Chapter Tutorial Program (CTP)

CTP

Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.

Want to instruct an SMTA tutorial? View the tutorial guidelines.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Upcoming Chapter Tutorial Programs

April 18, 2017
Puget Sound Defect Resolution Chapter Tutorial Program

April 19, 2017
Oregon Defect Resolution Chapter Tutorial Program







Puget Sound Defect Resolution Chapter Tutorial Program

Instructor: Jim Hall, ITM Consulting

April 18, 2017
8:30 a.m. - 4:00 p.m.
Astronics AES
12950 Willows Road NE
Kirkland, WA 98034


Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)
  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

    Course Outline:
    Part 1

  • Introduction
    - Prevention: Process Development and Validation
    - Variation (Common Cause)
    - Continuous Improvement
  • Defect Definition
    - Failure – PCBA does not function
    - Repair or Scrap
    - Escapes – Identified by customer
    - Reduced Reliability
    - Process Indicator
    - Special Cause vs. Common Cause
  • Defect Identification
    - Inspection
        * Manual
        * AOI
        * X-Ray
    - Test
        * ICT
        * Functional
        * Contamination
    - False Calls / Escapes

  • Causes of Defects
    - Special Cause vs. Common Cause
    - Variability (repeatability)
    - Accuracy
    - Process not Optimized
  • Root Cause Analysis
    - “5 Whys”
    - Cause and Effect Diagram
        * 6 M’s
        * Levels: Specific Processes vs Interactions

  • Process Relationships
    - Incoming Materials
    - Handling
    - Process Problems
        * Wrong Process
        * Degraded Process
        * Poor Process (common cause defects)

    Part 2

  • Specific Processes
    - General: wrong process, material, etc.
    - Printing
    - Placement
    - Soldering
    - Singulation
    - Coating
    - Mechanical Assembly
    - Testing

  • Specific Defect Examples and Causes
    - Wrong Part
    - Damaged Parts
    - Shorts
    - Opens
    - Poor Wetting
    - Insufficient
    - Contamination
    - New Specific Defects
        * HiP
        * Graping
    - Pad Cratering
    - CAF

  • Conclusion
  • Questions

    Jim Hall About the Instructor:

    Jim Hall
    Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:

  • SMT implementation and assembly facility set-up
  • SMT manufacturing process audits and process improvement
  • Manufacturing yield improvement
  • Productivity analysis and optimization
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Equipment evaluation and selection
  • SMT process equipment benchmark testing and evaluation
  • SMT product development

    Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.

    As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:

  • LEAN
  • FMEA
  • DFM
  • DMAIC
  • Cost Estimating
  • Failure Analysis

    Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.








    Oregon Defect Resolution Chapter Tutorial Program

    Instructor: Jim Hall, ITM Consulting

    April 19, 2017
    8:30 a.m. - 4:00 p.m.
    Axiom Electronic
    19545 NW Von Neumann Drive
    Beaverton, OR 97006


    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)
  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

    Course Outline:
    Part 1

  • Introduction
    - Prevention: Process Development and Validation
    - Variation (Common Cause)
    - Continuous Improvement
  • Defect Definition
    - Failure – PCBA does not function
    - Repair or Scrap
    - Escapes – Identified by customer
    - Reduced Reliability
    - Process Indicator
    - Special Cause vs. Common Cause
  • Defect Identification
    - Inspection
        * Manual
        * AOI
        * X-Ray
    - Test
        * ICT
        * Functional
        * Contamination
    - False Calls / Escapes

  • Causes of Defects
    - Special Cause vs. Common Cause
    - Variability (repeatability)
    - Accuracy
    - Process not Optimized
  • Root Cause Analysis
    - “5 Whys”
    - Cause and Effect Diagram
        * 6 M’s
        * Levels: Specific Processes vs Interactions

  • Process Relationships
    - Incoming Materials
    - Handling
    - Process Problems
        * Wrong Process
        * Degraded Process
        * Poor Process (common cause defects)

    Part 2

  • Specific Processes
    - General: wrong process, material, etc.
    - Printing
    - Placement
    - Soldering
    - Singulation
    - Coating
    - Mechanical Assembly
    - Testing

  • Specific Defect Examples and Causes
    - Wrong Part
    - Damaged Parts
    - Shorts
    - Opens
    - Poor Wetting
    - Insufficient
    - Contamination
    - New Specific Defects
        * HiP
        * Graping
    - Pad Cratering
    - CAF

  • Conclusion
  • Questions

    Jim Hall About the Instructor:

    Jim Hall
    Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:

  • SMT implementation and assembly facility set-up
  • SMT manufacturing process audits and process improvement
  • Manufacturing yield improvement
  • Productivity analysis and optimization
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Equipment evaluation and selection
  • SMT process equipment benchmark testing and evaluation
  • SMT product development

    Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.

    As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:

  • LEAN
  • FMEA
  • DFM
  • DMAIC
  • Cost Estimating
  • Failure Analysis

    Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.



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    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
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