SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Sep 11 & 18, 2014 Webtorial: Evaluating the Performance of Conformal Coatings

Oct 16 & 23, 2014 Webtorial: Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies

Nov 4 & 11, 2014 Webtorial: SMT and Through Hole Defect Analysis and Process Troubleshooting

Nov 18 & 25, 2014 Webtorial Stencil Printing - A Practical Guide to Defect Prevention and Yield Improvement

Dec 2 & 9, 2014 Webtorial: LED, BGA, and QFN Assembly and Inspection

Looking for a past webinar? Check the knowledge base.

Webinar vs Webtorial: What's the Difference?


  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*


  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Patti Coles, Director of Education at the SMTA. 952-920-7682.

    SMTA Webtorial:
    Evaluating the Performance of Conformal Coatings
    Doug Pauls, Rockwell CollinsTwo (2) 90 minute Sessions
    Thursday, September 11 & 18, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Doug Pauls, Rockwell Collins

    Conformal coatings should be chosen based upon how well they protect the electronic circuit against the challenges of the end use environment. The difficulty is that not many people know how to make that evaluation. What kinds of tests can be used? What parameters should be chosen? How should the data be interpreted? This course covers various tests that are used to do base material characterizations, as well as tests which cover more functional aspects of conformal coating. While much of the testing will be from a Class 3 Avionics perspective, the methodologies covered can be extended to other industry segments.

    Course Outline:

    1. Uses of conformal coatings
    2. Materials characterization tests for coatings
      • IPC-CC-830
      • MIL-I-46058
      • ASTM
    3. Performance specifications for coatings
      • J-STD-001
      • UL-746
    4. End Use Environments Overview
    5. Testing of Conformal Coatings
      • Fluid Susceptibility
      • Flammability
      • Fungus resistance
      • Salt spray and salt fog
      • Sand and dust testing
      • Humidity testing – static and condensing
      • Waterproofness testing
      • Thermal cycling and thermal shock
      • Vibration
      • Heat flow
      • RF testing
      • Material compatibility
      • Process effects
    6. What defects are found in these tests and what they mean
    7. Illustrative Case Studies
    8. Question and Answer Session

    Who should attend:
    This course is written for individuals responsible for choosing or evaluating conformal coatings for use on electronic assemblies in harsh end use environments.

    Your Instructor:
    The instructor for the course is Doug Pauls, a Principal Materials and Process Engineer at Rockwell Collins, Cedar Rapids, IA. Doug is the Chairman of the IPC Cleaning and Coating committees.

    Doug holds a B.A. in Chemistry and Physics from Carthage College, Kenosha, Wisconsin, and a B.S. in Electrical Engineering from the University of Wisconsin, Madison. He worked for the Naval Avionics Center in Indianapolis, Indiana for nine years as a Materials Engineer. Doug spent 8 years as the Technical Director of Contamination Studies Laboratories, performing process troubleshooting and optimization from a residue analysis perspective. Doug is an active IPC Chairman (General Chairman - Cleaning and Coating, Bare Board Cleanliness, Solder Mask) and presently chairs the IPC Technical Activities Executive Committee. Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes. Doug moved to Rockwell Collins in 2000, serving as their corporate expert on conformal coating materials and processes. He received Rockwell’s Arthur A. Collins Engineer of the Year award in 2004.

    Doug is known to have a pathological fear of free time, has been happily married for 28 years. He has 3 children and so has little free time, but does some woodworking, woodcarving, and occasionally sneaks away to do some hunting and fishing.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies
    Tim Jensen Two (2) 90 minute Sessions
    Thursday, October 16 & 23, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Tim Jensen, Indium Corporation

    This webtorial is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of assemblies. It will not focus on mathematical modeling but rather provide data and tools that can be used by process engineers to make immediate impactful changes to the process.

