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Chapter News

Tech Talk & Tour - Nov. 19, 2014

 The SMTA Arizona/Sonora Chapter cordially invites you to attend:

 

Tech Talk & Tour

Tom Foley, ASM Assembly Systems

“The Process Chain for 03015 Placement”

 

IMPORTANT INFO:

Wednesday, November 19, 2014

4:00 p.m.

Compliance Testing

1724 S. Nevada Way

Mesa, AZ 85204

 

 

CLICK HERE TO RSVP TODAY!

 

 

PRICE:

  • Members In Advance:  FREE!
  • Non-Members In Advance:  $10
  • Members at the Door:  $5
  • Non-Members at the Door:  $15

Cost includes:  Dinner, tour & presentation

 

AGENDA:

  • 4:00 p.m.        Registration
  • 4:30 p.m.        Tom Foley, “The Process Chain for 0315 Placement”
  • 5:00 p.m.        Dinner
  • 6:00 p.m.        Tour Compliance Testing

 

 

This outstanding professional development program

was made possible with support from

SMTA Arizona/Sonora Chapter.


“The Process Chain For 03015 Placement”

 

INTRODUCTION:

Only 0.15 millimeters wide and 0.3 millimeters in length, the 03015 component is the latest step in the miniaturization of resistors and capacitors that pose upcoming challenges for electronics manufacturers.

 

This presentation will provide an overview of ASM Assembly Systems extensive test results and process considerations for high yield 03015 placement.   The areas impacted include board design, component design, screen printing process & stencil design, component placement accuracy, and reflow parameters.

 

 

ABOUT TOM FOLEY

Tom Foley is the Quality Manager and Channel Manager for ASM Assembly Systems.  Having over 20 years of surface mount industry experience, Tom has previously held positions in product management, marketing, and applications engineering.   He has also served on industry committee’s such as IPC-9851, iNEMI Roadmap, and is a certified Six Sigma Black Belt.

 

COMPLIANCE TESTING

Compliance Testing  is an accredited full service Testing, Product Safety and Certification lab providing  FCC, IC, CE, EMC, EMI, RF and other tests to meet all of your needs.

 

 

LIMITED SEATING

RSVP HERE TO GUARANTEE YOUR SEAT!






PREVIOUS CHAPTER EVENTS


November 20, 2013
Annual Expo & Tech Forum
"Intricacies of LED Placement"
Presented by Larry Groves (Samsung C&T Automation)
"Curve Tracing Detects Counterfeit Components"
Presented by Chris O'Connor (Robson Technologies)
"Flying Probe Testing Adds New Capabilities"
Presented by Paul Bennett (Acculogic)
"Challenges of QFN, PoP and 01005 Component Rework:"
Presented by Robert Avila (Finetech USA)

October 8, 2013
Chapter Lunch Meeting
"Stability in an Unstable World"
Presented by Jim Walker (Gartner Inc.)

June 19, 2013
Chapter Lunch Meeting
"Stencil Design" and "Design for Manufacturing"
Presented by Joel Neer (Photo Design of AZ) and Adan Ortiz (QuikTek Assembly)

February 27, 2013
Chapter Lunch Meeting
"Custom IC Design for Implantable Medical Device Miniaturization"
Presented by Andrew Kelly (Cactus Semiconductor, Inc.)

December 4, 2012
Annual Expo & Tech Forum
"High Quality Vapor Phase Reflow Soldering"
Presented by Tom Dunn (Phase 4, Inc.)
"High Speed Digital"
Presented by Dean Hattula (Rogers Corp.)
"Opportunities in the MEMS Market"
Presented by Tony Massimini (Semico Research)
"Emerging IC Packaging Technologies"
Presented by Ahmer Syed (Amkor Technology)

October 31, 2012
Chapter Lunch Meeting
"Plasma-Deposited Nanomaterials for Electronics Manufacturing"
Presented by Greg Thomas (Semblant, Inc.)

