Contact Patti for available booth space. 952-920-7682 or patti@smta.org

Please note that exhibit traffic will be minimal while symposium is in session.
Full conference info is available here.

Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to:

Download a hard copy of the registration form

Cost to exhibit:

Booth type	CALCE/SMTA Members	Non-Members
One table includes access to Electrical Outlet	$450	$550
One table no access to Electrical Outlet	$400	$500

Sponsorship Opportunities:
Click here to download more information.

Coffee Break Sponsor - $500 (per day)

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

9:00AM
Registration opens

The SMTA Upper Midwest Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:30AM – 10:15AM
Determine Critical Cleaning Process Parameters for QFN's
Jigar Patel, M.S. Chemical Engineer, ZESTRON

QFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm.

11:00AM – 11:45AM
Boundary Scan Integration on Flying Probe Testers
Zinnour Soultanov, Principal Test Applications Engineer, SPEA America

Boundary Scan Test integration into Flying Probe Testers has been a long sought after capability in the Electronics Industry. The most recent integration is the latest generation flying probe system that includes latest generation boundary scan hardware and software. The boundary scan hardware uses synchronously the TAP port and the flying probes to drive and sense signals on the board. The two technologies exchange information through shared DLL’s and software to ensure the test flow is optimized and the test coverage is maximized.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor

2:00PM - 2:45PM
Options for Printing Fine Features and Breaking Through the Traditional .66 Area Ratio
Mike Burgess, DEK Printing Machines

Component miniaturization continues to pushthe limits of industry accepted manufacturing guidelines and the capabilities of modern printing machines. Breaking through the boundaries of traditional stencil design area ratios of 0.66is now necessary to assemble common everyday circuit boards. Achieving acceptable solder paste release with high transfer efficiency can be a challenge. Advancements in stencil materials, laser cutting machines and solder paste certainly aid the process, but are they enough?

Special thanks to our Technical Session Sponsor:

2:00PM
Raffle on Exhibit Floor

The SMTA Upper Midwest show is SOLD OUT! If you are interested in getting on the waiting list please contact SMTA Director of Exhibitions Emmy Garner .

Current Exhibitor List:

Accurate Carriers USA  #51 AIM  #27 All Flex Flexible Circuits & Heaters  #31 Amitron Corporation  #19 Apex Factory Automation  #16 ASC International, Inc.  #7 Ascentec Engineering  #49 Ayrshire Electronics  #26 Batten & Allen  #57 Benchside Technologies  #40 BEST Inc.  #14 Burton Industries Inc.  #9 Circuit Check Inc.  #47 Cobar Solder Products, Inc.  #44 Conductive Containers, Inc.  #24 Coridian Technologies, Inc.  #42 DEK USA  #22 Digitaltest, Inc.  #56 Discover Life Chiropractic LLC E-Tool  #5 E-tronix  #1 & 2 Electronic Systems Inc.  #48 Electrotek Corporation  #23 Ellsworth Adhesives  #4 EPTAC Corporation  #18 FCT Assembly  #34 FocalSpot, Inc.  #25 IDENTCO International  #36 Indium Corporation  #52

JMW Enterprises, Inc.  #28 JW Sales  #6 Krayden, Inc.  #33 Kyzen Corporation  #35 LaserJob Inc.  #3 Metaplast Circuits Ltd.  #37 Multicircuits  #12 Nikon Metrology  #39 Nordson DAGE  #15 Nordson YESTECH  #55 Omni-Tronics, Inc.  #54 Panasonic Factory Solutions of America  #53 Production Automation (P.A.C.)  #21 PROMATION, Inc.  #11 Prototron Circuits Inc.  #30 REStronics Northland  #38 Seica Inc.  #13 Seika Machinery, Inc.  #8 SPEA America  #17 Stanley Supply & Services  #50 StenTech Ltd.  #29 Syntek, Inc.  #46 Tenere, Inc.  #58 Texmac/Takaya Inc.  #45 Tonka Electronics, Inc.  #10 Universal Instruments  #20 VI Technology  #32 Viasystems  #41 ZESTRON Corporation  #43

Companies in bold are SMTA corporate members

Free Technical Program & Schedule:

8:30AM
Registration opens

The SMTA Ohio Chapter would like to invite you to attend the following technical presentations from three renowned technical speakers.

9:15AM – 10:00AM
Effects of Thermal Pad Patterning on QFN Voiding
Mario Scalzo, Senior Technical Support Engineer, Indium Corporation

Voiding under QFN’s is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless of the shape and number of subpads, increasing venting accessibility results in a decrease in the total number of voids, the largest voids, and discontinuity. Voiding caused by peripheral vias is comparable to voids caused by hidden vias. Voiding increases with decreasing print coverage and is attributed to insufficient solder. Voiding also decreases with an increase in the number of thermal vias. This phenomenon is attributed to volatiles bleeding through the small voids around the thermal via.

11:15AM – 12:00PM
The Top 7 Current Rework Challenges of BGA and QFN Packages
Bob Wetterman, IPC Master Instructor, BEST Inc.

