CALL FOR PARTICIPATION
Leaders Learning from Leaders
Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.
All submissions must be non-commercial in nature and focus on technology research rather than a company product. | Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings. |
 CALL FOR ABSTRACTS AIMS Harsh Environment Electronics Symposium
(covering Automotive, Industrial, Military & Space)
October 25-26, 2010
The Swan & Dolphin Resort & Convention Center
Orlando, FL
The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space. We are soliciting abstracts that will provide NEW and TIMELY INFORMATION to attendees on the LATEST DEVELOPMENTS in these areas. The symposium format will allow a significant amount of time for interaction and questions.
Specific subject areas include, but are not limited to, the following:
Semiconductor Technology Substrate Advancements Connectors and Interconnect Technology Lead-Free Implementation Tin Whiskers Corrosion Advancements in Materials Next Generation Harsh Environment Automotive Systems Solar Electronics Latest Developments in Thermal Cycle Testing for Extreme Environment Electronics Substrate Surface Finishes for Harsh Environment Applications Chemical, Thermal and Vibration Considerations for Industrial Electronics Reliability (HALT, ESS, HASS) Operating Environments for Military Electronics (land, sea, air and space)
Four of the six symposium sessions will require PRESENTATIONS ONLY. Speakers in these sessions will need to submit a powerpoint presentation for inclusion in the program proceedings. The remaining two sessions will require technical papers which will be included in the proceedings.
DEADLINE FOR ABSTRACTS: April 9, 2010
Please provide a 200-300 word abstract to the conference coordinator Melissa Serres. Abstracts can be submitted via email as a Word document attachment or uploaded to the Web site from the "Upload Abstract" button above.
Please include the following contact information with abstract: Name, Company, Mailing Address, Telephone Number, Fax Number, E-Mail Address, and Presentation Title.
Questions? Please contact:
Melissa Serres, Conference Coordinator
Phone: 952-920-7682
Email: melissa@smta.org
CALL FOR ABSTRACTS
Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts West
Technical Symposium: June 8-9, 2010
Workshops: June 10-11, 2010
Honeywell Deer Valley, Deer Valley (Phoenix), AZ
Abstracts due: April 9, 2010
SMTA and CALCE @ University of Maryland are pleased to announce a west coast venue for the Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts. The first three symposia (held in College Park, MD) were an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. We are pleased to offer a west coast venue in 2010.
A counterfeit electronic part is one whose identity (e.g., manufacturer, part number, date code, lot code) has been deliberately misrepresented. Counterfeit electronics have been reported in a wide range of products, including computers, telecommunications equipment, automobiles, avionics and military systems. Counterfeit electronics include everything from very inexpensive capacitors and resistors to costly microprocessors, completed assemblies and even systems.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry. Topics will include:
Electronic parts supply chain Sources of counterfeit parts Proven methodologies for reducing chances of being victims of counterfeit parts Supply chain management tools to mitigate counterfeit part risks Inspections tools and techniques for detecting counterfeit parts Authentication techniques for securing electronic part supply chain Trade and business issues adopted by industry Law enforcement and international cooperation
The conference is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to senior management, supply chain managers, component engineers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies addressing the issue. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
Please provide an abstract (within 300 words) on any relevant topics to Dr. Diganta Das via email to diganta@umd.edu no later than April 9th. The final presentations are due May 14th.
For more information about conference participation or registration, contact Melissa Serres.
Symposium Technical Committee:
Diganta Das, Ph.D., CALCE/University of Maryland, Conference Chair
Dan Dimase, Honeywell Technology Solutions, Conference Co-Chair
Bill Barthel, Plexus Corporation
Lisa Gardner, U.S. Government Accountability Office (GAO)
Robin Gray, National Electronic Distributors Association (NEDA)
Mark Crawford, Department of Commerce
Phil Montag, Honeywell Technology Solutions
Sydney Pope, Office of the Secretary of Defense
Phil Zulueta, Jet Propulsion Laboratories
CALL FOR PAPERS
International Wafer-Level Packaging Conference
October 13-14, 2010
Santa Clara Marriott Hotel
Santa Clara, CA
The SMTA, in conjunction with Chip Scale Review magazine, is pleased to announce plans for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC).
This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Visit iwlpc.com to view the complete Call for Papers and submit an abstract.
ABSTRACT SUBMISSION DEADLINE IS APRIL 23, 2010.
If you have any questions please contact SMTA director of education Melissa Serres.
SMTA South East Asia Technical Conference on Electronics Assembly Technologies
Call for Presentations
November 18-19, 2010
Eastin Hotel
Penang, Malaysia
Abstracts due: May 28, 2010
You are invited to submit an abstract to the SMTA's newest technical event in Penang, Malaysia. Presentations are sought in the following key technology tracks:
Assembly
Adhesives, Alternate Alloys, BGA/CSP Assembly Cleaning Connector Technology Copper Erosion DFX/Design for Six Sigma Dispensing Equipment Selection Facility Layout Flux and Solder Halogen and Halogen-Free Head-in-Pillow Defect Land Pattern Design Lead-Free Soldering (including case studies) Lead-Free Reliability Lean Manufacturing Low Volume / Prototype Assembly Medical Electronics Placement Printing Reflow Soldering Rework and Repair of QFNs RFID Assembly Selective Soldering Set Up Reduction Solder Paste Solder Voids Supplier Engineering Underfill Vapor Phase Reflow for High Reliability Assemblies Wave Soldering Yield Improvement
Components
BGA Battery Interactions BTCs (Bottom Termination Components) CSP (including Wafer-Level Packages) Component Solderability Component Reliability Connectors Embedded Passives Failure Analysis Fine Pitch Technology Flip Chip / Direct Chip Attach Lead/Termination Finish Leadless Packaging Multichip Packages (including 3-D Packaging Package on Package) Tin Whiskers
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Emerging Technologies
0201/01005 Components and Assembly Consumer Applications Electronic Printing Technology Embedded Technology / Actives and Assembly Flexible Electronics MEMS/RF MEMS/MOEMS Nanoelectronics Reliability of Nanodevices New Materials and Processes Optoelectronics Power or Thermal Management Sensors and Manufacturing Solar Technology System in a Package Thermal Interface Materials Wireless Applications including Bluetooth and Wi-Fi
Harsh Environment Applications
Components and Component Reliability Lead-free Issues for Harsh Environments Substrates Thermal Management
PCB Technology
Black Pad and Surface Finish Defects Embedded Passive and Active Components Halogen Free HDI Microvias (including filled and unfilled) Moisture Sensitivity Soldermask Substrate Reliability & Solderability Surface Finish
Process Control
Acoustic Imaging AOI CIM In-Circuit Test Process Modeling Software Test Strategies X-Ray
Business
Capacity Modeling Contract Manufacturing Doing Business in Asia Environmental Issues Lean Manufacturing / Quality Initiatives Operations Management Remaining Competitive RoHS Compliance Supplier Management Technology Roadmap
| The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission. Abstracts can be uploaded by clicking on the "upload abstracts" tab above.
Contact the Conference Coordinator, Bernie Selva, bernie@smta.org, or Melissa Serres, melissa@smta.org, with questions or comments.
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One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. Read the brief descriptions below of the respective links on the left nav bar.