August 15, 2012
Chapter Lunch Meeting
"Cleaning in the World of No Clean"
Presented by Mike Konrad (Aqueous Technologies)

April 24, 2012
Chapter Lunch Meeting
"Micro Rework"
Presented by Al Cabral (VJ Electronix)

December 7, 2011
Annual Expo & Tech Forum
"Thermal Analysis of Printed Circuit Board Assembly"
Presented by Clinton Smith (P.A.D.T. Inc.)
"Solder in the Age of 3D Semiconductor Assembly"
Presented by Andy Mackie, Ph.D. (Indium Corp.)
"Advanced Packaging for Mobile and Growth Products"
Presented by Steve Anderson (STATS ChipPAC)
"Challenges in Flexible Electronics Technology"
Presented by Doug Loy, Ph.D. (ASU Flexible Display Center)

August 31, 2011
Chapter Lunch Meeting
"Design for Flying Probe Testing"
Presented by Paul Bennett (Acculogic)

May 25, 2011
Chapter Dinner Meeting - Tucson
"CAM files to PCBs"
Presented by Mark Thompson (Prototron Circuits)

May 25, 2011
Chapter Lunch Meeting - Tempe
"PCB Impedance Control"
Presented by Mark Thompson (Prototron Circuits)

March 30, 2011
Chapter Lunch Meeting
"Package-on-Package SMT Assembly"
Presented by Larry Groves (Samsung Assembly Technology)

December 1, 2010
Annual Expo & Tech Forum
"Semiconductor Demand 2011 - Where is it going from here?"
Keynote presented by Jim Feldhan (Semico Research)
Downloadable presentations:
Semiconductor Demand Forecast - J.Feldhan
Laminate Fan-out Embedded Die Technologies - G.Stout
PCBA Mfg Quality Metrics - U.Bidurudontam

August 30, 2010
Joint Chapter Lunch Meeting with IPC / GPDC
"RFI / EMI Shielding"
Presented by Phil Strong (Orbel Corp.)

May 26, 2010
Chapter Lunch Meeting
"High Quality Vapor Phase Reflow Soldering - The Advanced Soft Solder Technology"
Presented by Jochen Lipp (IBL-Lottechnik GmbH)

February 4, 2010
Joint Chapter Lunch Meeting with IMAPS
"Analyzing the Recovery"
Presented by Bill McClean (IC Insights)

August 26, 2009
Annual Expo & Tech Forum
"New and Emerging Trends in Electronics"
Keynote presented by Dr. Dan Baldwin (Engent)

June 17, 2009
Chapter Lunch Meeting
"Assessing the Global Impact of RoHs/WEEE on Printed Wiring Board Assemblies"
Presented by Marissa Oskarsen (E-TECH Sales) and Peter Jenner (Weller)

May 20, 2009
Chapter Lunch Meeting
"Designing with Embedded Resistor Components"
Presented by Dave Burgess (Ticer Technologies)

April 22, 2009
Chapter Lunch Meeting
"Development of a 3W, 30GHz Satellite Transceiver for Commercial Applications"
Presented by David Laidig (U.S. Monolithics)






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
November 19, 2014
4:00 pm
Tech Talk & Tour Compliance Testing (480) 966-2018   Tom Dunn 
tdunn@phase4inc.com





President : Nicholas A Leonardi  (YINCAE Advanced Materials, LLC)
Phone : 480-334-7455
Email : naleonardi@aol.com

Secretary : Gary Gotchy  (Quik Tek Assembly)
Phone : 480-430-1426
Email : gary@quiktekassembly.com

Treasurer : Thomas A. Dunn  (Phase 4, Inc.)
Phone : 480-966-2018
Email : tdunn@phase4inc.com

Board Liaison : Michelle Ogihara (Seika Machinery, Inc.)
Phone Contact : 310-540-7310
Email Address : michelle@seikausa.com