MAY 18-20, 2010
TORONTO, ON, CANADA
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.
ABSTRACTS ARE DUE JANUARY 29, 2010
Visit the Call for Papers page to view the complete Call for Papers and to submit an abstract. More information on this program will be posted in February.
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SMTA Symposia include paper sessions, workshops, panel discussions, and other related conference events.
Featuring several companies, each presenting recent technical research, symposia focus on one main topic, highlighting critical issues and bringing new
scientific developments to light.