SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

May 6 & 13, 2014 Webtorial: PCB Cleaning: Applications, Analytics and Solutions

Jun 11, 2014 Free Webinar: Printed Electronics Technologies

Jun 12 & 19, 2014 Webtorial: PCB Surface Finishing Overview: Getting the Most Out of Your Surface Finish

Jul 15 & 22, 2014 Webtorial: Failure Analysis: Lessons Learned in Manufacturing

Aug 19 & 26, 2014 Webtorial: SMT For Movers, Shakers & Rainmakers

Sep 11 & 18, 2014 Webtorial: Evaluating the Performance of Conformal Coatings

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Patti Coles, Director of Education at the SMTA. patti@smta.org 952-920-7682.





    SMTA Webtorial:
    PCB Cleaning: Applications, Analytics and Solutions
    Umut Tosun, ZESTRON AmericaTwo (2) 90 minute Sessions
    Tuesday, May 6 & 13, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Umut Tosun, ZESTRON America

    Overview:
    If the reliability of your electronic assemblies is critical, removing impurities from the printed circuit board surface as well as underneath the components is necessary. This is truer today than ever for a variety of reasons including the change from eutectic to lead-free soldering process, climatic influence on PCB reliability and cleanliness requirements for bonding and conformal coating processes. These issues will be reviewed in-depth providing the background for a detailed discussion of electronic assembly cleaning processes.

    Solvent, surfactant and micro phase cleaning agent technologies will be reviewed including the benefits of each. This will be followed by a detailed discussion of commercially available cleaning equipment options such as Spray-In-Air, Ultrasonic, Spray-Under-Immersion and Immersion Air-Supported including their operating principle, optimization techniques and ideal cleaning agent types for each. As rinsing is critical to all aqueous cleaning processes, water treatment processes will also be reviewed.

    Once a cleaning process is implemented, one must understand the options available to assess the substrate cleanliness. Numerous indirect and direct measurement techniques will be discussed including recommended IPC test methods and standards. Cleaning issues associated with No-clean and Water Soluble flux systems will be discussed and three user case studies will be presented whereby product reliability issues were traced to insufficient cleaning processes.

    The impact of PCB design, geometry and component standoff height on the effectiveness of the cleaning process will be presented and suggested solutions provided. And finally, cleaning agent selection and considerations for material compatibility with regard to substrate surface, components and labels will be reviewed. .

    Course Outline:
    Part 1:

    • Introduction
    • Reasons for PCB Cleaning
      • Eutectic to Lead-free Process
      • Climatic Reliability
      • Coating
      • Bonding
    • Cleaning Agents
    • Cleaning Equipment
    • Surface Analytics
    • Questions and Answers

    Part 2:

    • Defluxing in a No-clean World
      • Case Study A: Cleanliness Assessment for Class III Lead-free No-clean Assemblies
    • Defluxing in an OA World
      • Case Study B: Solving Product Reliability Issues - Full Service EMS Provider
      • Case Study C: Solving Product Reliability Issues - Midsize OEM
    • Difficult to Clean Parts and Solutions
    • Material Compatibility
    • Questions and Answers

    Who should attend:
    This webinar is designed for production operators, managers and process engineers that would would like to gain a working knowledge of PCB cleaning applications, analytical methods and best practice solutions

    Your Instructor:
    Umut Tosun, M.S.Ch.E., is the Application Technology Manager at ZESTRON America. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He has authored and published numerous technical articles in leading electronics manufacturing magazines such as Circuits Assembly, SMT Magazine, Global SMT & Packing and US Tech.

    Mr. Tosun graduated with a Bachelor’s and Master’s Degree in Chemical Engineering from the Technical University of Hamburg, Germany. He joined ZESTRON in 2000.

    Registrations are being taken through the SMTA Online Registration System.






    Free Webinar:
    Printed Electronics Technologies
    Free for members!
    Wednesday, June 11th, 2014
    Presenter: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory, California Institute of Technology

    Offered at Two Convenient Times!
    Attend this webinar at either 12-1pm EST (for attendees in Americas and Europe) or 8-9pm EST (for attendees in Asia)

    Overview
    Printed electronics technologies and 2D/3D conventional/rapid printing of organic/nonorganic electronic devices on various small/large substrates are projected to grow exponentially in commercial industry, providing an opportunity for members of the surface mount technology association to tap into this rapid growth. To achieve this goal, this presentation provides knowledge gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps: OEA, ITRS, and iNEMI on this subject, each with different name identification for this evolving technology. The presentation is followed by a brief review of the status of the industry on standard development, including IEEE and IPC specifications. The talk concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging.
    Key Words: printed electronics, organic electronics, large area electronics, packaging hierarchy

    Who should attend
    Even though this presentation is intended for surface technology association members; others who are involved in electronics industry will also benefit. It is intended for audiences from various disciplines including scientist, R&D engineers, packaging engineer, specification participant engineers, visionaries, and managers who are looking to learn and expand research and business activities covering aspects of this rapidly growing technology.

