Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
|Jul 15 & 22, 2014||
Webtorial: Failure Analysis: Lessons Learned in Manufacturing
|Aug 19 & 26, 2014||
Webtorial: SMT For Movers, Shakers & Rainmakers
|Sep 10, 2014||
Free Webinar: Power and High Temp Electronics Manufacturing
|Sep 11 & 18, 2014||
Webtorial: Evaluating the Performance of Conformal Coatings
|Oct 16 & 23, 2014||
Webtorial: Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies
|Nov 4 & 11, 2014||
Webtorial: SMT and Through Hole Defect Analysis and Process Troubleshooting
|Dec 2 & 9, 2014||
Webtorial: LED, BGA, and QFN Assembly and Inspection
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Patti Coles, Director of Education at the SMTA. firstname.lastname@example.org 952-920-7682.
Failure Analysis: Lessons Learned in Manufacturing
Two (2) 90 Minute Sessions
Tuesday, July 15 and 22, 2014
1:00pm to 2:30pm Eastern
Presented by: Martin Anselm, Ph.D., Universal Instruments Corp.
Universal Instruments Corporation’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.
Thermogravimetric Analysis & IR Ion Chromatography Ion Contamination Shadow Moire SEM/EDS Wetting Balance/Solderability Acoustic Microscopy White Light Interferometry Mechanical Testing Optical Microscopy Mechanical Strain Gauge Analysis & Strain limits X-Ray Inspection Environmental Testing Solder Paste Print Transfer Efficiency Micro Hardness Testing Dye Penetration Testing Micro Sectioning Cross-section Etching
Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.
Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.
SMT For Movers, Shakers & Rainmakers Two(2) Part 90 Minute Sessions
Tuesday, August 19 & 26, 2014
11:00am to 12:30pm Eastern
Presented by: Ray Prasad, Ray Prasad Consultancy Group
Most of the SMT courses at various conferences cater primarily to Engineers and Technicians. They are too technical for the Rainmakers, the people who bring in the business and are dealing with business issues of SMT. The objective of this course is to provide technical information to movers, shakers and the rainmakers responsible for selling and buying of SMT equipment and materials including components and PCBs.
This course provides an overview of SMT manufacturing processes and role of SMT equipment and materials in non-technical manner. It begins with highlighting the problems that we all need to address, no matter what our job titles are and then delves into the role of materials and equipment to solve those problems. A good understanding of key issues in SMT without getting too technical is intended to help to help you in making sound business decisions.
This is not a theoretical course. It is based on Mr. Prasad's academic and hands on background in both business and technical disciplines. With Graduate degrees in business and engineering, he has over three decades of technical and business experience at Boeing, Intel, BeamWorks and numerous clients on both technical and business sides of the electronics industry.
How You Will Benefit
After completing this course you will be able to:
1. Benchmarking the Problem
Who Should Attend:
The target audiences for this course are the Movers, Shakers and the Rain Makers – dealing with all aspects of the business including legal disputes, mergers and acquisitions, finance, sales and purchase of SMT materials and equipment. Process and Design Engineers will also benefit from this course by learning to establish technical requirement for equipment and materials for purchase and simple technical solutions in design and process steps to prevent field returns.
About The Instructor:
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
Power and High Temp Electronics Manufacturing
Wednesday, September 10, 2014 @ 12:00 PM Eastern
Presenters: Dr. Chris Hunt, NPL
Bob Willis, NPL Defect Database Coordinator
SMTA will be running the "Power & High Temperature Manufacturing Experience" at SMTA International in September but before that we are running a pre-show webinar on high temperature solders which have long been used in hierarchical soldering for attaching silicon die within components. There is an increase in the demand for high temperature interconnect solutions with recent introductions of high power semiconductors. Application areas for these new devices include the electric vehicle and renewable energy. Characterization of electronic interconnect properties operating at temperatures above 200ºC, has not been undertaken in great detail. These new materials form different interconnection joints, dimensionally, structurally, and with different bond strengths. Understanding the degradation mechanism for these material solutions is in its infancy.
