.






    Empire Expo & Tech Forum

    Thursday September 18, 2014
    Location: Radisson Hotel Rochester Airport
    175 Jefferson Road
    Rochester, NY 14623

    Attendees
    Attendees Register Now

    Please see the Empire Chapter Page for More Information on Technical Sessions and Expo Materials.

    Exhibitors
    The cost to exhibit is $225 for corporate members. (click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

    Please contact SMTA Director of Exhibitions Emmy Ross or Jodi Wahl with questions or for additional information.






    Austin CTEA Expo & Tech Forum

    Tuesday October 14, 2014
    Location: Norris Conference Center
    2525 West Anderson Lane
    #365
    Austin, TX 78757
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    Coming Soon!


    Current Exhibitor List:

    BOFA Americas
    Conductive Containers, Inc. (CCI)
    Eatman Associates
    FCT Assembly
    INVENTEC Performance Chemicals
    KutzSales
    Kyzen Corporation
    MatriX-FocalSpot
    Nikon Metrology, Inc.
    Nordson Test and Inspection
    NPI Technologies, Inc.
    Panasonic Factory Solutions Company of America
    SMEC, Inc.
    Southwest Sytems Technology, Inc.
    Specialty Coating Systems

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 12th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Long Island Expo & Tech Forum

    Wednesday October 15, 2014
    Location: Islandia Marriott Long Island
    3635 Express Drive North
    Islandia, NY 11749
    Show Hours: 10:00am - 3:00pm

    Attendees
    Attendees Register Now

    Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Director of Exhibitions Emmy Ross or Sharon Dietrich with questions or for additional information.






    Connecticut Expo & Tech Forum

    Wednesday October 22, 2014
    Location: Waterbury Marriott
    63 Grand Street
    Waterbury, CT 06702
    Show Hours: 10:00am - 3:00pm

    Attendees
    Attendees Register Now

    Please see the Connecticut Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Director of Exhibitions Emmy Ross or Mark Siems with questions or for additional information.






    Intermountain (Utah) Expo & Tech Forum

    Thursday October 23, 2014
    Location: University of Utah
    Warnock Engineering Building (main lobby)
    72 S. Central Campus Drive
    Salt Lake City, UT 84112
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    Coming Soon!


    Current Exhibitor List:

    Accurate Carriers Inc.
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Nikon Metrology, Inc.
    Panasonic Factory Solutions Company of America
    PFC Flexible Circuits Limited
    Schoeller Electronics GmbH
    Semipack Services Inc.
    Smart Splice LLC
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 3rd, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    LA/Orange County Expo & Tech Forum

    Thursday November 6, 2014
    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    11:00am – 11:30am
    Determine Critical Cleaning Process Parameters for QFN's
    Naveenkamal Ravindran - Application Engineer, ZESTRON America

    NaveenQFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm. Since the leads of the QFN package do not extend out from the component body, but are located underneath the component body, cleaning the flux residues after the soldering process becomes a challenge. The low standoff associated with such components, typically 1 mil, and the large thermal pad at the center of the component body pose barriers to the complete removal of flux residues. Partially removed or untouched residues can lead to component failure resulting from electrochemical migration and dendritic growth as well as electrical leakage currents. This study is designed in two phases and will determine the critical cleaning process parameters for complete cleanliness underneath leadless devices or QFN's. Two groups of paste types will be used; lead-free water soluble and lead-free no-clean. The cleaning process will employ an aqueous alkaline cleaning agent and spray-in-air cleaning equipment. The goal of each phase is as follows: Phase 1: Determine the critical wash process parameters and cleaning equipment settings for QFN components Phase 2: Utilizing process parameters from Phase 1, verify cleaning results by using an industry standard test board. Cleanliness will be assessed via visual inspection for Phase 1 and visual inspection and Ion Chromatography analysis for Phase 2.

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    1:00pm – 1:30pm
    Ask the Experts About Contract Manufacturing/OEM Challenges
    Moderator - Barbara Kangesberg - BFK Solutions
    Panelists:

  • Doug Dills - Scienscope
  • Andy Mitchell - Consultant
  • Tom Seratti - Stratesys Group
  • David Tuza - I-Source
  • Steve Unszusz - W5 Test Solutions

    Take advantage of this interactive session to ask the experts about technical problems involving miniaturization, assembly complexity, product diversity, stencils, inspection/testing, contamination control/cleanrooms, component quality, coating, and ever-increasing customer expectations. Ask us about costs and about addressing SCAQMD and Federal regulations. Develop the knowledge to assure that, when your customers consider electronics assembly and rework services, your company stands out from the competition.

