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Upcoming Expos

SMTA Expos

Local Expos and Tech Forums have become one of the great benefits of local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

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September 1, 2015 Capital Expo & Tech Forum
September 16 - 17, 2015 Medical Electronics Sponsorship and Table Top Exhibit
October 14, 2015 Long Island Expo & Tech Forum
October 13 - 14, 2015 IWLPC- Wafer-Level Packaging Conference & Exhibition
September 29 - 30, 2015 SMTA International Electronics Exhibition
October 14 - 15, 2015 Guadalajara Expo & Tech Forum
October 20, 2015 Austin (CTEA) Expo & Tech Forum
October 20, 2015 Connecticut Expo & Tech Forum
October 22, 2015 Intermountain Utah Expo & Tech Forum
October 29, 2015 Empire Expo & Tech Forum
November 5, 2015 LA/Orange County Expo & Tech Forum
November 12, 2015 Space Coast Expo & Tech Forum
November 18 - 19, 2015 LED Assembly, Reliability & Testing Symposium & Exhibition
January 26, 2016 Rocky Mountain Expo & Tech Forum
April 20, 2016 Atlanta 20th Annual Expo


or download a hard copy form to pay by check!





Capital Expo & Tech Forum

Tuesday September 1, 2015
Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723

Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:

Exhibit Hours:
Tuesday, September 1st, 2015
9:00AM–3:00PM


9:00AM
Registration Opens

9:20AM-10:00AM
White BeltIndustry Trends are Boosting Jet Printing
Nico Coenen, Mycronic

The challenges of today’s production environment is not only the fact that components getting smaller but the biggest challenge is the combination of small and large components on the same board. Putting the right amount of solder paste for each component will be required to deliver the right quality. Depending on the volume requirements Jet Printing can be an alternative tool to cope with this mix or be used as an add on tool to compliment the screen printer in a high volume environment.
Jet printing has been around for a number of years and with the latest developments it has increased its window of opportunity. This non-contact method of applying solder paste has a large number of advantages compared to standard screen printing or dispensing. The technology allows to build up the volume by single dots to achieve the right amount for each component. Special applications like pin in paste, applying paste in cavities and many more challenges of today’s requirement can be easily accommodated with this technology. Mixing different types of solder paste with different metal content will be discussed as typically jetting paste is type 5 versus type 3 or 4 for a screen printer. Also will we compare volume repeatability on a jet printer versus screen printing in a real production environment.

11:20AM–12:00PM
White Belt LED, BGA, and QFN Inspection
Bill Cardoso, Ph.D, Creative Electron

In this presentation we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The presentation will focus on the pitfalls of manufacturing and inspecting PCBs with these devices and solution to the technical challenges encountered by luminaire integrators and contract manufacturers. This presentation is targeted at manufacturing, process, and quality personnel responsible for designing; implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this presentation.

12:00PM–1:00PM
FREE LUNCH!

1:00PM–1:40PM
White Belt pH Neutral Cleaning Agents - Market Expectation & Field Performance
Ravi Parthasarathy, ZESTRON Americas

With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.

The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.
Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components.

Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance.

2:00PM–2:40PM

Ed BriggsTransition From Water-Soluble to No-Clean Solder Paste - Just How Easy is It?
Edward Briggs, Indium Corporation


In SMT assembly, it is widely accepted that the quality of the stencil-printed solder paste deposit is the strongest determinant for good first pass yields and long-term reliability. So, it should come as no surprise that solder paste manufacturers focus heavily on their solder paste’s “printability” by performing many statistically-based stencil printing experiments to characterize them.

The solder paste’s performance in the reflow process is also a top concern. Therefore, solder pastes are also evaluated to assure that they have a wide reflow process window to produce an excellent solder joint with high-reliability characteristics.

In addition, solder pastes are designed and evaluated for other important parameters including stability in storage, minimization of voiding, long-term electrical reliability, and performance in minimizing defects such as graping and head-in-pillow.

