SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Apr 21 & 28, 2015 Webtorial: Reballing BGAs for Rework 101

May 22 & 29, 2015 Webtorial: Solder Joint Voids – All You Should Know

Jun 11 & 18, 2015 Webtorial: PCB Fabrication Methodologies and Strategy for Embedding Passive and Active Components

Jul 14 & 21, 2015 Webtorial: Assessment of Standards and Methods for Evaluation of Medical Electronic Device Reliability

Aug 11 & 18, 2015 Webtorial: Solder Paste Printing and Inspection

Looking for a past webinar? Check the knowledge base.

Webinar vs Webtorial: What's the Difference?


  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*


  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Patti Coles, Director of Education at the SMTA. 952-920-7682.

    SMTA Webtorial:
    Reballing BGAs for Rework 101
    Two (2) 90 minute Sessions
    Thursday, April 21 & 28, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Bob Wettermann, BEST Inc.

    Bob Wettermann

    What You Can Learn From This Course:
    When repair or rework technicians are required to rework a area array balled device or a solder alloy of a balled device needs to be swapped out for another then a device needs to be reballed. This requires a skilled technician to re-attach the solder balls to the package. Also taught in this class is the technique of reballing a ceramic part which requires that SnPb solder attaches non-collapsing solder balls to the device.Finally a newer technique in which a small outline package leadless device can be be reballed in order to be re-attached to a PCB will be shown. “Tricks of the trade” for reballing will be explained via various videos and photos.

    This webtorial is designed to walk you through the process of reballing both plastic and ceramic BGAs in low volume for cases where the BGA was removed and needs to be replaced as well as in cases where the alloy needs to be simply changed out.

    The course is designed for technicians and engineers working in design, manufacturing, quality, and field repairs.

    1) Background & Introduction
  • Need for the reballing of balled devices

    2) Reballing Process
  • Handling of Parts
  • Data Sheets
  • Tools
  • Process
  • Inspection
  • "Gotchas"
  • Marking
  • Bakeout & Drypack
  • Profiling

    3) Plastic Device Reballing
  • Ceramic Device Reballing
  • Reballing of Small Outline Leadless Packages

    4) Conclusions

    Instructor Bio:
    Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 16+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Solder Joint Voids – All You Should Know
    Two (2) 90 minute Sessions
    Friday, May 22 & 29, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Jennie Hwang Ph.D., H-Technologies Group

    Jennie Hwang

    Three fronts in the industry rekindle the interest and concern about solder joint voids – the increased use of newer packages (BTCs, PoPs), the ever-miniaturized electronics containing “smaller” solder joints, and the increased demand in solder joint reliability for high reliability products. Different types of solder joint voids, their causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance and the steps to minimize solder joint voids will be outlined.

    What will you learn:
    Part 1:

  • Potential effects
  • Likely impact on Reliability
  • Case studies
  • Different Sources
  • Factors contributing to each of the sources
  • Role of solder alloy composition

    Part 2:
  • Mitigating approaches
  • BGA voiding – additional factors
  • BTC solder joint voids
  • Voids criteria vs. applications
  • Inspection
  • Summary

    Who Should Attend:
    The course provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge and experience to this tutorial through both hands-on and advisory capacities. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker in innumerable international and national events. Dr. Hwang has received numerous honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    PCB Fabrication Methodologies and Strategy for Embedding Passive and Active Components
    Thursday, June 11 & 18, 2015
    1:00pm - 2:30pm Eastern
    Instructor: Vern Solberg, Solberg Technologies

    Vern Solberg

    Although the printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces, companies attempting to improve functionality and minimize space are now considering embedding a broad range of components within the circuit structure. Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process. Some components are easy candidates for integrating into the substrate while other may involve more complex processes and will be difficult to rationalize. Although a majority of the discrete passive and active devices may remain mounted on the outer surfaces of the multi-layer board, embedding one or more silicon based semiconductor elements within the inner layers of the structure will enable greater utilization of the circuit boards outer surfaces. Benefits can include improved performance, For example, by embedding the semiconductor on an inner layer of the circuit directly in line with a related semiconductor package mounted on the outer surface, the conductor interface can be minimized. The close coupling of semiconductor elements significantly reduces inductance and contributes to increasing signal speed.

