WorkshopsThursday, June 25
Three workshops will be held on Thursday, led by industry professionals with extensive experience in their respective subject areas. Workshop instructors deliver focused, in-depth presentations on topics of timely importance, based on their research and industry experience.
Please note: the workshops will be located in Glen L. Martin Hall on the University of Maryland Campus.
WS1: Electronic Part Supply Chain Evaluation and Managing Electronic Part Obsolescence for Counterfeit AvoidanceDiganta Das, Ph.D., CALCE and Peter Sandborn, Ph.D., CALCE - UMD
WS1: Electronic Part Supply Chain Evaluation and Managing Electronic Part Obsolescence for Counterfeit AvoidanceDiganta Das, Ph.D., CALCE and Peter Sandborn, CALCE
There is NO alternative to good supply chain management as a defense against counterfeit parts. Many types of products that have to be manufactured and supported for long periods of time lack control over critical parts of their supply chain, e.g., avionics and space, telecom infrastructure, and industrial controls. As a result, the components and technologies that these products depend on become obsolete long before the product’s field life (and sometimes manufacturing life) ends. One of the reasons of companies becoming victim of counterfeit electronics is lack of planning for obsolescence and making distress purchase from unauthorized sources. Guidelines based on DMSMS plans that include obsolescence and design refresh planning, supplier approval processes, auditing and contractual requirements will be discussed.
Much of the problem regarding counterfeit electronics is due to lack of due diligence by the part buyers. Understanding of the supply chain and assessing the supply chain before engaging them are necessary steps for any organization. This part of the course will cover how to understand and utilize process change notices for making supply change management and counterfeit detection more efficient. The role of counterfeit part reporting as a legal and technical tool along with its promises and limitations will be discussed with examples. Impact of the US DoD rule changes on the supply chain will be introduced. Authentication tools such as tagging, dye pigments, forensic markers and barcodes will also be discussed as a method of supply chain management.
- Ordinal scale approaches
- Data mining approaches
- Overview of mitigation approaches
- Lifetime/bridge buy – buy size determination
- Reactive vs. pro-active management
- Measuring system health
- Simple net present value based models
- Refresh planning
- Methods and Case Study
- Introduction and examples
- Use in counterfeit detection
- SAE standards 5553, 6081, 6171 and others
- Other organizations
- Forums for Reporting
- Pros and Cons
- Features of DFAR
- Impacts of DFAR
- DNA Based, Ceramic Based, and Polymer Based
- Creating a Supply Chain and Logistics Network for Taggants
Who Should Participate
For an electronics equipment manufacturer, it is difficult to identify counterfeit parts among the thousands of parts used daily, unless there is a sustained and deliberate attempt to verify the parts. The AS6171 Aerospace Standard (currently in draft) standardizes the test and inspection procedures, workmanship criteria, and minimum training and certification requirements to detect counterfeit electrical, electronic, and electromechanical parts. The standard comes in response to a significant and increasing volume of counterfeit EEE parts entering the supply chain. The standard is designed for adoption by aerospace and military manufacturers and contractors, providing uniform requirements, practices and methods to mitigate the risk of receiving and installing counterfeit electronic parts. The Standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk of the application, component, supplier, and other relevant risk factors.
This full day, combined lecture and hands-on workshop being offered at the Symposium on Counterfeit Parts and Materials, 2015, begins with a brief introduction to the electronic parts supply chain, the sources of authorized and unauthorized parts and overview of the diverse counterfeit part creation techniques. The tools, techniques and procedures for the non-destructive, destructive and analytical technique that are part of AS6171 will be discussed. Also included are discussions of minimum level of inspection, sampling plan based on tier level of accepted risk, and reject criteria.
One session of the workshop will be devoted to laboratory demonstration of relevant equipment used for counterfeit parts identification and inspection. Equipment such as x-ray, x-ray fluorescence, optical inspection, solvent testing, acoustic microscopy, electrical tests and other pertinent techniques. Attendees will also get an overview of the certification and training requirements for each AS6171 inspection technique. In the end, authentication tools (such as DNA marking, dye pigments and barcodes) will be discussed.
- Background and status
- Risk levels
- Test flow
- Sample size selection
- Test lab assessment and certification
- Non-destructive (e.g., optical, EVI, X-ray, XRF)
- Materials Characterization Techniques (e.g., FT-IR, DSC, TMA)
- Electrical Characterization (e.g., Basic VI, Parametric, fixtures)
- Destructive techniques (e.g., DPA, physical analysis, delayering)
- Environmental stress testing (e.g., temperature, HAST)
- Miscellaneous techniques (e.g., TGA)
Who Should Participate
Did you know that even if sensitive components are original, suspect counterfeit packaging will damage ESD sensitive devices?
Do you test ESD Materials such as Tape & Reel, JEDEC Trays and IC Carriers (Dip Tube) before testing takes place?
Suspect Counterfeiting extends beyond Fasteners and Slings. The visual inspection process does not go far enough. The days of purchasing USA products from your local distributor or manufacturer can be unknowingly circumvented by its procurement or engineering outsourcing from the Pacific Rim.
Today, more advanced packaging engineering principles are utilized to insure that products are protected, branded and properly labeled or RFID tagged so that non-conforming and suspect counterfeit products can be more easily traced, identified, inspected and mitigated. Therefore, original products designed with engineered packaging are more difficult to duplicate, substitute or counterfeit. This organic approach is taking on a very active role in comparison to the defensive posture of reliance upon suppliers to do the right thing. Many of these suspect counterfeit procedures practiced in the pharmaceutical sector can be transferred over to aerospace & defense.
If one does not test, then one does not have much of a program. See real case examples. If the global supply chain does not think that Suspect Counterfeit packaging material has infiltrated the supply chain, then think again. Aerospace sectors have seen launch delays and issues in space due to non-compliant materials. Class 0A (less than 125 volts) ESD-sensitive devices (sensitive to less than 50 volts) increasingly are being incorporated into aerospace hardware. Proper handling and “validated” packaging of these devices are essential to mitigate ESD issues in materials handling, assembly and storage. This interactive workshop will demonstrate how non-compliant or suspect counterfeit Dip Tubes (IC Carrier or Rails), JEDEC Trays and Tape & Reel pose real risks during transport, incoming inspection and automated pick & place. The aerospace & defense supply chain is being compromised from the manufacturer to the distributor and to the end user. What steps should one take to establish these preventative measures?
In an interactive format, this workshop will focus upon 3 device packaging types that have been subjected to corrective actions and quarantine due to non-compliant or suspect counterfeit materials. In case study format, this presentation will review not only related issues, but also validation methods with actual results that may have been overlooked as problematic for a suspect counterfeit countermeasure program.
In addition, supplier non-conformance that compromises the DoD Supply Chain for long-term storage will be reviewed. The instructor will discuss the standardized military standard testing that was conducted in which 4 out of 5 ESD packaging schemes failed with recommendations for the user to adhere to periodic materials testing in addition to device testing for the product life cycle to ensure supplier compliance.
Who Should Participate