    This webtorial will be broken into three parts:

    Course Outline:
    1. Mechanical Reliability

  • Drop shock vs. thermal cycling vs. vibration
  • Alloys and element addition impact
  • Board and component finish impact
  • Component and board warpage
  • Graping
  • Increased solder volume

    2. Electrical Reliability
  • Cleaned vs. No-Clean fluxes
  • SIR and Electromigration – Dendritic growth
  • Impact of low stand-off components (i.e. QFNs)
  • Creep corrosion
  • Conformal coating
  • Sn whiskering

    3. Thermal Reliability
  • Types of thermal interface materials
  • Assessing thermal conductivity
  • Bond line thickness
  • Impact of pressure
  • Pump-out considerations
  • Solder joint thermal interfaces and voiding

    Who should attend:
    Process engineers, quality engineers, design engineers, and engineering management

    Your Instructor:
    Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
    Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    SMT and Through Hole Defect Analysis and Process Troubleshooting
    S. Manian Ramkumar Ph.D. Two (2) 90 minute Sessions
    Tuesday, November 4 & 11, 2014
    1:00pm to 2:30pm Eastern
    Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology

    This workshop is aimed at providing a thorough understanding of the SMT and Through Hole defects and the various factors that influence the formation of the defects. Participants will be provided an in-depth look at the possible root causes for defects and their influence on yield. The knowledge gained from this workshop will help companies enhance product development, and manufacturing yield. Part 2 of the workshop series will use case studies to teach participants a systematic approach to solve process problems and identify the true root cause(s) for defects.

    Topical Outline
    1. SMT and THT Process

  • Assembly Types and Processes

    2. Process Defects and Definitions
  • Identifying different Defects

    3. Factors Influencing the Process Defects
  • PCB Related
  • Component Related
  • Materials Related
  • Equipment Related
  • Process Related
  • Supplier Related
  • Employee/Knowledge Related
  • Environment Related

    4. Possible Root Causes for Defects based upon Factors

    Who should attend?

  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Managers

    After completing this course, you will be able to:
    1. Understand as systematic approach to problem solving
    2. Develop the ability to define the problem clearly by repeated questioning
    3. Develop skills to address the root cause of problems
    4. Develop a methodology to find one or more solutions to address the root cause and identify a fix.
    5. Understand how the analytical methodology can be applied to many different situations.

    Dr. Ramkumar is a Professor and Chair of the Mechanical and Manufacturing Engineering Technology Department at the Rochester Institute of Technology (RIT). He is also the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Electronics Packaging Center and the Automation laboratories at RIT. The Center supports hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects and has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for companies on-site. His current research is in the use of a novel magnetically aligned ACA as a lead-free replacement with PCB assembly and 3D packaging.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial
    Stencil Printing - A Practical Guide to Defect Prevention and Yield Improvement
    Chrys Shea Two (2) 90 minute Sessions
    Thursday, November 18 and 25, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Course Objectives
    This brand new course begins with the basics of SMT solder paste stencil printing and ends with the latest research in stencil printing tools and technologies. The class starts with a quick description of printing fundamentals: solder paste characteristics and behaviors, the mechanics of the process and importance of a good setup, and the relationship between aperture sizes and paste deposit formations. It then progresses rapidly into troubleshooting techniques for both general and specific printing issues, and addresses problem prevention through proper stencil design and selection. Moving into advanced technology topics, the course reviews the last four years of independent research on stencil materials, manufacturing processes and nanocoatings, and closes with an update of automated Solder Paste Inspection (SPI) technologies, applications and special features. Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.

    Topics Covered

  • Solder paste
  • Mechanics of the printing process
  • Troubleshooting process problems
  • Stencil design
  • Stencil materials and manufacturing processes
  • Automatic Solder Paste Inspection (SPI)
  • Review and Q&A

    Who should attend:

  • SMT assembly process engineers and technicians responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields
  • OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors

    Instructor Bio:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. With several hundred publications to her credit, Chrys leverages her 20+ years of process engineering and management experience to create documents, presentations, web pages and other items that deliver complex technical topics clearly and effectively.

