Upcoming Expos

SMTA Expos

Local Expos and Tech Forums have become one of the great benefits of local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

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Sign up for multiple Expos at once!
All 2014 Shows Added!

September 18, 2014 Empire Expo & Tech Forum
October 14, 2014 Austin (CTEA) Expo & Tech Forum
October 15, 2014 Long Island Expo & Tech Forum
October 15 - 16, 2014 Guadalajara Expo & Tech Forum
October 22, 2014 Connecticut Expo & Tech Forum
October 23, 2014 Intermountain (Utah) Expo & Tech Forum
November 6, 2014 LA/Orange County Expo & Tech Forum
September 30 - 1, 2014 SMTA International Electronics Exhibition
November 11 - 12, 2014 IWLPC- Wafer-Level Packaging Conference & Exhibition
November 18 - 20, 2014 High-Reliability Cleaning and Conformal Coating Conference - Expo
November 19, 2014 Arizona Expo & Tech Forum
December 4, 2014 Space Coast and Tampa Bay Expo & Tech Forum







Empire Expo & Tech Forum

Thursday September 18, 2014
Location: Radisson Hotel Rochester Airport
175 Jefferson Road
Rochester, NY 14623
Show Hours: 11:00 AM

Attendees
Attendees Register Now

Please see the Empire Chapter Page for More Information on Technical Sessions and Expo Materials.

Exhibitors
The cost to exhibit is $225 for corporate members. (click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

Please contact SMTA Director of Exhibitions Emmy Ross or Jodi Wahl with questions or for additional information.






Austin (CTEA) Expo & Tech Forum

Tuesday October 14, 2014
Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757
Show Hours: 10:00am - 4:00pm

Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule

10:30am – 11:00am
Moving from Data to Meaning: Communicating Effectively in Technical Presentations
Melissa Murphy - Communications Coach, University of Texas at Austin
Melissa Murphy
Presentations often do not pass the “toddler test.” Are your presentations simple enough that a “toddler” can understand what you are saying? Are your presentations engaging enough to maintain the attention span of a “toddler”? Technical presentations, like most business presentations, are susceptible to complex jargon, complicated visuals, mundane monotone delivery and data overkill. The techniques covered in "Communicating Effectively in Technical Presentations" will teach you to pass the toddler test to ensure a successful presentation that will keep your
audience engaged as well as meet your goals as a communicator.

11:30am – 12:00pm
Update on Counterfeit Electronic Components
Jason Jowers - Quality and Operations Director, Velocity Electronics
Jason Jowers
A discussion about the proliferation of counterfeit electronic components, techniques with which companies can secure their supply chains, US government initiatives geared at keeping counterfeit components from entering the military supply chain, and industry standards related to counterfeit components.

12:00pm - 1:00pm
Join us for Free Lunch and Networking on the Show Floor
PLUS Door Prize Drawings!

1:30pm – 2:00pm
Reliability of Wearable Electronics
Cheryl Tulkoff - Senior Member of Technical Staff, DfR Solutions
Cheryl Tulkoff
Wearable electronics offer both significant opportunities and significant challenges to the design community. To ensure reliable and safe products, designers must be aware of new device packaging constraints, environmental conditions like sweat, UV & temperature exposure, tumble & drop, bending and torque, and the inevitable water immersion. Wireless communication and battery life needs must also be considered. And, that’s just the hardware! Even when the hardware performs well, software updates can introduce new failures and glitch behavior.

2:30pm – 3:00pm
Striplines and Microstrips
Jim Eatman - Principal, Eatman Associates
Jim Eatman
PC board traces act like transmission lines at higher frequencies. PC board designers have a choice of various topologies (stripline, microstrip, CPW, etc.) when implementing transmission lines on either rigid or flex circuits. As clock frequencies (and RF frequencies) continue to climb, transmission line design theory becomes more important to all players in the PC board design cycle – including mechanical engineers and CAD designers. This presentation is an introduction to the most common PC board transmission line topologies. The pros and cons of each topology are presented. In addition, there is a discussion of other issues that influence
transmission line performance: layout, material selection, and manufacturing tolerances.


