Do you want to help ensure SMTA technical programs continue to offer the high quality technical information for which SMTA is known? Then you should join the SMTA Technical Committee. If you have comments, suggestions, or would like to join the committee, please contact JoAnn Stromberg (joann@smta.org) or Patti Hvidhyld (patti@smta.org).
SMTA is currently looking for active technical committee roles in our Sub-Committees, Counterfeit and Medical Symposiums. Please contact Patti Hvidhyld if interested. Get great exposure for you and your company!
Files from the 2012 Mid-Year Meeting:
Slides (pdf)
Minutes (pdf)
Audio (wmv)
Mission Statement
The SMTA Technical Committee is a network of professionals who help the organization build skills, share practical experience and develop solutions by assisting the organization in bringing educational opportunities to its members and industry professionals.
The time commitment for participation in the SMTA Technical Committee is minimal. We meet yearly at the SMTA International Conference and then again in the spring through a webinar. During these meetings, you will have the opportunity to actively participate in a discussion on the direction of our educational opportunities. You will also hear from the SMTA educational department throughout the year on specific issues relating to our programming.
Many of the SMTA Technical Committee members also participate on a Subcommittee for one of our educational offerings throughout the year (ICSR. IWLPC, SMTAI, Medical, Counterfeit, etc.). Please take a look at our calendar of education events to see if you would be interested in a specific conference. Then contact Patti Hvidhyld for more information.
Committee Purpose
To organize and conduct technical programs as approved by the SMTA Board of Directors
To continuously improve the quality of the technical programs of the SMTA
To insure an adequate supply of high-quality papers for SMTA conferences
To identify emerging technologies in order to recommend and implement technical programs (including conferences and publications) reflective of and responsive to industry needs
Membership Requirements
A member in good standing of the SMTA
Demonstrated technical competency in area of expertise corresponding to the subcommittee you serve on
Established network of industry peers
Desire to improve the caliber and quality of professional and technical information exchanged within the SMTA and the industry
When possible, the ability to solicit and review 2-3 abstracts on an annual basis which could be used for an SMTA conference
Ability to work effectively in a team environment
Member Responsibilities
- Assist SMTA headquarters with educational programming schedule by suggesting important topics and potential speakers
- Participate in two meetings yearly (optional based on members' availability) - one webinar in spring; one meeting at SMTA International Conference
- Assist SMTA education department throughout year on questions related to educational programming (speaker searches, topic selection, event promotion, etc...)
- Help recruit speakers and instructors for upcoming conferences.
SMTA Sub-Committees
SMTA International
Raiyomand Aspandiar, Intel Corporation
Daniel Baldwin, Engent, Inc.
Donald Banks, St. Jude Medical
Lars Boettcher, Fraunhofer IZM Berlin
Mike Buetow, CIRCUITS ASSEMBLY Magazine
Srinivas Chada, Henkel Electronic Materials LLC
Marie Cole, IBM Corporation
John Evans, Auburn University
Trevor Galbraith, Global SMT & Packaging
Reza Ghaffarian, Jet Propulsion Laboratory
Steve Greathouse, Plexus Corp.
Denis Jean, Plexus Corp.
Matt Kelly, IBM Corporation
Jeff Kennedy, Celestica Inc.
Pradeep Lall, Auburn University
Andrew Mawer, Freescale Semiconductor
Heather McCormick, Celestica Inc.
Robert Rowland, RadiSys Corporation
Randy Schueller, DfR Solutions
Paul Vianco, Sandia National Laboratories
Bob Willis, ASKbobwillis.com
Charles Woychik, Tessera, Inc.
Pan Pacific Microelectronics Symposium
Bill Bader, iNEMI
Charles Bauer, TechLead Corporation
Tom Chung, ASTRI
Bernard Courtois, CMP
Krista Crotty, Alberi EcoTech
Joseph Fjelstad, Verdant Electronics
Shen-Li Fu, I-Shou University
Yu-Jung Huang, I-Shou University
Phillip Isaacs, IBM
Ricky Lee, HKUST-Center for Advanced Microsystems Packaging
Charles Lin, Bridge Semiconductor
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Tetsuro Nishimura, Nihon Superior Company Ltd.
Soren Norlyng, MICRONSULT
Kyung Paik, KAIST
Michael Pecht, University of Maryland
Horatio Quinones , Nordson ASYMTEK
Alan Rae, TPF Enterprises LLC
Vern Solberg, Solberg Technical Consulting
Keith Sweatman, Nihon Superior Company Ltd.
