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International Conference on Soldering & Reliability 2015

The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.

South East Asia Technical Training Conference on Electronics Assembly Technologies 2015

The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

Technical Program Finalized

Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

View the full program here!

Intel's Mokler to Give Keynote Address

How Thinner, Smaller Packages are Challenging Board Assembly Manufacturing

Scott Mokler, Intel Corporation Scott Mokler, Intel Corporation

As electronic devices grow in complexity and functionality they are also becoming smaller, thinner and more integrated. This combination, along with the continuous drive for cost reduction, creates a myriad of new challenges for surface mount and assembly processes. At Intel, we are investigating these challenges and exploring opportunities to accelerate Moore’s law though novel SMT and assembly technologies. In this presentation, I will describe our efforts to address the challenges, such as high temperature warpage, and to create opportunities such as Direct Chip Attach (DCA) and System-in-Package (SiP) integration to meet device miniaturization requirements.

Scott Mokler manages the platform development group within Intel’s Assembly & Test Technology Development Group. His team leads research and development in PCB and SMT technologies as well as board & system test integration for Intel. He has over 50 publications in the areas of semiconductor surface chemistry, semiconductor test as well as PCB and SMT technology. Scott graduated from Oregon State University with a PhD in Chemistry and spent five years as a Research Associate at the Imperial College prior to joining Intel in 1994.

Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

  • Registrations are being taken through the SMTA Online Registration System.

    Symposium on Counterfeit Parts and Materials Symposium on Counterfeit Parts and Materials

    Technical Symposium: June 23-24, 2015
    Expo: June 23-24, 2015
    Workshops: June 25, 2015

    University of Maryland, College Park, MD

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 23-25 at the Marriott Inn & Conference Center next to the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

    Topics will include:
  • Impact of supply chain changes on the component management practices: quality, reliability, manufacturability
  • Electronic parts distribution: current stage and evolution
  • Authentication techniques for securing electronic part supply chain
  • Federal procurement practices and its impact on electronic supply chain
  • Inspections tools and techniques for detecting counterfeit parts
  • New areas of counterfeit concerns: materials, energy storage
  • Industry and international working groups and standards on electronic part supply chain and counterfeit electronic parts

  • The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

    Registrations are being taken through the SMTA Online Registration System.

    LED Assembly, Reliability & Testing Symposium

    The bridge between research and development

    Light emitting diodes (LEDs) is increasingly the technology of choice in lighting and display applications. LEDs offer design flexibility, from zero-dimensional (dot-scale lighting) to three-dimensional lighting (color dimming using combination with different colors). LEDs have small exterior outline dimensions while offering high-energy efficiency that results in lower power consumption. With appropriate thermal management, LEDs can have longer lifespans than conventional lighting sources. LEDs are also eco-friendly products with less UV radiation and no mercury.

    LEDs had a rapid progression from research laboratories and academic institutions to store shelves and light sockets. This aggressive adoption curve has made LEDs ubiquitous across multiple applications, including automotive, industrial, sports, and entertainment lighting systems. However, the main challenge to an even wider deployment platform for LEDs is the disconnect between the potential performance observed in laboratories and the real performance observed in the field.

    The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.

    FREE Webinar Download: Shining a Light on LED Technology

    Presenter: Martine Simard-Normandin, MuAnalysis

    Light emitting diodes, LEDs, have evolved tremendously in the last few years. They are no longer relegated to such roles as low output power indicator lights on panels, or seasonal decorative light strings. Just as electronics has infiltrated every aspect of our lives, a LED invasion is aggressively underfoot. Yet the technology behind these devices is poorly understood, often leading to avoidable early failures. In this webinar we will look at every aspect of LED technology. First we will explore the semiconductor devices themselves and the structures within that allow them to be efficient emitters. Next we will focus on high brightness LEDs and review their packaging and assembly challenges. Then we will investigate LEDs in luminaires: the phosphor materials of the LED devices, LED driving circuits, dimming issues. Finally, the long term reliability issues and failure mechanisms of LED devices will be reviewed.

    Download webinar slides Download webinar slides

    Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.