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Upcoming Expos
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Local Expos and Tech Forums have become one of the great benefits of local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.
Sign up for multiple Expos at once! New Shows Added!
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June 25 - 26, 2013
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Counterfeit Electronic Parts Symposium East Tabletop Exhibition
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June 27, 2013
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Upper Midwest Expo & Tech Forum
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July 11, 2013
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Ohio Valley Expo & Tech Forum
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August 15, 2013
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Philadelphia Expo & Tech Forum
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September 10, 2013
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Capital Expo & Tech Forum
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September 18, 2013
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Wisconsin/Great Lakes Expo & Tech Forum
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October 9, 2013
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Long Island Expo & Tech Forum
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October 22, 2013
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Connecticut Expo & Tech Forum
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November 5, 2013
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LA/Orange County Expo & Tech Forum
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November 12 - 13, 2013
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SMTA/iNEMI Medical Electronics Symposium Tabletop Exhibition
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October 30 - 31, 2013
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Guadalajara Expo & Tech Forum
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November 19 - 21, 2013
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Counterfeit Electronic Parts Symposium West Tabletop Exhibition
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November 20, 2013
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Arizona Expo & Tech Forum
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December 5, 2013
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Austin (CTEA) Expo & Tech Forum
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January 23, 2014
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Carolinas Expo & Tech Forum
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March 4, 2014
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Dallas Expo & Tech Forum
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March 6, 2014
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Houston Expo & Tech Forum
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Counterfeit Electronic Parts Symposium East Tabletop Exhibition
Tuesday June 25, 2013
- Wednesday June 26, 2013
Location: The Marriott Inn & Conference Center
College Park, MD
Exhibitors
Exhibit Hours: June 25: 8:00am – 3:30pm June 26: 8:00am – 3:30pm
Contact Patti for available booth space. 952-920-7682 or patti@smta.org
Please note that exhibit traffic will be minimal while symposium is in session. Full conference info is available here.
Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to: 6 ft. Draped table Two chairs Attendee list Company sign Breakfast, Lunch & Breaks One copy of the conference proceedings
Download a hard copy of the registration form
Cost to exhibit: | Booth type | CALCE/SMTA Members | Non-Members | One table includes access to Electrical Outlet | $450 | $550 | One table no access to Electrical Outlet | $400 | $500 |
Sponsorship Opportunities: Click here to download more information.
Coffee Break Sponsor - $500 (per day) Signage on-site near registration and breaks Company name/logo listed in final program and handout
Lunch Sponsor - $750 (per day) Signage on-site near registration Powerpoint slide to be displayed during lunch Company name/logo listed in final program and handout
Contact Patti Hvidhyld at 952-920-7682 to purchase a sponsorship.
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Upper Midwest Expo & Tech Forum
Thursday June 27, 2013
Location: Embassy Suites Bloomington
2800 American Blvd. West
Bloomington, MN 55431
Show Hours: 10:00am - 3:00pm
Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
9:00AM Registration opens
The SMTA Upper Midwest Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.
9:30AM – 10:15AM Determine Critical Cleaning Process Parameters for QFN's Jigar Patel, M.S. Chemical Engineer, ZESTRON
QFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm.
11:00AM – 11:45AM Boundary Scan Integration on Flying Probe Testers Zinnour Soultanov, Principal Test Applications Engineer, SPEA America
Boundary Scan Test integration into Flying Probe Testers has been a long sought after capability in the Electronics Industry. The most recent integration is the latest generation flying probe system that includes latest generation boundary scan hardware and software. The boundary scan hardware uses synchronously the TAP port and the flying probes to drive and sense signals on the board. The two technologies exchange information through shared DLL’s and software to ensure the test flow is optimized and the test coverage is maximized.
12:00PM-1:30PM Free HOT Lunch on Exhibit Floor
2:00PM - 2:45PM Options for Printing Fine Features and Breaking Through the Traditional .66 Area Ratio Mike Burgess, DEK Printing Machines
Component miniaturization continues to pushthe limits of industry accepted manufacturing guidelines and the capabilities of modern printing machines. Breaking through the boundaries of traditional stencil design area ratios of 0.66is now necessary to assemble common everyday circuit boards. Achieving acceptable solder paste release with high transfer efficiency can be a challenge. Advancements in stencil materials, laser cutting machines and solder paste certainly aid the process, but are they enough?
Special thanks to our Technical Session Sponsor: 
2:00PM Raffle on Exhibit Floor
The SMTA Upper Midwest show is SOLD OUT! If you are interested in getting on the waiting list please contact SMTA Director of Exhibitions Emmy Garner .