We will also outline some of the existing interconnection methods and materials used for organic printed circuit substrates for high temperature operation up to 200ºC. Although there are many applications and companies running these processes there is very little literature in the public domain on PCB assembly.
You will have the opportunity to obtain a copy of the latest NPL report on "High Temperature materials" produced by the NPL Electronics Interconnection Group.
Topics covered include:
The feature and webinar are supported by SMT magazine.
Evaluating the Performance of Conformal Coatings Two (2) 90 minute Sessions
Thursday, September 11 & 18, 2014
1:00pm to 2:30pm Eastern
Presented by: Doug Pauls, Rockwell Collins
Conformal coatings should be chosen based upon how well they protect the electronic circuit against the challenges of the end use environment. The difficulty is that not many people know how to make that evaluation. What kinds of tests can be used? What parameters should be chosen? How should the data be interpreted? This course covers various tests that are used to do base material characterizations, as well as tests which cover more functional aspects of conformal coating. While much of the testing will be from a Class 3 Avionics perspective, the methodologies covered can be extended to other industry segments.
- Uses of conformal coatings
- Materials characterization tests for coatings
- Performance specifications for coatings
- End Use Environments Overview
- Testing of Conformal Coatings
- Fluid Susceptibility
- Fungus resistance
- Salt spray and salt fog
- Sand and dust testing
- Humidity testing – static and condensing
- Waterproofness testing
- Thermal cycling and thermal shock
- Heat flow
- RF testing
- Material compatibility
- Process effects
- What defects are found in these tests and what they mean
- Illustrative Case Studies
- Question and Answer Session
Who should attend:
This course is written for individuals responsible for choosing or evaluating conformal coatings for use on electronic assemblies in harsh end use environments.
The instructor for the course is Doug Pauls, a Principal Materials and Process Engineer at Rockwell Collins, Cedar Rapids, IA. Doug is the Chairman of the IPC Cleaning and Coating committees.
Doug holds a B.A. in Chemistry and Physics from Carthage College, Kenosha, Wisconsin, and a B.S. in Electrical Engineering from the University of Wisconsin, Madison. He worked for the Naval Avionics Center in Indianapolis, Indiana for nine years as a Materials Engineer. Doug spent 8 years as the Technical Director of Contamination Studies Laboratories, performing process troubleshooting and optimization from a residue analysis perspective. Doug is an active IPC Chairman (General Chairman - Cleaning and Coating, Bare Board Cleanliness, Solder Mask) and presently chairs the IPC Technical Activities Executive Committee. Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes. Doug moved to Rockwell Collins in 2000, serving as their corporate expert on conformal coating materials and processes. He received Rockwell’s Arthur A. Collins Engineer of the Year award in 2004.
Doug is known to have a pathological fear of free time, has been happily married for 28 years. He has 3 children and so has little free time, but does some woodworking, woodcarving, and occasionally sneaks away to do some hunting and fishing.
Registrations are being taken through the SMTA Online Registration System.
Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies Two (2) 90 minute Sessions
Thursday, October 16 & 23, 2014
1:00pm to 2:30pm Eastern
Presented by: Tim Jensen, Indium Corporation
This webtorial is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of assemblies. It will not focus on mathematical modeling but rather provide data and tools that can be used by process engineers to make immediate impactful changes to the process.
This webtorial will be broken into three parts:
1. Mechanical Reliability
2. Electrical Reliability
3. Thermal Reliability
Who should attend:
Process engineers, quality engineers, design engineers, and engineering management
Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials
SMT and Through Hole Defect Analysis and Process Troubleshooting Two (2) 90 minute Sessions
Tuesday, November 4 & 11, 2014
1:00pm to 2:30pm Eastern
Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology
This workshop is aimed at providing a thorough understanding of the SMT and Through Hole defects and the various factors that influence the formation of the defects. Participants will be provided an in-depth look at the possible root causes for defects and their influence on yield. The knowledge gained from this workshop will help companies enhance product development, and manufacturing yield. Part 2 of the workshop series will use case studies to teach participants a systematic approach to solve process problems and identify the true root cause(s) for defects.