    About the Presenter
    Dr. Reza Ghaffarian has more than 30 years of industrial and academic experience. For the last 20 years at NASA/JPL, he led R&D reliability and quality assurance activities in advanced electronic packaging and has been a consultant resource for most JPL projects including Mars Curiosity Rover. He received numerous awards including the NASA Exception Service Medal for outstanding leadership and industrial partnership. He has authored more than 150 technical papers, co-editor of a CSP book, and numerous book chapters including two in the Encyclopedia of Thermal Stresses (Dec. 2013). He serves as technical Advisor/Committee to SMTA, IPC, Microelectronics Journal, IMAPS, and IEEE IEMT/CPMT. He received his Ph.D. in 1982 from University of California at Los Angeles (UCLA).

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    PCB Surface Finishing Overview: Getting the Most Out of Your Surface Finish
    Two(2) Part 90 Minute Sessions
    Thursday, June 12 & 19, 2014
    11:00am to 12:30pm Eastern
    Presented by: Lenora Toscano, MacDermid

    Overview:
    The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, final finishes were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended end use life in aggressive environments and all this must be achieved at low cost. Designs have changed, lines and spaces are reduced, solder types and flux chemistries are different, there are a higher percentage of no clean assemblies, number of assembly cycles has increased, and many PCBs require multiple SMT steps and are followed by a selective or wave solder step. In addition to all these changes, there is a significant amount metal area left exposed in the end-use applications. This Webtorial will detail the process cycles, performance advantages and disadvantages of all surface finishes offered in the electronics market today. Sessions will be split by resultant solderjoint type; those that create Cu-Sn and those that create Ni-Sn solderjoints. A portion of the time will discuss areas of focus during fabrication to ensure the greatest performance from each individual finishes. This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications.

    Outline:
    1. Review of surface finish needs 2. Surface finishes available on the market 3. Process Cycles 4. Pros and Cons of each finish 5. Considerations for success with all surface finishes. 6. Part 1 will review nickel free surface finishes. Part 2 will focus on nickel containing finishes.

    Who Should Attend:
    Anyone who deals with surface finishes specifications and/or defect analysis. Those responsible for choosing the surface finish for end use products. Process engineers and supplier quality managers.

    About The Instructor:
    Lenora Toscano is the Director Final Finishes in the Electronics Division of MacDermid. Her responsibilities include innovation and marketing for all surface finishing specific to printed circuit boards. She also takes part in the development of new surface finishes outside of the conventional electronic markets. Her efforts have focused on developments that assess the compatibility between final finishes and different assembly and end-user applications. In addition, as the Director of OEM applications, Lenora works closely with fabricators, EMS and OEMs to understand customers’ needs for all MacDermid’s product lines. By narrowing the communication gaps within the electronic supply chain, Lenora is able to satisfy fabricators and OEM needs.

    Lenora has been working for MacDermid for 15 years and has been published in numerous industry technical conferences. She holds four patents. She graduated from the University of Connecticut with a Bachelor’s Degree in Chemistry and received her Master’s Degree in Chemistry.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    Failure Analysis: Lessons Learned in Manufacturing
    Martin AnselmTwo (2) 90 Minute Sessions
    Thursday, July 15 and 22, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Martin Anselm, Ph.D., Universal Instruments Corp.

    Overview:
    Universal Instruments Corporation’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

    Topics Covered:
  • What the major difficulties in lead-free reliability testing are
  • Mixed alloy assembly best practices
  • PCB plating considerations
  • Analytical testing techniques and what they can identify root causes for production failures
  • Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies
  • FA Tools and Techniques to be discussed include the following:
    Thermogravimetric Analysis & IR Ion Chromatography Ion Contamination Shadow Moire SEM/EDS Wetting Balance/Solderability Acoustic Microscopy White Light Interferometry Mechanical Testing Optical Microscopy Mechanical Strain Gauge Analysis & Strain limits X-Ray Inspection Environmental Testing Solder Paste Print Transfer Efficiency Micro Hardness Testing Dye Penetration Testing Micro Sectioning Cross-section Etching

    Suggestion:
    Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.

    Instructor Bio:
    Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    SMT For Movers, Shakers & Rainmakers
    Ray Prasad Two(2) Part 90 Minute Sessions
    Tuesday, August 19 & 26, 2014
    11:00am to 12:30pm Eastern
    Presented by: Ray Prasad, Ray Prasad Consultancy Group

    Overview:
    Most of the SMT courses at various conferences cater primarily to Engineers and Technicians. They are too technical for the Rainmakers, the people who bring in the business and are dealing with business issues of SMT. The objective of this course is to provide technical information to movers, shakers and the rainmakers responsible for selling and buying of SMT equipment and materials including components and PCBs.

    This course provides an overview of SMT manufacturing processes and role of SMT equipment and materials in non-technical manner. It begins with highlighting the problems that we all need to address, no matter what our job titles are and then delves into the role of materials and equipment to solve those problems. A good understanding of key issues in SMT without getting too technical is intended to help to help you in making sound business decisions.

