Dale Lee, Plexus Corporation
Tuesday, May, 13th, 2008
11am to 12:30pm Eastern
10am to 11:30am Central
9am to 10:30am Mountain
8am to 9:30am Pacific
Component packaging technology continues to decrease in size (length, width, thickness), interconnection density per unit area is increasing (thinner PCB’s, smaller lines & spaces), functional performance is increasing (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements.
Due to these evolutionary changes in technology, many elements in the product design and assembly process can no longer be ignored. This presentation will highlight examples of several elements within the product design process (PCB and assembly), manufacturing tooling design, SMT and PTH assembly, cleaning, SMT and PTH rework, and inspection/test opportunities that may impact process deployment and yield improvement.
Who should attend?
This event is ideally suited to PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and anyone responsible for yield monitoring and process improvements on printing and reflow. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.
Dale Lee is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.
