SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Mar 14, 2017 Webinar: What are the Next Concerns in Counterfeit Electronics?

Mar 22 & 23, 2017 Webtorial: Role of Bismuth in Lead-free Systems – All You Need to Know

Apr 4, 2017 Webinar: Exploring Interferometry Sensors for Advanced Packaging Metrology Applications

Apr 10 & 12, 2017 Webtorial: Photonic Integrated Circuits

May 9 & 11, 2017 Webtorial: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

Nov 14 & 16, 2017 Webtorial: Reflow - Understanding the Complete Process & Defect Prevention

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, ryan@smta.org 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org 952-920-7682 or submit your abstract here.






    SMTA Webinar:
    What are the Next Concerns in Counterfeit Electronics?

    Tuesday, March 14, 2017
    1:00pm-2:00pm Eastern
    Presented by: Diganta Das, Ph.D., CALCE/University of Maryland

    Diganta Das

    Complimentary Webinar for Members!

    Course Overview:
    The counterfeit part mitigation and control plans reached a milestone in 2016 with release of the long awaited test standard AS 6171. The year also saw release of an updated version of "Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition" and its accompanying aerospace recommended practices. This Webinar will cover the salient elements of these published standards and the status of other related standards. In addition, the concerns on the future of counterfeit - including those of non-electronic systems, higher level assembly, tampered electronic components and systems and their relationship with the highly visible area of cyber-security. This coverage will include other sources of standards such as JEDEC and IPC and top level analysis of reported counterfeit data.

    About the Presenter:
    Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is an Associate Research Scientist at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Role of Bismuth in Lead-free Systems – All You Need to Know

    Two (2) 90 minute Sessions
    March 22 and 23, 2017
    1:00pm to 2:30pm Eastern
    Jennie Hwang Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

    Overview:
    Bismuth (Bi), which is introduced either through the supply chain or by design, is becoming an inevitable element in lead-free electronic products. With the deliberation of all relevant parameters, theoretical and practical, Bi plays a “potent” role in electronic solder systems. The proper use of Bi can profoundly benefit the performance and reliability of electronic package and assembly including solder joint performance, tin whisker mitigation, among others. An adequate understanding of the properties and performance parameters of Bi is critical to product reliability. This webtorial will discuss the relevant aspects of Bi to help dispel misconceptions and to demonstrate performance criteria related to Bi. The goal is to help achieve the desired level of performance and product reliability. Your questions and issues for solutions and discussions are welcome.

    Main topics for Part 1:

  • Your issues & concerns related to Bi
  • Bi - characteristics, resources, safety data
  • Bi effects in 63Sn37Pb solder joint
          --Physical properties
          --Mechanical behavior
  • Effects of Bi from component coating and PCB surface finish
          --Dissolving into solder joint
          --Estimation of concentration of Bi in solder joint
          --Effect of compositional change

  • Bi effects in SAC solder joint (SnAgCuBi)
          --Compositional change
          --Stress vs. strain
          --Fatigue behavior
  • Bi effects in other Pb-free alloys (SnCu, SnAg, SnAgIn)
          --Stress vs. strain
          --Fatigue performance

    Main topics for Part 2:

  • Historically established Bi-containing electronic solder alloys
          --Pb-containing
          --Pb-free
  • Bi-containing Pb-free solder alloys
          --Melting temperature range
          --Compositional control level
          --Physical, mechanical properties
          --BGA thermal fatigue performance
  • PCB through-hole fillet-lifting vs. Bi
          --Causes
          --Solutions
  • Low temperature BiPbSn phase
          --Presence or absence
          --Thermograms
          --Detectable or non-detectable effects
          --General guidelines
  • Design limit in Pb-free solder joints vs. solder joint reliability
  • Concluding points
  • Who Should Attend:
    The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

    Bio:
    Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and government programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. She has received numerous honors/awards including the U.S. Congressional certificate of recognition, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 450+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and implementations, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University's Board of Trustees.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webinar:
    Exploring Interferometry Sensors for Advanced Packaging Metrology Applications

    Tuesday, April 4, 2017
    11:00am-12:00pm Central
    Presented by: Julia Brueckner, Ph.D., Quantum Analytics

    Julia Brueckner Complimentary Webinar for Members!

