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CLICK HERE TO SUGGEST A TOPIC FOR AN SMTA ON-LINE PRESENTATION
Listen to outstanding speakers without leaving your desk. SMTA Online Presentations are a great solution for getting the latest knowledge at the best price. There are currently two formats of online presentations: webinars and webtorials.
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Webinars:
One session lasting 60 to 90 minutes.
Covers introductory concepts or broadly covers multiple topics.
Comparable to a conference session.
Cost: $75USD for SMTA members/$150USD for non-members.*
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Webtorials:
Two sessions lasting 90 minutes each.
In depth, focused topics with demos and working examples.
Comparable to a tutorial.
Cost: $150USD for SMTA members/$300USD for non-members.*
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*The price of an individual membership is included in non-member registration.
The presentations are broadcast using GoToWebinar for the presentation materials, using Telecon or VoIP for the audio, and GoToWebinar chat options for submitting questions directly to the instructor. PDF files of the presentation material are also distributed to registered attendees.
Remember, each registrant is allowed one phone line connection for as many site employees as can be accomodated by your AV facilities. If necessary, multiple phone lines must be individually registered.
If you have any questions, contact Ryan Flaherty, Director of Communications at the SMTA. Ryan@smta.org 952-920-7682.
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Mechanical and Thermal Reliability of Package on Package webinar
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March 25, 2010
12-1:30pm Eastern/9-10:30am Pacific
presented by Heather McCormick, Celestica
Package on Package components are seeing increasing adoption in handheld portable applications, and in other products where dense circuitry is essential. By stacking a memory device on top of a logic package, Package on Package (PoP) enables a significant amount of functionality in a very small footprint. This webinar will provide a brief overview of some of the Package on Package variations available, and will outline package on package assembly processes, including primary attach, rework and underfill. A strong focus will be placed on the reliability of the final assemblies, and the reliability impacts of different assembly variations such as assembly using dip flux or dip solder paste for attaching the upper package will be discussed. Results on different PoP package types in both accelerated thermal cycling and drop testing will be presented, along with a discussion of the failure modes for the packages. The effect of underfill on reliability and on the failure modes will also be included.
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Registrations are being taken through the SMTA Online Registration System.
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Lead-Free Lessons Learned: Surface Mount Technology Webtorial
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Two (2) 90 minute Sessions
Wednesday, March 17 and Wednesday, March 24, 2010
1:00pm to 2:30pm Eastern
Presented by: Chrys Shea, Shea Engineering Services
Overview:
Experience is the best teacher, but its lessons are often expensive - particularly in the context of printed circuit assembly, where small problems can add up to big dollars very quickly. The assembly process is filled with opportunities for quality concerns, and taking it lead-free only adds to the list of potential pitfalls. This webtorial reviews the most common problems that have occurred in lead-free SMT assembly, how to avoid them, and tactics to address them if they do arise.
Topics Covered (Session 1: Mar. 17):
Common defects: head-in-pillow, solder bridges, solder beads, voids, tombstones Optimizing print quality, lead-free stencil design and intrusive reflow
Topics Covered (Session 2: Mar. 24):
The influence of the PWB fabrication process and surface finish on the SMT assembly process Mixed metals solder systems in BGAs, including new data on low Silver BGA spheres in both SnPb and Pb-free assembly processes Hybrid solder pastes for mixed metal systems and tin-lead HIP mitigation Halogens and halides in the SMT assembly process
Who should attend?
Process Engineers and Technicians Quality Assurance Professionals New Product Introduction Engineers Production Managers and Supervisors Procurement and Supplier Quality Engineers Anyone who wants to avoid some of the common pitfalls of lead-free circuit assembly
Instructor:
Chrys Shea has been analyzing circuit assembly processes for nearly 20 years, and is well known for her common-sense, practical approach to resolving processing issues. She has been sharing her research findings and observations for the past decade, authoring numerous technical articles and regular magazine columns on a variety of PCB assembly-related topics. Chrys earned her Bachelor’s Degree in Mechanical Engineering from the University of Massachusetts and her Master’s Degree in Manufacturing Engineering from the University of Rhode Island. She is the founder and owner of Shea Engineering Services.
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Registrations are being taken through the SMTA Online Registration System.
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Go Greener in Your Cleaner! - Cleaning Process Benchmarking Webinar
Held in conjunction with Virtual PCB
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 Available On Demand until May 4, 2010
Presented by Dr. Harald Wack, ZESTRON America
Over the past decade, the cleanliness requirements for manufacturers have increased significantly. This is primarily due to higher performance expectations, higher component densities and newer materials being used. The North American electronics assembly market consists mainly of military, aerospace, medical, and automotive manufacturing industries, all of which require a guaranteed life time product reliability. With higher cleaning performance requirements and increased environmental regulations the cleaning process has become a focal point for many companies. RoHs and REACH, but also stricter, local waste water regulations and VOC limits, have forced numerous, recent process re-qualifications.
