Surface Mount Technology Association
Member Log On
 Member ID 
 Password     
Forgot Password/ID?
 
Get SMTA news! subscribe!

 
      
 

STI Electronics

Seika Machinery, Inc.
 


CTP Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.


Cancellation Policy: Registration fees will be refunded (less a $50 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Atlantic Canada DFX Chapter Tutorial Program
DFX Project Setup, Measurement Definition, and Elements: From Introduction to Advanced DFX Analysis

Instructor: Dale Lee, Plexus
September 29, 2010
8:30 a.m. - 4:00 p.m.
Nova Scotia Community College, Waterfront Campus
80 Mawiomi Place
Dartmouth, Nova Scotia B2Y 0A5
Price:
Members $100 (US)
Non-Members $175 (US) a one-year individual SMTA membership is included in the non-member price.

Introduction:
Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.

As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.

As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.

This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.

What you will learn:

  • Introduction
    Elements of Design Process
  • Establishing a DFX Program
    DFA Program Structure, How To Measure Success
    DFX Types/Listing - Concurrent vs Serial
    Definition of Program Parameters - Volumes, Location, Etc.
    DFM Global Impacts - Electronics, Plastics, Metals, Coatings
    Assembly Process Definition - PCA, HLA
  • Global Product Design Elements
    Manufacturing Environment, Design Documentation, Cultural
  • Component Selection
    Package Types, Assembly Process
  • PCB Design Impacts
    PCB Fabrication Panel Utilization
    PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
    Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design
  • Through Hole Solder Design Impacts
    Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
    Solder Mask, Tooling Design, Copper Dissolution
  • SMT Solder Design Impacts
    Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design
  • Process Control Impacts
    Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage
  • Cleaning Impacts
    Compatibility Issues, Low Stand-off Components


  • Who should attend:
    This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.

    About the Instructor:
    Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.

    Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.

    Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.

    Contact Karen Frericks at 952-920-7682 with questions.

    Registrations are being taken through the SMTA Online Registration System.


     


    Home | Site Map | Update Your Info | Related Links | Feedback | Contact Us | Privacy Policy | Top

    Copyright © 1999-2010 SMTA, All rights reserved.
    Reproduction in whole or in part without permission is prohibited.
    SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819