Upcoming Expos

SMTA Expos

Local Expos and Tech Forums have become one of the great benefits of local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

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All 2014 Shows Added!

November 6, 2014 LA/Orange County Expo & Tech Forum
November 11 - 12, 2014 IWLPC- Wafer-Level Packaging Conference & Exhibition
November 18 - 20, 2014 High-Reliability Cleaning and Conformal Coating Conference - Expo
December 4, 2014 Space Coast and Tampa Bay Expo & Tech Forum
January 28, 2015 Rocky Mountain Expo & Tech Forum
September 29 - 30, 2015 SMTA International Electronics Exhibition







LA/Orange County Expo & Tech Forum

Thursday November 6, 2014
Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815
Show Hours: 10:00am - 3:00pm

Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule

11:00am – 11:30am
Determine Critical Cleaning Process Parameters for QFN's
Naveenkamal Ravindran - Application Engineer, ZESTRON America

NaveenQFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm. Since the leads of the QFN package do not extend out from the component body, but are located underneath the component body, cleaning the flux residues after the soldering process becomes a challenge. The low standoff associated with such components, typically 1 mil, and the large thermal pad at the center of the component body pose barriers to the complete removal of flux residues. Partially removed or untouched residues can lead to component failure resulting from electrochemical migration and dendritic growth as well as electrical leakage currents. This study is designed in two phases and will determine the critical cleaning process parameters for complete cleanliness underneath leadless devices or QFN's. Two groups of paste types will be used; lead-free water soluble and lead-free no-clean. The cleaning process will employ an aqueous alkaline cleaning agent and spray-in-air cleaning equipment. The goal of each phase is as follows: Phase 1: Determine the critical wash process parameters and cleaning equipment settings for QFN components Phase 2: Utilizing process parameters from Phase 1, verify cleaning results by using an industry standard test board. Cleanliness will be assessed via visual inspection for Phase 1 and visual inspection and Ion Chromatography analysis for Phase 2.

12:00PM - 1:00PM
Free Lunch on Show Floor!

1:00pm – 1:30pm
Ask the Experts About Contract Manufacturing/OEM Challenges
Moderator - Barbara Kangesberg - BFK Solutions
BarbaraPanelists:

  • Doug Dills - Scienscope
  • Andy Mitchell - Consultant
  • Tom Seratti - Stratesys Group
  • David Tuza - I-Source
  • Steve Unszusz - W5 Test Solutions

    Take advantage of this interactive session to ask the experts about technical problems involving miniaturization, assembly complexity, product diversity, stencils, inspection/testing, contamination control/cleanrooms, component quality, coating, and ever-increasing customer expectations. Ask us about costs and about addressing SCAQMD and Federal regulations. Develop the knowledge to assure that, when your customers consider electronics assembly and rework services, your company stands out from the competition.

    2:00pm – 2:30pm
    Design for Manufacturing Managing New Generations of High Density Surface Mount Components
    Vern Solberg - Solberg Technical Consulting

    Vern SolbergAs technology advances, electronic packaging has become more sophisticated and more complex. Many of the new IC device families have more I/O and finer contact pitch than their predecessors, dramatically affecting the methodology used in board design and assembly processing. When adapting the QFN, BGA and CSP families of ICs in particular, the designer must have a clear understanding of PC board fabrication tolerances, assembly process principles and realistic expectations for machine placement accuracy. The most successful SMT programs are those that have implemented process proven circuit board design rules. These rules specifically define the geometry and spacing of the land patterns for surface mount devices. Adhering to these rules will influence manufacturing efficiency as well as contribute to product quality and reliability. Only when PCB design related disciplines are properly defined and implemented, can maximum assembly process yield be achieved.This presentation will focus on a number of key disciplines that can enable successful implementation of QFN package technology, high-density BGA and fine-pitch chip-scale BGA device families. All of these package technologies offer improved product performance and reduced product size, but land pattern geometry, circuit routing and assembly processing have become more complex. When adapting these newer, and often higher l/O package families, the designer and process engineer must recognize disciplines, capabilities and limitations within each other's realm. In addition, each must have an understanding of the industry standards and tolerances that control IC packaging and the requirements established by the industry for the attachment of these devices to the PC board.


    Current Exhibitor List:

    American Hakko Products Inc.
    Amistar Automation, Inc.
    AMTECH
    Area51-ESG, Inc.
    Ascentec Engineering
    BigC: Dino-Lite Scopes
    BOFA Americas
    Botron
    CALTEX Scientific
    Competitive Edge Manufacturing Equipment (CEME)
    Creative Electron
    Crystal Mark, Inc.
    DiversiTech Representatives, Inc.
    DiversiTech Representatives, Inc.
    EPTAC Corporation
    Fuji America Corporation
    I Source Technical Services, Inc.
    Indium Corporation
    INVENTEC Performance Chemicals
    Ironwood Electronics
    JBC TOOLS USA
    JH Technologies
    Koki Solder America
    Kyzen Corporation
    MatriX-FocalSpot
    METCAL
    Microtek Laboratories
    Multicircuits Inc.
    Nikon Metrology, Inc.
    NPI Technologies, Inc.
    PA&LS
    Panasonic Factory Solutions Company of America
    PFC Flexible Circuits Limited
    PMR
    Production Basics
    Prototron Circuits Inc.
    RCA Marketing
    Scienscope International
    Seika Machinery, Inc.
    Sirco Industrial, Inc.
    Specialty Coating Systems
    Stratesys Group
    TAGARNO
    Technical Devices Company
    Techspray Products
    Test Research, Inc.
    Totech Americas
    Universal Instruments Corporation
    UTZ Technologies
    W5 Test Solutions
    Weller-Tools
    Yamaha Motor IM / Trans-Tec America
    ZESTRON Corporation

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 17th, 2014!