Current Exhibitor List:
Accurate Carriers USA
#51
AIM
#27
All Flex Flexible Circuits & Heaters
#31
Amitron Corporation
#19
Apex Factory Automation
#16
ASC International, Inc.
#7
Ascentec Engineering
#49
Ayrshire Electronics
#26
Batten & Allen
#57
Benchside Technologies
#40
BEST Inc.
#14
Burton Industries Inc.
#9
Circuit Check Inc.
#47
Cobar Solder Products, Inc.
#44
Conductive Containers, Inc.
#24
Coridian Technologies, Inc.
#42
DEK USA
#22
Digitaltest, Inc.
#56
Discover Life Chiropractic LLC
E-Tool
#5
E-tronix
#1 & 2
Electronic Systems Inc.
#48
Electrotek Corporation
#23
Ellsworth Adhesives
#4
EPTAC Corporation
#18
FCT Assembly
#34
FocalSpot, Inc.
#25
IDENTCO International
#36
Indium Corporation
#52
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JMW Enterprises, Inc.
#28
JW Sales
#6
Krayden, Inc.
#33
Kyzen Corporation
#35
LaserJob Inc.
#3
Metaplast Circuits Ltd.
#37
Multicircuits
#12
Nikon Metrology
#39
Nordson DAGE
#15
Nordson YESTECH
#55
Omni-Tronics, Inc.
#54
Panasonic Factory Solutions of America
#53
Production Automation (P.A.C.)
#21
PROMATION, Inc.
#11
Prototron Circuits Inc.
#30
REStronics Northland
#38
Seica Inc.
#13
Seika Machinery, Inc.
#8
SPEA America
#17
Stanley Supply & Services
#50
StenTech Ltd.
#29
Syntek, Inc.
#46
Tenere, Inc.
#58
Texmac/Takaya Inc.
#45
Tonka Electronics, Inc.
#10
Universal Instruments
#20
VI Technology
#32
Viasystems
#41
ZESTRON Corporation
#43
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Companies in bold are SMTA corporate members
Exhibitors
Exhibitor Floorplan In Hall
Important Exhibitor Materials: Hard Copy of Exhibitor Reg Form Advertising and Sponsorship Opportunities Exhibitor Details
Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
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Ohio Valley Expo & Tech Forum 
Thursday July 11, 2013
Location: Doubletree Hotel
6200 Quarry Lane
Independence (Cleveland), OH
Show Hours: 10AM-3PM
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
8:30AM Registration opens
The SMTA Ohio Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.
9:15AM – 10:00AM Effects of Thermal Pad Patterning on QFN Voiding Mario Scalzo, Senior Technical Support Engineer, Indium Corporation
Voiding under QFN’s is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless of the shape and number of subpads, increasing venting accessibility results in a decrease in the total number of voids, the largest voids, and discontinuity. Voiding caused by peripheral vias is comparable to voids caused by hidden vias. Voiding increases with decreasing print coverage and is attributed to insufficient solder. Voiding also decreases with an increase in the number of thermal vias. This phenomenon is attributed to volatiles bleeding through the small voids around the thermal via.
11:15AM – 12:00PM The Top 7 Current Rework Challenges of BGA and QFN Packages Bob Wetterman, IPC Master Instructor, BEST Inc. With the proliferation of leadless device packages their rework has continued to be a challenge as solder voiding, open connections at the IO pads along with inspection of the devices continues to be problematic. In this session the challenges of leadless device rework, the methods of removal and replacement and their advantages/disadvantages will be outlined. Bob will discuss the “Challenges in BGA Rework” including examples of: Cheap Solder Mask, Masking off Nearby Components, Warping, Site Prepping without Damage, Micro Device Reballing, POP Rework, TMV Rework. Bring your own challenges for the larger group discussion at the end of this session.
12:00PM-1:30PM Free HOT Lunch on Exhibit Floor Special thanks to our lunch sponsor:
1:15PM - 2:00PM Cleaning Flux Residue Under Bottom Termination Components Debbie Alavezos-Carboni, National Sales Manager, Kyzen Corporation
Manufacturers today are cleaning not just to remove flux residue. We will explore the concerns of leaving these other contaminants and especially no-clean flux residue on modern electronic assemblies. Many such devices incorporate Bottom Termination Components (BTC); which limit access of the cleaning fluid to the soil. Bottom Termination Components consist of any surface mount device whose external connections consist of metalized terminations that are an integral part of the circuit assembly. Common BTC examples include QFN, DFN, SON, LGA, MLP, and MLF packages. Critical variables for removing flux residues and other contaminants are the cleaning agent, heat exposure, gap height (BTC to board), and fluid flow dynamics. The cleaning agent must match up to the soil in order to solubilize and carry it away. Efficient mechanical energy is also required to deliver the cleaning agent to these residues which often under fill the component. The purpose of this research is to better understand why so many manufacturers are cleaning their no-clean assemblies and to provide general process conditions that will successfully remove flux residue and other contamination from under and around modern BTC components. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.
