Technical Program

Click here to view a printable PDF

Monday, May 22, 2017

Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

1:00pm — 4:30pm

  • Bob Willis –
  • Helmut Schweigart, Ph.D. - ZESTRON
  • Mike Bixenman, DBA – KYZEN Corporation
  • Get details

    Tuesday, May 23, 2017

    Tuesday Keynote Address

    Prabjit Singh, Ph.D. IBM Corporation
    Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

    Session 1: Residues trapped under Component Terminations

  • Karthik Vijay, Indium Corporation
    Dendritic Growth & Corrosion under Low-Standoff Components in Automotive Electronics – A Flux Solution
  • Bruno Tolla, Ph.D., Kester
    Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components
  • Mike Bixenman, DBA, KYZEN Corporation
    Development of a Risk Profile from Flux Residues Trapped under Leadless Components
  • Bob Willis and Martin Wickham, NPL
    Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
  • Vladimir Sitko, PBT Works
    Cleaning Process Performance Measurement

    Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

  • Doug Pauls, Rockwell Collins
    Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage Currents
  • Dave Hillman, Rockwell Collins
    Flux Residues under Components – Are they Bad?
  • Eric Camden, Foresite
    Electronic Assembly – Where do Contaminants come from?
  • Bart van de Lisdonk, Interflux
    Chemical Reliability of Soldering Residue

    Session 3: Process Control and Cleaning Material Innovations

  • Andreas Reinhardt, SEHO Systems GmbH
    Measures to Minimize Contamination During Wave and Reflow Soldering
  • Rodrigo Aguilar, Inventec
    Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead Free Materials
  • Mark Routley, GEN3 Systems
    Process Control of Ionic Contamination achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
  • Todd Rountree, Austin American Technology
    Addressing the Problems with Ionic Cleanliness Testing Modern Circuits

    Wednesday, May 24, 2017

    Wednesday Keynote Address

    Rudiger Knofe, Siemens AG
    Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

    Session 4: Conformal Coating Materials and Processes

  • Helmut Schweigart, Ph.D. ZESTRON
    Selection of Protective Measures against Climatic Stress
  • David Foote, Nordson March
    Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures without Impact on Coating Performance
  • Marie Kaing, Humiseal
    Conformal Coating Materials for High Temperature Automotive Applications
  • Rakesh Kumar, Ph.D., Specialty Coatings
    Challenges of Designing Electronics for Conformal Insulation to Enhance their Protection and Reliability
  • Eva Rogge, Euro Plasma
    Innovative Plasma Coatings for High Volume Conformal Coating of Electronics
  • Michael Szuch, Nordson Asymtek
    Transitioning from Manual to Automated Conformal Coating
  • Mathieu Gonsolin, Exelsius
    Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability

  • Supported by:
    Global SMT & Packaging