    Important Exhibitor Materials:

  • Show Poster

  • Expo Brochure

  • Exhibitor Floorplan

  • Advertising and Sponsorship Opportunities

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    IWLPC- Wafer-Level Packaging Conference & Exhibition
    Note - If you already registered for the conference you do not need to register separately for the expo

    Tuesday November 11, 2014 - Wednesday November 12, 2014
    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110

    Attendees

    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 9:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, November 12th, 9:00am – 3:30pm

    To Register for a FREE Exhibits Attendee Pass, click here.

    View the floor plan


    Current Exhibitor List:

    3M Electronics Materials Solutions  #56
    Aehr Test Systems  #44
    AGC Electronics Americas  #52
    AI Technology, Inc.  #43
    AMICRA Microtechnologies GmbH  #11
    Amkor Technology Inc.  #16
    Applied Materials, Inc.  #41
    Axus Technology  #33
    Chip Scale Review  #24
    Conductive Containers, Inc.  #3
    CORWIL Technology Corporation  #32
    cyberTECHNOLOGIES USA  #2
    Deca Technologies  #36
    EV Group  #42
    FlipChip International  #29
    Frontier Semiconductor  #54
    FRT of America  #15
    Hesse Mechatronics, Inc.  #4
    i2a Technologies  #48
    IMAT, Inc.  #40
    Innovative Micro Technology (IMT)  #55
    Invensas Corporation  #34
    Inventec Performance Chemicals Mexico  #57
    Johnstech International  #1
    Kita USA  #45
    KLA-Tencor  #31
    LaserJob, Inc.  #47
    LB Semicon  #26
    MCT Worldwide LLC  #37
    Milestone Technology  #10
    Mühlbauer, Inc.  #46
    Nagase America Corporation  #9
    NAMICS  #12
    NANIUM S.A.  #28
    Nordson DAGE  #39
    Owens Design  #23
    Pac Tech USA  #27
    Panasonic Factory Solutions Company of America  #7
    Plasma-Therm, LLC  #35
    Promex Industries Inc.  #38
    ProTec Carrier Systems GmbH  #49
    Ridgetop Group, Inc.  #58
    SavanSys Solutions LLC  #20
    SET North America  #19
    Silex Microsystems  #21
    Smiths Connectors - IDI  #17
    Sonix  #30
    Sonoscan, Inc.  #22
    SPTS Technologies  #14
    Suss MicroTec, Inc.  #25
    Teradyne-Silicon Release Solutions  #50
    Toray International America Inc.  #18
    Triton Micro Technologies, Inc.  #53
    Unisem  #13
    Universal Instruments Corporation  #51
    XYZTEC  #5
    Yield Engineering Systems, Inc.  #6
    YXLON  #8

    Companies in bold are SMTA corporate members
    Exhibitors
    Exhibitor Information
    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 9:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, November 12th, 9:00am – 3:30pm

    All booth spaces have SOLD OUT!



    View the floor plan

    Exhibitor Details

    Exhibitor Kit

    Questions?
    Please contact your Chip Scale Review sales representative or Patti Hvidhyld - Coles from SMTA with questions or for more information.

    Sponsorship Opportunities


    View available Sponsorship Opportunities

    Show Directory Advertising Opportunities

    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!






    High-Reliability Cleaning and Conformal Coating Conference - Expo High-Reliability Cleaning and Conformal Coating Conference - Expo

    Tuesday November 18, 2014 - Thursday November 20, 2014
    Location: Marriott Schaumberg
    Schaumberg, IL

    Exhibitors

    Tabletop Exhibit

    Cost: $1200 IPC or SMTA member/$1500 non member

  • One six foot table to be located in the break area
  • One electrical outlet
  • Company logo on all electronic and printed promotional materials
  • Logo on all on-site printed materials
  • List of Conference participants (after the event)
  • One complimentary Conference registration for tabletop staff
  • Additional conference registration at a 25% discount

    Download the application to exhibit

    Sponsorship Opportunities

    Badge Lanyards, exhibitor provided $800 IPC or SMTA member / $1,000 nonmember

    Networking Opportunities

    Benefits Include:
  • Recognition as Event Sponsor on all electronic and printed promotional materials
  • Company logo on agenda and on-site signage
  • Recognition announced at the beginning and end of sponsored function

    Networking Reception (Tuesday) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Luncheons

    Tuesday (box lunch) $1,000 IPC or SMTA member /$1,200 nonmember

    Wednesday (seated luncheon) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Thursday (box lunch) $1,000 IPC or SMTA member / $1,200 nonmember

    Conference Refreshment Breaks $1,500 IPC or SMTA member / $1,900 nonmember

    For more info about the program and to register for the conference, click here.






