SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Apr 4, 2017 Webinar: Exploring Interferometry Sensors for Advanced Packaging Metrology Applications

Apr 10 & 12, 2017 Webtorial: Photonic Integrated Circuits

May 9 & 11, 2017 Webtorial: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

Jun 1, 2017 Webinar: Supply Chain Risk Insights Powered by Watson?

Jul 18 & 20, 2017 Webtorial: Stencil Printing-The Essentials

Aug 8 & 10, 2017 Webtorial: Stencil Printing-Advanced Topics

Nov 14 & 16, 2017 Webtorial: Reflow - Understanding the Complete Process & Defect Prevention

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, ryan@smta.org 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org 952-920-7682 or submit your abstract here.






    SMTA Webinar:
    Exploring Interferometry Sensors for Advanced Packaging Metrology Applications

    Tuesday, April 4, 2017
    11:00am-12:00pm Central
    Presented by: Julia Brueckner, Ph.D., Quantum Analytics

    Julia Brueckner Complimentary Webinar for Members!

    Overview:
    The end of node scaling is approaching. As a consequence, the need to start scaling the packages is growing constantly. Fan out wafer-level packaging (FO-WLP) offers an efficient solution due to its possibility for high IO count, thin package and short development times. The process flow to build a so called redistribution layer (RDL) requires a full lithography and plating cycle. To ensure a reliable product, all involved process steps need to be tightly monitored and controlled accurately. The challenge here: how to measure step height of pads or under bump metallization (UBM) features on structures that are not completely flat and show height variations. In this webinar, we’ll explore ways to tackle that problem and introduce the work flow of a stable algorithm to evaluate the above mentioned features automatically for different devices. We will discuss how White Light Interferometry (WLI) and Spectral Coherence Interferometry (SCI) can be used to achieve fast and accurate measurements of step heights, critical dimensions (CDs) of pads, UBM structures, as well as polymer thickness. We will share data taken from measurements - displaying full wafer maps, 3D profiles, and identifying the anomalies that are revealed.

    Topics Covered:

  • White light interferometry sensor and technology
  • Spectral coherence interferometry sensor and technology
  • Measurement principles
  • Application examples in packaging
  • Data evaluation
  • Who Should Attend:

  • R&D Managers
  • Laboratory Managers
  • Operators
  • About the Presenter:
    Julia, a native of Offenbach, Germany, received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she received her Ph.D. in Chemistry from the University of Heidelberg for her dissertation: Ultrafast Triplet Formation in N-Substituted Pentacene Derivatives. During her studies she was awarded several scholarships including a Fulbright scholarship to UC Berkley, and a Procter & Gamble award for the best thesis in the Master of Chemistry studies. Upon receiving her Ph.D., Julia joined Sentronics Metrology in Mannheim, Germany as an applications scientist. In March 2016, she was requested to directly work with Quantum Analytics, the US distributor to promote Sentronics Metrology equipment in the US semiconductor industry.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Photonic Integrated Circuits

    Two (2) 90 minute Sessions
    April 10 and 12, 2017
    1:00pm to 2:30pm Eastern
    Presented by: Stefan F Preble, Ph.D., Rochester Institute of Technology

    Overview:
    In this webtorial you will be introduced to photonic integrated circuits (PICs). PICs are an emerging technology where photonic circuits (waveguides, lasers, detectors, modulators) are manufactured using integrated circuit technology and closely integrated with microelectronics. The circuits are finding applications in high performance communication, computing and sensing systems. PIC technology is in its infancy, only emerging a decade ago, but is rapidly growing in complexity and demand. Consequently, as the advantages are realized and the manufacturing hurdles are overcome, photonic circuits will become ubiquitous in future microsystems. You will learn about the fundamental building blocks of PICs, the integration of PICs into the CMOS manufacturing design methodology, and the challenges that remain, particularly with packaging.

    Who Should Attend:
    General audience with a BS degree in EE, Electronic packaging, Telecommunications or equivalent field.

    Bio:

    Dr. Stefan Preble is an Associate Professor in the Kate Gleason College of Engineering at the Rochester Institute of Technology. He received his B.S. degree from RIT in Electrical Engineering (2002), and Ph. D. in Electrical & Computer Engineering from Cornell University (2007). His research is focused on Integrated Photonics with the goal of realizing high performance computing, communication and sensing systems that leverage the high speed, bandwidth and sensitivity of light. Professor Preble has received numerous awards recognizing his work, including a DARPA (Defense Advanced Research Projects Agency) Young Faculty Award and an AFOSR (Air Force Office of Scientific Research) Young Investigator Award.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

    Two (2) 90 minute Sessions
    May 9 and 11, 2017
    12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
    Bob Willis Presented by: Bob Willis, bobwillis.co.uk

    Overview:
    This session includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob's presentation comes alive with many unique process video clips on testing and failures which provide a clear understanding of the root cause of failure and corrective action. A FREE copy of Bob's e-book on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course.

    Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

    Topics will include:

  • Package types
  • Design and PCB guide lines for parts
  • Assembly process options
  • Inspection standards
  • Common process and reliability failures
  • Defect Investigation techniques and corrective action


  • Bio:
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production. Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webinar:
    Supply Chain Risk Insights Powered by Watson?

    Thursday, June 1
    1:00pm-2:00pm Eastern
    Presented by: Tom Ward, IBM and Rahul Nahar, IBM

    Complimentary Webinar for Members!

    Summary:
    How do supply chain leaders know when to take costly risk mitigating actions to recover from the impact of a natural event (ie. a hurricane or earthquake) and when can they simply take caution, but no action?

    Course Overview:
    Managing global supply chains can be a risky business. The race for leaner supply chains has placed supply chain sites and suppliers in some unstable regions of the world. Events ranging from major hurricanes to social unrest and epidemics, threaten to disrupt the delivery of products and services. Risk Insights is a threat visualization service which uses the power of Watson to help supply chain leaders mitigate risk. Risk Insights utilizes news, weather event and social media data using Watson technologies to delivers new insights to IBM Risk Analysts on Bluemix. Data is ingested from dozens of real time reports ranging from the TWC to Twitter feeds from the National Hurricane Center. The trajectory of each named storm is monitored and displayed on Risk Insights. The storm track is supplemented with hourly analyzed news about the climatic event as it occurs. Risk analysts get the latest view of typhoons and hurricanes and are alerted when these intersect with their supply base.

    Objectives:

  • Automated storm tracking, visualization, and risk assessments speed decision-making to minimize impact
  • Automated monitoring of impactful news events and social media feeds
  • Geospatial visualization of internal and external operations and supply chain locations
  • Extendable to other risk events, for example, strikes, conflicts, geo-political events, epidemics, and natural / man-made disasters
  • Risk mitigation workflow based on analytics
  • Share best practices for developing and deploying an supply chain cognitive service

    About the Presenters:
    Tom Ward Tom Ward is currently the IBM Enterprise Services Cloud and Cognitive strategist. He has led supply chain cloud projects over the past six years and for the past three years, Tom has led Watson applications for the Supply Chain. He has been a featured supply chain conference speaker and published author in Forbes, Supply Chain Management Review, AME, ASQ and APICS. Tom has a Master’s degree in EE from RPI.

    Rahul Nahar Rahul Nahar is the IBM Enterprise Services Analytics, Architecture & Strategy Senior Technical Staff Member. In his current role Rahul leads the development of Analytics and Cognitive Solutions for Enterprise Services. Rahul has been leading the effort to leverage Watson API’s and Solutions in Account Receivables Collections, Supply Chain Risk Management (Risk Insights), Quality and Client Satisfaction. Rahul has a broad experience in developing and implementing Analytic Solutions for across the Supply Chain. Rahul has a Master’s in ME from UVa.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Stencil Printing-The Essentials

    Two (2) 90 minute Sessions
    July 18 and 20, 2017
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea Chrys Shea Engineering

    Overview:

    Session 1, July 18, 2017
    This introductory course on SMT solder paste stencil printing gives the attendees a solid foundation in the basic elements of printing to help them reduce defects and improve yields on the production line. Topics include the flow behavior of solder pastes, the mechanics of the process and the key role of tooling in successful printing.

    After understanding the basic elements of the process and their influence on yields, attendees then review troubleshooting tactics, including the 5-miunte check that reveals the source of most problems. A more detailed review of the most probable causes of defects follows, discussing reasons for solder bridges, peaking, insufficient deposits, and gasketing and alignment issues.

    Session 2, July 20, 2017
    All about stencils! This session focuses on stencil design, stencil materials, stencil manufacturing processes and stencil nanocoatings. The session begins with optimizing stencil design and construction based on PCB layout and component type. It discusses approaches for BTCs, miniaturized, and through-hole components by using aperture designs, multi-level stencils and solder preforms.

    It then reviews materials and manufacturing processes, discussing the different options for stainless steel and nickel, and the state of the market on electroforming, laser cutting and elecropolishing.

    Nanocoatings are quickly gaining popularity. An overview of the types of nanocoatings available, the benefits and drawbacks of each, and user-generated data on the process improvement they offer are discussed in detail. Additionally, a spreadsheet to help calculate the cost of defects, printer consumables, and payback periods on nanocoatings is demonstrated and the download link is provided.

    Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.