Current Exhibitor List:

BEST Inc.
BOFA Americas
Carl Zeiss Microscopy
Conductive Containers, Inc. (CCI)
ECI Screenprint
FCT Assembly
FHP Reps, LLC
INVENTEC Performance Chemicals
Krayden Inc.
KutzSales
Kyzen Corporation
Master of Science in Technology Commercialization
MatriX-FocalSpot
Nikon Metrology, Inc.
Nordson Test and Inspection
NPI Technologies, Inc.
Olympus
Panasonic Factory Solutions Company of America
PFC Flexible Circuits
Prototron Circuits
QCG
Seika Machinery, Inc.
Silicon Hills Design Inc.
SMD
SMEC, Inc.
Southwest Sytems Technology, Inc.
Specialty Coating Systems
StenTech
Sunshine Circuits
Test Research, Inc.
Texmac/Takaya Inc.
Texwipe
Venkel LTD

Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 12th, 2014!

Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Long Island Expo & Tech Forum

    Wednesday October 15, 2014
    Location: Islandia Marriott Long Island
    3635 Express Drive North
    Islandia, NY 11749
    Show Hours: 10:00am - 3:00pm

    Attendees
    Attendees Register Now

    Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Director of Exhibitions Emmy Ross or Sharon Dietrich with questions or for additional information.






    Guadalajara Expo & Tech Forum

    Wednesday October 15, 2014 - Thursday October 16, 2014
    Location: Hotel Guadalajara Crowne Plaza
    Av. Lopez Mateos Sur No. 2500 Esq. Mariano Otero
    Col. Cd. del Sol C.P., Zapopan
    Jalisco 45050

    Attendees
    Attendees Register Now

    Please see the Guadalajara Chapter Page for More Information on Technical Sessions.

    Exhibitors
    Please see the Guadalajara Chapter Page for More Information on Expo Materials.






    Connecticut Expo & Tech Forum

    Wednesday October 22, 2014
    Location: Waterbury Marriott
    63 Grand Street
    Waterbury, CT 06702
    Show Hours: 10:00am - 3:00pm

    Attendees
    Attendees Register Now

    Please see the Connecticut Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Director of Exhibitions Emmy Ross or Mark Siems with questions or for additional information.






    Intermountain (Utah) Expo & Tech Forum

    Thursday October 23, 2014
    Location: University of Utah
    Warnock Engineering Building (main lobby)
    72 S. Central Campus Drive
    Salt Lake City, UT 84112
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    9:45am – 10:30am
    SIR Measurements During Modified Automotive Damp Heat Cycling: Solder Paste and Conformal Coating Compatibility
    Bruce Barton - Customer Technical Service Engineer, Alpha
    Bruce Barton
    Manufacturers of automotive electronics are very concerned with reliability, as the devices they assemble will be used in harsh environments and many must function reliably for the safe operation of the vehicles in which they are installed. For this reason, automotive circuits are often treated with conformal coating after assembly to protect against moisture and to reduce the growth of tin whiskers [1]. Sometimes the flux residues, even residues from “no-clean” materials, are cleaned from the circuit before coating, but often these coatings are applied directly over uncleaned reflowed solder paste. Therefore, it is important to provide reliability data on combinations of these materials.

    11:15am – 12:00pm
    Determining Critical Cleaning Process Parameters for QFNs
    Jigar Patel - Senior Process Engineer, ZESTRON America
    Jigar Patel
    As one of the fastest growing package types within the electronics industry, Bottom Termination Components connect integrated circuits to printed circuit boards. However, the leads are located underneath the component body thereby inhibiting cleaning after the soldering process. Learn how to define and validate the optimal cleaning process parameters for Bottom Termination Components.

    12:00pm - 1:00pm
    Join us for Free Lunch and Networking on the Show Floor

    1:00pm – 1:45pm
    Board Level Underfills and Adhesives for High Reliability Applicaitons
    Karl Loh - President and Co-Founder, Zymet
    Karl Loh
    A wide range of board level underfills and edgebond adhesives, also known as cornerbond adhesives, have been developed, to enhance mechanical shock and vibration performance of area array components such as BGA’s, POP’s, CSP’s, and WLP’s. Use of such materials can affect thermal cycle performance, negatively or positively. The materials range from reworkable underfills and adhesives designed for high speed processing, with sacrifices to thermal cycle performance, to materials that are designed to increase performance. The trade-offs between process performance and reliability, along with advances to overcome them, will be discussed.