    2:00pm – 2:30pm
    Design for Manufacturing Managing New Generations of High Density Surface Mount Components
    Vern Solberg - Solberg Technical Consulting

    Vern SolbergAs technology advances, electronic packaging has become more sophisticated and more complex. Many of the new IC device families have more I/O and finer contact pitch than their predecessors, dramatically affecting the methodology used in board design and assembly processing. When adapting the QFN, BGA and CSP families of ICs in particular, the designer must have a clear understanding of PC board fabrication tolerances, assembly process principles and realistic expectations for machine placement accuracy. The most successful SMT programs are those that have implemented process proven circuit board design rules. These rules specifically define the geometry and spacing of the land patterns for surface mount devices. Adhering to these rules will influence manufacturing efficiency as well as contribute to product quality and reliability. Only when PCB design related disciplines are properly defined and implemented, can maximum assembly process yield be achieved.This presentation will focus on a number of key disciplines that can enable successful implementation of QFN package technology, high-density BGA and fine-pitch chip-scale BGA device families. All of these package technologies offer improved product performance and reduced product size, but land pattern geometry, circuit routing and assembly processing have become more complex. When adapting these newer, and often higher l/O package families, the designer and process engineer must recognize disciplines, capabilities and limitations within each other's realm. In addition, each must have an understanding of the industry standards and tolerances that control IC packaging and the requirements established by the industry for the attachment of these devices to the PC board.


    Current Exhibitor List:

    Ascentec Engineering
    Creative Electron, Inc.
    EPTAC Corporation
    Fuji America Corporation
    Indium Corporation
    INVENTEC Performance Chemicals
    Ironwood Electronics
    Koki Solder America
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Nikon Metrology, Inc.
    NPI Technologies, Inc.
    Panasonic Factory Solutions Company of America
    PFC Flexible Circuits Limited
    Weller
    Weller-Tools
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 17th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    IWLPC- Wafer-Level Packaging Conference & Exhibition
    Note - If you already registered for the conference you do not need to register separately for the expo

    Tuesday November 11, 2014 - Wednesday November 12, 2014
    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110

    Attendees

    Current Exhibitor List:
    Aehr Test Systems  #44
    AGC Electronics Americas  #52
    AI Technology, Inc.  #43
    AMICRA Microtechnologies GmbH  #11
    Amkor Technology Inc.  #16
    Applied Materials, Inc.  #41
    Axus Technology  #33
    Chip Scale Review  #24
    Conductive Containers, Inc.  #3
    CORWIL Technology Corporation  #32
    CORWIL Technology Corporation  #32
    Deca Technologies  #36
    EV Group  #42
    FRT of America  #15
    Hesse Mechatronics, Inc.  #4
    i2a Technologies  #48
    IMAT, Inc.  #40
    Invensas Corporation  #34
    Inventec Performance Chemicals Mexico  #57
    Johnstech International  #1
    Kita USA  #45
    KLA-Tencor  #31
    LaserJob, Inc.  #47
    LB Semicon  #26
    MCT Worldwide LLC  #37
    Mühlbauer, Inc.  #46
    NAMICS  #12
    NANIUM S.A.  #28
    Nordson DAGE  #39
    Orbotech, Inc.  #14
    Owens Design  #23
    Pac Tech USA  #27
    Panasonic Factory Solutions Company of America  #7
    Plasma-Therm, LLC  #35
    Promex Industries Inc.  #38
    Ridgetop Group, Inc.  #58
    S-Cubed  #10
    SavanSys Solutions LLC  #20
    SET North America  #19
    Silex Microsystems  #21
    Smiths Connectors - IDI  #17
    Sonoscan, Inc.  #22
    Suss MicroTec, Inc.  #25
    Toray International America Inc.  #18
    Triton Micro Technologies, Inc.  #53
    Unisem  #13
    XYZTEC  #5
    Yield Engineering Systems, Inc.  #6
    YXLON  #8

    Companies in bold are SMTA corporate members
    Exhibitors
    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 10:00am – 5:30pm
    Wednesday, November 12th, 10:00am – 3:30pm

    To Register for a FREE Exhibits Attendee Pass, click here.


