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CLICK HERE TO SUGGEST A TOPIC FOR AN SMTA ON-LINE PRESENTATION
Listen to outstanding speakers without leaving your desk. SMTA On-line Presentations feature instructors who, for approximately ninety minutes each, speak on timely and specific topics.
The presentations are broadcast using GoToWebinar for the presentation materials, using Telecon for the audio, and GoToWebinar chat options for submitting questions directly to the instructor. PDF files of the presentation material are also distributed to registered attendees.
The cost for each 90-minute on-line presentation is $75USD/$150USD for SMTA members/non-members, and the price of an individual membership is included in non-member registration. Remember, each registrant is allowed one phone line connection for as many site employees as can be accomodated by your AV facilities. If necessary, multiple phone lines must be individually registered.
If you have any questions, contact Ryan Flaherty, Director of Communications at the SMTA. Ryan@smta.org 952-920-7682.
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Design and Assembly Challenges of Ball Grid Arrays (BGAs) and Bottom Terminations Components (BTCs)
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Tuesday, July 7 and Tuesday, July 14, 2009
1:00pm to 2:30pm Eastern
Ray Prasad, Ray Prasad Consultancy Group
COURSE OBJECTIVE
The objective of this two session webinar is to identify the design and process issues in BGAs and BTC and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free.
This is not a theoretical course, it is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients. This course deals with "real-world" problems in lead free implementation.
WHO SHOULD ATTEND
Anyone in process, quality, manufacturing, design, purchasing and management who wants to acquire a solid understanding of design and manufacturing issues in SMT, BGAs, BTCs (QFN, MLF), for building assemblies in-house or at a subcontractor will benefit from this course.
SESSION 1
Tuesday, July 7, 2009
Overview
The lead free train has been moving fast. Even if you work in a currently exempt industry you need to get onboard or risk losing market share to competitors; particularly when the leaded products and components you are using become only available in lead free.
Learn about the key reasons for Lead Free conversion and their impact on your business and most importantly how to resolve issues for an effective implementation of BGAs and Bottom Terminations surface mount components such as QFN, DFN and MLF in a lead free world at a lower cost and higher yield.
Topics covered
Overview of BGAs and BTCs Why conversion to lead-free solders is necessary and its impact on materials and assembly processes Design issues for lead-free: Laminates for lead-free, lead-free surface finishes and component considerations
After completing this section you will be able to:
Get an overview of BGA, CSP and emerging technologies such as BTCs (QFN, MLF) Learn the reasons for lead-free conversion. It is not the just because of the EU legislation Learn the impact of RoHS change-over on laminate and component selection and surface finishes
SESSION 2
Tuesday, July 14, 2009
Overview
Designing for BGA and BTC can involve trial and error and lots of frustration. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of lead-free has compounded the designer’s task.
Learn about the latest design and process guidelines developed by IPC 7095 (BGA) and IPC 7093 (BTC), currently chaired by Ray Prasad.
Topics covered
Design and process guidelines for BGAs and BTCs Backward and forward compatibility: issues and answers Key strategies in design and manufacturing processes to prevent field returns
After completing this section you will be able to:
Learn about the latest guidelines for designing with BGAs and BTCs Determine the best way to deal with backward and forward compatibility situations (lead-free and tin-lead components on the same board) Understand metallurgy of lead-free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment to prevent field failures
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Registrations are being taken through the SMTA Online Registration System.
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Inspecting, Detecting and Rejecting Counterfeit and Reworked Electronic Components in the Open Marketplace
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 Tuesday, July 28, 2009
12pm to 1:30pm Eastern
Presented by Art Ogg, World Micro
This presentation will focus on leading edge techniques and procedures being used to detect counterfeit and reworked electronic components in the open marketplace.
Attendees of the webinar will learn how the current counterfeiting organizations have come into being, why they flourish, what steps the U.S. Government is taking to mitigate their import into this country and what individual companies can do to limit their exposure.
The presenter will demonstrate actual examples and pictures of counterfeited parts and explain how they were detected. Examples of equipment needed to make inspection processes more likely to detect counterfeited and reworked parts will be shown and explained.
In summary, the attendees will learn the sources of counterfeited components, how to inspect and detect components and what each company should do to limit their exposure to illegal parts in the United States.
Art Ogg joined World Micro in March 2006. As the Director of Quality, Mr. Ogg is responsible for World Micro Quality Initiatives, product quality, ISO Certifications and technical documentation.
Prior to joining World Micro, Mr. Ogg held Senior Quality management positions with Seagate Technology and Digital Equipment Corporation. He brings 40 years of high tech electronics experience to this position.
Mr. Ogg earned his degree in Business Administration from the North Central College. He is an IDEA Certified Professional Inspector, an ISO Lead Auditor and a 6-Sigma Greenbelt.
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Registrations are being taken through the SMTA Online Registration System.
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MORE WEBINARS COMING SOON!
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.
All cancellation requests must be received prior to the start time of the event.
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The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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CONSIDERATIONS FOR RECEIVING THE BROADCAST
Register via GoToWebinar upon recieving the email with confirmation and instructions.
As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise (or discard as they are answered).
For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial)
or email gotowebinar@citrixonline.com.
Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
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