South East Asia Technical Training Conference on Electronics Assembly Technologies 2016
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Online registration is now closed! Please register on-site.
Technical Program Finalized
Sessions and topics in our 2016 program will focus on new Solder Alloys for Reliability, LED Technology, Traceability, Test, High Reliability, Components, Microelectronics, Printing, Assembly, BGAs, BTCs, and Harsh Environments Issues.
There will be adequate time to have our industry experts respond to your questions
Networking time will allow you to continue discussions following the presentations
This is one of the best ways to enhance your knowledge and your company's profitability
Extensive participation from experts from around the world provides for a comprehensive educational experience
The SMTA reputation ensures high quality technical information that can be put to use immediately
Ultrapure Water Micro Conference
The Ultrapure Water Micro conference collects the leading thinkers, planners and doers on the water side of microelectronics manufacturing in one place to discuss technological breakthroughs and upcoming needs, cost saving and reuse opportunities, and developments in the sector. Visit ultrapurewatermicro.com to book your pass for UPW Micro 2016, June 7-8 in Austin, Texas."
International Conference on Soldering & Reliability 2016
The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.
Technical Symposium: June 28-30, 2016 Expo: June 28-29, 2016 Workshops: June 30, 2016 University of Maryland, College Park, MD
SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 28-29 at the College Park Marriott Hotel & Conference Center. The Workshops will be held June 30 at the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.
Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Keynote Speakers Announced
Counterfeit Electronic Parts - Observations and Insights from a US Defense Industry Perspective
Henry Livingston, BAE Systems
Henry Livingston had been an early and frequent voice in the area of risks posed by counterfeit electronics to the industry in general and the defense sector in particular. He will relate his observations and insights from personal experience in counterfeit electronic part avoidance related activity over the past decade pointing out where we went right and where we may have gone wrong. Henry will also present his thoughts on how SAE Aerospace Standard AS5553 can serve as criteria for assessing a 'Contractor Counterfeit Electronic Part Detection and Avoidance Systems' in compliance with recent department of defense regulations in view of changes both in the government regulations and in the standard.
Getting Ready for Coming Deluge of Complex Cloned Devices
Thomas Sharpe, SMTCorp
Clones had been a concern of people in the electronics parts supply chain for a long time but wa generally as something that is to come in the future, not now. Badly made clones had been relatively easy to detect through materials comparison and as a result, there is some complacency. In this Keynote address, Tom Sharpe will show that we need to get more prepared for a clone onslaught. He will present information on the direction to which China is moving into very quickly as a state-sponsored manufacturer of much more complex clone devices within the next 4-6 years and that push will have impact globally and on the US.
The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
"How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others.
Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.
The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.
LED Assembly, Reliability & Testing Symposium 2016
The inaugural CALCE-SMTA LED A.R.T. Symposium at Atlanta, Georgia concluded during November 17 - 19, 2015. It was three days of packed technical presentations on LED Assembly, Failure Mechanisms, Packaging, Applications, Reliability and Testing and Cleaning. The material discussed had direct industry applications for the whole supply chain with unique emphasis on product realization with LEDs. In this event, we had 70 attendees, 16 exhibiting companies and 18 Technical presentations with people from 9 countries and 26 of the 50 United States.
Robert F. Karlicek, Jr., Ph.D from Smart Lighting Engineering Research Center, Rensselaer Polytechnic Institute kicked off the symposium with a keynote address on Emerging Trends in LED with big picture forward looking issues in LED applications well beyond illumination. Kurt-Juergen Lang from Osram Opto Semiconductors focused on LED applications in automotive space in his keynote address. The symposium concluded with a tour at Georgia Tech Institute for Electronics and Nanotechnology and its laboratories followed by a tour of the Packaging Research Center.
Workshop on LED Failure Mechanisms, Reliability and Qualification covered the latest in understanding of failure mechanisms of LEDS and how the industry is using or not using the knowledge on failure mechanisms in reliability assessment and qualification. If you are interested in future sessions of this course contact Dr. Diganta Das.
Photos from the 2015 LED Symposium
Thank you to everyone that attended the first LED Symposium and to our speakers and exhibitors. It was a great three...
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date.
Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.