The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.
SMTA-IPC High Reliability Cleaning and Conformal Coating Conference
Organized by and
November 18-20, 2014 Chicago Marriott Schaumberg Schaumberg, IL
"How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others.
Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.
The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.
How Thinner, Smaller Packages are Challenging Board Assembly Manufacturing
Scott Mokler, Intel Corporation
As electronic devices grow in complexity and functionality they are also becoming smaller, thinner and more integrated. This combination, along with the continuous drive for cost reduction, creates a myriad of new challenges for surface mount and assembly processes. At Intel, we are investigating these challenges and exploring opportunities to accelerate Moore’s law though novel SMT and assembly technologies. In this presentation, I will describe our efforts to address the challenges, such as high temperature warpage, and to create opportunities such as Direct Chip Attach (DCA) and System-in-Package (SiP) integration to meet device miniaturization requirements.
Scott Mokler manages the platform development group within Intel’s Assembly & Test Technology Development Group. His team leads research and development in PCB and SMT technologies as well as board & system test integration for Intel. He has over 50 publications in the areas of semiconductor surface chemistry, semiconductor test as well as PCB and SMT technology. Scott graduated from Oregon State University with a PhD in Chemistry and spent five years as a Research Associate at the Imperial College prior to joining Intel in 1994.
Why Should You Attend:
There will be adequate time to have our industry experts respond to your questions
Networking time will allow you to continue discussions following the presentations
This is one of the best ways to enhance your knowledge and your company's profitability
Extensive participation from experts from around the world provides for a comprehensive educational experience
The SMTA reputation ensures high quality technical information that can be put to use immediately
Technical Symposium: June 23-25, 2015 Workshops: June 25, 2015 Expo: June 23-24, 2015 University of Maryland, College Park, MD
SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 23-25 at the Marriott Inn & Conference Center next to the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.
Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Topics will include:
Impact of supply chain changes on the component management practices: quality, reliability, manufacturability
Electronic parts distribution: current stage and evolution
Authentication techniques for securing electronic part supply chain
Federal procurement practices and its impact on electronic supply chain
Inspections tools and techniques for detecting counterfeit parts
New areas of counterfeit concerns: materials, energy storage
Industry and international working groups and standards on electronic part supply chain and counterfeit electronic parts
The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
LED Assembly, Reliability & Testing Symposium
The bridge between research and development
Light emitting diodes (LEDs) is increasingly the technology of choice in lighting and display applications. LEDs offer design flexibility, from zero-dimensional (dot-scale lighting) to three-dimensional lighting (color dimming using combination with different colors). LEDs have small exterior outline dimensions while offering high-energy efficiency that results in lower power consumption. With appropriate thermal management, LEDs can have longer lifespans than conventional lighting sources. LEDs are also eco-friendly products with less UV radiation and no mercury.
LEDs had a rapid progression from research laboratories and academic institutions to store shelves and light sockets. This aggressive adoption curve has made LEDs ubiquitous across multiple applications, including automotive, industrial, sports, and entertainment lighting systems. However, the main challenge to an even wider deployment platform for LEDs is the disconnect between the potential performance observed in laboratories and the real performance observed in the field.
The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date.
Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.