Abby Tsoi, Kasion Automation Ltd.
Rao Tummala, Georgia Institute of Technology
Henry Utsunomiya, Interconnection Technologies, Inc.
M. Juergen Wolf, Fraunhofer Institute
Peter Pooh
International Conference Soldering Reliability (ICSR)
Laura Turbini, Research In Motion, Conference Chair
Peter Arrowsmith, BOTE Engineering
Bev Christian, Research In Motion
Matt Kelly, IBM Corporation
Tim Luke, Cookson Electronics Assembly Materials
Polina Snugovsky, Celestica Inc.
Counterfeit Electronic Parts Symposium
Diganta Das, Ph.D., CALCE/University of Maryland, Conference Chair
Bill Barthel, Plexus Corporation
Gary Beckstedt, World Micro
Mark Crawford, Department of Commerce
Lisa Gardner, U.S. Government Accountability Office (GAO)
Robin Gray, National Electronic Distributors Association (NEDA)
Sydney Pope, Office of the Secretary of Defense
Tim Trainer, Global Intellectual Property Strategy Center, P.C.
Phil Zulueta, Jet Propulsion Laboratories
South East Asia Conference
Ly Guat Lee, Flextronics Technology, Conference Chair
KL Lim, Plexus Manufacturing Sdn. Bhd.
Lian-Huat Ng, Plexus Manufacturing Sdn. Bhd.
Teng Hoon Ng, Celestica (Thailand) Co., Ltd.
Jonas Sjoberg, Flextronics International
AK Tan, Robert Bosch (M) Sdn. Bhd.
David Vetharudge, Listech Technology
International Wafer Level Packaging Conference (IWLPC)
Andrew Strandjord, PacTech USA, General Chair
Luu Nguyen, National Semiconductor, Technical Chair
Marketing/Conference
Steve Greathouse, Plexus Corporation
Richard Haas, Richard Haas Marcom Consulting
Andy Mackie, Indium Corporation
Alan Rae, TPF Enterprises LLC
3D Integration
Francoise von Trapp, 3DIncites, 3D Integration Chair
Peter Ramm, Fraunhofer EMFT, 3D Integration Co-Chair
Herb Reiter, eda 2 asic Consulting, Inc.
Zhaozhi(George) Li, Intel ATTD
Wafer-Level Packaging
Beth Keser, Qualcomm, WLP Track Chair
Ted Tessier, FlipChip International
Ravi Chilukuri, Amkor Technology
MEMS
Russell Shumway, Amkor Technology, MEMS Chair
Michelle Bourke, Kilbrydon, MEMS Co-Chair
Nick Leonardi, Premier Semiconductor Services
Ron Molnar, AZ Tech Direct
Roger Grace, Small Times Magazine
Maaike Taklo, SINTEF ICT
Tom Clifford, TJB Associates
High Performance Cleaning and Coating Conference
Mike Bixenman, Kyzen Corporation, Conference Chair
David Adams, Rockwell-Collins
Debbie Carboni, Kyzen Corporation
Julie Fields, Technical Devices Company
David Hillman, Rockwell Collins
Barbara Kanegsberg, BFK Solutions LLC
Jeff Kennedy, Celestica Inc.
Bill Kenyon, Global Centre Consulting
Steve Stach, Austin American Technology Corporation
Bill Vuono, Raytheon
Harald Wack, ZESTRON EU
Medical Conference
Ronald Molnar, PackageMate, Inc. General Chair
Dale Lee, Plexus Corp, Techincal Chair
Dock Brown, Medtronic
Randy Crutchfield, Medtronic Microelectronics Center
Robert Kinyanjui, Sanmina-SCI
Rakesh Kumar, Specialty Coating Systems, Inc.
Nicholas Leonardi, Premier Semiconductor Services
Kexia Sun, Starkey Laboratories
Donald Banks, St. Jude Medical
Certification
Bill Barthel, Plexus Corp., Committee Chair
Scott Penin, Paradigm Contract Mfg. LLC
Tom Borkes, The Jefferson Project
W. James Hall, ITM Consulting
Ronald Lasky, PE, Indium Corporation / Dartmouth College
Scott Penin, Paradigm Contract Manufacturing LLC
Phil Zarrow, ITM Consulting
