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Chapter Tutorial Program (CTP)

CTP

Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.

Want to instruct an SMTA tutorial? View the tutorial guidelines.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Upcoming Chapter Tutorial Programs

June 8, 2016
Oregon Chapter Tutorial Program: 4 Ps of SMT in a Lead Free World



Oregon Chapter Tutorial Program:
4 Ps of SMT in a Lead Free World

Problems and Promises, Principles and Practice
Instructor: Ray Prasad, Ray Prasad Consultancy Group

June 8, 2016
8:30 a.m. - 4:00 p.m.
Axiom Electronics
19545 NW Von Neumann Drive, #200
Beaverton, OR 97006-6939

Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Oregon Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)


  • New this year! Get a $20 EARLY BIRD discount on regular Member and Non-Member registrations if registration is completed by midnight on May 6, 2016.

    Members (with Early Bird): $180
    Non-Members (with Early Bird): $255

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    About This Course:
    The objective of this course is to identify the technical issues in Through hole, SMT, tin-lead, Lead Free BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. After a brief overview of SMT components and advanced packaging, the course provides details of all the SMT manufacturing processes including paste application, lead free soldering, Selective Soldering, and repair. The course concludes by providing examples of common defects and their root causes.

    How You Will Benefit: After completing this course you will be able to

  • Get a good understanding of SMT, its benefits and limitations
  • Select appropriate SMT components, materials, processes, and equipment
  • Get an overview of BGA, CSP, PoP
  • Troubleshoot SMT and Lead free problems in manufacturing
  • Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment


    Topics Covered:

  • Brief Overview of SMT and Lead Free including SMT components, Advanced Packaging including, BGA, BTC, Flip Chip and PoP
  • Solder paste and its application and Soldering (Wave and Reflow) for tin-lead and Lead Free
  • Flux and Cleaning and No Clean
  • Examples of Defects and their root causes
  • Repair


    Who should attend:
    Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of SMT, Lead Free, Fine pitch, and BGA manufacturing issues for building assemblies in-house or at a subcontractor will benefit from this course.



    About the Instructor:

    Ray Prasad Ray Prasad
    Mr. Prasad is an inductee to the IPC Hall of Fame and has more than 30 years of experience in all aspects of Surface Mount Technology (SMT). He has been responsible for developing and implementing SMT for numerous system products. While serving as a lead engineer, he introduced SMT into the airplanes at Boeing and managed the global implementation of SMT at Intel Corporation when SMT was at its infancy in early 80’s.

    Mr. Prasad’s expertise includes all areas of SMT including SMT, Fine pitch, ball grid array, chip scale packaging technology, and design for manufacturing. He has chaired various IPC committees related to these subjects (IPC 7095 on BGA and IPC 7093 on BTC, IPC 7351 on land pattern design and IPC 786 on Moisture Sensitive Packages). In addition to authoring a textbook on surface mount technology used at leading Universities, Mr. Prasad has published more than 100 papers and currently serves on the advisory board of a SMT magazine.

    Education

  • M.B.A from University of California at Berkeley.
  • M.S., Materials Science and Engineering from University of California at Berkeley
  • B.S., Metallurgical Engineering from Regional Institute of Technology, Jamshedpur in India

    Consulting and Work History
    In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.

    Awards/Associations
    Mr. Prasad is an inductee to the IPC Hall of Fame – the highest honor in our industry and he is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel Achievement Award.

    Publications/Patents
    Author of the textbook Surface Mount Technology: Principles and Practice and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.

    A longtime member of IPC, he is currently the Chairman IPC 7530 “Reflow Profile Development” and IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF.

    Ray is the past Chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (IPC 786, now J-STD-020/33) committees.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.