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Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.
Want to instruct an SMTA tutorial? View the tutorial guidelines.
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date.
Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.
Upcoming Chapter Tutorial Programs
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May 21, 2013
Upper Midwest "Four P's of SMT" Chapter Tutorial Program
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September 13, 2013
West Penn "Intro to DfM" Chapter Tutorial Program
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Instructor: Ray Prasad, Ray Prasad Consultancy Group
May 21, 2013
9:00 a.m. - 4:00 p.m.
Hennepin Technical College
Eden Prairie Campus
13100 College View Drive
Eden Prairie, MN 55347 | Price:
Members: $200
Non-Members: $275 (a one-year INDIVIDUAL SMTA membership is included in the non-member price)
Upper Midwest Chapter Officers: $100
Student Members: $50
Student Non-Members: $55 (a one-year STUDENT membership is included in the non-member price)
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Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
Introduction:
There is no doubt that lead free has impacted on almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronics products and equipment including the military and medical industry.
The lead free train has been moving fast. Even if you work in a currently exempt industry, you need to get onboard or risk losing market share to competitors -- particularly when the leaded products and components you are using become only available in lead free.
Learn how to resolve issues for an effective implementation of SMT in a lead free world at a lower cost and higher yield.
The objective of this course is to identify the technical issues in through hole, SMT, BGA, fine pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free. After very briefly providing an overview of SMT, the course provides details of all the SMT manufacturing processes including lead free soldering, Selective Soldering, and repair.
This is not a theoretical course. It is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients, and deals with "real-world" problems in SMT and lead free implementation.
How You Will Benefit:
After completing this course you will be able to: Get a good understanding of SMT, its benefits and limitations Select appropriate SMT components, materials, processes, and equipment Get an overview of BGA, CSP and emerging technologies Troubleshoot SMT and Lead free problems in manufacturing Determine best way to deal with mixed BGAs and other components (lead free and tin-lead) on the same board. Implementation including its benefits and pitfalls. Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment. Understand how to implement lead-free technology in your products and manufacturing processes either in-house or at a subcontractor including transitional issues
Topics Covered:
Brief Overview of SMT and Lead Free Key Reflow Defects, their desired ratios to prevent field failures. Solder paste and its application Soldering (Wave and Reflow) Lead-free Implementation: Problems and Promises Selective Soldering Flux and Cleaning and No Clean Repair
Who Should Attend:
Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of SMT, Lead Free, fine pitch, and BGA manufacturing issues for building assemblies in-house or at a subcontractor will benefit from this course.
About the Instructor:
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA”. He is also the Co-Chairman of IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees.
Mr. Prasad was inducted to the IPC Hall of Fame. He is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
Contact Karen Frericks at 952-920-7682 with questions.
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Registrations are being taken through the SMTA Online Registration System.
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Instructor: Cheryl Tulkoff, CRE, DfR Solutions, Senior Member of the Technical Staff
September 13, 2013
9:00 a.m. - 4:00 p.m.
Matric
2099 Hill City Road
Seneca, PA 16346 | Price:
Members: $200
Non-Members: $275 (a one-year INDIVIDUAL SMTA membership is included in the non-member price)
West Penn Chapter Officers: $100
Student Members: $50
Student Non-Members: $55 (a one-year STUDENT membership is included in the non-member price)
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Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
Introduction:
In the electronics industry. the quality and reliability of any product is highly dependent upon the capability of the manufacturing supplier, regardless of whether it is a contractor or a captured shop. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations, which can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Design plays a critical role in the success or failure of manufacturing and assembly.
Designing printed boards today is more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.
This course provides a comprehensive insight into the areas where design plays an important role in the manufacturing process. This workshop addresses the increasingly sophisticated PCB fabrication technologies and processes.
Course Outline:
MODULE 1: INTRODUCTIONS
Intro to Design for Manufacturing Key Global DfM Guidelines
MODULE 2: INDUSTRY STANDARD DESIGN RULES (Reference)
Overview of Industry Standard Organizations
MODULE 3: OVERVIEW OF DFM TASKS
Types of Review Processes Root Cause Problem Solving Failure Analysis (Reference)
MODULE 4: DfM - COMPONENT Component Robustness Temperature Sensitivity Level Moisture Sensitivity Level Pb-free Issues
MODULE 5: DfM – PRINTED CIRCUIT BOARD Surface Finishes Cracking & Delamination Plated Through Vias / Holes Laminate Selection Conductive Anodic Filament Supplier Selection Strain/Flexure Issues & Pad Cratering Cleanliness Electrochemical Migration
MODULE 6: DfM - SOLDER General Soldering Lead Free Solder Alloy Update Hand Soldering Copper Dissolution Mixed Assembly
About the Instructor:
Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.
Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She has held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years. She is also an ASQ Certified Reliability Engineer and a member of SMTA and iMAPS.
Contact Karen Frericks at 952-920-7682 with questions.
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Registrations are being taken through the SMTA Online Registration System.
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