    2:15pm – 3:00pm
    Adhesives for Enhancing Electronic System Reliability
    Dan Yu - Henkel Electronic Materials

    Abstract coming soon!


    Current Exhibitor List:

    Accurate Carriers Inc.
    GPD Global
    Indium Corporation
    KIC
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Nikon Metrology, Inc.
    PFC Flexible Circuits Limited
    Prototron Circuits
    REStronics
    Schoeller Electronics GmbH
    Semipack Services Inc.
    Smart Splice LLC
    Technica, USA
    VI Technology
    Vision Engineering, Inc.
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 3rd, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    LA/Orange County Expo & Tech Forum

    Thursday November 6, 2014
    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815
    Show Hours: 10:00am - 3:00pm

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    11:00am – 11:30am
    Determine Critical Cleaning Process Parameters for QFN's
    Naveenkamal Ravindran - Application Engineer, ZESTRON America

    NaveenQFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm. Since the leads of the QFN package do not extend out from the component body, but are located underneath the component body, cleaning the flux residues after the soldering process becomes a challenge. The low standoff associated with such components, typically 1 mil, and the large thermal pad at the center of the component body pose barriers to the complete removal of flux residues. Partially removed or untouched residues can lead to component failure resulting from electrochemical migration and dendritic growth as well as electrical leakage currents. This study is designed in two phases and will determine the critical cleaning process parameters for complete cleanliness underneath leadless devices or QFN's. Two groups of paste types will be used; lead-free water soluble and lead-free no-clean. The cleaning process will employ an aqueous alkaline cleaning agent and spray-in-air cleaning equipment. The goal of each phase is as follows: Phase 1: Determine the critical wash process parameters and cleaning equipment settings for QFN components Phase 2: Utilizing process parameters from Phase 1, verify cleaning results by using an industry standard test board. Cleanliness will be assessed via visual inspection for Phase 1 and visual inspection and Ion Chromatography analysis for Phase 2.

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    1:00pm – 1:30pm
    Ask the Experts About Contract Manufacturing/OEM Challenges
    Moderator - Barbara Kangesberg - BFK Solutions
    BarbaraPanelists:

  • Doug Dills - Scienscope
  • Andy Mitchell - Consultant
  • Tom Seratti - Stratesys Group
  • David Tuza - I-Source
  • Steve Unszusz - W5 Test Solutions

    Take advantage of this interactive session to ask the experts about technical problems involving miniaturization, assembly complexity, product diversity, stencils, inspection/testing, contamination control/cleanrooms, component quality, coating, and ever-increasing customer expectations. Ask us about costs and about addressing SCAQMD and Federal regulations. Develop the knowledge to assure that, when your customers consider electronics assembly and rework services, your company stands out from the competition.

    2:00pm – 2:30pm
    Design for Manufacturing Managing New Generations of High Density Surface Mount Components
    Vern Solberg - Solberg Technical Consulting

    Vern SolbergAs technology advances, electronic packaging has become more sophisticated and more complex. Many of the new IC device families have more I/O and finer contact pitch than their predecessors, dramatically affecting the methodology used in board design and assembly processing. When adapting the QFN, BGA and CSP families of ICs in particular, the designer must have a clear understanding of PC board fabrication tolerances, assembly process principles and realistic expectations for machine placement accuracy. The most successful SMT programs are those that have implemented process proven circuit board design rules. These rules specifically define the geometry and spacing of the land patterns for surface mount devices. Adhering to these rules will influence manufacturing efficiency as well as contribute to product quality and reliability. Only when PCB design related disciplines are properly defined and implemented, can maximum assembly process yield be achieved.This presentation will focus on a number of key disciplines that can enable successful implementation of QFN package technology, high-density BGA and fine-pitch chip-scale BGA device families. All of these package technologies offer improved product performance and reduced product size, but land pattern geometry, circuit routing and assembly processing have become more complex. When adapting these newer, and often higher l/O package families, the designer and process engineer must recognize disciplines, capabilities and limitations within each other's realm. In addition, each must have an understanding of the industry standards and tolerances that control IC packaging and the requirements established by the industry for the attachment of these devices to the PC board.