As a result of all of this work by solder paste suppliers, it is often possible to change from an SMT process that uses a solder paste that has water-soluble flux residues to one that has no-clean flux residues. The focus of this paper is to compare the printing and reflow characteristics of water-soluble and no-clean pastes in order to demonstrate the ease of converting to no-clean solder pastes.

The paper will conclude by recommending a simple strategy that will enable the small changes necessary to make the switch from water-wash to no-clean solder pastes. Some of the peripheral processes such as cleaning and rework will also be covered.

3:00PM
Raffle on Exhibit Floor for Several Exhibitor Give-Aways!


Current Exhibitor List:

Acculogic Inc.
ACE Production Selective Soldering Solutions
AIM
American Standard Circuits
Ascentech LLC - GEN 3
Circuit Solutions, LLC
Colonial Circuits Inc.
Conductive Containers, Inc.
Electrolube/HK Wentworth America, Inc.
Electronic Interconnect
Electrotek Corporation
Fritsch GmbH
Geib Refining Corp.
Heller Industries
Indium Corporation
Island SMT
JBC Tools USA, Inc.
Juki Automation
Keyence Corporation of America
Kyzen Corporation
LM Instruments
Methods Automation Inc.
Microtek Laboratories
Millennium Circuits Limited
National Technical Systems
Nikon Metrology
Nordson Test and Inspection
PACE Worldwide
Photo Etch Technology
Progressive SMT Systems
Prototron Circuits
RS Simmons Co.
Scienscope International
Seica Inc.
Smart Splice LLC
Techni-Tool, Inc.
Texwipe
The Test Connection, Inc.(TTCI)
Weller
Zentech Manufacturing, Inc.
ZESTRON Americas

Companies in bold are SMTA corporate members
Exhibitors
The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends Friday, July 31st, 2015!

Click here for Ad and Sponsorship opportunities!

Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    Medical Electronics Sponsorship and Table Top Exhibit Medical Electronics Sponsorship and Table Top Exhibit

    Wednesday September 16, 2015 - Thursday September 17, 2015
    Location: Marylhurst University
    17600 Pacific Highway (Hwy. 43)
    Portland, OR 97036-0261

    Attendees

    Exhibit Hall Hours for Paid Technical Conference Attendees

    September 16: 10:00am – 5:00pm; Reception: 5:00pm – 7:00pm
    September 17: 10:00am – 3:30pm
    To Register for the technical conference, click here.

    Exhibitor Reception (FREE)

    September 16: 5:00pm – 7:00pm
    If you are not going to register and attend the technical conference you can still join us for our exhibitor reception. This is a good opportunity to talk with our exhibitors as well as network with your industry colleagues.
    To Register for the Exhibitor Reception, click here.


    Current Exhibitor List:

    Accretech America, Inc.
    Akrometrix, LLC
    Apex Microtechnology
    AT&S Americas LLC
    AVX Medical
    Corfin Industries
    CORWIL Technology Corporation
    DISCO Hi-Tec America, Inc.
    ECD
    Epec Engineered Technologies
    Finetech
    FKN Systek, Inc.
    Foresite, Inc.
    Geib Refining Corp.
    Hadland Technologies
    IPDiA
    Ironwood Electronics
    Kyocera America
    Medtronic
    Micro Systems Technologies, Inc.
    Microdul AG
    Pac Tech USA
    Palomar Technologies, Inc.
    PFC Flexible Circuits Limited
    Silex Microsystems
    Universal Instruments Corporation
    XJTAG
    ZESTRON

    Companies in bold are SMTA corporate members
    Exhibitors

    Sponsorship Information

    Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the Sponsorship Benefits link below. For more information contact Gina Edwards at MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Sponsorship Benefits

    Sponsorship Application*

    *If you wish to pay through our secure server please use the "Register for Sponsorship or Exhibit" button at the bottom of this page. We will still need the Application form filled out.

    Exhibiting Information

    The conference will include an exhibition area featuring up to 40 tabletop displays that will be open during conference breaks plus after hours.

