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First Meeting of 2017 - February 23 at The Test Connection

The SMTA Capital Chapter is pleased to announce its first meeting of 2017 on February 23rd, scheduled from 5:00 pm to 8:00 pm at The Test Connection, 11400 Cronridge Drive, Suite H, Owings Mills, MD, 21117.  The focus of this chapter meeting will be “Flying Probe in Modern Day” presented by Joe Folsom and Tim Dykes, The Test Connection, featuring a demo and tour of the facility.

As flying probe continues to evolve in the production test tool, there needs to be a technology understanding of what the flying probe tester is, what this solution can and cannot do and have a technical understanding of designing for success. This review of the history, theory and demonstrations, manufactures and engineers will observe trends for test opportunities and learn limitations to be avoided.  

First, a quick review of where flying probe test came from, the late 1980s, where it is now, the 2010s, and what we can see for the future of this production test technology. The overview will review the trends from the major manufactures are attempting to address. Secondly, Design for Test (DfT) Guidelines for the flying probe test solution will be examined. Even though flying probe test is more DfT leant than the In-Circuit Test (ICT) using a bed of nails fixture, the test development and the test execution costs can show performance and cost savings with following some physical and electrical rules.

The presentation will conclude with a demo on both a single and double sided tester with a customer supplied board. Attendees will see the areas of strength and weakness of both systems. Two updated systems side by side will allow attendees to review the results of each solution in real time.

Joe Folsom is a Sr. Technologies/Lead Test Engineer at The Test Connection (TTCI). Mr. Folsom holds a BA in Mathematics from The Johns Hopkins University. He started at TTCI in 1994 as an In-circuit Test development engineer. While at TTCI, Mr. Folsom has been through in-house training on GenRad 228x, Completed User Training Course for HP3070 Series II, GenRad 228X Advanced Application trained, RSI CAMCAD, RSI BOM Explorer and RSI Exchange trained, Corelis boundary scan trained,  Asset Inter-Tech boundary scan trained (eDFT), Digitaltest trained in CLINK and CITE(w/Visual Basic) for Condor flying probe, XJTAG boundary scan trained,  Agilent Technologies TS-5400 Developers trained,  Seica trained in VIVA for Pilot V84D flying probe and has completed Teradyne TestStation Program Development. Mr. Folsom oversees the test development applications requirements at TTCI.

Tim Dykes is a test development lead engineer at The Test Connection (TTCI). Mr. Dykes is in his third year at TTCI, and has completed flying probe training from Seica and Digitaltest. He has logged development of a few hundred test development applications. Applications development and user training support is Mr. Dykes’s current role with TTCI. His background includes, five years of CNC based manufacturing in the stone industry, ten years of IT service and support. As a senior test engineer he frequently consults with Seica and Digitaltest to assist them with flying probe applications and test program development.

The evening is scheduled as follows:
5:00-6:00 pm Registration & Networking
6:00-6:30 pm Dinner
6:30-7:30 pm Presentation & Demo: “Flying Probe in Modern Day” presented by Joe Folsom and Tim Dykes, The Test Connection
7:30-8:00 pm Facility Tour

11400 Cronridge Drive
Suite H
Owings Mills, MD, 21117 
(410) 205-7300

Please join us for this networking, learning and dinner event. The registration fees are $20 for members and $30 for non-members.  Any new member that joins the chapter at this event can attend the next chapter meeting for FREE.

To RSVP, please click on the following link:

We want to hear from you about SMT Processes Certification

The SMTA Certification Committee is looking for feedback about the existing SMT Processes Certification Program. It takes less than 2 minutes to provide your input about the potential of running a program in the DC area.

Take the survey here!

Download the latest Chapter Newsletter

January 2016 Newsletter

August 2012 Newsletter

September 2010 Newsletter

May 2010 Newsletter

The SMTA Capital Chapter is looking for sponsors to advertise in our newsletter.  Advertising revenues will help the Capital Chapter to bring the best experts to our meetings and workshops.  Please, contact Fernando Rueda ( for details.

Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
February 23, 2017
SMTA Capital Chapter to Host First Meeting of the Year The Test Connection (410) 205-7300   Bert Horner
August 24, 2017
Vendor-Expo - Capital 2017 Johns Hopkins University/Applied Physics Lab   Kaitlyn Gherity 

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Our Chapter Leaders

President : Brian A. Costanzo  (DRS Signal Solutions)
Phone : 301-944-8535
Email :

Vice President : Karen Walters Ebner  (Raytheon Systems Company)
Phone : 443-558-5332
Email :

Secretary : Bert Horner  (The Test Connection, Inc.)
Phone : 410-205-7300
Email :

Treasurer : Fernando Rueda  (KYZEN Corporation)
Phone : 615-983-4603
Email :

VP of Technical Programs : John Vaughan  (Zentech Manufacturing, Inc.)
Phone : 443-348-4500
Email :

VP of Membership : Tom O'Connor  
Phone : 410-730-3385
Email :

VP Communications (Appointed) : Jessica Kreis  (ZESTRON Americas)
Phone : 703-393-9880
Email :

Board Liaison : Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880
Email Address :

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Global Members of our Chapter

ZESTRON Americas

Global Participating Members of our Chapter

Harris Corporation

KYZEN Corporation

ZESTRON Americas

ZESTRON Americas

Corporate Members of our Chapter

Annapolis Micro Systems, Inc.

Apex Factory Automation


Department of Defense



Practical Technologies, Inc.

Simplimatic Automation

The Test Connection, Inc.

Zentech Manufacturing, Inc.

ZESTRON Americas

SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos Vitronics Soltec USA ZESTRON Americas

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