Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. The following are the dates for compliance: July 22, 2014 – medical devices and monitoring and control instruments; July 22, 2016 – in vitro diagnostic medical devices; July 22, 2017 – industrial monitoring and control equipment; and July 22, 2019 – electrical and electronic equipment which falls outside the scope of the original RoHS Directive. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Sessions and topics in our 2014 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.
Why Should You Attend:
There will be adequate time to have our industry experts respond to your questions
Networking time will allow you to continue discussions following the presentations
This is one of the best ways to enhance your knowledge and your company's profitability
Extensive participation from experts from around the world provides for a comprehensive educational experience
The SMTA reputation ensures high quality technical information that can be put to use immediately
Training Courses - Tuesday, April 8th
9:00 am – 12:00 pm T1 - Electromigration – The Hurdle for Miniaturization and High Power Devices Ning-Cheng Lee, Ph.D., Indium Corporation
9:00 am – 12:00 pm T2 - 3D PoP for the SMT World Charles Bauer, Ph.D., TechLead Corporation
1:30 pm – 4:30 pm T3 - Achieving High Reliability of Lead-Free Soldering - Materials Consideration Ning-Cheng Lee, Ph.D., Indium Corporation
1:30 pm – 4:30 pm T4 - Cleaning and Contamination Process Guide Mike Bixenman,Ph.D., Kyzen Corporation
Conference Day 1- Wednesday, April 9th
Session 1: Sustainable Lead Free Manufacturing
Chair: David Vetharudge, Listech Technology
9:00 Applying Lean Six Sigma in Manufacturing (Printed Circuit Board Assembly) Johan Jr. Chan, IBM Corporation
9:30 Do's and Don'ts - Good and Bad Practices - Myths and Reality of Soldering, Rework and Repair Terry Clitheroe, SMCBA (Australian SMT Association)
10:000.35mm Pitch Extra Small Outline No Lead (XSON) Package PCBA Process Characterization (On Main Board) Ricky Liew, Motorola Solutions Sdn Bhd
Coffee Break - 10:30 – 10:45
Session 2: Solder Paste Reliability
Chair: KL Lim, Plexus Corporation
10:45 The Rheology and Printing Behavior of Water Soluble Solder Pastes Li Tianpeng, Kester Components Pte Ltd
11:15 Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys Sze Pei Lim, Indium Corporation
11:45 High Reliability Pb-Free Halogen Free Solder Ian Wilding, Henkel Ltd
Lunch - 12:15 - 1:15
Session 3: Reliability of Low Silver Alternatives to SAC Alloys
Chair: Chee Choong Kooi, Intel Corporation
1:15 The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped With Mn Sehar Samiappan, Indium Corporation
1:45 Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality Kok Kwan Tang, Intel Corporation
2:15 Gold Embrittlement in Lead-free Solder Alex Chiu, Agilent Technologies
2:45 Properties and Structure of Magnetic Receptive Fe_Centric SAC305 Solder R. Gopal Krishnan, National University of Singapore
Coffee Break – 3:15 -3:30
Session 4: Latest Advances in High Density Interconnect
Conference Information This event is intensely focused on electronic assembly reliability, and the influence of cleaning and coating upon producing reliable hardware.
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date.
Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.