    Course objectives:
    This course was developed to better enable the product designer and manufacturing specialist to have a clear understanding of the principles for electronic packaging by embedding components in an organic multilayer circuit board structure. The course will include design guidelines, material selection and termination methodology for embedding both ‘active and passive components including resistor, capacitor, inductor and discrete transistor elements. Process variations for embedding and interconnecting thinned semiconductor elements within the multi-layer PCB will be illustrated with examples of core type and coreless substrate structures.

    Who Should Attend?
    The material presented has been specifically prepared for PCB Designers, Design Engineers and those responsible for electronic product development, assembly processing and manufacturing efficiency. This would include manufacturing and test engineering specialists for the OEM, ODM and EMS providers.

    Course Outline

    Planning strategy

  • Market drivers for miniaturization
  • Total circuit consideration
  • Internal component mounting
  • External component mounting
  • Circuit interface variations

    Layout strategy
  • Embedded passives mounting plus external attachment
  • Passives inside mounting structure plus external attachment
  • Embedded actives and passives plus external attachment

    Base materials and build-up structures
  • Organic base material selection criteria
  • Conductor characteristics (copper foil/film)
  • Passive component forming material and process
  • Discrete passive component selection
  • Solder and other attachment materials

    Core and coreless structures

  • Two sided base core (with or without vias)
  • Multilayered base core (with or without thru, blind, or buried vias)
  • Die first coreless package processing

    Embedded component PCB development
  • PCB supplier selection
  • Land pattern development
  • Component termination guidelines
  • Plating and coating alternatives

    Component attachment process
  • Preparation for component placement
  • Assembly process variations for passive components
  • Preparation for embedding active die elements
  • Assembly process variations for active die elements

    About the presenter:
    Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and as an educator. In addition to tutorial and workshop programs for industry related events Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansa State Universities Microelectronics Laboratories in Salina.

    Solberg holds several patents for 3D IC packaging innovations including the folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication. Vern also participates in and supports several industry organizations including IPC, SMTA , IEEE and IMAPS.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Assessment of Standards and Methods for Evaluation of Medical Electronic Device Reliability
    Bhanu Sood Two (2) 90 Minute Sessions
    Tuesday, July 14 & 21, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Bhanu Sood, Center for Advanced Life Cycle Engineering (CALCE)

    How does a medical device company utilize field return data to improve the reliability of its current products? Do the reliability tests provide adequate coverage, or are they simply satisfying requirements set in the standards? How are companies addressing device risks in qualification plans?

    This webtorial provides answers to these questions and more. The Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland is the largest electronic products and systems research center focused on electronics reliability. CALCE has developed methodologies implemented on numerous standards for reliability assessment, prediction, and the integration of reliability in the design of electronic products. In this webinar, we focus on the reliability issues of medical devices.

    Reliability is reported as a cumulative survival estimate of failed devices. However, these probability estimates do not provide information on the reliability with regards to specific failure mechanisms. In this session, a methodology is provided for using field returns to estimate the medical device reliability and plan reliability tests for new generations of devices.

    Bhanu Sood ( is the Director of the Test Services and Failure Analysis Laboratory at CALCE. Bhanu’s research areas at CALCE include development of analysis methodologies for component- and PCBA-level failures, materials characterization techniques for counterfeit parts identification, and investigating failure mechanisms in printed circuit boards. Prior to joining CALCE, Bhanu worked at the Naval Research Laboratory in the areas of embedded electronics, embedded batteries, and laser-assisted micro-fabrication techniques. Bhanu holds a US Patent for a laser-based technique for the transfer and embedding of electronic components and devices.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Solder Paste Printing and Inspection
    Chrys Shea Two (2) 90 minute Sessions
    Tuesday, August 11 and 18, 2013
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Overview: This two-part webtorial combines the basics of SMT solder paste stencil printing and process troubleshooting with an overview of automated Solder Paste Inspection (SPI) technologies in both laboratory and production environments.

  • Process basics include material properties, process steps and the mechanics of proper printer setups.
  • Process troubleshooting builds on the basics to help attendees identify potential root causes of print quality problems and how to diagnose them.
  • The SPI overview discusses the three major types of SPI measurement technologies and the similarities and differences in their measurement algorithms.
  • Laboratory use of SPI demonstrates how the technology is used in stencil printing research and development studies.
  • Production use of SPI discusses the importance of print yields, appropriate tolerance settings, considerations in transfer efficiencies and statistical process control.

    Who will benefit from this course?

  • SMT assembly process engineers and technicians responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields
  • OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors

    Instructor Bio:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
    Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.

    Registrations are being taken through the SMTA Online Registration System.

    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.

  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.