Bob Willis, Electronic Presentation Services More recently Bob coordinated the SMART Group Lead-Free Hands-On Experience at NEPCON Electronics 2003. This gave the opportunity for over 150 engineers to process four different PCB solder finishes with two different lead-free pastes through convection and vapor phase reflow. They also had the opportunity to inspect boards with optical and X-ray equipment. Bob is currently planning Hands-On Experience 2. He has also run training workshops with research groups like ITTF, SINTEF, NPL, and IVF in Europe. Bob has organized and run three lead-free production lines at international exhibitions, Productronica and NEPCON Electronics in Germany and England, to provide an insight to the practical use of lead-free soldering on BGA, CSP, 0201, and through hole intrusive reflow connectors. This has resulted in technical papers being published in Germany, USA, and the UK. Bob also defined the process and assisted with the setup and running of the first simultaneous double-sided reflow process using tin/silver/copper for reflow of through hole and surface mount products. Although the problems associated with fillet lifting of through hole joints have been well documented by many researchers, it was Bob Willis who highlighted the same problem could exist with pin in paste / intrusive reflow soldering. He demonstrated that the problem could occur with each of the common lead-free alternative alloys, but despite poor appearance, they provided reliable joints even after 2000 thermal cycles. In doing so, he has produced video simulations of fillet lifting to help understand the way fillet lifting occurs. Bob also had the pleasure of contributing a small section to the text book on lead-free soldering technology, Environment-Friendly Electronics by Jennie Hwang. His contribution to the book provides examples of lead-free defects that companies may experience during the introduction of lead-free into production. Bob was responsible for the Lead-Free Assembly & Soldering "CookBook" CD-ROM concept in 1999, the world's first interactive training resource. He implemented the concept and produced the CD in partnership with the National Physical Laboratory (NPL), drawing on the many resources available in the industry, including valuable work from Soldertec Global. The CD is now in its 3rd edition, and it incorporate many interviews with leading engineers involved with lead-free research and process introduction. Bob recently produced one of the first sets of inspection reference posters covering reflow and wave solder joints using lead-free terminations and different alloys, and he is currently producing three new lead-free interactive CD's with Soldertec Global on Hand, Wave, and Reflow Soldering, that will be featured shortly in the SMTA Book Store. Bob led the SMART Group Lead-Free Mission to Japan, and with this team produced a report and organized several conference presentations on their findings. The mission was supported by the DTI and visited many companies in Japan, and a seminar was presented in Tokyo at the British Embassy to over 60 technologists and senior managers of many leading Japanese producers. Bob has conducted workshops on lead-free production process for IPC, APEX, SMTA, and NEPCON Exhibitions in the USA, as well as SMT Nuremberg and Productronica, Germany. In addition Bob has coordinated the annual SMART Group Lead-Free Update Seminars with the SMART Group PR Director, Mike Judd. He has assisted with the launch of two DTI Lead-Free Reports written by representatives of Soldertec global and NPL at two NEPCON Exhibitions. He is currently supporting the NPL "Lead-Free Masterclasses" workshops on design, manufacturing, and rework, which are being presented around the UK during 2004. The workshops are sponsored by EM&T magazine. Over the last fifteen years, Bob has been involved in all aspects of surface mounted assembly, both at production and quality levels, and he has trained engineers and other personnel in modern production. Bob Willis operates Electronic Presentation Services, a training and consulting business based in England that operates worldwide. Bob provides services in most areas of electronic manufacture, as well as printed circuit board manufacture, to companies of all sizes that produce a range of products.