3:00PM Raffle on Exhibit Floor - Special thanks to our raffle sponsors: 
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The SMTA Ohio show is SOLD OUT! If you are interested in getting on the waiting list please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
Exhibitor Floorplan In Hall
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Philadelphia Expo & Tech Forum
Thursday August 15, 2013
Location: Crowne Plaza Philadelphia Cherry Hill
2349 West Marlton Pike
Cherry Hill, NJ 08002
Show Hours: 10:00am - 3:00pm
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
9:00AM Registration opens
The SMTA Philadelphia Chapter would like to invite you to attend the following technical presentations from four renowned technical speakers.
9:30AM – 10:15AM Avoiding Counterfeits When Addressing Component Obsolescence David Steele, Da-Tech
Counterfeit electronic components work their way into the electronics supply chain by a variety of means and take on many forms. A common entry point opens up when parts on legacy products become obsolete. When Original Component Manufacturers discontinue products, sourcing departments are often forced outside of their authorized distribution networks, increasing the risk of receiving parts that are used, re-marked, electrical test failures, or even functional knockoffs.
11:00AM – 11:45AM Can RoHS Conversion Actually Reduce Product Cost? Chrys Shea, Shea Engineering Services
The Reduction of Hazardous Substances directive of 2006 mandated the removal of six dangerous materials from electrical and electronic devices. Perhaps the most difficult to remove was lead, as it was contained in nearly all electronic solders, and no drop-in replacements were readily available.The most viable solder replacements, alloys from the Tin-Silver-Copper (SAC) family, are far more expensive than tin-lead and require higher processing temperatures. The higher soldering temperatures require more costly energy to process and more heat-tolerant PCB laminates. The high-heatlaminates are also more expensive than their tin-lead counterparts, andthey present more difficulty for board fabricators to process.
12:00PM-1:30PM Free HOT Lunch on Exhibit Floor
1:00PM - 1:45PM PCB Cleaning After Rework (Some Spot Clean Better than Others) Debbie Carboni, Kyzen Corporation
Most assembly houses have various forms of spot cleaning or bench top cleaning in at least one stage. Whether it is an aerosol cleaning solvents, IPA in a pump bottle, or a pan with some chemistry, brush, swab, or wipe: Assemblers’ seem to always struggle achieving consistent results with a manual cleaning process. Do you wonder why your IPA doesn’t seem to work like it did 5 years ago? Do you know what causes contamination relocation? Do you how to determine what the best cleaning agent is at the bench? These are just a few of the questions that will be reviewed. This presentation will discuss the influencing factors for inconsistency in cleaning as well as the precautions you can take to improve spot cleaning methods.
2:00PM - 2:45PM Conformal Coating Compatibility with No-clean Fluxes Mitch Holtzer, Alpha
Electronic assemblies used in aerospace and automotive applications have extreme exposure to harsh environmental conditions. Rapid changes in humidity and temperature over long periods of time can be challenging to the electrical integrity of these assemblies. Most demand for soldering materials is driven by the consumer electronics market. Mobile communications, portable computing (lap-tops, tablets, and netbooks), flat panel display televisions and automotive infotainment create the most demand for soldering materials. Each of these applications’ rapid growth has been enabled by ever increasing functionality at lower price points.
Special thanks to our Technical Session Sponsor: 
2:45PM Raffle on Exhibit Floor
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on July 12th, 2013!
Exhibitor Floorplan
Important Exhibitor Materials: Hard Copy of Exhibitor Reg Form Advertising and Sponsorship Opportunities Exhibitor Details
Please contact SMTA Director of Exhibitons Emmy Garner with questions or for additional information.
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Capital Expo & Tech Forum 
Tuesday September 10, 2013
Location: Johns Hopkins University/Applied Physics Lab
11100 Johns Hopkins Rd.
Laurel, MD 20723
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
9:30AM Can Nano Coatings Really Improve Stencil Performance? Robert Dervaes, VP Technology at FCT Assembly
10:15AM Break on show floor!
10:45 Why Clean PCBs? Kalyan Nukala, Application Engineer at ZESTRON
11:30AM FREE lunch on show floor!
12:30PM Cleaning in the Age of No-Clean Mike Konrad, President of Aqueous Technologies
1:15PM Break on show floor!
1:45PM Showing You Things You Can’t See and Doing More with What You Can See. John Travis, Sales Manager of Nordson
2:30PM Panel Discussion
3:30PM Expo Closes
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for corporate members is $350/$450 (early bird/regular) and $425/$525 (early bird/regular) for non-corporate members (click here for membership information). The cost to exhibit includes: one tabletop exhibit space, access to electricity for an additional $25 per outlet, one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird deadline is July 30th, 2013.