    Overview:
    The end of node scaling is approaching. As a consequence, the need to start scaling the packages is growing constantly. Fan out wafer-level packaging (FO-WLP) offers an efficient solution due to its possibility for high IO count, thin package and short development times. The process flow to build a so called redistribution layer (RDL) requires a full lithography and plating cycle. To ensure a reliable product, all involved process steps need to be tightly monitored and controlled accurately. The challenge here: how to measure step height of pads or under bump metallization (UBM) features on structures that are not completely flat and show height variations. In this webinar, we’ll explore ways to tackle that problem and introduce the work flow of a stable algorithm to evaluate the above mentioned features automatically for different devices. We will discuss how White Light Interferometry (WLI) and Spectral Coherence Interferometry (SCI) can be used to achieve fast and accurate measurements of step heights, critical dimensions (CDs) of pads, UBM structures, as well as polymer thickness. We will share data taken from measurements - displaying full wafer maps, 3D profiles, and identifying the anomalies that are revealed.

    Topics Covered:

  • White light interferometry sensor and technology
  • Spectral coherence interferometry sensor and technology
  • Measurement principles
  • Application examples in packaging
  • Data evaluation
  • Who Should Attend:

  • R&D Managers
  • Laboratory Managers
  • Operators
  • About the Presenter:
    Julia, a native of Offenbach, Germany, received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she received her Ph.D. in Chemistry from the University of Heidelberg for her dissertation: Ultrafast Triplet Formation in N-Substituted Pentacene Derivatives. During her studies she was awarded several scholarships including a Fulbright scholarship to UC Berkley, and a Procter & Gamble award for the best thesis in the Master of Chemistry studies. Upon receiving her Ph.D., Julia joined Sentronics Metrology in Mannheim, Germany as an applications scientist. In March 2016, she was requested to directly work with Quantum Analytics, the US distributor to promote Sentronics Metrology equipment in the US semiconductor industry.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Photonic Integrated Circuits

    Two (2) 90 minute Sessions
    April 10 and 12, 2017
    1:00pm to 2:30pm Eastern
    Presented by: Stefan F Preble, Ph.D., Rochester Institute of Technology

    Overview:

    In this webtorial you will be introduced to photonic integrated circuits (PICs). PICs are an emerging technology where photonic circuits (waveguides, lasers, detectors, modulators) are manufactured using integrated circuit technology and closely integrated with microelectronics. The circuits are finding applications in high performance communication, computing and sensing systems. PIC technology is in its infancy, only emerging a decade ago, but is rapidly growing in complexity and demand. Consequently, as the advantages are realized and the manufacturing hurdles are overcome, photonic circuits will become ubiquitous in future microsystems. You will learn about the fundamental building blocks of PICs, the integration of PICs into the CMOS manufacturing design methodology, and the challenges that remain, particularly with packaging.

    Who Should Attend:
    General audience with a BS degree in EE, Electronic packaging, Telecommunications or equivalent field.


    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

    Two (2) 90 minute Sessions
    May 9 and 11, 2017
    12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
    Jennie Hwang Presented by: Bob Willis, bobwillis.co.uk

    Overview:
    This session includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob's presentation comes alive with many unique process video clips on testing and failures which provide a clear understanding of the root cause of failure and corrective action. A FREE copy of Bob's e-book on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course.

    Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

    Topics will include:

  • Package types
  • Design and PCB guide lines for parts
  • Assembly process options
  • Inspection standards
  • Common process and reliability failures
  • Defect Investigation techniques and corrective action


  • Bio:
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production. Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Reflow - Understanding the Complete Process & Defect Prevention

    Two (2) 90 minute Sessions
    November 14 and 16, 2017
    12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
    Jennie Hwang Presented by: Bob Willis, bobwillis.co.uk

    Overview:
    The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures

    With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues see in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. Each delegate registered on the webinar will receive a free set of wall charts on reflow soldering and temperature profiling

    If you have a specific process problems with reflow send it to Bob to include in the webinar.


    Topics will include:

  • Design for reflow soldering
  • Selecting the best solder paste
  • Fundamentals of solder joint formation
  • Optimising your reflow process
  • Correct profiling procedures
  • Correct PCB finish for your process
  • Common soldering problems and why they occur
  • Reliability of solder joints
  • Practical testing of solder joints


  • Bio:
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division.

    As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.

    Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection

    Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck

    In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA

    Registrations are being taken through the SMTA Online Registration System.




    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top