    Current Exhibitor List:

    AMTECH
    Ascentec Engineering
    BOFA Americas
    Creative Electron, Inc.
    EPTAC Corporation
    Fuji America Corporation
    Indium Corporation
    INVENTEC Performance Chemicals
    Ironwood Electronics
    Koki Solder America
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Nikon Metrology, Inc.
    NPI Technologies, Inc.
    PA&LS
    Panasonic Factory Solutions Company of America
    PFC Flexible Circuits Limited
    Specialty Coating Systems
    Stratesys Group
    Weller
    Weller-Tools
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 17th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    IWLPC- Wafer-Level Packaging Conference & Exhibition
    Note - If you already registered for the conference you do not need to register separately for the expo

    Tuesday November 11, 2014 - Wednesday November 12, 2014
    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110

    Attendees

    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 10:00am – 5:30pm
    Wednesday, November 12th, 10:00am – 3:30pm

    To Register for a FREE Exhibits Attendee Pass, click here.

    View the floor plan


    Current Exhibitor List:

    3M Electronics Materials Solutions  #56
    Aehr Test Systems  #44
    AGC Electronics Americas  #52
    AI Technology, Inc.  #43
    AMICRA Microtechnologies GmbH  #11
    Amkor Technology Inc.  #16
    Applied Materials, Inc.  #41
    Axus Technology  #33
    Chip Scale Review  #24
    Conductive Containers, Inc.  #3
    CORWIL Technology Corporation  #32
    CyberTECHNOLOGIES USA  #2
    Deca Technologies  #36
    EV Group  #42
    FlipChip International  #29
    Frontier Semiconductor  #54
    FRT of America  #15
    Hesse Mechatronics, Inc.  #4
    i2a Technologies  #48
    IMAT, Inc.  #40
    Invensas Corporation  #34
    Inventec Performance Chemicals Mexico  #57
    Johnstech International  #1
    Kita USA  #45
    KLA-Tencor  #31
    LaserJob, Inc.  #47
    LB Semicon  #26
    MCT Worldwide LLC  #37
    Milestone Technology  #10
    Mühlbauer, Inc.  #46
    Nagase America Corporation  #9
    NAMICS  #12
    NANIUM S.A.  #28
    Nordson DAGE  #39
    Owens Design  #23
    Pac Tech USA  #27
    Panasonic Factory Solutions Company of America  #7
    PJC Technologies, Inc.
    Plasma-Therm, LLC  #35
    Promex Industries Inc.  #38
    ProTec Carrier Systems GmbH  #49
    Ridgetop Group, Inc.  #58
    SavanSys Solutions LLC  #20
    SET North America  #19
    Silex Microsystems  #21
    Smiths Connectors - IDI  #17
    Sonix  #30
    Sonoscan, Inc.  #22
    SPTS Technologies  #14
    SPTS Technologies
    Suss MicroTec, Inc.  #25
    Teradyne-Silicon Release Solutions  #50
    Toray International America Inc.  #18
    Triton Micro Technologies, Inc.  #53
    Unisem  #13
    Universal Instruments Coporation  #51
    XYZTEC  #5
    Yield Engineering Systems, Inc.  #6
    Yole Développement  #55
    YXLON  #8

    Companies in bold are SMTA corporate members
    Exhibitors
    Exhibitor Information
    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 10:00am – 5:30pm
    Wednesday, November 12th, 10:00am – 3:30pm

    All booth spaces have SOLD OUT!



    View the floor plan

    Exhibitor Details

    Exhibitor Kit

    Questions?
    Please contact your Chip Scale Review sales representative or Patti Hvidhyld - Coles from SMTA with questions or for more information.

    Sponsorship Opportunities


    View available Sponsorship Opportunities

    Show Directory Advertising Opportunities

    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!






    High-Reliability Cleaning and Conformal Coating Conference - Expo High-Reliability Cleaning and Conformal Coating Conference - Expo

    Tuesday November 18, 2014 - Thursday November 20, 2014
    Location: Marriott Schaumberg
    Schaumberg, IL

    Exhibitors

    Tabletop Exhibit

    Cost: $1200 IPC or SMTA member/$1500 non member

  • One six foot table to be located in the break area
  • One electrical outlet
  • Company logo on all electronic and printed promotional materials
  • Logo on all on-site printed materials
  • List of Conference participants (after the event)
  • One complimentary Conference registration for tabletop staff
  • Additional conference registration at a 25% discount