    Chrys is a favorite speaker at SMTA events, and has twice received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.

    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island, and is a past president of the Philadelphia SMTA Chapter. She launched Shea Engineering services in 2008. Contact Chrys at or (609) 239-2995

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    LED, BGA, and QFN Assembly and Inspection
    Two (2) 90 minute Sessions
    Tuesday, December 2 & 9, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Bill Cardoso and Glen Thomas, Creative Electron

    In this webtorial we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The webtorial will focus on the pitfalls of manufacturing and inspecting PCBs with these devices. Presentations will provide content to solve many of the technical challenges encountered by luminaire integrators and contract manufacturers. This tutorial is targeted at manufacturing, process, and quality personnel responsible for designing, implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this Webtorial.
    We will use a library of assemblies inspected at Creative Electron’s Advanced Solutions Lab to provide attendees with real life examples of assembly issues. Attendees are welcome to send their own assemblies to Creative Electron prior to the webtorial so that the material can be used during training.

    Topics Covered:

  • How LED material handling and storage impact assembly performance
  • LED x-ray inspection: How voids cost you money
  • Case study: How lack of quality killed a successful LED company
  • Process design for BGA and QFN assembly and rework
  • BGA and QFN x-ray inspection: How to see what often goes wrong
  • X-Ray as a tool for quality process design and control

    Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. Real life examples make great teaching materials for our tutorial. Please feel free to send us your samples so we can discuss them during the live sessions.

    Bill Cardoso Your Instructors:
    Bill Cardoso, Ph.D.,
    is the Chief Executive Officer and founder of Creative Electron. A native of Brazil, Bill came to the US in 1998 as a 'guest engineer' at the US Department of Energy's renowned Fermi National Accelerator Laboratory (Fermilab), one of the leading research institutions for high energy and nuclear physics. In a nine year career at Fermilab and starting with an associate electronics degree earned in Brazil at age 13, Bill took on significant project, personnel, and budget responsibilities while at the same time earning MS and PhD degrees from the Illinois Institute of Technology (IIT) and an MBA from the University of Chicago.

    After leaving Fermilab as Department Head for Electronic Systems Engineering, Bill moved to California to become the VP of Technology at the government contracting firm he eventually acquired from the estate of the founder to create Creative Electron in 2008.
    An industry thought leader, Bill has been recognized as IIT's 2011 Outstanding Young Alumnus Awardee for his contributions to science and technology. He is also a Senior member of the Institute of Electrical and Electronics Engineers (IEEE), Surface Mount Technology Association (SMTA), American Physics Society (APS), and the International Society for Optics and Photonics (SPIE).
    Bill is a holder of several patents in the areas of radiation detection, radiography, and quality inspection.
    Bill is an active member of his community and is part of the technical committee of several conferences including the SMTA/CALCE Component Counterfeit Conference, SMTA International, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium.
    Bill serves in the G19 committee writing the standards for counterfeit detection for the aerospace and defense markets. He is also a reviewer of academic proposals for the Department of Energy, Department of Homeland Security, and National Science Foundation. He is the author of over 120 technical publications, a contributor to 2 books, and is a frequent speaker at technical conferences on radiography and optical inspection worldwide.

    Glen Thomas Dr. Glen Thomas
    is a proven veteran in the inspection market with over two decades of experience developing and marketing x-ray systems. Glen leads Creative Electron's lead generation and branding strategy. Glen also manages the company's relationship with our domestic and international sales channels. He has been instrumental in helping the company create the best x-ray inspection systems in the world by providing its customers with unrivaled value. Dr. Thomas has held executive leadership positions and was instrument at the growth of companies like Faxitron, Micro Focus Imaging, Radsource Technologies, X-Ray Imaging Solutions, and Lixi.
    Glen is the VP of Operations for the SMTA Great Lakes Chapter. Glen holds a BS in Electrical Engineering and a PhD from the University of Wisconsin in Madison.

    Registrations are being taken through the SMTA Online Registration System.

    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.

  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.