| CLICK HERE to view the full conference program |
Sessions over the two days will cover:
Supply Chain Solder Printing Alternate Alloys BTC Assembly & Repair Counterfeit Components Cleaning New Material Reliability Advanced Packaging
Why Should You Attend:
There will be adequate time to have our industry experts respond to your questions Networking time will allow you to continue discussions following the presentations This is one of the best ways to enhance your knowledge and your company's profitability Extensive participation from experts from around the world provides for a comprehensive educational experience The SMTA reputation ensures high quality technical information that can be put to use immediately
Eastin Hotel Penang
1 Solok Bayan Indah
Queens Bay, 11900 Bayan Lepas, Pulau Pinang, Malaysia
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Educational Training Half-Day Courses
Click titles to view details of each workshop
WS1: 9:00am - 12:00pm Tim Jensen, Indium Corporation
In this workshop, a detailed discussion of soldering materials, components, and PCBs will be given to help the attendee understand the important aspects of each to produce a high reliability product that meets current and future legislative restrictions.
WS2: 9:00am – 12:00pm Chuck Bauer, TechLead Corporation
Embedding active and passive components in the interconnect substrate offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development, these benefits come at a price: disrupted logistics, yield management concerns, and limited rework and repair options.
WS3: 1:30pm – 4:30pm Brian Toleno, Henkel Corporation
Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.
WS4: 1:30pm – 4:30pm Yan Liu, Indium Corporation
This course covers Package on Package (PoP) Technology, including trends, designs, material selection, processes, and reliability. The approaches of enhancing the reliability will be discussed in details, including effect of fluxes, solder alloy types, processes, profiles, via designs, and ball sizes. Being the solution with the highest potential, epoxy flux will be introduced and will be compared with other solutions. Finally, head in pillow control at reflow soldering, particularly at PoP will be instructed. The control includes considerations on materials, processes, and designs.
Online registration now closed, please register on site.
Register four people for the Technical Conference and pay for only three! The four people must be from the same company, and registrations must be submitted consecutively. The discount will be processed at SMTA headquarters, and is not available on-site. Complete a hard copy registration form for each person signing up for a group discount.
To pay with cash or check, contact SMTA Penang Chapter firstname.lastname@example.org
Supported by Persatuan Surface Mount Technology P. Pinang.
Special recognition is given to the Technical Committee for their many contributions in developing this outstanding program.
Mei Ming Khaw, Agilent
KL Lim, Plexus
Lian-Huat Ng, Plexus
Teng Hoon Ng, Celestica, Inc.
Jonas Sjoberg, Flextronics
AK Tan, Robert Bosch Sdn Bhd
David Vetharudge, Listech Technology
"The extensive participation of experts from around the world provides for a comprehensive educational experience and the SMTA reputation ensures high quality technical information that can be applied immediately."
-Marie Cole, Distinguished Engineer
SMTA VP Technical Programs