CALL FOR PARTICIPATION
Leaders Learning from Leaders
Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.
All submissions must be non-commercial in nature and focus on technology research rather than a company product. | Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings. |
Call for Papers: International Conference on Soldering and Reliability  May 18-20, 2010
Toronto, Ontario, Canada
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.
ABSTRACTS ARE DUE JANUARY 29, 2010
Suggested topics to be covered include:
| SnPb with lead-free components Reliability Harsh Environment Tin Whiskers New Alloys Electromigration Thermal dissipation
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Manufacturing Process Package on Package Advanced Packaging Halogen-Free Laminates High Density Interconnects Thermal Interface Materials Underfill |
If you would like to present at this conference, please submit a 200-300 word abstract to Melissa Serres at melissa@smta.org. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February, 2010.
Technical papers are required and will be due on April 9, 2010.
The conference is sponsored by the SMTA Toronto Chapter.
Questions? Please contact:
Melissa Serres, Conference Coordinator
Phone: 952-920-7682
Email: melissa@smta.org
CALL FOR ABSTRACTS AIMS Harsh Environment Electronics Symposium
(covering Automotive, Industrial, Military & Space)
October 25-26, 2010
The Swan & Dolphin Resort & Convention Center
Orlando, FL
The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space. We are soliciting abstracts that will provide NEW and TIMELY INFORMATION to attendees on the LATEST DEVELOPMENTS in these areas. The symposium format will allow a significant amount of time for interaction and questions.
Specific subject areas include, but are not limited to, the following:
Semiconductor Technology Substrate Advancements Connectors and Interconnect Technology Lead-Free Implementation Tin Whiskers Corrosion Advancements in Materials Next Generation Harsh Environment Automotive Systems Solar Electronics Latest Developments in Thermal Cycle Testing for Extreme Environment Electronics Substrate Surface Finishes for Harsh Environment Applications Chemical, Thermal and Vibration Considerations for Industrial Electronics Reliability (HALT, ESS, HASS) Operating Environments for Military Electronics (land, sea, air and space)
Four of the six symposium sessions will require PRESENTATIONS ONLY. Speakers in these sessions will need to submit a powerpoint presentation for inclusion in the program proceedings. The remaining two sessions will require technical papers which will be included in the proceedings.
DEADLINE FOR ABSTRACTS: April 9, 2010
Please provide a 200-300 word abstract to the conference coordinator Melissa Serres. Abstracts can be submitted via email as a Word document attachment or uploaded to the Web site from the "Upload Abstract" button above.
Please include the following contact information with abstract: Name, Company, Mailing Address, Telephone Number, Fax Number, E-Mail Address, and Presentation Title.
Questions? Please contact:
Melissa Serres, Conference Coordinator
Phone: 952-920-7682
Email: melissa@smta.org
CALL FOR PAPERS
International Wafer-Level Packaging Conference
October 13-14, 2010
Santa Clara Marriott Hotel
Santa Clara, CA
The SMTA, in conjunction with Chip Scale Review magazine, is pleased to announce plans for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC).
This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Visit iwlpc.com to view the complete Call for Papers and submit an abstract.
ABSTRACT SUBMISSION DEADLINE IS APRIL 23, 2010.
If you have any questions please contact SMTA director of education Melissa Serres.
SMTA South East Asia Technical Conference on Electronics Assembly Technologies
Call for Presentations
November 18-19, 2010
Eastin Hotel
Penang, Malaysia
Abstracts due: May 28, 2010
You are invited to submit an abstract to the SMTA's newest technical event in Penang, Malaysia. Presentations are sought in the following key technology tracks:
Assembly
Adhesives, Alternate Alloys, BGA/CSP Assembly Cleaning Connector Technology Copper Erosion DFX/Design for Six Sigma Dispensing Equipment Selection Facility Layout Flux and Solder Halogen and Halogen-Free Head-in-Pillow Defect Land Pattern Design Lead-Free Soldering (including case studies) Lead-Free Reliability Lean Manufacturing Low Volume / Prototype Assembly Medical Electronics Placement Printing Reflow Soldering Rework and Repair of QFNs RFID Assembly Selective Soldering Set Up Reduction Solder Paste Solder Voids Supplier Engineering Underfill Vapor Phase Reflow for High Reliability Assemblies Wave Soldering Yield Improvement
Components
BGA Battery Interactions BTCs (Bottom Termination Components) CSP (including Wafer-Level Packages) Component Solderability Component Reliability Connectors Embedded Passives Failure Analysis Fine Pitch Technology Flip Chip / Direct Chip Attach Lead/Termination Finish Leadless Packaging Multichip Packages (including 3-D Packaging Package on Package) Tin Whiskers
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Emerging Technologies
0201/01005 Components and Assembly Consumer Applications Electronic Printing Technology Embedded Technology / Actives and Assembly Flexible Electronics MEMS/RF MEMS/MOEMS Nanoelectronics Reliability of Nanodevices New Materials and Processes Optoelectronics Power or Thermal Management Sensors and Manufacturing Solar Technology System in a Package Thermal Interface Materials Wireless Applications including Bluetooth and Wi-Fi
Harsh Environment Applications
Components and Component Reliability Lead-free Issues for Harsh Environments Substrates Thermal Management
PCB Technology
Black Pad and Surface Finish Defects Embedded Passive and Active Components Halogen Free HDI Microvias (including filled and unfilled) Moisture Sensitivity Soldermask Substrate Reliability & Solderability Surface Finish
Process Control
Acoustic Imaging AOI CIM In-Circuit Test Process Modeling Software Test Strategies X-Ray
Business
Capacity Modeling Contract Manufacturing Doing Business in Asia Environmental Issues Lean Manufacturing / Quality Initiatives Operations Management Remaining Competitive RoHS Compliance Supplier Management Technology Roadmap
| The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission. Abstracts can be uploaded by clicking on the "upload abstracts" tab above.
Contact the Conference Coordinator, Bernie Selva, bernie@smta.org, or Melissa Serres, melissa@smta.org, with questions or comments.
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One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. Read the brief descriptions below of the respective links on the left nav bar.