    Please e-mail JoAnnStromberg regarding exhibiting at joann@smta.org or 952-920-7682; for sponsorship information please contact Gina Edwards, MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings
  • Download a hard copy of the registration form

    Exhibit Pricing:
    Member* (*iNEMI/MEPTEC/OregonBio/SMTA): $895
    Non-member: $995

    Exhibit Hours:
    September 16: 10:00am – 5:00pm; Reception: 5:00pm – 7:00pm
    September 17: 10:00am – 3:30pm

    Please note that exhibit traffic will be minimal while symposium is in session.






    Long Island Expo & Tech Forum

    Wednesday October 14, 2015
    Location: Islandia Marriott Long Island
    3635 Express Drive North
    Islandia, NY 11749

    Attendees
    Attendees Register Now

    Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    Exhibitors Register Now
    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Expo Manager Kaitlyn Gherity or Sharon Dietrich with questions or for additional information.






    IWLPC- Wafer-Level Packaging Conference & Exhibition
    Note - If you already registered for the conference you do not need to register separately for the expo

    Tuesday October 13, 2015 - Wednesday October 14, 2015
    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110

    Attendees

    Exhibition: October 13-14, 2015
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, October 13th, 10:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, October 14th, 10:00am – 4:00pm

    If you are looking to attend JUST the Expo, click here to register for a FREE Exhibits Attendee Pass. This is not intended for exhibitors or those attending the technical conference or tutorials.

    View the floor plan


    Current Exhibitor List:

    Aehr Test Systems  #54
    AI Technology, Inc.  #18
    Akrometrix, LLC  #59
    AMICRA Microtechnologies GmbH  #11
    Amkor Technology Inc.  #2
    Applied Materials, Inc.  #41
    ATV Technologie GmbH
    Axus Technology  #34
    Chip Scale Review  #24
    CMK America Corporation
    Conductive Containers, Inc.  #43
    Deca Technologies  #36
    DJ DevCorp  #58
    ECI Technology  #33
    EV Group  #12
    FlipChip International - Hua Tian  #29
    Frontier Semiconductor  #50
    FRT of America  #4
    IMAT, Inc.  #40
    inTEST Corp.  #55
    Johnstech International  #1
    Kita USA Inc.  #45
    KLA-Tencor  #31
    KYZEN Corporation  #68
    LB Semicon Inc.  #26
    Materion  #46
    Mi Equipment (M) Sdn Bhd  #39
    NAMICS Technologies, Inc.  #7
    NANIUM S.A.  #28
    Nepes Corporation  #23
    New Venture Research Corporation  #21
    Nikon Metrology  #15
    Nordson DAGE  #56
    Owens Design Inc.  #37
    Pac Tech USA Inc.  #27
    Palomar Technologies  #8
    Plasma-Therm, LLC  #35
    Quartet Mechanics  #17
    SavanSys Solutions, LLC  #44
    Shenmao Technology Inc.  #5
    Sierra Circuits, Inc  #53
    Silex Microsystems  #14
    Smiths Connectors  #6
    Sonoscan, Inc.  #22
    Specialty Coating Systems  #52
    SPTS Technologies  #42
    STATS ChipPAC Ltd.  #19
    Suss MicroTec, Inc.  #25
    TechSearch International Inc.  #3
    Teikoku Taping System, Inc.
    Unisem  #13
    Yield Engineering Systems, Inc.  #38
    Yole Développement  #10
    YXLON FeinFocus  #20
    Zymet, Inc.  #22

    Companies in bold are SMTA corporate members
    Exhibitors
    Dates: October 13-14, 2015
    Location: DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, October 13th, 10:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, October 14th, 10:00am – 4:00pm

    Exhibitor Application

    View the floor plan

    Why Exhibit at IWLPC?
    * Reach a focused international audience
    * Generate Exposure in this highly competitive marketplace
    * Share New Products and concepts to the market
    * Enhance Relationships with existing customers and generate new leads

    What's Included?

