SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Oct 15 & 23, 2014 Webtorial: Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies

Nov 4 & 11, 2014 Webtorial: SMT and Through Hole Defect Analysis and Process Troubleshooting

Nov 18 & 25, 2014 Webtorial Stencil Printing - A Practical Guide to Defect Prevention and Yield Improvement

Dec 2 & 9, 2014 Webtorial: LED, BGA, and QFN Assembly and Inspection

Dec 3 & 10, 2014 Webinar: IPC-A-610 and IPC J-STD-001 Moving From Rev. E to Rev. F

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Patti Coles, Director of Education at the SMTA. patti@smta.org 952-920-7682.





    SMTA Webtorial:
    Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies

    Tim Jensen Two (2) 90 minute Sessions
    Wednesday, October 15 & Thursday, October 23, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Tim Jensen, Indium Corporation

    Overview:
    This webtorial is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of assemblies. It will not focus on mathematical modeling but rather provide data and tools that can be used by process engineers to make immediate impactful changes to the process.

    This webtorial will be broken into three parts:

    Course Outline:
    1. Mechanical Reliability

  • Drop shock vs. thermal cycling vs. vibration
  • Alloys and element addition impact
  • Board and component finish impact
  • Component and board warpage
  • Graping
  • Increased solder volume

    2. Electrical Reliability
  • Cleaned vs. No-Clean fluxes
  • SIR and Electromigration – Dendritic growth
  • Impact of low stand-off components (i.e. QFNs)
  • Creep corrosion
  • Conformal coating
  • Sn whiskering

    3. Thermal Reliability
  • Types of thermal interface materials
  • Assessing thermal conductivity
  • Bond line thickness
  • Impact of pressure
  • Pump-out considerations
  • Solder joint thermal interfaces and voiding

    Who should attend:
    Process engineers, quality engineers, design engineers, and engineering management

    Your Instructor:
    Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
    Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials






    SMTA Webtorial:
    SMT and Through Hole Defect Analysis and Process Troubleshooting
    S. Manian Ramkumar Ph.D. Two (2) 90 minute Sessions
    Tuesday, November 4 & 11, 2014
    1:00pm to 2:30pm Eastern
    Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology

    Overview:
    This workshop is aimed at providing a thorough understanding of the SMT and Through Hole defects and the various factors that influence the formation of the defects. Participants will be provided an in-depth look at the possible root causes for defects and their influence on yield. The knowledge gained from this workshop will help companies enhance product development, and manufacturing yield. Part 2 of the workshop series will use case studies to teach participants a systematic approach to solve process problems and identify the true root cause(s) for defects.

    Topical Outline
    1. SMT and THT Process

  • Assembly Types and Processes

    2. Process Defects and Definitions
  • Identifying different Defects

    3. Factors Influencing the Process Defects
  • PCB Related
  • Component Related
  • Materials Related
  • Equipment Related
  • Process Related
  • Supplier Related
  • Employee/Knowledge Related
  • Environment Related

    4. Possible Root Causes for Defects based upon Factors

    Who should attend?

  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Managers

    After completing this course, you will be able to:
    1. Understand as systematic approach to problem solving
    2. Develop the ability to define the problem clearly by repeated questioning
    3. Develop skills to address the root cause of problems
    4. Develop a methodology to find one or more solutions to address the root cause and identify a fix.
    5. Understand how the analytical methodology can be applied to many different situations.

    Bio:
    Dr. Ramkumar is a Professor and Chair of the Mechanical and Manufacturing Engineering Technology Department at the Rochester Institute of Technology (RIT). He is also the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Electronics Packaging Center and the Automation laboratories at RIT. The Center supports hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects and has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for companies on-site. His current research is in the use of a novel magnetically aligned ACA as a lead-free replacement with PCB assembly and 3D packaging.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial
    Stencil Printing - A Practical Guide to Defect Prevention and Yield Improvement
    Chrys Shea Two (2) 90 minute Sessions
    Thursday, November 18 and 25, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Course Objectives
    This brand new course begins with the basics of SMT solder paste stencil printing and ends with the latest research in stencil printing tools and technologies. The class starts with a quick description of printing fundamentals: solder paste characteristics and behaviors, the mechanics of the process and importance of a good setup, and the relationship between aperture sizes and paste deposit formations. It then progresses rapidly into troubleshooting techniques for both general and specific printing issues, and addresses problem prevention through proper stencil design and selection. Moving into advanced technology topics, the course reviews the last four years of independent research on stencil materials, manufacturing processes and nanocoatings, and closes with an update of automated Solder Paste Inspection (SPI) technologies, applications and special features. Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.

    Topics Covered

  • Solder paste
  • Mechanics of the printing process
  • Troubleshooting process problems
  • Stencil design
  • Stencil materials and manufacturing processes
  • Automatic Solder Paste Inspection (SPI)
  • Review and Q&A

    Who should attend:

  • SMT assembly process engineers and technicians responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields
  • OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors

    Instructor Bio:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. With several hundred publications to her credit, Chrys leverages her 20+ years of process engineering and management experience to create documents, presentations, web pages and other items that deliver complex technical topics clearly and effectively.

    Chrys is a favorite speaker at SMTA events, and has twice received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.

