Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, email@example.com 952-920-7682.
If you are interested in presenting a webinar or webtorial, contact Jenny Ng, firstname.lastname@example.org 952-920-7682 or submit your abstract here.
It is Time for Low Temperature - Low Temperature Solders, New Development, and Their Applications Two (2) 90 minute Sessions
Tuesday, May 17 and Thursday, May 19, 2016
Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation
Since the dawn of the electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperatures around 300C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200C. Low temperature solders with melting temperature < 180C are currently mainly used for niche applications. However, the iNEMI Roadmap predicts low temperature soldering to become one of the main stream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.
What you will Learn
You will learn the benefits of low temperature soldering, and how this may broaden your options in product design, your soldering process, your choice of components and board materials, and hierarchic combinations. You will also know the variety of solder alloys, and the pro and cons of each of the alloys in terms of their properties and their performance at the applications.
Who Should Attend:
Technology directors, technology managers, product managers, design engineers, process engineers, reliability engineers, material scientists, process technicians, and any one who is interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course.
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies" by Newnes, and co-author of "Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials" by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
Management Overview of the Smart Factory (Industry 4.0) Principles, Costs, Risks and Benefits Wednesday, June 15, 2016
12:00pm to 1:00pm Eastern
Presented by: Jay Gorajia, Mentor Graphics
Complimentary Webinar for Members!
In this webinar, we will investigate what Industry 4.0 or "Smart Factory" actually is, but really, and more importantly, what the issues are behind it that makes significant change to the PCB electronics industry inevitable. We will look at through the whole supply and demand chain, at what changes need to be made, starting with the consumer, the customer, to understand what their demands are, how they want to behave, and what benefits or changes Industry 4.0 will bring to them. Manufacturing analytics is core to Industry 4.0, and its related Cyber-Physical Systems connectivity to better manage delivery, quality and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Industry 4.0, and the related benefits.
- Enabling true Design Collaboration and automated manufacturing feedback
Who Should Attend:
This webinar is intended for Electronic Manufacturing management, production, quality, IT, engineering, and design interface/collaboration teams.
Jay Gorajia is Director of Consulting, PCB Design and Manufacturing Services, for the Consulting Division at Mentor Graphics. Jay works with contract manufacturers and OEMs to improve efficiency and help define cost, quality and productivity improvement solutions in design quality, design to manufacturing, manufacturing engineering and production manufacturing. For over 20 years Jay has worked with hundreds of manufacturers and design organizations around the world, resulting in real improvements through a systematic metrics-based methodology. Mr. Gorajia holds a Bachelor’s degree (B.Sc.) in Electronic Engineering and a Masters in Business Administration (MBA) in Technology Management. He has published a number of articles and White Papers in industry leading technical magazines and industry conferences.
Comparing PCB Surface Finishes and Their Assembly Process Compatibility Two (2) 90 minute Sessions
Tuesday, June 21 and Thursday, June 23, 2016
Presented by: Rob Rowland Axiom Electronics
PCB (printed circuit board) surface finishes provide several important functions, the most important being solderability protection. Unfortunately, the ideal PCB surface finish does not exist today. Every surface finish has some concerns that keep it from being the ideal finish. Surface finish selection has become more challenging as PCBA (printed circuit board assembly) complexity has increased (e.g. fine pitch components, BGAs, use of less active fluxes, etc.). A PCB surface finish must be compatible enough with the assembly processes and end use application (i.e. product reliability) to achieve acceptable results. The end user must select the best overall surface finish for compatibility with their assembly processes and end use application (e.g. consumer products or space applications). This is not an easy task because there are so many process and PCB variables. These include the flux chemistry and solder alloy, the soldering process, PCB thickness and power/ground layers. The impact of each variable must be clearly understood to achieve good soldering results and the desired level of solder joint reliability. The purpose of this presentation is to provide users with a practical overview of the common PCB surface finishes, their advantages and disadvantages, and some key process and reliability attributes to keep in mind when selecting a surface finish.
The PCB surface finishes addressed in this presentation are HASL (hot air solder leveling), OSP (organic surface protection), ENIG (electroless nickel immersion gold), ENEPIG (electroless nickel electroless palladium immersion gold), ImAg (immersion silver) and ImSn (immersion tin).