  • Two Choices:
    Just one left! 8'x10' Pipe & Drape inside exhibit hall (a table & two chairs are provided)
    OR
    11 left! 6ft table-top outside exhibit hall/foyer (NO pipe & drape, ONLY a table and two chairs) (See Floor Plan)

  • NEW! Standard Electricity Included
  • Two Free Lunches Per Day
  • Coffee Breaks
  • All Access to the Reception
  • Attendee List
  • Show Directory Listing
  • Company Sign
  • IWLPC Proceedings Flash Drive
  • One Conference Pass (a $700 value)

  • How Much is it to Exhibit?
    8x10 Booth: SMTA Member $1,500 | Non-Member $1,700
    6ft Table-Top: SMTA Member $1,100 | Non-Member $1,300

    Questions?
    Please contact your Chip Scale Review sales representative or Jenny Ng from SMTA with questions or for more information.

    Sponsorship Opportunities


    View available Sponsorship Opportunities

    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!






    SMTA International Electronics Exhibition

    Tuesday September 29, 2015 - Wednesday September 30, 2015
    Location: Rosemont Convention Center
    Rosemont, IL

    Exhibitors
    Exhibitors Register Now
    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1000 attendees from 25 different countries.






    Guadalajara Expo & Tech Forum

    Wednesday October 14, 2015 - Thursday October 15, 2015
    Location: Hotel Riu Guadalajara
    Guadalajara

    Attendees
    Attendees Register Now

    Please see the Guadalajara Chapter Page for More Information on Technical Sessions.

    Exhibitors
    Please see the Guadalajara Chapter Page for More Information on Expo Materials.






    Austin (CTEA) Expo & Tech Forum

    Tuesday October 20, 2015
    Location: Norris Conference Center
    2525 West Anderson Lane
    #365
    Austin, TX 78757

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

  • Norris Conference Center Location

  • Free Technical Program & Schedule:

    Exhibit Hours:
    Tuesday, October 20th, 2015
    10:00AM–4:00PM


    9:30AM
    Registration Opens

    10:30AM-11:00AM
    White BeltImproving First Pass Yields and SMT Line Utilization for High Mix Low Volume Electronics Manufacturing
    Tommy Fox, Optimal Electronics

    Electronics manufacturers are challenged daily to improve profitability and utilization of assets in SMT manufacturing. Improvement approaches using software Manufacturing Execution Systems (MES) are discussed that increase first pass yield and increase line utilization for high-mix, low-volume electronics manufacturing.

    11:30AM–12:00PM
    White Belt Using Risk Analysis to Improve Project Plans, Budgets & Schedules
    Cheryl Tulkoff, Flipped Health

    There are many tools and software programs designed to help manage technology and business risks. Some of the familiar and commonly used techniques include Work Breakdown Structure (WBS), Gantt Charts, Critical Path Method (CPM), and Program Evaluation & Review Technique (PERT). However, a less commonly used but extremely valuable tool is the use of decision risk and risk analysis modeling. Monte Carlo simulation and the use of decision trees can be used to choose among alternatives in a risky environment. This presentation is designed to help break down and structure risky problems through the use of decision and risk analysis for the evaluation of real world projects and opportunities. Case study examples using Excel, @Risk, and PrecisionTree software will be shared. Add or expand your capabilities by learning more about these modeling methods. Resources: Data Analysis & Decision Making with Microsoft Excel by Albright, Winston and Zappe; Palisade for Excel, http://www.palisade.com/risk/, and http://www.palisade.com/precisiontree/

    12:00PM–1:00PM
    COMPLIMENTARY LUNCH!