  • Space Coast and Tampa Bay Expo & Tech Forum

    Thursday December 4, 2014
    Location: Park Inn by Radisson
    3011 Maingate Lane
    Kissimmee, FL 34747

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    9:00am – 10:00am
    Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes
    Ed Briggs - Technical Support Engineer, Indium Corporation
    Ed Briggs
    The explosive growth of personal electronic devices, such as mobile phones, tablets, and personal music devices, have driven the need for smaller and smaller active and passive electrical components. Not long ago, 0201 passives were seen as the ultimate in miniaturization, but now we have 01005 passives with rumors of even smaller sizes not far behind. For active components, array packages with 0.4mm pitch are virtually a requirement for enabling the many features in modern portable electronic devices. To meet the challenge of stencil printing the smaller stencil apertures, there is an increased interest in utilizing finer particle-sized solder pastes to improve transfer efficiency. The smaller particle size results in a large surface area-to-volume ratio that challenges the solder paste’s flux to effectively perform its fluxing action. The resulting surface oxidation can lead to voiding, graping, head-in-pillow, and other defects.

    11:00am – 12:00pm
    Selecting Stencil Technologies to Optimize Print Performance and Updates on the Latest Stencil Printing Research
    Chrys Shea - President, Shea Engineering
    Chrys Shea
    Today’s SMT process engineers have many choices in stencil design, manufacturing and surface treatments. Available technology options include:

  • Stencil Design: tradeoffs with foil thickness and aperture sizes, steps, overprints and preforms.
  • Materials: nickel, stainless steel, stress-relieved and fine grain SS, nickel-plated SS.
  • Manufacturing processes: electroforming, laser-cutting, electropolishing.
  • Nanocoatings: different materials, application methods and thicknesses.

    Each PCB layout is unique, and some may dictate different combinations of technologies to optimize print performance. This presentation discusses stencil design options and tools, and reviews the results of independent performance tests to help process engineers determine the best stencil strategy for their assembly operations.

    12:00pm - 1:30pm
    Join us for Free Lunch and Networking on the Show Floor
    PLUS Door Prize Drawings!

    1:30pm – 2:30pm
    Scott Nelson Ask the Experts: SMT Processes and Cleaning Applications for High Rel Assemblies
    Moderator: Scott Nelson - Manufacturing Engineer, Harris Corporation

    Sponsored by: Zestron Corporation

    Zestron


    Panelists:

  • Tim O'Neil - Technical Marketing Manager, AIM Solder
  • Alan Hardy - Automotive, Electronics & Military Market Manager, Specialty Coating Systems


    Current Exhibitor List:

    ACL Staticide, Inc.
    AGI Corporation
    AIM
    Air Vac Engineering Company, Inc.
    America Taping & Reeling
    Aven Inc.
    BOFA Americas
    Brady Corporation
    Conductive Containers, Inc
    ELANTAS PDG, Inc.
    Electro-Comp Tape & Reel Services
    EPTAC Corporation
    FCT Assembly, Inc.
    GPD Global
    Indium Corporation
    Inventec Performance Chemicals
    JBC Tools USA Inc.
    Kester
    Kintner Equipment Corporation
    Koh Young America, Inc.
    Kurt Whitlock Associates
    Kyzen Corporation
    Metal Etching Technology Associates Inc.
    METCAL
    Nikon Metrology, Inc.
    PACE Worldwide
    Panasonic Factory Solutions of America
    Photo Etch Technology
    PVA
    REStronics Southeast
    Scienscope International
    Seika Machinery, Inc.
    SOMACIS/Hallmark Circuits
    Sovella, Inc.
    SPEA America
    Specialty Coating Systems
    Stanley Supply & Services
    STARboard TECHnology
    StenTech
    Technical Resources Corporation, Inc.
    TechSpray/Heller
    TEK Products
    Test Research, Inc.
    The Green Rep/Robotas
    Tropical Stencil, Inc.
    Vashaw Scientific, Inc.
    Weller
    YXLON FeinFocus
    ZESTRON

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on November 7th, 2014!

    Important Exhibitor Materials:

  • Exhibitor Floorplan

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    Rocky Mountain Expo & Tech Forum

    Wednesday January 28, 2015
    Location: Champions Club at Mile High Stadium
    1701 Bryant Street
    Denver, CO 80204

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule

    Coming Soon!


    Current Exhibitor List:


    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on January 9th, 2015!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Sponsorship and Advertising Form
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.






    SMTA International Electronics Exhibition

    Tuesday September 29, 2015 - Wednesday September 30, 2015
    Location: Rosemont Convention Center
    Rosemont, IL

    Exhibitors
    Exhibitors Register Now
    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1000 attendees from 25 different countries.






    Cancellation Policy: Please note that exhibit fees will not be refunded if exhibitor cancels exhibit space.