Important Exhibitor Materials: Show Details Advertising and Sponsorship Opportunities Hard Copy of Exhibitor Reg Form
Please contact SMTA Director of Exhibitions with questions or for additional information.
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SMTA/iNEMI Medical Electronics Symposium Tabletop Exhibition
Tuesday November 12, 2013
- Wednesday November 13, 2013
Location: Embassy Suites
Milipitas, CA
Exhibitors
Exhibit Hours: November 12: 8:00am – 3:30pm November 13: 8:00am – 3:30pm
Please note that exhibit traffic will be minimal while symposium is in session. Exhibit space at the Medical Electronics Symposium entitles you to: 6 ft. Draped table Two chairs Attendee list Company sign Breakfast, Lunch & Breaks One copy of the conference proceedings
Download a hard copy of the registration form
Cost to exhibit: | Booth type | SMTA/iNEMI Members | Non-Members | One table includes access to Electrical Outlet | $450 | $550 | One table no access to Electrical Outlet | $400 | $500 |
Sponsorship Opportunities: Click here to download more information.
Coffee Break Sponsor - $500 (per day) Signage on-site near registration and breaks Company name/logo listed in final program and handout
Lunch Sponsor - $750 (per day) Signage on-site near registration Powerpoint slide to be displayed during lunch Company name/logo listed in final program and handout
Contact Patti Hvidhyld at 952-920-7682 to purchase a sponsorship.
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Counterfeit Electronic Parts Symposium West Tabletop Exhibition
Tuesday November 19, 2013
- Thursday November 21, 2013
Location: Town & Country Resort
500 Hotel Circle North
San Diego, CA 92108
Exhibitors
Exhibit Hours: November 19: 8:00am – 3:30pm November 20: 8:00am – 3:30pm Please note that exhibit traffic will be minimal while symposium is in session. Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to: 6 ft. Draped table Two chairs Attendee list Company sign Breakfast, Lunch & Breaks One copy of the conference proceedings
Download a hard copy of the registration form
Cost to exhibit: | Booth type | CALCE/SMTA Members | Non-Members | One table includes access to Electrical Outlet | $475 | $575 | One table no access to Electrical Outlet | $425 | $525 |
Sponsorship Opportunities: Click here to download more information.
Coffee Break Sponsor - $250 (per day) Signage on-site near registration and breaks Company name/logo listed in final program and handout
Lunch Sponsor - $550 (per day) Signage on-site near registration Powerpoint slide to be displayed during lunch Company name/logo listed in final program and handout
Contact Patti Hvidhyld at 952-920-7682 to purchase a sponsorship.
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Austin (CTEA) Expo & Tech Forum
Thursday December 5, 2013
Location: Norris Conference Center
2525 West Anderson Lane
Austin, TX 78757
Show Hours: 10AM-3PM
Attendees
Free Technical Program & Schedule:
Coming Soon!
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for SMTA Corporate members is $350/$450 (early/regular). The cost for non-corporate members is $425/$525 (early/regular) (click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list, and electricity for an additional $25 per outlet. Early Bird expires October 31st!
Important Exhibitor Materials: Coming Soon!
Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
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Carolinas Expo & Tech Forum
Thursday January 23, 2014
Location: Double Tree Raleigh Brownstone - University
1707 Hillsborough Street
Raleigh, NC 27605
Show Hours: 10:00AM - 3:00PM
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Coming Soon!
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on December 20th, 2013!
Important Exhibitor Materials: Advertising and Sponsorship Opportunities Hard Copy of Exhibitor Reg Form Exhibitor Details
Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
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Dallas Expo & Tech Forum 
Tuesday March 4, 2014
Location: Plano Center
2000 E. Spring Creek Pkwy
Plano, TX 75074
Show Hours: 10:00AM - 3:00PM
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Coming Soon!
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on February 1st, 2014!
Important Exhibitor Materials: Advertising and Sponsorship Opportunities Hard Copy of Exhibitor Reg Form Exhibitor Details
Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
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Houston Expo & Tech Forum
Thursday March 6, 2014
Location: Stafford Centre
10505 Cash Road
Stafford, TX 77477
Show Hours: 10:00AM - 3:00PM
Attendees
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Coming Soon!
Current Exhibitor List:
Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on February 4th, 2014!
Important Exhibitor Materials: Advertising and Sponsorship Opportunities Hard Copy of Exhibitor Reg Form Exhibitor Details
Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.
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| Cancellation Policy: Please note that exhibit fees will not be refunded if exhibitor cancels exhibit space. |
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