    This is not a theoretical course. Supplemented with a quiz, it is a very interactive course and is based on Mr. Prasad's academic and hands on background in both business and technical disciplines. With Graduate degrees in business and engineering, he has over three decades of technical and business experience at Boeing, Intel, BeamWorks and numerous clients on both technical and business sides of the electronics industry.


    You are also encouraged to bring your pesky defects for class discussion and root cause analysis.
    How You Will Benefit
    After completing this course you will be able to:

  • Get a good understanding of the problem in the SMT and how you, as a business professional, can help address those problems.
  • Learn what features your materials and equipment should have to give a competitive advantage in various applications such as fine pitch, no clean and lead free environment.
  • Learn how to determine the key equipment features you need if you are in the market for buying or selling SMT equipment
  • There is a quiz (really) before and after the class and you will be certain that you learned technical information you need to be effective in making business decisions including legal disputes, buying and selling SMT equipment and materials investment decisions such as mergers and acquisitions of EMS companies.

    Topics Covered:
    1. Benchmarking the Problem

  • Lead Pitch and Configuration and Their Impact on Quality
  • Impact of Lead Free, No clean, Fine Pitch and No Lead on Yield
  • Role of Materials and Equipment in Controlling Quality 2. SMT Components, Processes and Equipment
  • Selection & Evaluation of SMT Equipment
  • Active and Passive SMT components
  • SMT Process Flow for Various Types of Products
  • Adhesive, Paste and Their Application
  • Soldering (Reflow including Vapor Phase, Wave & Selective)
  • Flux and Cleaning & No Clean
  • AOI, Repair and Test 3. Strategy for Preventing Field Returns
  • Quality Index for Managers to Monitor
  • Quiz and Review

    Who Should Attend:
    The target audiences for this course are the Movers, Shakers and the Rain Makers – dealing with all aspects of the business including legal disputes, mergers and acquisitions, finance, sales and purchase of SMT materials and equipment. Process and Design Engineers will also benefit from this course by learning to establish technical requirement for equipment and materials for purchase and simple technical solutions in design and process steps to prevent field returns.

    About The Instructor:
    Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

    Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.

    Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    Evaluating the Performance of Conformal Coatings
    Doug Pauls, Rockwell CollinsTwo (2) 90 minute Sessions
    Thursday, September 11 & 18, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Doug Pauls, Rockwell Collins

    Overview:
    Conformal coatings should be chosen based upon how well they protect the electronic circuit against the challenges of the end use environment. The difficulty is that not many people know how to make that evaluation. What kinds of tests can be used? What parameters should be chosen? How should the data be interpreted? This course covers various tests that are used to do base material characterizations, as well as tests which cover more functional aspects of conformal coating. While much of the testing will be from a Class 3 Avionics perspective, the methodologies covered can be extended to other industry segments.

    Course Outline:

    1. Uses of conformal coatings
    2. Materials characterization tests for coatings
      • IPC-CC-830
      • MIL-I-46058
      • ASTM
    3. Performance specifications for coatings
      • J-STD-001
      • UL-746
    4. End Use Environments Overview
    5. Testing of Conformal Coatings
      • Fluid Susceptibility
      • Flammability
      • Fungus resistance
      • Salt spray and salt fog
      • Sand and dust testing
      • Humidity testing – static and condensing
      • Waterproofness testing
      • Thermal cycling and thermal shock
      • Vibration
      • Heat flow
      • RF testing
      • Material compatibility
      • Process effects
    6. What defects are found in these tests and what they mean
    7. Illustrative Case Studies
    8. Question and Answer Session

    Who should attend:
    This course is written for individuals responsible for choosing or evaluating conformal coatings for use on electronic assemblies in harsh end use environments.

    Your Instructor:
    The instructor for the course is Doug Pauls, a Principal Materials and Process Engineer at Rockwell Collins, Cedar Rapids, IA. Doug is the Chairman of the IPC Cleaning and Coating committees.

    Doug holds a B.A. in Chemistry and Physics from Carthage College, Kenosha, Wisconsin, and a B.S. in Electrical Engineering from the University of Wisconsin, Madison. He worked for the Naval Avionics Center in Indianapolis, Indiana for nine years as a Materials Engineer. Doug spent 8 years as the Technical Director of Contamination Studies Laboratories, performing process troubleshooting and optimization from a residue analysis perspective. Doug is an active IPC Chairman (General Chairman - Cleaning and Coating, Bare Board Cleanliness, Solder Mask) and presently chairs the IPC Technical Activities Executive Committee. Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes. Doug moved to Rockwell Collins in 2000, serving as their corporate expert on conformal coating materials and processes. He received Rockwell’s Arthur A. Collins Engineer of the Year award in 2004.

    Doug is known to have a pathological fear of free time, has been happily married for 28 years. He has 3 children and so has little free time, but does some woodworking, woodcarving, and occasionally sneaks away to do some hunting and fishing.

    Registrations are being taken through the SMTA Online Registration System.






    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.