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Held at:
OnCore Manufacturing
237 Via Vera Cruz                                                         RSVP NOW
San Marcos, CA 92078


"Underfill materials to improve mechanical robustness over a variety of applications"
By Art Ackerman
The consumer electronics market continues to see increased demand for materials able to meet the growing challenges of tomorrow’s devices. Increased functionality, reduced real estate, and increased density continue to be significant challenges to design and manufacturing engineers alike. The use of innovative materials, such as underfills, has been shown to improve the mechanical robustness of a wide variety of devices such as CSP, BGA, and WLSP components a variety of devices with respect to drop and thermal cycle testing. A variety of material solutions for consumer electronics such as cellular phones and laptops is presented. The performance of different materials will be discussed with respect to application and manufacturing requirement. Finally a review of environmental considerations will be offered.
BIOGRAPHY
Art Ackerman currently serves as a Senior Applications Engineer for Henkel Corporation, where he supports a global customer base and a broad range of advanced materials products. Much of his work centers on assembly processes for electronics used in the commercial, defense and aerospace, medical and photovoltaic markets. Upon completion of his degree in 2000 (Chemical Engineering) at the University of California at Santa Barbara, Ackerman spent 5 years working in front-end semiconductor processing. His time in semiconductor manufacturing included experience with epitaxial growth of III-IV semiconductor devices and materials integration of non-CTE matched semiconductor substrates for Solar, Telecom and Luminescence applications. This work has proved an invaluable foundation for Ackerman’s current efforts with materials such as Film and paste adhesives, underfills, solders, etc. to enable next-generation assembly processes.

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