    Download the application to exhibit

    Sponsorship Opportunities

    Badge Lanyards, exhibitor provided $800 IPC or SMTA member / $1,000 nonmember

    Networking Opportunities

    Benefits Include:
  • Recognition as Event Sponsor on all electronic and printed promotional materials
  • Company logo on agenda and on-site signage
  • Recognition announced at the beginning and end of sponsored function

    Networking Reception (Tuesday) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Luncheons

    Tuesday (box lunch) $1,000 IPC or SMTA member /$1,200 nonmember

    Wednesday (seated luncheon) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Thursday (box lunch) $1,000 IPC or SMTA member / $1,200 nonmember

    Conference Refreshment Breaks $1,500 IPC or SMTA member / $1,900 nonmember

    For more info about the program and to register for the conference, click here.






  • Arizona Expo & Tech Forum

    Wednesday November 19, 2014
    Location: Marriott Phoenix Tempe at The Buttes
    2000 Wescourt Way
    Tempe, AZ 85282
    Show Hours: 10AM-3PM

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    TBD


    Current Exhibitor List:

    Indium Corporation
    INVENTEC Performance Chemicals
    Prototron Circuits
    ZESTRON America

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird pricing ends on October 31st, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Space Coast and Tampa Bay Expo & Tech Forum

    Thursday December 4, 2014
    Location: Park Inn by Radisson
    3011 Maingate Lane
    Kissimmee, FL 34747

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    9:00am – 10:00am
    Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes
    Ed Briggs - Technical Support Engineer, Indium Corporation
    Ed Briggs
    The explosive growth of personal electronic devices, such as mobile phones, tablets, and personal music devices, have driven the need for smaller and smaller active and passive electrical components. Not long ago, 0201 passives were seen as the ultimate in miniaturization, but now we have 01005 passives with rumors of even smaller sizes not far behind. For active components, array packages with 0.4mm pitch are virtually a requirement for enabling the many features in modern portable electronic devices. To meet the challenge of stencil printing the smaller stencil apertures, there is an increased interest in utilizing finer particle-sized solder pastes to improve transfer efficiency. The smaller particle size results in a large surface area-to-volume ratio that challenges the solder paste’s flux to effectively perform its fluxing action. The resulting surface oxidation can lead to voiding, graping, head-in-pillow, and other defects.

    11:00am – 12:00pm
    Selecting Stencil Technologies to Optimize Print Performance and Updates on the Latest Stencil Printing Research
    Chrys Shea - President, Shea Engineering
    Chrys Shea
    Today’s SMT process engineers have many choices in stencil design, manufacturing and surface treatments. Available technology options include:

  • Stencil Design: tradeoffs with foil thickness and aperture sizes, steps, overprints and preforms.
  • Materials: nickel, stainless steel, stress-relieved and fine grain SS, nickel-plated SS.
  • Manufacturing processes: electroforming, laser-cutting, electropolishing.
  • Nanocoatings: different materials, application methods and thicknesses.

    Each PCB layout is unique, and some may dictate different combinations of technologies to optimize print performance. This presentation discusses stencil design options and tools, and reviews the results of independent performance tests to help process engineers determine the best stencil strategy for their assembly operations.

    12:00pm - 1:30pm
    Join us for Free Lunch and Networking on the Show Floor
    PLUS Door Prize Drawings!

    1:30pm – 2:30pm
    Scott Nelson Panel Discussion - PCB Assembly: Cleaning, Coating, and Reliability
    Moderator: Scott Nelson - Manufacturing Engineer, Harris Corporation
    Sponsored by: Zestron Corporation

    Zestron


    More Information Coming Soon!


    Current Exhibitor List:

    ACL Staticide, Inc.
    AGI Corporation
    AIM
    BOFA Americas
    Conductive Containers, Inc
    ELANTAS PDG, Inc.
    EPTAC Corporation
    FCT Assembly, Inc.
    GPD Global
    Indium Corporation
    Kyzen Corporation
    METCAL
    Nikon Metrology, Inc.
    PACE Worldwide
    Panasonic Factory Solutions of America
    PVA
    Specialty Coating Systems
    STARboard TECHnology
    StenTech
    Tropical Stencil, Inc.
    ZESTRON

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on November 7th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Cancellation Policy: Please note that exhibit fees will not be refunded if exhibitor cancels exhibit space.