Technical Program

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Monday, May 22, 2017


Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

1:00pm — 4:30pm

Instructors:
  • Bob Willis – bobwillis.co.uk
  • Helmut Schweigart, Ph.D. - ZESTRON
  • Mike Bixenman, DBA – KYZEN Corporation
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    Tuesday, May 23, 2017


    Tuesday Keynote Address

    Prabjit Singh, Ph.D. IBM Corporation
    Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

    Session 1: Residues trapped under Component Terminations

  • Karthik Vijay, Indium Corporation
    Dendritic Growth & Corrosion under Low-Standoff Components in Automotive Electronics – A Flux Solution
  • Bruno Tolla, Ph.D., Kester
    Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components
  • Mike Bixenman, DBA, KYZEN Corporation
    Development of a Risk Profile from Flux Residues Trapped under Leadless Components
  • Bob Willis and Martin Wickham, NPL
    Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
  • Vladimir Sitko, PBT Works
    Cleaning Process Performance Measurement

    Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

  • Doug Pauls, Rockwell Collins
    Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage Currents
  • Dave Hillman, Rockwell Collins
    Flux Residues under Components – Are they Bad?
  • Eric Camden, Foresite
    Electronic Assembly – Where do Contaminants come from?
  • Bart van de Lisdonk, Interflux
    Chemical Reliability of Soldering Residue

    Session 3: Process Control and Cleaning Material Innovations

  • Andreas Reinhardt, SEHO Systems GmbH
    Measures to Minimize Contamination During Wave and Reflow Soldering
  • Rodrigo Aguilar, Inventec
    Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead Free Materials
  • Mark Routley, GEN3 Systems
    Process Control of Ionic Contamination achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
  • Todd Rountree, Austin American Technology
    Addressing the Problems with Ionic Cleanliness Testing Modern Circuits



    Wednesday, May 24, 2017


    Wednesday Keynote Address

    Rudiger Knofe, Siemens AG
    Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

    Session 4: Conformal Coating Materials and Processes

  • Helmut Schweigart, Ph.D. ZESTRON
    Selection of Protective Measures against Climatic Stress
  • David Foote, Nordson March
    Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures without Impact on Coating Performance
  • Marie Kaing, Humiseal
    Conformal Coating Materials for High Temperature Automotive Applications
  • Rakesh Kumar, Ph.D., Specialty Coatings
    Challenges of Designing Electronics for Conformal Insulation to Enhance their Protection and Reliability
  • Eva Rogge, Euro Plasma
    Innovative Plasma Coatings for High Volume Conformal Coating of Electronics
  • Michael Szuch, Nordson Asymtek
    Transitioning from Manual to Automated Conformal Coating
  • Mathieu Gonsolin, Exelsius
    Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability








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    Global SMT & Packaging