Rob Rowland is currently the Engineering Manager at Axiom Electronics. Rob has more than 30 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA). He has been the technical program director of SMTA International for more than 15 years. In 1999 he received the SMTA Founders Award and in 2010 he received the SMTA Member of Technical Distinction Award. In 2005 and 2008 he received Distinguished Committee Service Awards for his contributions to IPC-7095. Rob is a frequent author and speaker at industry trade events. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
Registrations are being taken through the SMTA Online Registration System.
Stencil Printing-Advanced Topics Two (2) 90 minute Sessions
Tuesday, August 23, 2016 and Thursday, August 25, 2016
Presented by: Chrys Shea Shea Engineering Services
Session 1, August 23, 2016
This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with handling incoming stencils, and the need to clean and verify them before putting them into production. A simple stencil verification method using SPI is described in detail, as is the inclusion of test coupons to aid in troubleshooting stencil quality issues.
The session continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from several real-world stencil trials. It discusses the impact of aperture size and thickness variation, aperture location, and wall cut quality.
Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers, and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the effects of cleaning and nanocoatings are shown.
Session 2, August 25, 2016
Automated Solder Paste Inspection (SPI) is almost as important as the print process itself. SPI helps maintain process control, dial-in difficult PCBs, track defect trends and feedback positional errors or the need to perform an underwipe to the printer.
The session starts with basic methods of SPI equipment and their measurement algorithms. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields.
The differences between accuracy and repeatability are discussed, as are the effects of setting of reference planes and measurement thresholds. Finally, special features of some machines are highlighted, and their impact on the overall printing process output are discussed.
Finally, new information from current research projects, if available, will be presented.
Session 1, August 23, 2016
1. Stencil Verification
1.1. SPI verification
1.2. Test coupons
1.3. SEM images
1.4. Cleaning before using
2. Stencil Troubleshooting
2.1. Physical damage
2.2. Foil thickness
2.3. Aperture size
2.4. Aperture location
2.5. Impact on AR & TE
2.6. Cut Quality
3.1. Purpose and methods
3.2. UV Test results
3.3. Solvent requirements
3.4. Solvent compatibility with solder pastes
3.5. Solvent and paper compatibility with nanocoatings
Session 2, August 25, 2016
4. Automated Solder Paste Inspection (SPI)
4.1. SPI basics
4.2. Production implementation
4.3. Setting inspection tolerances
4.4. Improving print yields
4.5. Accuracy and Repeatability
4.6. Reference planes and measurement thresholds
4.7. Special features to improve performance
Who will benefit from this course?
The Three Fundamentals to the Ultimate Reliability in Consumer Electronics Thursday, November 3, 2016
Two convenient times: 11:00am or 2:00pm Eastern
Presented by: Craig Hillman, Ph.D., DfR Solutions
Complimentary Webinar for Members!
The standard rule for reliability has been consumer electronics are cheap, disposable, and poor quality and military/space are robust, long-lasting, and very expensive. What if somebody broke these rules? Can you have a low-cost piece of electronics with very high reliability? How would you do it? What would it mean for every other industry willing to pay large sums to meet market expectations of performance? In this presentation, Dr. Craig Hillman, who has consulted with over 1000 electronic OEMs on reliability, will discuss how certain organizations consistently out-perform their peers in quality and reliability. Based on years of observing multiple organizations in a variety of markets, Dr. Hillman has identified the three key fundamentals that drive reliability excellence. Attend this exclusive webinar and learn how to implement these philosophies into your organization, regardless of whether you are the Vice President of Quality or a beginner reliability engineer.
Registrations are being taken through the SMTA Online Registration System.
Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys Two (2) 90 minute Sessions
Tuesday, November 8 and Tuesday, November 15, 2016
Presented by: Bob Willis, Bobwillisonline.com & NPL National Physical Laboratory
When we start to talk about high temperature electronics it's not the solder it's all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200oC, however, there are many applications that have to work at much higher levels, up to 300oC. Typically the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.
The webinar is a mixture or theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory . A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.
Topics may include:
Instructor Bob Willis
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.
Bob has conducted workshops and set up production lines, assembly features and his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers worldwide like Productronica, Germany, IPC APEX, SMTAI in the USA plus National Electronics Week and Nepcon Electronics in UK.
Bob was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and was elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he has also worked on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.
Bob organises the NPL Defects Database on behalf of NPL and organises the Electronics Interconnection Division’s monthly online technology webinars and on site workshops. He has authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers from around the world.
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
CONSIDERATIONS FOR RECEIVING THE BROADCAST