    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island, and is a past president of the Philadelphia SMTA Chapter. She launched Shea Engineering services in 2008. Contact Chrys at Chrys@sheaengineering.com or (609) 239-2995

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    LED, BGA, and QFN Assembly and Inspection
    Two (2) 90 minute Sessions
    Tuesday, December 2 & 9, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Bill Cardoso and Glen Thomas, Creative Electron

    Overview:
    In this webtorial we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The webtorial will focus on the pitfalls of manufacturing and inspecting PCBs with these devices. Presentations will provide content to solve many of the technical challenges encountered by luminaire integrators and contract manufacturers. This tutorial is targeted at manufacturing, process, and quality personnel responsible for designing, implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this Webtorial.
    We will use a library of assemblies inspected at Creative Electron’s Advanced Solutions Lab to provide attendees with real life examples of assembly issues. Attendees are welcome to send their own assemblies to Creative Electron prior to the webtorial so that the material can be used during training.

    Topics Covered:

  • How LED material handling and storage impact assembly performance
  • LED x-ray inspection: How voids cost you money
  • Case study: How lack of quality killed a successful LED company
  • Process design for BGA and QFN assembly and rework
  • BGA and QFN x-ray inspection: How to see what often goes wrong
  • X-Ray as a tool for quality process design and control

    Suggestion:
    Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. Real life examples make great teaching materials for our tutorial. Please feel free to send us your samples so we can discuss them during the live sessions.

    Bill Cardoso Your Instructors:
    Bill Cardoso, Ph.D.,
    is the Chief Executive Officer and founder of Creative Electron. A native of Brazil, Bill came to the US in 1998 as a 'guest engineer' at the US Department of Energy's renowned Fermi National Accelerator Laboratory (Fermilab), one of the leading research institutions for high energy and nuclear physics. In a nine year career at Fermilab and starting with an associate electronics degree earned in Brazil at age 13, Bill took on significant project, personnel, and budget responsibilities while at the same time earning MS and PhD degrees from the Illinois Institute of Technology (IIT) and an MBA from the University of Chicago.

    After leaving Fermilab as Department Head for Electronic Systems Engineering, Bill moved to California to become the VP of Technology at the government contracting firm he eventually acquired from the estate of the founder to create Creative Electron in 2008.
    An industry thought leader, Bill has been recognized as IIT's 2011 Outstanding Young Alumnus Awardee for his contributions to science and technology. He is also a Senior member of the Institute of Electrical and Electronics Engineers (IEEE), Surface Mount Technology Association (SMTA), American Physics Society (APS), and the International Society for Optics and Photonics (SPIE).
    Bill is a holder of several patents in the areas of radiation detection, radiography, and quality inspection.
    Bill is an active member of his community and is part of the technical committee of several conferences including the SMTA/CALCE Component Counterfeit Conference, SMTA International, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium.
    Bill serves in the G19 committee writing the standards for counterfeit detection for the aerospace and defense markets. He is also a reviewer of academic proposals for the Department of Energy, Department of Homeland Security, and National Science Foundation. He is the author of over 120 technical publications, a contributor to 2 books, and is a frequent speaker at technical conferences on radiography and optical inspection worldwide.

    Glen Thomas Dr. Glen Thomas
    is a proven veteran in the inspection market with over two decades of experience developing and marketing x-ray systems. Glen leads Creative Electron's lead generation and branding strategy. Glen also manages the company's relationship with our domestic and international sales channels. He has been instrumental in helping the company create the best x-ray inspection systems in the world by providing its customers with unrivaled value. Dr. Thomas has held executive leadership positions and was instrument at the growth of companies like Faxitron, Micro Focus Imaging, Radsource Technologies, X-Ray Imaging Solutions, and Lixi.
    Glen is the VP of Operations for the SMTA Great Lakes Chapter. Glen holds a BS in Electrical Engineering and a PhD from the University of Wisconsin in Madison.

    Registrations are being taken through the SMTA Online Registration System.






    Webinar:
    IPC-A-610 and IPC J-STD-001 Moving From Rev. E to Rev. F
    Wednesday, December 3rd and December 10th, 2014
    1:00pm - 2:00pm Eastern
    Presenter: Norman Mier and James Barnhart, BEST

    Overview
    We are pleased to announce that BEST Inc. will be offering two 1-hour webinars, held over the lunchtime hour, which will discuss the significant changes instituted in the soon-to-be released 'F' revisions of the IPC-A-610 and the IPC J-STD-001. The webinars will not only give you knowledge about the revisions, it will give you the opportunity to ask questions about changes between the revisions. The BEST Master IPC Instructors will cover the significant changes in the standards during the webinars.

    Schedule
    December 3rd: IPC-A-610

    December 10th: IPC J-STD-001

    Just register once and then you will get an email to confirm your registration the Friday before each presentation.

    Who Should Attend
    Certified IPC Trainers (CITs), engineering/manufacturing supervisors, and quality assurance supervisors are encouraged to attend.

    About the Presenters
    Norman Mier is a Master IPC Trainer at BEST Inc. He is a retired veteran with over 20 years of experience in the electronics rework and repair industry. Norm originally received his training through the Navy's Micro Miniature (2M) Electronic Repair Program and has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001, IPC/WHMA-A-620, and IPC 7711/7721. Additionally, he has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field.

    James Barnhart is a Master IPC Trainer at BEST Inc. He started as a 2M Miniature/Micro-miniature repair technician and progressed to being an 'A' level instructor in the Navy's 2M program. James has worked in the electronics field since the mid 80's and trained many technicians in the repair of PCB's. During his time as a 2M instructor, he was involved in the rewriting of the 2M courses and incorporated SMT repair techniques into the program. He is a Master IPC Trainer at BEST in IPC J-STD-001, IPC-A-610 and IPC 7711/21.

    Registrations are being taken through the SMTA Online Registration System.






    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.