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SMTA Symposia include paper sessions, workshops, panel discussions, and other related conference events.
Featuring several companies, each presenting recent technical research, symposia focus on one main topic, highlighting critical issues and bringing new
scientific developments to light.
Symposia are often co-located with SMTA Academy courses.
Cancellation Policy: Registration fees will be refunded (less a $50 processing fee) if written notice is postmarked two weeks prior to the event date.
Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.
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April 28-30, 2008
Washington Duke Inn & Golf Club, Durham, NC
Conference Information
The 3D/SiP Advanced Packaging Symposium will provide you with the most up-to-date research in the field of advanced packaging with particular attention to materials, manufacturing, assembly and Package/PWB reliability in a Pb-free environment.
SYMPOSIUM SCHEDULE
Monday, April 28: 1:00p.m. – 4:30p.m.
Half Day Tutorial
* Click on tutorial title to view complete description
3D Packaging Applications, Requirements, Infrastructure and Technologies
Lee Smith, Amkor Technology
Tuesday, April 29: 8:30a.m. – 5:00p.m.
Session I: PoP 3D Assembly and Reliability
Session II: 3D Wafer Level Integration and Processing
Session III: System in Package
Wednesday, April 30: 8:30a.m. – 4:45p.m.
Session IV: TSV and 3D Interconnects
Session V: Thermal Analysis
Session VI: Flip Chip Processes and Materials
Session VII: Advanced Substrate Technology
The following are some of the 2008 3D/SiP Advanced Packaging Symposium speakers:
Biao Cai, IBM
Dan Baldwin, Engent, Inc.
Brock LaMeres, Montana State University
Sara Paisner, Lord Corporation
George White, Jacket Micro Devices
Gene Dunn, Panasonic
Click here to view the complete symposium schedule.
SPECIAL EVENTS
April 29, 8:40a.m. - 9:30a.m.
Tuesday Keynote Address: Key Challenges in 3D/SiP Packaging and Assembly
Dongkai Shangguan, Vice President and Senior Technical Fellow, Flextronics
April 29, 5:00pm - 6:00pm
Welcome Reception
Let us welcome you to Research Triangle Park and the 3D/SiP Advanced Packaging Symposium by joining us at this afternoon reception.
April 30, 8:30a.m. - 9:15a.m.
Wednesday Keynote Address: Challenges in High Performance Network Packaging
Judy Priest, Principal Engineer & Signal Integrity Manager, Cisco Systems
REGISTRATION
Click on the "Register Now" tab located in the right, upper corner to register for this symposium. For more information on this program please contact SMTA Director of Educational Programming, Melissa Serres.
ACCOMMODATIONS
Washington Duke Inn
3001 Cameron Blvd.
Durham, NC 27705
P: 800-443-3853
Rate: $175/night
Reference the SMTA/3D/SiP Advanced Packaging Symposium when making your reservations to ensure receipt of the discounted rate. Contact the SMTA if you have any difficulty making your reservation.
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Registrations are being taken through the SMTA Online Registration System.
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International Conference on Soldering and Reliability
May 13-16, 2008
Toronto Hilton Airport Hotel, Toronto, Ontario
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada in 2007, this conference will bring together the community of soldering and reliability experts.
To register for the conference or academy workshops please click on the "Register Now" button on the right side of the page.
PROGRAM OUTLINE
SMTA Lead-Free Academy
Tuesday, May 13, 2008
Click on the course titles to view the full descriptions.
T1: The Reality of Reliability of Lead-Free
Craig Hillman, Ph.D., DfR Solutions: 8:00a.m. - 5:00p.m.
T2: Lead-Free Soldering – Metallurgical Fundamentals, Failure Mode, Optimal Processes, and Reliability
Ning-Cheng Lee, Ph.D., Indium Corporation of America: 8:00a.m. - 12:00p.m.
T3: Taking Terror out of Lead Free Circuit Board Surface Finishes and Assembly
Bihari Patel, MacDermid, Inc.: 1:00p.m. - 5:00p.m.
T4: Lead-Free Rework: Its Implementation and Lessons Learned
Doug Peck, AEIC Inc.: 8:00a.m. - 12:00p.m.
Conference Schedule
Wednesday, May 14, 2008
Hours: 8:00a.m. - 5:15p.m.
Thursday, May 15, 2008
Hours: 8:00a.m. - 5:15p.m.
Friday, May 16, 2008
8:00a.m. - 11:30a.m.
The 2008 International Conference on Soldering & Reliability speakers include: Denis Barbini, Ph.D., Vitronics Soltec Mike Bixenman, Kyzen Corporation Steve Martel, Sonoscan Doug D. Perovic, University of Toronto Keith Sweatman, Nihon Superior and many more...
Click here to view the speaker line-up and conference details.
Special Events
Reception with Exhibitors
Wednesday, May 14, 2008: 5:15pm - 6:30pm
Join us for a reception that gives industry suppliers the opportunity to join the technical conference and exhibit their products. All coffee breaks, lunches, and the evening reception will be held in the exhibit hall to offer a networking opportunity for all exhibitors and conference attendees.
Keynote Presentation
Thursday, May 15, 2008
Tin Whiskers: The Facts, Just the Facts
Carol Handwerker, Purdue University
Please check the Vendor Days page for more information about exhibiting at this event.
Accomodations
Hilton Toronto Airport
5875 Airport Road
Mississauga, Ontario
Canada
Tel: 905-677-9900
Room Rate: $140CND
Reference group code SMT08 when making your reservations to ensure receipt of the discounted rate.
Technical Committee
Laura Turbini, Ph.D, Research in Motion, Conference Chairperson
Bev Christian, Research in Motion
Matthew Kelly, IBM Corporation
Polina Snugovsky, Celestica, Inc.
The International Conference on Soldering & Reliability is sponsored by the SMTA and held in co-operation with the SMTA Toronto Chapter.
For more information on this program please contact SMTA Director of Educational Programming, Melissa Serres.
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Registrations are being taken through the SMTA Online Registration System.
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