Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, firstname.lastname@example.org 952-920-7682.
Solder Paste Printing and Inspection Two (2) 90 minute Sessions
Tuesday, August 11 and 18, 2015
1:00pm to 2:30pm Eastern
Presented by: Chrys Shea, Shea Engineering Services
Overview: This two-part webtorial combines the basics of SMT solder paste stencil printing and process troubleshooting with an overview of automated Solder Paste Inspection (SPI) technologies in both laboratory and production environments.
Who will benefit from this course?
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.
Design for Cleaning and Reliability Two (2) 90 Minute Sessions
Tuesday, Sept 1 and Thursday Sept 3, 2015
1:00pm to 2:30pm Eastern
Presented by: Mike Bixenman, Kyzen Corporation
Reliability engineering challenges the complexity of systems, performance and environments. Reliable hardware is more challenging to reproduce due to component size, residues trapped under bottom terminations, shorter distance between conductors, higher pinout devices in a smaller footprint, increased electrical field and environmental factors. There is no one universal test method for quantifying reliability risks. The amount and nature of the data generated depends on the product being produced, the consequences of failure and the end-use environment.
Residues under component terminations can impact device functions over time. The problem is that the standoff heights within the Z-Axis of miniaturized components are approaching one mil. During reflow, flux residues can become entrapped under the bottom terminations. Mobile ions within the flux residues form leakage currents, especially when the device is operating within humid environments. Ionics in flux residue can exacerbate contamination levels under the part, which can lead to high resistance shorts across pads.
Companies who require devices to meet long term reliability must clean electronic hardware. This two part Webtorial will teach Design for Cleaning and Reliability.
Session #1: Design for Cleaning
Session #2: Design for Reliability
Dr. Mike Bixenman is the Chief Technology Officer and Co-Founder of Kyzen Corporation. Mike is an active research fellow who tackles industry problems by running collaborative research studies with industry experts. The co-authors of this research – Mark McMeen and Jason Tynes of STI Electronics designed the Sensor Test Board / Test Method and David Lober of Kyzen Corporation worked on the test method. Kyzen has joined the STI research team to conduct research on an improved test method to measure the resistance of residues from non-cleaned and cleaned test boards using low residue solder pastes under a series of bottom terminated components.
Solder Paste Print & Reflow Problems - Causes & Cures
Tuesday, September 15, 2015 @ 1:00 PM Eastern
Presenter: Bob Willis, SMTAI Feature Organiser
Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?
Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis. there are common process defects during printing and reflow and with this webinar we show you the causes and cures to help your yield improvement.
The webinar will be presented by Bob Willis SMTAI Feature Organiser.
Topics covered in the webinar:
A copy of each of the slides presented will be sent out after the webinar.
The webinar will run for between 60-90min with question and answer session and limited to 100 people.
Material Properties and How They Affect Electronic Devices Two (2) 90 Minute Sessions
Thursday October 8 & 15, 2015
1:00pm to 2:30pm Eastern
Presented by: Brian Toleno Ph.D., Henkel Electronic Materials LLC
Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.
We will then apply what had been discussed to look at one specific type of adhesives used in surface mount technology - Methods and Selection of underfill and encapsulant materials. We will discuss the differences between underfilling, potting, conformal coating, and encapsulation the advantages and disadvantages of each approach and the relation of performance to material properties for each.
Who Should Attend:
After this training course attendees will have a better understanding of how these material properties affect reliability performance, the relationship between process and properties and understand what properties can be compared between data sheets.
Reballing of Devices-The “How To” as well as “How Do I Know My Supplier Has Done Good Work” Two (2) 90 minute Sessions
Thursday, December 3 & 10, 2015
1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.
What You Can Learn From This Course:
When repair or rework technicians are required to rework a balled area array device or the solder alloy of a balled device needs to be swapped out for another, then a device needs to be reballed. This requires a skilled technician to re-attach the solder balls to the package. This webtorial will go through the common practice of plastic package reballing. Also taught in this class will be technique of reballing a ceramic part which requires that SnPb solder attaches non-collapsing solder balls to the device. Finally, a newer technique in which a small outline package leadless device can be be reballed in order to be re-attached to a PCB will be shown. “Tricks of the trade” for reballing will be explained via various videos and photos.
This webtorial is designed to walk you through the process of reballing both plastic and ceramic BGAs in low volume for cases where the BGA was removed and needs to be replaced as well as in cases where the alloy needs to be simply changed out.
Finally, the development of inspection criteria will be discussed for those having devices reballed as an outsourced service.
The course is designed for technicians and engineers working in design, manufacturing, quality, and field repairs as well as those in component engineering and purchasing having the solder reballing completed by an outside supplier.
1) Background & Introduction
2) Reballing Process
3) Plastic Device Reballing
4) Developing specifications for outsourced reballing suppliers
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 16+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
Failure Analysis: Analytical Techniques and What They Tell You About Your Failure Two (2) 90 Minute Sessions
Tuesday, December 15 and Wednesday, December 16, 2015
1:00pm to 2:30pm Eastern
Presented by: Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
When reviewed in conjunction with research or production, failures provide a unique perspective on design for manufacturability and reliability. This course will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. Analytical techniques for materials characterization will be discussed and how they can be used to determine root cause. Participants are encouraged to bring specific questions or examples of surface mount process difficulties to be shared in open discussion at the end of the course.
Who should attend?
Those involved in printed board design, assembly and bare board fabrication. Special emphasis will be placed on the integration of material selection, bare board fabrication and assembly as related to enhancing long-term reliability of printed boards subjected to lead-free assembly.
Martin has recently accepted a position as an Assistant Professor at Rochester Institute of Technology (RIT) within the MMET department. In addition to teaching classes Martin is the Associate Director of the CEMA lab where he will be conducting research into electronics manufacturing, materials and reliability. He began his career in electronics Failure Analysis at Universal Instruments. Martin has worked with some of the world’s largest OEMs and CMs not only determining root cause, but to also implementing process, design and materials changes in order to improve end product quality, reliability, and manufacturability. While at Universal, Martin also managed the Advanced Research in Electronics Assembly (AREA) Consortium where he lead a team of researchers who conduct fundamental studies in electronics. AREA was funded by Tier 1 OEMs, CMs and Suppliers.
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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