SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Feb 10 & 17, 2015 Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Mar 18 & 25, 2015 Webtorial: Process Optimization and Defect Elimination for PCB Assembly

Apr 21 & 28, 2015 Webtorial: Reballing BGAs for Rework 101

Looking for a past webinar? Check the knowledge base.

Webinar vs Webtorial: What's the Difference?


  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*


  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Patti Coles, Director of Education at the SMTA. 952-920-7682.

    SMTA Webtorial:
    Electromigration – The Hurdle For Miniaturization and High Power Devices
    Two (2) 90 minute Sessions
    Tuesday, February 10 & 17, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation

    Ning-Cheng Lee

    What You Can Learn From This Course:
    Electromigration is migration of metal materials driven by the high current density. With the continuous miniaturization and increasing versatility and speed of electronic devices, the current density of miniaturized solder joints is getting so high that the solder joint integrity deteriorates rapidly due to electromigration. This is particularly true for high power devices. This course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. Electromigration behavior within redistribution layer is also reviewed and discussed. Most importantly, recommendation will be provided about how to achieve long life under high current-stressed conditions for solder joints and redistribution layer through optimized designs.

    1)EM mechanisms

  • Effect of current density and temperature
  • EM path through solder, Al, and Cu
  • Effect of solder grain orientation
  • Effect of solder composition

    2) EM resistance of solder joints
  • Sn vs Pb
  • Pb-containing vs Pb-free
  • Relative resistance of solder, Cu, Ni, and IMC
  • Effect of solder volume
  • Relative performance of solder joints with variation in metallurgy and configuration
  • Recommended designs of solder joints for superior EM resistance

    3) EM resistance of RDL
  • Effect of via diam, pad opening, Cu thickness of UBM, size of taper trace, configuration of RDL vs via location and solder location

    Who Should Attend:
    Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

    Instructor Bio:
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

    Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference. He was honored as 2002 SMTA Member of Distinction, and received 2003 Lead Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He served on the board of governors for CPMT, serves on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Process Optimization and Defect Elimination for PCB Assembly
    Two (2) 90 minute Sessions
    Wednesday, March 18 & 25, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Tim Jensen, Indium Corporation

    Tim Jensen

    In this workshop, a detailed discussion of soldering materials, components, and PCBs will be given to help the attendee understand the important aspects of each to produce a complete electronics product that meets current and future legislative restrictions. Additionally, a detailed discussion of the assembly process will be covered with an examination of process optimization and defect elimination.

    What you will learn:
    1) The Different Solder Alloy Systems (Cost and Reliability)

  • How the Pb-Free Alloys Were Chosen
  • Trends Toward Alternative Alloys
  • The Importance of Dopants

    2) How Solder Paste Selection Influences Profitability, Reliability, and Efficiency
  • Composition: Flux, Powder and the Many Additives
  • Powder Types
  • The Formation of Intermetallics
  • Sn/Pb vs. Pb-Free

    3) Optimizing the Pb-Free Stencil Printing Process
  • Why 65% of Assembly Defects are From Printing
  • SMT Printing Fundamentals
  • Stencil Design
  • Achieving an Optimized Lead-Free SMT Printing Process

    4) The Pb-Free Reflow Process
  • Lead-Free Reflow Differences
  • Ramp to Peak versus Soak Profiles
  • Achieving an Optimized Lead-Free SMT Reflow Process

    5) Pb-Free SMT Defects: Causes and Solutions
  • Tombstoning
  • Graping
  • Head-In-Pillow
  • Voiding
  • Poor Wetting
  • Higher Temperature Issues

    6) Through-hole Soldering Optimization for Defect Minimization
  • Lead-Free Wave Soldering Process Fundamentals
  • Reliability vs. Hole Fill: J-STD-004B Dilemma
  • SAC vs SnCu Alloys
  • Poor Hole Fill
  • Achieving an Optimized Lead-Free Wave Soldering
  • SMT Alternatives to Wave Soldering

    Who should attend:
    This program provides a practical set of information that can be applied for those in electronics manufacturing positions such as process engineering.

    Your Instructor:
    Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.

    Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Reballing BGAs for Rework 101
    Two (2) 90 minute Sessions
    Thursday, April 21 & 28, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Bob Wettermann, BEST Inc.

    Bob Wettermann

    What You Can Learn From This Course:
    When repair or rework technicians are required to rework a area array balled device or a solder alloy of a balled device needs to be swapped out for another then a device needs to be reballed. This requires a skilled technician to re-attach the solder balls to the package. Also taught in this class is the technique of reballing a ceramic part which requires that SnPb solder attaches non-collapsing solder balls to the device.Finally a newer technique in which a small outline package leadless device can be be reballed in order to be re-attached to a PCB will be shown. “Tricks of the trade” for reballing will be explained via various videos and photos.

    This webtorial is design to walk you through the process of reballing both plastic and ceramic BGAs in low volume for cases where the BGA was removed and needs to be replaced as well as in cases where the alloy needs to be simply changed out.

    The course is designed for technicians and engineers working in design, manufacturing, quality, and field repairs.

    1) Background & Introduction

  • Need for the reballing of balled devices

    2) Reballing Process
  • Handling of Parts
  • Data Sheets
  • Tools
  • Process
  • Inspection
  • "Gotchas"
  • Marking
  • Bakeout & Drypack
  • Profiling

    3) Plastic Device Reballing
  • Ceramic Device Reballing
  • Reballing of Small Outline Leadless Packages

    4) Conclusions

    Instructor Bio:
    Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 16+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

    Registrations are being taken through the SMTA Online Registration System.

    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.

  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.