With the proliferation of leadless device packages their rework has continued to be a challenge as solder voiding, open connections at the IO pads along with inspection of the devices continues to be problematic. In this session the challenges of leadless device rework, the methods of removal and replacement and their advantages/disadvantages will be outlined. Bob will discuss the “Challenges in BGA Rework” including examples of: Cheap Solder Mask, Masking off Nearby Components, Warping, Site Prepping without Damage, Micro Device Reballing, POP Rework, TMV Rework. Bring your own challenges for the larger group discussion at the end of this session.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor
Special thanks to our lunch sponsor:

1:15PM - 2:00PM
Cleaning Flux Residue Under Bottom Termination Components
Debbie Alavezos-Carboni, National Sales Manager, Kyzen Corporation

Manufacturers today are cleaning not just to remove flux residue. We will explore the concerns of leaving these other contaminants and especially no-clean flux residue on modern electronic assemblies. Many such devices incorporate Bottom Termination Components (BTC); which limit access of the cleaning fluid to the soil. Bottom Termination Components consist of any surface mount device whose external connections consist of metalized terminations that are an integral part of the circuit assembly. Common BTC examples include QFN, DFN, SON, LGA, MLP, and MLF packages. Critical variables for removing flux residues and other contaminants are the cleaning agent, heat exposure, gap height (BTC to board), and fluid flow dynamics. The cleaning agent must match up to the soil in order to solubilize and carry it away. Efficient mechanical energy is also required to deliver the cleaning agent to these residues which often under fill the component. The purpose of this research is to better understand why so many manufacturers are cleaning their no-clean assemblies and to provide general process conditions that will successfully remove flux residue and other contamination from under and around modern BTC components. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.

3:00PM
Raffle on Exhibit Floor - Special thanks to our raffle sponsors:

Free Technical Program & Schedule:

9:00AM
Registration opens

The SMTA Philadelphia Chapter would like to invite you to attend the following technical presentations from four renowned technical speakers.

9:30AM – 10:15AM
Avoiding Counterfeits When Addressing Component Obsolescence
David Steele, Da-Tech

Counterfeit electronic components work their way into the electronics supply chain by a variety of means and take on many forms. A common entry point opens up when parts on legacy products become obsolete. When Original Component Manufacturers discontinue products, sourcing departments are often forced outside of their authorized distribution networks, increasing the risk of receiving parts that are used, re-marked, electrical test failures, or even functional knockoffs.

11:00AM – 11:45AM
Can RoHS Conversion Actually Reduce Product Cost?
Chrys Shea, Shea Engineering Services

The Reduction of Hazardous Substances directive of 2006 mandated the removal of six dangerous materials from electrical and electronic devices. Perhaps the most difficult to remove was lead, as it was contained in nearly all electronic solders, and no drop-in replacements were readily available.The most viable solder replacements, alloys from the Tin-Silver-Copper (SAC) family, are far more expensive than tin-lead and require higher processing temperatures. The higher soldering temperatures require more costly energy to process and more heat-tolerant PCB laminates. The high-heatlaminates are also more expensive than their tin-lead counterparts, andthey present more difficulty for board fabricators to process.

12:00PM-1:30PM
Free HOT Lunch on Exhibit Floor

1:00PM - 1:45PM
PCB Cleaning After Rework (Some Spot Clean Better than Others)
Debbie Carboni, Kyzen Corporation

Most assembly houses have various forms of spot cleaning or bench top cleaning in at least one stage. Whether it is an aerosol cleaning solvents, IPA in a pump bottle, or a pan with some chemistry, brush, swab, or wipe: Assemblers’ seem to always struggle achieving consistent results with a manual cleaning process. Do you wonder why your IPA doesn’t seem to work like it did 5 years ago? Do you know what causes contamination relocation? Do you how to determine what the best cleaning agent is at the bench? These are just a few of the questions that will be reviewed. This presentation will discuss the influencing factors for inconsistency in cleaning as well as the precautions you can take to improve spot cleaning methods.

2:00PM - 2:45PM
Conformal Coating Compatibility with No-clean Fluxes
Mitch Holtzer, Alpha

Electronic assemblies used in aerospace and automotive applications have extreme exposure to harsh environmental conditions. Rapid changes in humidity and temperature over long periods of time can be challenging to the electrical integrity of these assemblies. Most demand for soldering materials is driven by the consumer electronics market. Mobile communications, portable computing (lap-tops, tablets, and netbooks), flat panel display televisions and automotive infotainment create the most demand for soldering materials. Each of these applications’ rapid growth has been enabled by ever increasing functionality at lower price points.

Special thanks to our Technical Session Sponsor:

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

TBD

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitons Emmy Garner with questions or for additional information.

Free Technical Program & Schedule:

Coming Soon!

Exhibitor Floorplan

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.

Please note that exhibit traffic will be minimal while symposium is in session.

Exhibit space at the Medical Electronics Symposium entitles you to:

Coming Soon!

Important Exhibitor Materials:
Coming Soon!

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.

Free Technical Program & Schedule:

Coming Soon!

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.

Free Technical Program & Schedule:

Coming Soon!

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.

Free Technical Program & Schedule:

Coming Soon!

Important Exhibitor Materials:

Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.