Español   |   中文
SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Apr 20, 2016 Webinar: PCB Surface Finishing Overview: How Process Parameters Effect Functional Performance

Apr 26 & 28, 2016 Webtorial: Solder Reflow Fundamentals Understanding Thermal Profiles and Defect Mitigation

May 17 & 19, 2016 Webtorial: It is Time for Low Temperature - Low Temperature Solders, New Development, and Their Applications

Nov 8 & 15, 2016 Webtorial: Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, ryan@smta.org 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org 952-920-7682 or submit your abstract here.





    SMTA Webinar:
    PCB Surface Finishing Overview: How Process Parameters Effect Functional Performance
    Wednesday, April 20, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Leonara Toscano, MacDermid Enthone

    Overview:
    The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, they were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended life in aggressive environments and all this must be achieved at a low cost.

    As the last step in the manufacture of printed circuit boards, all process steps leading to the surface finish must be taken into consideration. The quality of the product entering the surface finish line will affect the resultant performance. It is important to follow operating guidelines to ensure a wide operating window. This Tutorial will detail the surface finishes on the market and the pros and cons associated with them from a fabrication perspective. It will review process cycles and suggest areas from improvement. The session will focus on process parameters within the surface finish line to help promote a wide operating window and achieve desired performance.

    This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications. It will also give end users a better understanding of the challenges associated with each surface finish which may help with selection for specific technologies.

    Outline:
    1. Review of surface finish offerings
    2. Surface finish process cycles and suggestions for improved performance
    3. Discussion of the copper quality entering the surface finish line and its effects

    Who Should Attend: Anyone who deals with specifications and/or defect analysis for surface finishes. Those responsible for choosing the surface finish for end use products. Process engineers and supplier quality managers.

    Instructor Bio:
    Lenora Toscano is the Director of OEM Applications for the Electronics Division of MacDermid Enthone. Her responsibilities enable her to work closely with fabricators, EMS and OEM’s to understand customers’ needs for all MacDermid Enthone’s product lines. By narrowing the communication gaps within the electronic supply chain, Lenora is able to satisfy fabricators and OEM needs.

    Lenora has been in the industry for over 18 years, has numerous technical publications and holds four patents. She graduated from the University of Connecticut with a Bachelor’s Degree in Chemistry and received her Master’s Degree in Chemistry.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    Solder Reflow Fundamentals Understanding Thermal Profiles and Defect Mitigation
    Two (2) 90 minute Sessions
    Tuesday, April 26 and Thursday, April 28, 2016

    1:00-2:30pm Eastern
    Presented by: Fred Dimock, BTU International and Karl Seelig, AIM

    Overview:
    This class is an extension of Solder Reflow Fundamentals – Understanding and Obtaining Profiles. It focuses on how the shape of reflow profiles affects various defects and what the SMT engineer/technician can do to eliminate them. It is designed for the SMT engineers/technicians that want a better understanding of the reflow process, identifies defects, and gives practical troubleshooting steps. This was a high rated workshop from SMTAI that you can attend right from your desk!

    Outline:

  • Recipe and Profiles
  • Properties of Solder Paste
  • Metals and flux
  • Profile shapes
  • Defect identification and mitigation
  • Solder Balls
  • Opens
  • Voids
  • Tombstoning

    Who Should Attend:
    This will benefit SMT process engineers and technicians that want a better understanding of the reflow process and to learn practical steps to eliminate soldering defects.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    It is Time for Low Temperature - Low Temperature Solders, New Development, and Their Applications
    Two (2) 90 minute Sessions
    Tuesday, May 17 and Thursday, May 19, 2016

    1:00-2:30pm Eastern
    Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation

    Overview:
    Since the dawn of the electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperatures around 300C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200C. Low temperature solders with melting temperature < 180C are currently mainly used for niche applications. However, the iNEMI Roadmap predicts low temperature soldering to become one of the main stream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

    Outline:

  • Market Demand & Tentative Binary Alloys Options
  • SnIn
  • BiSn
  • BiSn + Ag
  • BiSn + Proprietary Dopants
  • BiSn + In, Ni
  • BiSn + Sb, Zn, Ag
  • SnInAg & Applications
  • Summary
  • Appendix

    What you will Learn
    You will learn the benefits of low temperature soldering, and how this may broaden your options in product design, your soldering process, your choice of components and board materials, and hierarchic combinations. You will also know the variety of solder alloys, and the pro and cons of each of the alloys in terms of their properties and their performance at the applications.

    Who Should Attend:
    Technology directors, technology managers, product managers, design engineers, process engineers, reliability engineers, material scientists, process technicians, and any one who is interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course.

    Instructor Bio
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies" by Newnes, and co-author of "Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials" by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

    Registrations are being taken through the SMTA Online Registration System.






    SMTA Webtorial:
    Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys
    Two (2) 90 minute Sessions
    Tuesday, November 8 and Tuesday, November 15, 2016

    12:00pm-1:30pm Eastern
    Presented by: Bob Willis, Bobwillisonline.com & NPL National Physical Laboratory

    Overview:
    When we start to talk about high temperature electronics it's not the solder it's all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200oC, however, there are many applications that have to work at much higher levels, up to 300oC. Typically the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.

    High Temp Defects

    The webinar is a mixture or theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory . A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.

    High Temp Defects

    Topics may include:

  • Oil, Gas, Space, Automotive & Military Applications
  • Reference books, specification and standards
  • Product temperature range
  • Component compatibility
  • PCB substrate choices & specifications and design
  • Soldering alloy choices
  • Assembly & soldering options
  • Setting up and assessment of soldering systems
  • Critical choice in the selection of cored wire for automated assembly
  • Reliability assessment & testing results
  • Failure modes
  • Inspection of solder joints and new defect types

    Bob Willis Instructor Bob Willis
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.

    Bob has conducted workshops and set up production lines, assembly features and his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers worldwide like Productronica, Germany, IPC APEX, SMTAI in the USA plus National Electronics Week and Nepcon Electronics in UK.

    Bob was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and was elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he has also worked on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.

    Bob organises the NPL Defects Database on behalf of NPL and organises the Electronics Interconnection Division’s monthly online technology webinars and on site workshops. He has authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers from around the world.

    Registrations are being taken through the SMTA Online Registration System.






    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.