The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

Sessions and topics in our 2012 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes. Sessions over the two days will cover: Assembly-Process and Materials Assembly-Reliability Business Issues Cleaning for Today's Challenging Designs Harsh Environment Applications Advanced Packaging Developments (including Package on Package) Process Control Latest Developments in Surface Finishes Why Should You Attend: There will be adequate time to have our industry experts respond to your questions Networking time will allow you to continue discussions following the presentations This is one of the best ways to enhance your knowledge and your company's profitability Extensive participation from experts from around the world provides for a comprehensive educational experience The SMTA reputation ensures high quality technical information that can be put to use immediately Accommodations Eastin Hotel Penang 1 Solok Bayan Indah Queens Bay, 11900 Bayan Lepas, Pulau Pinang, Malaysia 04-6121111 Book your hotel reservations online: http://www.eastinhotel-penang.com/ppc/?gclid=CPCu7tj69qYCFcjsKgod3gEhDg

Supported by Persatuan Surface Mount Technology P. Pinang. Special recognition is given to the Technical Committee for their many contributions in developing this outstanding program. Technical Committee Conference Chair: LyGuat Lee, Ph.D, Flextronics KL Lim, Plexus Lian-Huat Ng, Plexus Teng Hoon Ng, Celestica, Inc. Jona Sjoberg, Flextronics AK Tan, Robert Bosch Sdn Bhd David Vetharudge, Listech Technology Media Partner

Registration

Your registration fee will include a CD Conference Proceedings, coffee breaks, and lunches.

Two day conference fee is approx. RM455 (US$150) members / RM607(US$200) non-members
One day conference fee is approx. RM303 (US$100) members / RM379 (US$125) non-members
Speaker fee is approx. RM303 (US$100)

To pay by check, (checks are payable to SMTA) please mail payment to:
SMTA
5200 Willson Road, Suite 215
Edina, MN 55424-1316
USA

To pay by wire transfer or if an invoice is needed please contact Krissy Ohnstad, krissy@smta.org.

Training Workshops (Note: Training workshops are not included with two-day conference registration)

WS1: 9:00am – 12:00pm
Reliability of Lead-Free Solder Joints
Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation

What You Can Learn From This Course:
This course covers the reliability of lead-free solder joints. The reliability discussed includes the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history, and novel alloys with reduced fragility will be presented. Corrosion, and tin whisker will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contributing to the reliability.

Course Content:
A. Thermal Cycle Reliability of Lead-free Solder Joints
1). Effect of Thermal Cycle Test Condition
2). Effect of PCB Surface Finish Cu vs Ni
3). Effect of Reflow Temperature
4). Reliability of Reworked SMT Joints

B. Fragility
1). Fragility of Lead-Free Solder Joints
2). Effect of Component Finish
3). Effect of Alloy, PCB Surface Finish, Reflow History, and Strain Rate
4). Effect of IMC Thickness
5). Effect of Isothermal Aging
6). Effect of Thermal Cycling
7). Effect of Intermetallic Morphology
8). Novel Alloys with Reduced Fragility
a. Mn, Ti, (Bi, Ce, Y) Dopants on SnAgCu
b. SnAgNiP, SnAgCuP
c. Ni, In Dopants on Sn1.0Ag0.1Cu
d. Co, Pt, Ni Dopants on SnAg

C. Reliability – Corrosion
1). SAC405
2). Corrosion Resistance of PWB Finishes

D. Tin Whisker

Who Should Take This Course:
Any one who wants to know the reliability lead-free solder joints under various applications and like to know the best options should take this course.

Abut The Instructor:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

WS2: 9:00am – 12:00pm
Workshop Title: Designing for Reliability - Cleaning Basics in the Age of High Density Interconnects
Instructors: Mike Bixenman and Jason Chan, Kyzen Corporation

Workshop Overview
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean flux residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a greater reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.

Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries.

Designing for reliability requires repeatability and reproducibility studies during engineering and manufacturing development from pass test to good design. Full operational testing is needed to prove that electronic assemblies and packages operate as specified. Discovering failures after products are designed causes scheduled delays and increases in life-cycle cost. The cleaning workshop will teach about contamination and its effect on reliability, cleaning in an HDI world, designing the cleaning process, integrating the cleaning agent and machine, and controlling the process.

Topics People Will Learn from Attending the Workshop:

Who Should Take This Course:
Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

Abut The Instructor:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.