Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, firstname.lastname@example.org 952-920-7682.
If you are interested in presenting a webinar or webtorial, contact Jenny Ng, email@example.com 952-920-7682 or submit your abstract here.
The Three Fundamentals to the Ultimate Reliability in Consumer Electronics Thursday, November 3, 2016
Two convenient times: 11:00am or 2:00pm Eastern
Presented by: Craig Hillman, Ph.D., DfR Solutions
Complimentary Webinar for Members!
The standard rule for reliability has been consumer electronics are cheap, disposable, and poor quality and military/space are robust, long-lasting, and very expensive. What if somebody broke these rules? Can you have a low-cost piece of electronics with very high reliability? How would you do it? What would it mean for every other industry willing to pay large sums to meet market expectations of performance? In this presentation, Dr. Craig Hillman, who has consulted with over 1000 electronic OEMs on reliability, will discuss how certain organizations consistently out-perform their peers in quality and reliability. Based on years of observing multiple organizations in a variety of markets, Dr. Hillman has identified the three key fundamentals that drive reliability excellence. Attend this exclusive webinar and learn how to implement these philosophies into your organization, regardless of whether you are the Vice President of Quality or a beginner reliability engineer.
Registrations are being taken through the SMTA Online Registration System.
Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys Two (2) 90 minute Sessions
Tuesday, November 8 and Tuesday, November 15, 2016
Presented by: Bob Willis, Bobwillisonline.com & NPL National Physical Laboratory
When we start to talk about high temperature electronics it's not the solder it's all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200°C, however, there are many applications that have to work at much higher levels, up to 300°C. Typically the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.
The webtorial is a mixture of theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory. A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.
Topics may include:
Instructor Bob Willis
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.
Bob has conducted workshops and set up production lines, assembly features and his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers worldwide like Productronica, Germany, IPC APEX, SMTAI in the USA plus National Electronics Week and Nepcon Electronics in UK.
Bob was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and was elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he has also worked on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.
Bob organises the NPL Defects Database on behalf of NPL and organises the Electronics Interconnection Division’s monthly online technology webinars and on site workshops. He has authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers from around the world.
Tin Whisker – All You Should Know Two (2) 90 minute Sessions
December 7 and 8, 2016
1:00pm to 2:30pm Eastern
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group
For the recent years, concerns about tin whiskers are intensifying although tin whisker and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on tin whisker from physical/phenomenal occurrence to fundamental scientific base to mitigating measures. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Relative ranking of the tin whisker propensity among lead-free solder alloys in relation to SnPb alloy will be outlined.
What will you learn:
Who Should Attend:
The webinar provides a working knowledge to all who are concerned with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this webtorial through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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