This study was prepared to focus on cleaning process benchmarking. In other words, how can one compare established cleaning processes with newer process technologies? The authors will present recent cleaning challenges including the removal of flux residues under challenging low standoff components such as 0603 chip capacitors, while using pH-neutral de-fluxing agents as well as alkaline chemistries with reduced VOC levels. The objective was to assess their effectiveness, demonstrate any limitations while adhering to higher environmental standards. To further demonstrate the challenge of increasing VOC limitations, the study also highlights experimental findings on vapor recovery methods used presently in the industry. This will allow users to benefit from experimental comparison data to further enhance their respective cleaning process while conforming to the latest environmental regulations.
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Registrations are being taken through the SMTA Online Registration System.
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Root Cause Failure Analysis of Printed Circuit Board Assemblies Through Analysis of Product and Tooling Design webinar
Held in conjunction with Virtual PCB
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 Available On Demand until May 4, 2010
Presented by Dale Lee, Plexus Corporation
Failure analysis of printed circuit board production failures traditionally focused on supplier quality and/or manufacturing process issues. With the goal to reduce or eliminate assembly defects, determination of a failure’s root cause is critical to prevention of future failures. During the late 1980s and early 1990s, the Department of Defense focused failure analysis on mechanical failures instead of electrical failures. The goal was to address not only material failures but failures induced through product and/or assembly process tooling design.
With today's component packaging technology decreased size (length, width, thickness), increased interconnection density per unit area (thinner PCB’s, smaller lines & spaces), increased functional performance (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements, root cause failure analysis of printed circuit board assemblies is critical to achieving a high first pass yield manufacturing process. This presentation and discussion will introduce the element of root cause failure analysis through the correlation of product and tooling design with assembly defects. The presentation will include examples of actual product design, manufacturing tooling design, and SMT & PTH assembly process issues matched to actual product failures.
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Registrations are being taken through the SMTA Online Registration System.
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Status of the Proliferation of Lead-Free Alloys: 2010 Webinar
Held in conjunction with Virtual PCB
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 Available On Demand until May 4, 2010
Ronald Lasky, PhD, PE, Indium Corporation
The EU's RoHS law has driven a significant amount of research to find an alloy for electronic assembly that will satisfy RoHS's lead-free requirement and have optimum assembly process ability and reliability. The resulting research, much of it lead by iNEMI, resulted in the near eutectic tin-silver-copper alloy SAC387 (Sn95.5Ag3.8Cu0.7) as an initial choice to fill this need in the early 2000s. But by 2004 or so, many people were using SAC305, partially because of its greater resistance to tombstoning and lower silver content. It appeared that SAC305 would become the de-facto lead-free standard alloy for RoHS compliant electronic assembly. However, with the dramatic increase in silver prices in the last few years, SAC105, having 2% less silver was being evaluated and used for its obvious cost savings. Reliability testing of SAC105 also showed that although it did not perform as well as SAC305 in thermal fatigue cycle testing, it was better than SAC305 in drop shock tests. The explosive growth of mobile phone sales and other portable electronic devices made this superior drop shock performance attractive for these types of devices.
In addition to research relating to SAC305 and SAC105, much investigation has been performed on the effects of small quantities (<0.1%) of alloying metals on lead-free alloys' process ability and reliability performance. These "dopants" can dramatically affect an alloy's performance. All of the above work has resulted in what many are calling lead-free alloy proliferation as more and more alloys are being considered for implementation. This proliferation drives up solder paste cost as paste manufacturers cannot achieve economies of scale. In addition, with so many alloys to consider, it is difficult for researchers to develop extensive data bases of process and reliability performance. These new alloys and the introduction of new and miniaturized components, have also resulted in new failure modes such as "graping," and the "head-in-pillow" defect.
This webinar is an overview of this lead-free alloy proliferation, a discussion of these new failure modes and how to minimize them and an outlook on how alloy convergence might occur.
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Registrations are being taken through the SMTA Online Registration System.
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MORE WEBINARS COMING SOON!
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.
All cancellation requests must be received prior to the start time of the event.
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The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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CONSIDERATIONS FOR RECEIVING THE BROADCAST
Register via GoToWebinar upon recieving the email with confirmation and instructions.
As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise (or discard as they are answered).
For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial)
or email gotowebinar@citrixonline.com.
Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
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