1. SMT and THT Process
2. Process Defects and Definitions
3. Factors Influencing the Process Defects
4. Possible Root Causes for Defects based upon Factors
Who should attend?
After completing this course, you will be able to:
1. Understand as systematic approach to problem solving
2. Develop the ability to define the problem clearly by repeated questioning
3. Develop skills to address the root cause of problems
4. Develop a methodology to find one or more solutions to address the root cause and identify a fix.
5. Understand how the analytical methodology can be applied to many different situations.
Dr. Ramkumar is a Professor and Chair of the Mechanical and Manufacturing Engineering Technology Department at the Rochester Institute of Technology (RIT). He is also the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Electronics Packaging Center and the Automation laboratories at RIT. The Center supports hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects and has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for companies on-site. His current research is in the use of a novel magnetically aligned ACA as a lead-free replacement with PCB assembly and 3D packaging.
LED, BGA, and QFN Assembly and Inspection Two (2) 90 minute Sessions
Tuesday, December 2 & 9, 2014
1:00pm to 2:30pm Eastern
Presented by: Bill Cardoso and Glen Thomas, Creative Electron
In this webtorial we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The webtorial will focus on the pitfalls of manufacturing and inspecting PCBs with these devices. Presentations will provide content to solve many of the technical challenges encountered by luminaire integrators and contract manufacturers. This tutorial is targeted at manufacturing, process, and quality personnel responsible for designing, implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this Webtorial.
We will use a library of assemblies inspected at Creative Electron’s Advanced Solutions Lab to provide attendees with real life examples of assembly issues. Attendees are welcome to send their own assemblies to Creative Electron prior to the webtorial so that the material can be used during training.
Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. Real life examples make great teaching materials for our tutorial. Please feel free to send us your samples so we can discuss them during the live sessions.
Bill Cardoso, Ph.D.,
is the Chief Executive Officer and founder of Creative Electron. A native of Brazil, Bill came to the US in 1998 as a 'guest engineer' at the US Department of Energy's renowned Fermi National Accelerator Laboratory (Fermilab), one of the leading research institutions for high energy and nuclear physics. In a nine year career at Fermilab and starting with an associate electronics degree earned in Brazil at age 13, Bill took on significant project, personnel, and budget responsibilities while at the same time earning MS and PhD degrees from the Illinois Institute of Technology (IIT) and an MBA from the University of Chicago.
After leaving Fermilab as Department Head for Electronic Systems Engineering, Bill moved to California to become the VP of Technology at the government contracting firm he eventually acquired from the estate of the founder to create Creative Electron in 2008.
An industry thought leader, Bill has been recognized as IIT's 2011 Outstanding Young Alumnus Awardee for his contributions to science and technology. He is also a Senior member of the Institute of Electrical and Electronics Engineers (IEEE), Surface Mount Technology Association (SMTA), American Physics Society (APS), and the International Society for Optics and Photonics (SPIE).
Bill is a holder of several patents in the areas of radiation detection, radiography, and quality inspection.
Bill is an active member of his community and is part of the technical committee of several conferences including the SMTA/CALCE Component Counterfeit Conference, SMTA International, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium.
Bill serves in the G19 committee writing the standards for counterfeit detection for the aerospace and defense markets. He is also a reviewer of academic proposals for the Department of Energy, Department of Homeland Security, and National Science Foundation. He is the author of over 120 technical publications, a contributor to 2 books, and is a frequent speaker at technical conferences on radiography and optical inspection worldwide.
Dr. Glen Thomas
is a proven veteran in the inspection market with over two decades of experience developing and marketing x-ray systems. Glen leads Creative Electron's lead generation and branding strategy. Glen also manages the company's relationship with our domestic and international sales channels. He has been instrumental in helping the company create the best x-ray inspection systems in the world by providing its customers with unrivaled value. Dr. Thomas has held executive leadership positions and was instrument at the growth of companies like Faxitron, Micro Focus Imaging, Radsource Technologies, X-Ray Imaging Solutions, and Lixi.
Glen is the VP of Operations for the SMTA Great Lakes Chapter. Glen holds a BS in Electrical Engineering and a PhD from the University of Wisconsin in Madison.
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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