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South East Asia Technical Training Conference on Electronics Assembly Technologies 2016

The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

Submit an Abstract

Abstracts (300 words) are due January 4, 2016. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please indicate if your abstract is for a course you are offering to instruct.

Click here to submit an abstract

Presentations are sought in the following key technology tracks: Assembly

  • Adhesives, Alternate Alloys, BGA/CSP Assembly
  • Cleaning
  • Connector Technology
  • Copper Erosion
  • DFX/Design for Six Sigma
  • Equipment Selection
  • Flux and Solder
  • Halogen and Halogen-Free
  • Head-in-Pillow Defect
  • Land Pattern Design
  • Laser Soldering
  • Lead-Free Soldering (including case studies)
  • Lead-Free Reliability
  • Lean Manufacturing
  • Low Volume / Prototype Assembly
  • Medical Electronics
  • Placement
  • Printing
  • Reflow Soldering
  • Rework and Repair of QFNs
  • RFID Assembly
  • Selective Soldering
  • Set Up Reduction
  • Solder Paste
  • Solder Voids
  • Supplier Engineering
  • Underfill
  • Vapor Phase Reflow for High Reliability Assemblies
  • Wave Soldering
  • Yield Improvement


  • BGA
  • Battery Interactions
  • BTCs (Bottom Termination Components)
  • CSP (including Wafer-Level Packages)
  • Component Solderability
  • Component Reliability
  • Connectors
  • Embedded Passives
  • Failure Analysis
  • Fine Pitch Technology
  • Flip Chip / Direct Chip Attach
  • Lead/Termination Finish
  • Leadless Packaging
  • Multichip Packages (including 3-D Packaging, Package on Package)
  • Tin Whiskers

    Emerging Technologies

  • 0201/01005 Components and Assembly
  • Consumer Applications
  • Counterfeit Electronics
  • Electronic Printing Technology
  • Embedded Technology / Actives and Assembly
  • Flexible Electronics
  • Nanoelectronics
  • Reliability of Nanodevices
  • New Materials and Processes
  • Optoelectronics
  • Power or Thermal Management
  • Sensors and Manufacturing
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Wireless Applications including Bluetooth and Wi-Fi

    Harsh Environment Applications

  • Components and Component Reliability
  • Lead-free Issues for Harsh Environments
  • Substrates
  • Thermal Management

    PCB Technology

  • Black Pad and Surface Finish Defects
  • Embedded Passive and Active Components
  • Halogen Free
  • HDI
  • Microvias (including filled and unfilled)
  • Moisture Sensitivity
  • Soldermask
  • Substrate Reliability & Solderability
  • Surface Finish Pros and Cons
  • PCB Laminates

    Process Control

  • Acoustic Imaging
  • AOI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • X-Ray


  • Capacity Modeling
  • Contract Manufacturing
  • Doing Business in Asia
  • Environmental Issues
  • Lean Manufacturing / Quality Initiatives
  • Operations Management
  • Remaining Competitive
  • RoHS Compliance
  • Supplier Management
  • Technology Roadmap

  • Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

  • International Conference on Soldering & Reliability 2016

    The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.

    LED Assembly, Reliability & Testing Symposium

    The bridge between research and development

    Technical Symposium: November 17-18
    Expo: November 17-18
    Workshop: November 19
    Crown Plaza Midtown/Atlanta, GA

    Light emitting diodes (LEDs) is increasingly the technology of choice in lighting and display applications. LEDs offer design flexibility, from zero-dimensional (dot-scale lighting) to three-dimensional lighting (color dimming using combination with different colors). LEDs have small exterior outline dimensions while offering high-energy efficiency that results in lower power consumption. With appropriate thermal management, LEDs can have longer lifespans than conventional lighting sources. LEDs are also eco-friendly products with less UV radiation and no mercury.

    LEDs had a rapid progression from research laboratories and academic institutions to store shelves and light sockets. This aggressive adoption curve has made LEDs ubiquitous across multiple applications, including automotive, industrial, sports, and entertainment lighting systems. However, the main challenge to an even wider deployment platform for LEDs is the disconnect between the potential performance observed in laboratories and the real performance observed in the field.

    The LED Assembly, Reliability & Testing (A.R.T.) Symposium provides you with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.

    Photos from the 2015 LED Symposium

    Thank you to everyone that attended the first LED Symposium and to our speakers and exhibitors. It was a great three...

    Posted by Surface Mount Technology Association - SMTA on Thursday, November 19, 2015

    Georgia Tech Packaging Tour

    November 18
    3:15 pm transportation pickup

    You are invited to tour the Georgia Tech Packaging Center. This is an exciting opportunity to tour a 300mm lab associated with the Institute of Electronics Nantechnology, hear from students on industry projects and network. Transportation and refreshments will be provided.

    FREE Webinar Download: LEDs and Solid State Lighting Ecosystem

    Presenter: Makarand "Chips" Chipalkatti, Ph.D., Dr. Chips Consulting

    Over a decade and a half ago, when LED lighting was a subject of debate and considerable disbelief, some had predicted a disruptive change in the lighting industry of the sort that happens once in a generation. This disruption is now real, and the lighting industry is clearly undergoing tectonic change in rapid fire mode. Every major incumbent manufacturer is undergoing constant reorganization, while new start-ups emerge claiming a place in the new lighting industry. Yet, LED lighting has not generated the sort of profits expected despite significant growth. Global supply chains and fierce competition by hundreds of new players has created quite a challenge. Yet, there is great opportunity in this industry expected to be $21B by 2018 according to a recent report. Where do those opportunities lie and where are the new growth areas for industry players in the lighting, semiconductor, and electronics industry? This talk will cover some of the transformation process and point to the areas of current and future change. Future growth corridors that are now visible will also be discussed.

    Download webinar slides Download webinar slides

    FREE Webinar Download: Shining a Light on LED Technology

    Presenter: Martine Simard-Normandin, MuAnalysis

    Light emitting diodes, LEDs, have evolved tremendously in the last few years. They are no longer relegated to such roles as low output power indicator lights on panels, or seasonal decorative light strings. Just as electronics has infiltrated every aspect of our lives, a LED invasion is aggressively underfoot. Yet the technology behind these devices is poorly understood, often leading to avoidable early failures. In this webinar we will look at every aspect of LED technology. First we will explore the semiconductor devices themselves and the structures within that allow them to be efficient emitters. Next we will focus on high brightness LEDs and review their packaging and assembly challenges. Then we will investigate LEDs in luminaires: the phosphor materials of the LED devices, LED driving circuits, dimming issues. Finally, the long term reliability issues and failure mechanisms of LED devices will be reviewed.

    Download webinar slides Download webinar slides

    Symposium on Counterfeit Parts and Materials 2016

    Technical Symposium: June 28-30, 2016
    Expo: June 28-29, 2016
    Workshops: June 30, 2016

    University of Maryland, College Park, MD

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 28-29 at the College Park Marriott Hotel & Conference Center. The Workshops will be held June 30 at the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

    The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

    Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.