    1:00PM
    Door Prize Drawing

    1:30PM–2:00PM
    White Belt Package on Package (PoP) Soldering Materials and Process Considerations
    Robert Wallace, Alpha

    Package on Package (PoP) technology has been one of the most requested areas for new product development and product trials. Assemblers at the forefront of miniaturization are either building products with PoP technology today, or evaluating the process. One key driver for this demand is the desire to reduce the time to market for New Product Introductions, particularly in feature rich, advanced hand held devices. An increasing trend is to mix and match memory and logic chips using PoP sub-assemblies. This allows, for instance, a hand held device maker to offer multiple options for memory capacity on a single platform. It also allows OEM’s and ODM’s to select from a menu of memory and logic device producers, rather than being locked into one company offering a SiP chip. This versatility is especially important during the NPI phase, as a new model may or may not receive commercial acceptance. Thus the risk of paying for the tooling and process development of a complex SiP assembly can be avoided. This presentation will describe test methods used by Alpha to qualify low viscosity PoP Solder Paste and Flux Gel and the unique application measurement process required. Unlike printed solder paste, PoP paste and flux gel is generally a dipping operation, and there have been several lessons learned in determining the correct viscosity, powder size distribution, and application technique required for a highly reproducible sub-assembly process. This presentation will explore multiple examples, and draw some conclusions on the successful qualification of a solder paste based PoP process.

    2:30PM–3:00PM
    Ed BriggsThe Transformative Future of Solar Energy
    DJ Rosebaugh, Lighthouse Solar


    This presentation is focused more on the macro and market view of distributed power generation versus detailed engineering issues. We will begin with a fundamental overview and history of solar PV power generation, system design, and technologies. That will serve as a foundation for discussing the implications of this technology on individuals and commercial entities, and to speculate on the long term implications and opportunities of distributed solar energy generation.

    4:00PM
    Expo Closes

    Special Thanks to Our Sponsors:












    Current Exhibitor List:

    ALPHA
    Conductive Containers, Inc.
    Eatman Associates
    FCT Assembly
    FHP Reps, LLC
    ICAPE Group
    INVENTEC Performance Chemicals
    JBC Tools USA Inc.
    Krayden, Inc.
    Kyzen Corporation
    Nordson Test and Inspection
    NPI Materials, Inc.
    Prototron Circuits
    Seika Machinery, Inc.
    Silicon Hills Design Inc.
    Specialty Coating Systems
    StenTech
    STI Electronics, Inc.
    Test Research, Inc.
    Westak

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 18th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Application

  • Exhibitor Details

  • Norris Conference Center Location

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    Connecticut Expo & Tech Forum

    Tuesday October 20, 2015
    Location: Waterbury Marriott
    63 Grand Street
    Waterbury, CT 06702

    Attendees
    Attendees Register Now

    Please see the Connecticut Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    The cost to exhibit is $325/$350 (early/regular) for corporate members. The cost to exhibit for non corporate members is $350/$375 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact Mark Siems to register for a table or for additional questions!






    Intermountain Utah Expo & Tech Forum

    Thursday October 22, 2015
    Location: University of Utah
    Warnock Engineering Building (main lobby)
    72 S. Central Campus Drive
    Salt Lake City, UT 84112

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Details to Come!


    Current Exhibitor List:

    JBC Tools USA Inc.
    Panasonic Factory Solutions of America
    Prototron Circuits
    Rehm Thermal Systems, LLC
    StenTech Ltd.
    Weller

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 25th, 2015!

    Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    Empire Expo & Tech Forum

    Thursday October 29, 2015
    Location: Radisson Hotel (Rochester)
    175 Jefferson Road
    Rochester, NY 14623

    Attendees
    Attendees Register Now

    Please see the Empire Chapter Page for More Information on Technical Sessions and Expo Materials,

    Exhibitors
    Exhibitors Register Now
    The cost to exhibit is $225 for one table (price will increase to $300 after September 25th), $375 for two, $525 for three, or $675 for four. The cost to exhibit includes: one 6ft draped table, two chairs, electricity and attendee list.

    Please contact Drew Ake at aake@harris.com to register for the event.