    Download Exhibitor Application

    View the floor plan

    Registered Exhibitor Details

    Exhibitor
    Why Exhibit at IWLPC?
    * Reach a focused international audience
    * Generate Exposure in this highly competitive marketplace
    * Share New Products and concepts to the market
    * Enhance Relationships with existing customers and generate new leads

    What's Included?

  • Full Pipe and Draped Booths, 8’x10’ and 8’x8’ Sizes Available (See Floor Plan)
  • Two Free Lunches Per Day
  • Coffee Breaks
  • All Access to the Reception
  • Attendee List
  • Show Directory Listing
  • Company Sign
  • IWLPC Proceedings Flash Drive
  • One Conference Pass (a $700 value)

  • How Much is it to Exhibit?
    Early-Bird Rates: On/Before August 8th: SMTA Member $1,150 | Non-Member $1,300
    Electricity $50
    After August 8th costs increase by $150

    Can I Sponsor?
    Numerous levels are available. Find more info here.
    Email your completed form to: Kim Newman at Chip Scale Review knewman@chipscalereview.com or fax to 408-429-8605
    Questions? Contact Kim Newman at 408-429-8585 or knewman@chipscalereview.com.

    Questions?
    Please contact your Chip Scale Review sales representative or Patti Hvidhyld - Coles from SMTA with questions or for more information.

    Sponsorship Opportunities


    View available Sponsorship Opportunities

    Show Directory Advertising Opportunities

    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!






    High-Reliability Cleaning and Conformal Coating Conference - Expo High-Reliability Cleaning and Conformal Coating Conference - Expo

    Tuesday November 18, 2014 - Thursday November 20, 2014
    Location: Marriott Schaumberg
    Schaumberg, IL

    Exhibitors

    Tabletop Exhibit

    Cost: $1200 IPC or SMTA member/$1500 non member

  • One six foot table to be located in the break area
  • One electrical outlet
  • Company logo on all electronic and printed promotional materials
  • Logo on all on-site printed materials
  • List of Conference participants (after the event)
  • One complimentary Conference registration for tabletop staff
  • Additional conference registration at a 25% discount

    Download the application to exhibit

    Sponsorship Opportunities

    Badge Lanyards, exhibitor provided $800 IPC or SMTA member / $1,000 nonmember

    Networking Opportunities

    Benefits Include:
  • Recognition as Event Sponsor on all electronic and printed promotional materials
  • Company logo on agenda and on-site signage
  • Recognition announced at the beginning and end of sponsored function

    Networking Reception (Tuesday) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Luncheons

    Tuesday (box lunch) $1,000 IPC or SMTA member /$1,200 nonmember

    Wednesday (seated luncheon) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Thursday (box lunch) $1,000 IPC or SMTA member / $1,200 nonmember

    Conference Refreshment Breaks $1,500 IPC or SMTA member / $1,900 nonmember

    For more info about the program and to register for the conference, click here.






  • Arizona Expo & Tech Forum

    Wednesday November 19, 2014
    Location: Marriott Phoenix Tempe at The Buttes
    2000 Wescourt Way
    Tempe, AZ 85282
    Show Hours: 10AM-3PM

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    TBD


    Current Exhibitor List:

    Indium Corporation
    INVENTEC Performance Chemicals
    ZESTRON America

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird pricing ends on October 31st, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Tampa Bay and Space Coast Expo & Tech Forum

    Thursday December 4, 2014
    Location: Park Inn by Radisson
    3011 Maingate Lane
    Kissimmee, FL 34747

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    Coming Soon!


    Current Exhibitor List:

    BOFA Americas
    Conductive Containers, Inc
    FCT Assembly, Inc.
    GPD Global
    Indium Corporation
    Kyzen Corporation
    METCAL
    Nikon Metrology, Inc.
    PVA
    Tropical Stencil, Inc.
    ZESTRON

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on November 7th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Cancellation Policy: Please note that exhibit fees will not be refunded if exhibitor cancels exhibit space.