Chapter Tutorial Program (CTP)

CTP

Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.

Want to instruct an SMTA tutorial? View the tutorial guidelines.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Upcoming Chapter Tutorial Programs

March 10, 2015
Space Coast Advanced SMT Chapter Tutorial Program

March 17, 2015
Puget Sound Advanced SMT Chapter Tutorial Program

March 19, 2015
Oregon Advanced SMT Chapter Tutorial Program



Space Coast Advanced SMT Chapter Tutorial Program

Enabling Implementation of Advanced Technologies
Instructor: Denis Barbini, Universal Instruments

March 10, 2015
9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993


Registration Deadline is March 5th!
Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.






    Puget Sound Advanced SMT Chapter Tutorial Program

    Enabling Implementation of Advanced Technologies
    Instructor: Denis Barbini, Universal Instruments

    March 17, 2015
    8:30 a.m. - 4:00 p.m.
    Microsoft
    15563 NE 31st Street
    Redmond, WA 98052

    Registration Deadline is March 12th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Puget Sound Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.






    Oregon Advanced SMT Chapter Tutorial Program

    Enabling Implementation of Advanced Technologies
    Instructor: Denis Barbini, Universal Instruments

    March 19, 2015
    8:30 a.m. - 4:00 p.m.
    Axiom Electronics
    19545 NW Von Neumann Drive
    Beaverton, OR 97006-6939

    Registration Deadline is March 13th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Oregon Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.

  • Registrations are being taken through the SMTA Online Registration System.