    LA/Orange County Expo & Tech Forum

    Thursday November 5, 2015
    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, November 5, 2015
    10:00AM–3:00PM


    9:30AM
    Registration opens

    11:00AM–11:30AM
    The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance
    Karen Tellefsen and Mitch Holtzer, Alpha

    Electrical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrical reliability of a printed circuit. This paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues. Three different reflow temperature vs. time profiles, a 1.5 °C/s ramp to 230°C, a 1.5 °C/s ramp to 250°C and a 90 s soak at 175°C with a 230°C peak, were used to reflow three lead-free solder pastes in both air and nitrogen atmospheres. Fourier transform infrared spectra of the reflowed flux residues shows how reflow profile conditions and atmosphere affects the decrease of a peak around 1700 cm-1 and the appearance and increase of another peak at 1600 cm-1. The 1700 cm-1 is smaller for flux residues that were reflowed under hotter conditions and for those that were reflowed in air. The peak at 1600 cm-1 is larger for residues exposed to hotter reflow profiles in air, but is hardly present for residues reflowed in nitrogen. The affect of these reflow conditions on surface insulation resistance (SIR) per IPC-TM-650 Method 2.6.3.7 at 40°C 90% RH and 12V bias has been studied. This measurement shows that hotter reflow conditions result in higher SIR values for two of the pastes, as would be expected, but has a smaller affect on the third paste.

    12:00PM–1:00PM
    Free lunch on the show floor!

    1:00PM–1:30PM
    Oh, Flux! – How Not to Clean Electronics Assemblies
    Barbara Kanegsberg & Ed Kanegsberg, BFK Solutions LLC

    Is it the irate customer? Is it the flux residue? Is it the friendly SCAQMD or OSHA inspector? You’ll laugh; you’ll cringe! You’ll have fun! Forget the success stories. We all tend to hear glowing reports of successes. Research has shown that successes are reported; failures are not. You can learn more from failures than successes. Hear about real-life cleaning mishaps. Hear about “partial successes.” Learn how to interpret success stories and adapt the approach for your own manufacturing facility. Come away with great ideas to clean electronics assemblies and to avoid costly investments in process equipment and chemicals that are not right for you. Understand how to fix small issues before the line goes down, before you lose business. Unlike reality T.V, most names will be changed to protect the innocent.

    2:00PM–2:30PM
    Effects of Shelf Life and Manufacturing Environment on Solder Paste
    Neil Poole, Henkel

    A number of studies have shown that up to 60-80% of all electronics assembly defects are related to the solder paste printing and reflow characteristics. Since the introduction of lead free solder paste, manufactures have concentrated on improving the printing performance and widening the reflow window, but the number one problem in assembly of circuit boards still point to the solder paste. While some of these defects can be blamed on environmental elements, temperature, and humidity on the factory floor or possible temperature variations during the shipping and handling. The condition of the paste, while fresh is usually good, but many of the process defects may be attributed to the logistics of getting material from the vendors to the shop floor. In this presentation Henkel will explore effects of shelf life and manufacturing environment on solder paste.

    3:00PM
    Expo Closes


    Current Exhibitor List:

    AMTECH
    Ascentec Engineering
    BOFA Americas
    Creative Electron, Inc.
    EPTAC Corporation
    Fritsch GmbH
    Fuji America Corporation
    I Source Technical Services, Inc.
    INVENTEC Performance Chemicals
    JBC Tools USA Inc.
    Kyzen Corporation
    METCAL
    Nikon Metrology
    PA&LS
    Panasonic Factory Solutions of America
    Progressive SMT Systems
    Smart Splice LLC
    Texwipe
    Universal Instruments Corporation
    Weller - A Division of Apex Tool Group
    XJTAG

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 9th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    Space Coast Expo & Tech Forum

    Thursday November 12, 2015
    Location: Melbourne Auditorium
    625 East Hibiscus Blvd
    Melbourne, FL

    Attendees

    Please see the Space Coast Chapter Page for More Information on Technical Sessions and Expo Materials.

    Free Technical Program & Schedule:

    Coming Soon!