    Course Outline
    Session 1, July 18, 2017
    1. Solder Paste Behavior
    1.1. Properties & characteristics
    1.2. Behaviors during the printing process
    1.3. Printability differences between no-clean and water wash, tin-lead and lead-free
    2. Mechanics of the Printing Process
    2.1. Alignment and gasketing
    2.2. PCB support
    2.3. Squeegee or direct print head motion
    2.4. Paste setup & release
    2.5. Area ratios and transfer efficiencies
    3. Troubleshooting Process Problems
    3.1. 5-minute system check
    3.2. Typical defects and likely root causes to investigate

    Session 2, July 20, 2017
    4. Stencil Technology
    4.1. Optimizing design and materials based on PCB layout
    4.2. Stencil Stepping
    4.3. BTC and QFN aperture design
    4.4. Preforms
    4.5. Pin-in-Paste
    5. Stencil Materials and Manufacturing Processes
    5.1. Nickel – Electroformed and plated over stainless steel
    5.2. Stainless Steel – stress relieved, fine grain and high-tension capable new materials
    5.3. Electroforming
    5.4. Laser Cutting
    5.5. High tension foils and frames
    5.6. Stencil Inspection & verification for production
    6. Nanocoatings
    6.1. Purpose
    6.2. Types
    6.3. Benefits
    6.4. Quantifying costs and ROI spreadsheet

    Who Should Attend:

  • SMT assembly process engineers, technicians and advanced-level operators who are responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers who assess and/or support SMT assembly contractors

    About the presenter:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
    Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA "Member of Technical Distinction" award.
    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Stencil Printing-Advanced Topics

    Two (2) 90 minute Sessions
    August 8 and 10, 2017
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea Chrys Shea Engineering

    Overview:
    Session 1, August 8, 2017
    This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with handling incoming stencils, and the need to clean and verify them before putting them into production. A simple stencil verification method using SPI is described in detail, as is the inclusion of test coupons to aid in troubleshooting stencil quality issues.

    The session continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from several real-world stencil trials. It discusses the impact of aperture size and thickness variation, aperture location, and wall cut quality.

    Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers, and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the effects of cleaning and nanocoatings are shown.

    Session 2, August 10, 2017
    Automated Solder Paste Inspection (SPI) is almost as important as the print process itself. SPI helps maintain process control, dial-in difficult PCBs, track defect trends and feedback positional errors or the need to perform an underwipe to the printer.

    The session starts with basic methods of SPI equipment and their measurement algorithms. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields.

    The differences between accuracy and repeatability are discussed, as are the effects of setting of reference planes and measurement thresholds. Finally, special features of some machines are highlighted, and their impact on the overall printing process output are discussed.

    Finally, new information from current research projects, if available, will be presented.

    Course Outline
    Session 1, August 8, 2017
    1. Stencil Verification
    1.1. SPI verification
    1.2. Test coupons
    1.3. SEM images
    1.4. Cleaning before using
    2. Stencil Troubleshooting
    2.1. Physical damage
    2.2. Foil thickness
    2.3. Aperture size
    2.4. Aperture location
    2.5. Impact on AR & TE
    2.6. Cut Quality
    3. Underwiping
    3.1. Purpose and methods
    3.2. UV Test results
    3.3. Solvent requirements
    3.4. Solvent compatibility with solder pastes
    3.5. Solvent and paper compatibility with nanocoatings

    Session 2, August 10, 2017
    4. Automated Solder Paste Inspection (SPI)
    4.1. SPI basics
    4.2. Production implementation
    4.3. Setting inspection tolerances
    4.4. Improving print yields
    4.5. Accuracy and Repeatability
    4.6. Reference planes and measurement thresholds
    4.7. Special features to improve performance

    Who Should Attend

  • SMT assembly process engineers and technicians responsible for production or new product introduction processes
  • Engineers and technicians just entering the SMT field who want to master the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers responsible for supporting and/or assessing SMT assembly contractors

    About the presenter:

    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
    Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Reflow - Understanding the Complete Process & Defect Prevention

    Two (2) 90 minute Sessions
    November 14 and 16, 2017
    12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
    Jennie Hwang Presented by: Bob Willis, bobwillis.co.uk

    Overview:
    The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures

    With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues see in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. Each delegate registered on the webinar will receive a free set of wall charts on reflow soldering and temperature profiling

    If you have a specific process problems with reflow send it to Bob to include in the webinar.


    Topics will include:

  • Design for reflow soldering
  • Selecting the best solder paste
  • Fundamentals of solder joint formation
  • Optimising your reflow process
  • Correct profiling procedures
  • Correct PCB finish for your process
  • Common soldering problems and why they occur
  • Reliability of solder joints
  • Practical testing of solder joints


  • Bio:
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division.

    As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.

    Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection

    Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck

    In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA

    Registrations are being taken through the SMTA Online Registration System.




    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
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    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
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