Instructor: Dale Lee, Plexus September 29, 2010 8:30 a.m. - 4:00 p.m. Nova Scotia Community College, Waterfront Campus 80 Mawiomi Place Dartmouth, Nova Scotia B2Y 0A5 | Price: Members $100 (US) Non-Members $175 (US) a one-year individual SMTA membership is included in the non-member price. |
Introduction: Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.
As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.
As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.
This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.
What you will learn: Introduction Elements of Design Process Establishing a DFX Program DFA Program Structure, How To Measure Success DFX Types/Listing - Concurrent vs Serial Definition of Program Parameters - Volumes, Location, Etc. DFM Global Impacts - Electronics, Plastics, Metals, Coatings Assembly Process Definition - PCA, HLA Global Product Design Elements Manufacturing Environment, Design Documentation, Cultural Component Selection Package Types, Assembly Process PCB Design Impacts PCB Fabrication Panel Utilization PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design Through Hole Solder Design Impacts Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion, Solder Mask, Tooling Design, Copper Dissolution SMT Solder Design Impacts Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design Process Control Impacts Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage Cleaning Impacts Compatibility Issues, Low Stand-off Components
Who should attend: This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.
About the Instructor: Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.
Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.
Contact Karen Frericks at 952-920-7682 with questions.
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Registrations are being taken through the SMTA Online Registration System.
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