    Current Exhibitor List:

    AGI Corporation
    AIM
    Ascentec Engineering
    ASM Assembly Systems, LLC
    BTU International
    Circuit Technology
    Conductive Containers, Inc.
    Conecsus LLC
    ELANTAS PDG
    EPTAC Corporation
    FCT Assembly, Inc.
    Indium Corporation
    JBC Tools USA Inc.
    Kurt Whitlock Associates
    Kyzen Corporation
    Lone Star Circuits
    MET Stencil
    METCAL
    Nikon Metrology
    Nordson ASYMTEK
    PACE Worldwide
    Photo Etch Technology
    PVA
    Rehm Thermal Systems, LLC
    Scienscope International
    Seica Inc.
    STI Electronics, Inc.
    Technical Resources Corporation
    TEK Products
    Texwipe
    Tropical Stencil, Inc.
    Universal Instruments Corporation
    Vashaw Scientific, Inc.
    Weller
    YXLON FeinFocus
    ZESTRON Americas

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information).
    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $25 per outlet. Early bird pricing ends on October 16th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Kaitlyn Gherity or Eileen Hibbler with questions or for additional information.






    LED Assembly, Reliability & Testing Symposium & Exhibition
    Note - If you already registered for the symposium you do not need to register separately for the expo

    Wednesday November 18, 2015 - Thursday November 19, 2015
    Location: Crowne Plaza Midtown
    590 West Peachtree Street Northwest
    Atlanta, GA 30308

    Attendees

    Exhibit Attendee:

    Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Come and visit the exhibits for FREE. Plan to network with leading suppliers in the LED component industry. We will provide you with FREE refreshments.

    Exhibit Hours:
    November 18: 8:00am – 6:30pm, Exhibitor Reception 5:00pm - 6:30pm
    November 19: 8:00am – 3:30pm


    Exhibitors
    Exhibitor Information:

    At the LED A.R.T. Symposium and Exhibition you will network with Assembly/Packaging Engineers, Corporate/General Management, Test Engineers, Designers, Buyers, R&D Engineers, and more.

    Download a hard copy of the registration form

    Cost to exhibit:

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $750 $850
    One table
    no access to Electrical Outlet
    $700 $800


    Sponsorship Opportunities:
    Click here to download more information.

    Exhibitor Reception Sponsor: $2,000
  • Sponsors will make special toast and receive signage at the reception and also napkins and table tents at the reception! Reception will be in the Exhibit Hall.
  • FREE exhibit table with Electric
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Lanyard Sponsor: $400/$800
  • Provide 150 Lanyards and they will be the official lanyard for the conference(If you would like us to make the lanyards it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Bag Sponsor: $400/$800
  • Provide 150 Bags and they will be the official bags of the conference. (If you would like us to make the bags it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • Logo on all marketing event materials
  • On-site signage (posted throughout conference/expo area)

    Lunch Sponsors: $800
  • Logo recognition in Show Directory
  • Logo recognition and link to company Web site
  • On-site signage (posted throughout conference/expo area)

    Refreshment Break Sponsorships: $550
  • On-site signage (posted near coffee breaks)
  • Recognition in Show Directory






  • Rocky Mountain Expo & Tech Forum

    Tuesday January 26, 2016
    Location: West Club at Mile High Stadium
    1701 Bryant Street
    Denver, CO 80204

    Attendees

    Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2016 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth.

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Mile High Stadium

    Free Technical Program & Schedule

    Coming Soon!




    Exhibitors
    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on December 22nd, 2015!

    NEW SPONSORSHIP! Diamond Vision
    Big Screenm Get your name and logo on the BIG SCREEN at Sports Authority Field and on the screens in the West Club during the Expo! Click HERE for more information

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Sponsorship and Advertising Form
  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    Cancellation Policy: All exhibit fees are non-refundable. Payment can be deferred to another expo within the same year, if notification is received more than two weeks prior to the original exhibition date, after which no payment allocation will be made.